Light source heat dissipation structure, endoscope light source optical machine and endoscope system

Abstract

The application relates to the technical field of medical devices, and discloses a light source heat dissipation structure, an endoscope light source light machine and an endoscope system. The light source heat dissipation structure is used for the endoscope light source light machine. The light source heat dissipation structure comprises a main shell and a plurality of heat conduction pieces. The heat conduction pieces are arranged in one-to-one correspondence with light emitting elements, and the heat conduction pieces are connected with the corresponding light emitting elements. The heat conduction pieces are connected with the main shell. The light source heat dissipation structure further comprises a heat dissipation module. The heat dissipation module is connected with the main shell, and the heat dissipation module is in contact with the heat conduction pieces. The light source heat dissipation structure, the endoscope light source light machine and the endoscope system provided by the application are used for solving the problem that a plurality of light emitting elements are installed on the same heat dissipation module and it is inconvenient to individually adjust the positions of the light emitting elements.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and in particular to a light source heat dissipation structure, an endoscope light source optical mechanism, and an endoscope system. Background Technology

[0002] In addition to white light spectrum, current endoscopic light source optical engines can also output narrowband spectrum. To achieve multiple spectral outputs, it is usually necessary to couple the light from multiple light-emitting elements through an optical system. Multiple light-emitting elements mean multiple heat sources, and the increase in heat sources will inevitably lead to an increase in heat dissipation pressure.

[0003] Currently, for multiple light-emitting elements, a corresponding number of heat dissipation modules are typically designed, with each light-emitting element having its own independent heat dissipation solution. However, when the light source and optical engine are outputting the spectrum normally, the power consumption of each light-emitting element is different. When outputting a narrowband spectrum, some light-emitting elements are not emitting light, so the corresponding heat dissipation modules do not need to work, resulting in a waste of heat dissipation performance. On the other hand, some light-emitting elements require very high power consumption to support narrowband imaging.

[0004] In related technologies, to avoid wasting the heat dissipation performance of the heat dissipation module or insufficient heat dissipation, multiple light-emitting elements are generally installed on the same heat dissipation module. Compared with installing them on separate heat dissipation modules, when one of the light-emitting elements is not working or has low power consumption, the high-power light-emitting elements can share the heat dissipation modules of other paths, which greatly improves the heat dissipation efficiency. However, since the position of each light-emitting element relative to the central axis of the collimating lens group in the mounting plane needs to be adjusted, it is not convenient to adjust the position of each light-emitting element individually if multiple light-emitting elements are installed on the same heat dissipation module. Utility Model Content

[0005] This application provides a light source heat dissipation structure, an endoscope light source optical engine, and an endoscope system to solve the problem that it is inconvenient to adjust the position of each light-emitting element individually when multiple light-emitting elements are installed on the same heat dissipation module.

[0006] In a first aspect, embodiments of this application provide a light source heat dissipation structure for an endoscope light source optical engine. The light source heat dissipation structure includes a main housing and a plurality of heat-conducting components. The heat-conducting components are configured to correspond one-to-one with light-emitting elements and are connected to the corresponding light-emitting elements. The heat-conducting components are connected to the main housing. The light source heat dissipation structure further includes a heat dissipation module, which is connected to the main housing and is in contact with the heat-conducting components.

[0007] The heat dissipation structure for the light source provided in this application embodiment has at least the following beneficial effects:

[0008] Since the heat dissipation structure of the light source includes a main housing and multiple heat-conducting components, the heat-conducting components are used to correspond one-to-one with the light-emitting elements and are used to connect to the corresponding light-emitting elements. The heat-conducting components are connected to the main housing. The heat dissipation structure of the light source also includes a heat dissipation module, which is connected to the main housing and is in contact with the heat-conducting components. Therefore, the heat generated by the light-emitting elements can be conducted to the heat dissipation module through the corresponding heat-conducting components to ensure its heat dissipation effect. Furthermore, the position of each corresponding light-emitting element can be adjusted individually by adjusting the position of the heat-conducting components relative to the main housing before the heat-conducting components are connected to the main housing.

