A high-power-density, high-precision, high-strength and electrically insulated cooler

Abstract

The utility model discloses a high power density, high accuracy, high strength and electric insulating cooler, including ceramic base and sealing cover, setting up medium circulation cooling channel in ceramic base, the both ends of medium circulation cooling channel are communicated respectively in two medium circulation joints that ceramic base end part is provided with, and the outside of medium circulation cooling channel on ceramic base is covered by sealing cover and forms the seal. The utility model discloses ceramic base bottom surface and the heat dissipation surface of the device that is cooled closely fit heat dissipation, and the flatness error of ceramic base bottom surface is less than 0.003mm, has high accuracy, connects through bolt passing through mounting hole, and simple and reliable. Sealing cover is fixed on ceramic base through the sealing of glue cementation, adopts cementation, and further improves the uniform distribution of heat dissipation and adhesive force, and removes local stress.

Description

Technical Field

[0001] This utility model relates to the field of high power density heat dissipation technology, and in particular to a cooler with high power density, high precision, high strength and electrical insulation. Background Technology

[0002] High power density heat dissipation is widely used in high-power chips (such as AI chips, GPUs, CPUs, etc.), power electronics (such as SiC, IGBTs), and high-current contacts (such as fast-charging terminals / contacts for high-rate batteries). Current main heat dissipation methods include water-cooled plates, vapor chamber heat sinks, water-cooled copper-aluminum heat sinks, and immersion cooling. These methods either struggle to address the high contact thermal resistance at the interface (e.g., the thermal conductivity bottleneck of the interface material), or suffer from unstable weld joints leading to localized hot spots. Alternatively, limitations imposed by the application scenario, such as limited installation space or the requirement for heat sink insulation for contact terminals, further hinder their effectiveness.

[0003] Therefore, heat dissipation and cooling have become the main challenges faced by the above applications. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model designs a cooler with high power density, high precision, high strength and electrical insulation.

[0005] The present invention adopts the following technical solution: A high-power-density, high-precision, high-strength, and electrically insulating cooler includes a ceramic base and a sealing cover. A medium flow cooling channel is provided inside the ceramic base, and two medium flow connectors are provided at the ends of the ceramic base. The two medium flow connectors are respectively connected to the two ends of the medium flow cooling channel. The sealing cover covers the outside of the medium flow cooling channel on the ceramic base to form a seal.

[0006] Preferably, the ceramic base has at least one mounting hole. Due to its high strength, the connection can be made using at least one bolt, which is simple and reliable.

[0007] Preferably, the ceramic base is integrally molded from injection-molded ceramic.

[0008] Preferably, the ceramic base has a sealing cover mounting groove, and a sealing cover is fixedly mounted on the sealing cover mounting groove.

[0009] Preferably, the sealing cap is fixed to the ceramic base by adhesive bonding. Adhesive bonding further improves heat dissipation and the uniform distribution of adhesive force, eliminating localized stress.

[0010] Preferably, the ceramic base has multiple protrusions, and the sealing cover has multiple corresponding grooves, with the grooves and protrusions engaging and locking together.

[0011] Preferably, the flatness error of the bottom surface of the ceramic base is less than 0.003 mm. This high-precision bottom surface allows for direct, tight fit with the device being cooled, enabling heat dissipation.

[0012] The beneficial effects of this utility model are: (1) This utility model can achieve high precision, thereby enabling direct connection between the radiator and the object being cooled, eliminating the bottleneck of the thermal interface material; (2) Due to its high strength, the connection method can use at least one bolt connection, which is simple and reliable; (3) Adhesive bonding further improves heat dissipation and the uniform distribution of adhesive force, eliminating local stress. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a structure according to Embodiment 1 of this utility model; Figure 2 This is a schematic diagram of a ceramic base in Embodiment 1 of this utility model; Figure 3 This is a schematic diagram of a sealing cap in Embodiment 1 of this utility model; Figure 4 This is a schematic diagram of a structure of Embodiment 2 of this utility model; Figure 5 This is a schematic diagram of a structure of embodiment 3 of this utility model; Figure 6 This is a schematic diagram of a structure of embodiment 4 of this utility model; In the diagram: 1. Ceramic base, 2. Sealing cap, 3. Medium flow connector, 4. Mounting hole, 5. Medium flow cooling channel, 6. Sealing cap mounting groove, 7. Protrusion, 8. Groove. Detailed Implementation

