PCB board mold with higher service life

Abstract

This utility model discloses a PCB board mold with a long service life, belonging to the field of PCB processing mold technology. It includes a bottom mold base, with stamping dies fixed to both sides of the top surface of the bottom mold base. The stamping die includes a top mold frame, with guide pillars fixed around the bottom surface of the top mold frame. A pillar base is fixed to the bottom end of each guide pillar, and a soft rubber ring is fitted to the top surface of the pillar base. A ring sleeve is fitted to the top of each guide pillar. This mold is integrally fixed to the bottom mold frame via the guide pillars around the bottom surface of the top mold frame. During stamping, the bottom of the ring sleeve around the top mold plate contacts the soft rubber ring on the top surface of the pillar base to provide external cushioning. Meanwhile, the central stamping plate, in conjunction with the elastically expandable rubber posts built into the buffer rods on both sides, contacts the top surface of the PCB board groove during stamping, forming an internal elastic cushioning process on both sides. This achieves bidirectional cushioning of the entire mold during a single stamping process, thereby reducing wear on the mold body and extending its service life.

Description

Technical Field

[0001] This utility model relates to the field of PCB processing mold technology, specifically to PCB board molds with a long service life. Background Technology

[0002] PCB, or Printed Circuit Board, is the support structure and electrical connection carrier for electronic components. It forms conductive paths through copper foil etching, enabling signal transmission and power distribution between components. PCB production mainly uses stamping. Precision stamping dies are made according to design drawings, and the board material is positioned on a CNC punch press. The die is then used for high-speed punching. PCB stamping dies are high-precision processing equipment used in the electronics manufacturing industry. They are mainly used to divide PCB printed circuit boards and are commonly found in the production of micro-electronic components such as mobile phone motherboards and memory cards. Through high-precision cutting technology, PCB boards are divided into independent components of specific shapes or sizes, which is suitable for the mass production of precision electronic components.

[0003] A Chinese patent website (patent publication number CN209812526U) discloses a stamping die for preventing PCB board damage, including an upper die and a lower die. A PCB substrate is placed in the middle of the upper surface of the lower die. Fixed seats are provided on both sides of the upper surface of the lower die. An adjusting screw is screwed onto the fixed seat. A pressure plate is fixedly connected to one end of the adjusting screw near the PCB substrate, and an adjusting knob is fixedly connected to the other end of the adjusting screw. Multiple punches are fixedly provided on the bottom surface of the upper die, with the lower part of the multiple punches facing the PCB substrate.

[0004] The aforementioned PCB stamping process utilizes stamping equipment and dies to perform partial or complete punching or perforation operations on the PCB board. Knobs on both sides of the lower die are used to press the PCB substrate firmly against the pressure plates, thus preventing the substrate from shifting and causing damage. However, during continuous processing, the upper and lower dies of the aforementioned die will continuously make stamping contact. Since there is no buffer structure between the upper and lower dies during the stamping process, the continuous stamping process will cause wear between the upper and lower dies. In addition, when the stamping force is too high, it will also affect the stability of the PCB board material and cause losses. Therefore, we propose a PCB die with a longer service life. Utility Model Content

[0005] The summary section of this application is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description section below. This summary section is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0006] The purpose of this invention is to provide a PCB board mold with a longer service life to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a PCB board mold with a long service life, including a bottom mold base, stamping dies fixed on both sides of the top surface of the bottom mold base, a top mold frame, guide pillars fixed around the bottom surface of the top mold frame, a pillar base fixed at the bottom end of the guide pillars, a soft rubber ring attached to the top surface of the pillar base, a ring sleeve fitted on the top of the guide pillars, ball bearings embedded around the inner wall of the ring sleeve, the ring sleeve being embedded and fixed to the four sides of the upper mold plate, and threaded posts fixed around the bottom surface of the upper mold plate, a stamping plate connected to the bottom end of the threaded posts, buffer plates fixed on both sides of the stamping plate, buffer rods distributed at both ends of the buffer plates, rubber posts connected to the bottom inner end of the buffer rods, and springs connected to the top ends of the rubber posts.

[0008] Furthermore, the rubber pile forms an elastic telescopic structure with springs and buffer rods, and the buffer rods are fixed to the two sides of the stamping plate.

[0009] Furthermore, the stamping plate is connected to the bottom surface of the upper template via threaded piles to form a detachable structure, and the upper template has rings fixed inside the four perimeter ends.

[0010] Furthermore, the upper template is slidably engaged with the guide post through a surrounding ring, and the balls are distributed equidistantly along the inner wall of the surrounding ring.