[0009] In some embodiments, the thermal conductive element is located between the heat dissipation module and the main housing, and the thermal conductive element is used to conform to at least a portion of the surface of the heat dissipation module.

[0010] In some embodiments, a thermally conductive material is filled between the thermally conductive element and the heat dissipation module.

[0011] In some embodiments, the heat-conducting element has a boss on the side facing the heat dissipation module, and the boss abuts against the heat dissipation module.

[0012] In some embodiments, the main housing is provided with a plurality of mounting holes, each corresponding to a light-emitting element, and the light-emitting element is located inside the corresponding mounting hole.

[0013] In some embodiments, the main housing is further provided with a threaded hole located on the periphery of the mounting hole, and the axis of the threaded hole is parallel to the axis of the mounting hole. The heat-conducting component is provided with a through hole, the axis of which is parallel to the axis of the mounting hole. The heat dissipation structure of the light source includes a threaded connector, which is inserted into the through hole and the threaded hole to connect the heat-conducting component to the main housing.

[0014] In some embodiments, one mounting hole corresponds to multiple threaded holes, and the threaded holes, the through holes, and the threaded connectors are provided in a one-to-one correspondence.

[0015] In some embodiments, the heat dissipation module includes a thermally conductive substrate and a main body. The thermally conductive substrate is in contact with the thermally conductive component. The main body is provided with a mounting groove, and the thermally conductive substrate is located in the mounting groove. The surface of the main body is provided with heat dissipation protrusions.

[0016] Secondly, embodiments of this application provide an endoscope light source optical mechanism, which includes a light source heat dissipation structure and multiple light-emitting elements as described in the first aspect.

[0017] The endoscopic light source optical mechanism provided in this application embodiment has at least the following beneficial effects:

[0018] Since the heat dissipation structure of the light source includes a main housing and multiple heat-conducting components, the heat-conducting components are used to correspond one-to-one with the light-emitting elements and are used to connect to the corresponding light-emitting elements. The heat-conducting components are connected to the main housing. The heat dissipation structure of the light source also includes a heat dissipation module, which is connected to the main housing and is in contact with the heat-conducting components. Therefore, the heat generated by the light-emitting elements can be conducted to the heat dissipation module through the corresponding heat-conducting components to ensure its heat dissipation effect. Furthermore, the position of each corresponding light-emitting element can be adjusted individually by adjusting the position of the heat-conducting components relative to the main housing before the heat-conducting components are connected to the main housing.

[0019] Thirdly, embodiments of this application provide an endoscope system, the endoscope system including an endoscope and an endoscope light source optical engine as described in the second aspect.

[0020] The endoscope system provided in this application has at least the following beneficial effects:

[0021] Since the heat dissipation structure of the light source includes a main housing and multiple heat-conducting components, the heat-conducting components are used to correspond one-to-one with the light-emitting elements and are used to connect to the corresponding light-emitting elements. The heat-conducting components are connected to the main housing. The heat dissipation structure of the light source also includes a heat dissipation module, which is connected to the main housing and is in contact with the heat-conducting components. Therefore, the heat generated by the light-emitting elements can be conducted to the heat dissipation module through the corresponding heat-conducting components to ensure its heat dissipation effect. Furthermore, the position of each corresponding light-emitting element can be adjusted individually by adjusting the position of the heat-conducting components relative to the main housing before the heat-conducting components are connected to the main housing. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the optical mechanism of the endoscope light source in one embodiment of this application;

[0024] Figure 2 yes Figure 1 A schematic diagram of the optical mechanism of the endoscope light source from another perspective;

[0025] Figure 3 yes Figure 1 The diagram shows the structure of the light-emitting element, heat-conducting component, and heat dissipation module in the optical engine of the endoscope light source.

[0026] Figure 4 yes Figure 1 The diagram shows the structure of the main housing, light-emitting element, and heat-conducting component in the optical engine of the endoscope light source.