[0014] The technical solution of this utility model will be further described in detail below through specific embodiments and with reference to the accompanying drawings: Example 1: As Figures 1-3 As shown, a high power density, high precision, high strength and electrical insulation cooler includes a ceramic base 1 and a sealing cover 2. A medium flow cooling channel 5 is provided inside the ceramic base. Two medium flow connectors 3 are provided at the end of the ceramic base. The two medium flow connectors are respectively connected to the two ends of the medium flow cooling channel. The sealing cover covers the outside of the medium flow cooling channel on the ceramic base to form a seal.

[0015] The ceramic base has four mounting holes 4. The ceramic base is integrally molded from injection-molded ceramic.

[0016] A sealing cover mounting groove 6 is provided on the ceramic base, and a sealing cover is fixedly mounted on the groove. The sealing cover is glued and fixed to the ceramic base. The ceramic base has multiple protrusions 7, and the sealing cover has corresponding grooves 8, which engage with the protrusions. The flatness error of the bottom surface of the ceramic base is less than 0.003mm.

[0017] Example 2: As Figure 4 As shown, in this embodiment, the ceramic base has three mounting holes. The rest is the same as in Embodiment 1.

[0018] Example 3: As Figure 4 As shown, in this embodiment, the ceramic base has two mounting holes. The rest is the same as in Embodiment 1.

[0019] Example 4: Figure 4 As shown, in this embodiment, a mounting hole is provided on the ceramic base. The rest is the same as in Embodiment 1.

[0020] In use, this invention involves tightly fitting the bottom surface of the ceramic base to the surface of the device being cooled. The flatness error of the bottom surface of the ceramic base is less than 0.003mm, demonstrating high precision. Connection is achieved via bolts passing through mounting holes, making it simple and reliable. The sealing cap is glued and fixed to the ceramic base, using adhesive bonding to further improve heat dissipation and ensure uniform distribution of adhesion, while eliminating localized stress.

[0021] The embodiments described above are merely preferred solutions of this utility model and are not intended to limit this utility model in any way. Other variations and modifications are possible without departing from the technical solutions described in the claims.

Claims

1. A cooler with high power density, high precision, high strength, and electrical insulation, characterized in that, It includes a ceramic base and a sealing cap. The ceramic base is provided with a medium flow cooling channel. Two medium flow connectors are provided at the end of the ceramic base. The two medium flow connectors are respectively connected to the two ends of the medium flow cooling channel. The sealing cap covers the outside of the medium flow cooling channel on the ceramic base to form a seal.

2. The cooler with high power density, high precision, high strength, and electrical insulation according to claim 1, characterized in that, The ceramic base has at least one mounting hole.

3. A high-power-density, high-precision, high-strength, and electrically insulating cooler according to claim 1, characterized in that, The ceramic base is integrally molded from injection-molded ceramic.

4. A high-power-density, high-precision, high-strength, and electrically insulating cooler according to claim 1, characterized in that, The ceramic base has a sealing cover mounting groove, and a sealing cover is fixedly mounted on the sealing cover mounting groove.

5. A high-power-density, high-precision, high-strength, and electrically insulating cooler according to claim 1, characterized in that, The sealing cap is fixed to the ceramic base by adhesive.

6. A high-power-density, high-precision, high-strength, and electrically insulating cooler according to claim 1, characterized in that, The ceramic base has multiple protrusions, and the sealing cover has multiple corresponding grooves, which engage with each other.

7. A high-power-density, high-precision, high-strength, and electrically insulating cooler according to claim 1, characterized in that, The flatness error of the bottom surface of the ceramic base is less than 0.003 mm.

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