[0011] Furthermore, the top mold frame is fixedly connected to the bottom mold base around the top surface via guide posts around the top surface, and the size of the ring sleeve matches the size of the soft rubber ring at the bottom of the guide posts.

[0012] Furthermore, the bottom mold base includes a bottom mold frame, a PCB board groove is formed at the center of the top surface of the bottom mold frame, a waste material groove is formed at the bottom surface of the PCB board groove, and guide pillars and pillar seats are fixed around the top surface of the bottom mold frame.

[0013] Furthermore, the PCB board slot has punched holes inside, and the PCB board slot is connected to the bottom waste trough through the punched holes.

[0014] Compared with the prior art, the beneficial effects of this utility model are: The mold is fixed to the bottom mold frame by the guide pillars around the bottom of the top mold frame. During stamping, the bottom of the ring around the template contacts the soft rubber ring on the top surface of the pillar base to provide external cushioning. Meanwhile, the central stamping plate can contact the elastic and telescopic rubber piles built into the buffer rods on both sides and the top surface of the PCB board groove during stamping, forming an elastic cushioning process on both sides inside. This achieves the bidirectional cushioning purpose of the entire mold in one stamping process, thereby reducing the wear and tear on the mold body and extending its service life. This mold uses the bottom mold frame as the mold base to provide bottom stability during the stamping process. The PCB board groove opened on the top surface of the bottom mold frame matches the size of the bottom surface of the stamping plate, which can maintain stable stamping of the PCB board material. With the waste groove connected to the bottom of the through hole, the waste material punched out can be quickly collected and cleaned up. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of the main body of this utility model; Figure 2 This is a front view structural diagram of the main body of this utility model; Figure 3 This is a top view of the internal structure of the ring-shaped sleeve of this utility model; Figure 4 This is a three-dimensional structural diagram of the stamping plate of this utility model; Figure 5 This is a schematic diagram of the internal structure of the buffer rods on both sides of the stamping plate of this utility model.

[0016] In the diagram: 1. Bottom mold base; 101. Bottom mold frame; 102. PCB board groove; 103. Scrap material groove; 2. Stamping die assembly; 201. Top mold frame; 202. Guide pillar; 203. Column base; 204. Soft rubber ring; 205. Ring sleeve; 206. Ball bearing; 207. Upper template; 208. Threaded pile; 209. Stamping plate; 210. Buffer plate; 211. Buffer rod; 212. Rubber pile; 213. Spring. Detailed Implementation

[0017] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0018] It should also be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0019] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules, or units, and are not used to limit the order of functions performed by these devices, modules, or units or their interdependencies. It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0020] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] This utility model provides, for example Figure 1-5 The PCB board mold with a long service life shown includes a bottom mold base 1. Stamping dies 2 are fixed on both sides of the top surface of the bottom mold base 1. The bottom mold base 1 includes a bottom mold frame 101. A PCB board groove 102 is opened in the center of the top surface of the bottom mold frame 101. A waste material groove 103 is opened in the bottom surface of the PCB board groove 102. Guide pillars 202 and pillar seats 203 are fixed around the top surface of the bottom mold frame 101. To ensure the stability of the bottom structure of this mold during the stamping of PCB boards, such as Figure 1 As shown, this mold can use the bottom mold frame 101 as the mold base to provide bottom stability during the stamping process. The PCB board groove 102 opened on the top surface of the bottom mold frame 101 matches the bottom surface size of the stamping plate 209, which can maintain stable stamping of the PCB board material. With the waste groove 103 connected to the bottom of the through hole, the waste material punched out can be quickly collected and easily cleaned.

[0022] like Figure 1-5 As shown, the stamping die 2 includes a top die frame 201. Guide pillars 202 are fixed around the bottom surface of the top die frame 201. A column base 203 is fixed at the bottom end of the guide pillars 202. A soft rubber ring 204 is attached to the top surface of the column base 203. A ring sleeve 205 is sleeved on the top of the guide pillars 202. Ball bearings 206 are embedded around the inner wall of the ring sleeve 205. The ring sleeve 205 is embedded and fixed around the four sides of the upper template 207. Threaded piles 208 are fixed around the bottom surface of the upper template 207. A stamping plate 209 is connected to the bottom end of the threaded piles 208. Buffer plates 210 are fixed on both sides of the stamping plate 209. Buffer rods 211 are distributed at both ends of the buffer plate 210. A rubber pile 212 is connected to the bottom end of the buffer rod 211. A spring 213 is connected to the top end of the rubber pile 212. To provide cushioning for the overall mold during the stamping process of PCB boards, such as Figure 1-5As shown, this mold is fixed to the bottom mold frame 101 by the guide pillars 202 around the bottom surface of the top mold frame 201. During stamping, it can cooperate with the soft rubber rings 204 on the top surface of the column base 203 to provide external buffering through the bottom of the rings 205 around the template 207. Meanwhile, the central stamping plate 209 can cooperate with the elastic and telescopic rubber piles 212 built into the buffer rods 211 on both sides to contact the top surface of the PCB board groove 102 at the same time as stamping, forming an elastic buffering process on both sides inside. This achieves the bidirectional buffering purpose of the mold in one stamping process, thereby reducing the wear on the mold body and improving its service life. The upper template 207 is engaged with the guide post 202 through the surrounding ring 205. During the sliding process, the balls 206 embedded in the inner wall of the ring 205 can roll synchronously along the outer wall of the guide post 202, thereby effectively reducing the wear on the outer wall of the guide post 202 during frequent stamping and further improving its service life.

[0023] In summary, when using this mold, the user first places the PCB board material to be stamped into the corresponding PCB board slot 102. Then, the upper template 207 is pressed by the driven hydraulic pile, causing the upper template 207 to slide downward during the stamping process. At this time, the surrounding rings 205 roll synchronously along the outer wall of the guide post 202 with the ball bearings 206 until the stamping plate 209 connected to the bottom of the upper template 207 stamps the PCB board slot 102 below. When contacting the stamping, the bottom of the surrounding rings 205 contacts the soft rubber ring 204 on the top surface of the column base 203 for buffering. At the same time, the rubber pile 212 contacts both sides of the top surface of the PCB board slot 102 and is further buffered by the elasticity of the spring 213, completing the stamping buffering process. The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the utility model involved in the embodiments of this disclosure is not limited to the technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.

Claims

1. A PCB mold with higher service life, comprising a bottom mold base (1), characterized in that, The bottom mold base (1) has stamping dies (2) fixed on both sides of its top surface. The stamping die (2) includes a top mold frame (201). Guide posts (202) are fixed around the bottom surface of the top mold frame (201). A column base (203) is fixed at the bottom end of the guide post (202). A soft rubber ring (204) is attached to the top surface of the column base (203). A ring sleeve (205) is fitted on the top of the guide post (202). Ball bearings (206) are embedded around the inner wall of the ring sleeve (205). 5) The upper template (207) is embedded and fixed around the four sides, and the bottom surface of the upper template (207) is fixed with threaded piles (208). The bottom end of the threaded piles (208) is connected to a stamping plate (209). The two sides of the stamping plate (209) are fixed with buffer plates (210). The two ends of the buffer plates (210) are distributed with buffer rods (211). The bottom end of the buffer rods (211) is connected with rubber piles (212). The top end of the rubber piles (212) is connected with a spring (213).

2. The PCB board mold with a long service life according to claim 1, characterized in that, The rubber pile (212) forms an elastic telescopic structure with the spring (213) and the buffer rod (211), and the buffer rod (211) is fixed to both sides of the stamping plate (209).

3. The long-life PCB board mold of claim 1, wherein, The stamping plate (209) forms a detachable structure with the bottom surface of the upper template (207) through the threaded pile (208), and the upper template (207) has rings (205) fixed inside the four perimeter ends.

4. The PCB board mold with a long service life according to claim 1, characterized in that, The upper template (207) is slidably engaged with the guide post (202) through the four-sided ring sleeve (205), and the balls (206) are distributed equidistantly along the inner wall of the ring sleeve (205).

5. The PCB board mold with a long service life according to claim 1, characterized in that, The top mold frame (201) is fixedly connected to the bottom mold base (1) around the top surface through the guide posts (202) around the top surface, and the size of the ring (205) matches the size of the soft rubber ring (204) at the bottom of the guide post (202).

6. The PCB board mold with a long service life according to claim 1, characterized in that, The bottom mold base (1) includes a bottom mold frame (101), a PCB board groove (102) is provided at the center of the top surface of the bottom mold frame (101), a waste material groove (103) is provided at the bottom surface of the PCB board groove (102), and guide posts (202) and column bases (203) are fixed around the top surface of the bottom mold frame (101).

7. The PCB board mold with a long service life according to claim 6, characterized in that, The PCB board groove (102) has punched holes inside, and the PCB board groove (102) is connected to the bottom waste groove (103) through the punched holes.

Images