[0027] Figure 5 yes Figure 1 The front view of the heat dissipation module in the optical engine of the endoscope light source is shown.

[0028] Figure 6 yes Figure 1 The diagram shows a three-dimensional structural schematic of the heat dissipation module in the optical engine of the endoscope light source.

[0029] The markings in the diagram mean:

[0030] 100. Endoscopic light source optical mechanism;

[0031] 10. Main shell;

[0032] 11. Mounting holes;

[0033] 20. Light-emitting elements;

[0034] 30. Thermal conductive components;

[0035] 31. Boss; 32. Through hole;

[0036] 40. Heat dissipation module;

[0037] 41. Thermally conductive substrate; 42. Main body component; 421. Mounting groove; 422. Heat dissipation protrusion;

[0038] 50. Collimating lens group;

[0039] 60. Two-dimensional mirror group. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0041] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0043] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0044] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0045] In addition to white light spectrum, current endoscopic light source optical engines can also output narrowband spectrum. To achieve multiple spectral outputs, it is usually necessary to couple the light from multiple light-emitting elements through an optical system. Multiple light-emitting elements mean multiple heat sources, and the increase in heat sources will inevitably lead to an increase in heat dissipation pressure.

[0046] Currently, for multiple light-emitting elements (LEDs), a corresponding number of heat dissipation modules are typically designed, with each LED having its own independent heat dissipation solution. However, during normal output spectrum output, the power consumption of each LED varies. When outputting narrowband spectra, some LEDs are not emitting light, so their corresponding heat dissipation modules do not need to operate, resulting in wasted heat dissipation performance. Conversely, some LEDs require high power consumption to support narrowband imaging. Due to space limitations in the endoscope's light source and optical engine, the heat dissipation modules for these high-power LEDs cannot be designed to be too large to dissipate the high heat generated during operation. Failure to dissipate heat in a timely manner leads to heat accumulation in these high-power LEDs, resulting in excessively high junction temperatures. This can cause LED lifespan degradation, color temperature drift, phosphor aging, and even LED burnout. Therefore, as the number of LEDs integrated into the endoscope's light source and optical engine increases, the independent heat dissipation module solution suffers from low heat dissipation efficiency, resulting in wasted heat dissipation performance or insufficient heat dissipation.

[0047] In related technologies, to avoid wasting the heat dissipation performance of the heat dissipation module or insufficient heat dissipation, multiple light-emitting elements are generally installed on the same heat dissipation module. Compared with installing them on separate heat dissipation modules, when one of the light-emitting elements is not working or has low power consumption, the high-power light-emitting elements can share the heat dissipation modules of other paths, which greatly improves the heat dissipation efficiency. However, since the position of each light-emitting element relative to the central axis of the collimating lens group in the mounting plane needs to be adjusted, it is not convenient to adjust the position of each light-emitting element individually if multiple light-emitting elements are installed on the same heat dissipation module.

[0048] In view of this, this application provides a light source heat dissipation structure, an endoscope light source optical engine, and an endoscope system. Since the light source heat dissipation structure includes a main housing and multiple heat-conducting components, the heat-conducting components are used to correspond one-to-one with the light-emitting elements and are used to connect to the corresponding light-emitting elements. The heat-conducting components are connected to the main housing. The light source heat dissipation structure also includes a heat dissipation module, which is connected to the main housing and contacts the heat-conducting components. Therefore, the heat generated by the light-emitting elements can be conducted to the heat dissipation module through the corresponding heat-conducting components to ensure its heat dissipation effect. Furthermore, the position of each corresponding light-emitting element can be adjusted individually by adjusting the position of the heat-conducting components relative to the main housing before connecting the heat-conducting components to the main housing.

[0049] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of the endoscope light source optical engine 100 in one embodiment of this application. Figure 2 yes Figure 1 The diagram shows another view of the structure of the endoscope light source optical engine 100. Figure 3 yes Figure 1 The diagram shows the structure of the light-emitting element 20, the heat-conducting element 30, and the heat dissipation module 40 in the endoscope light source optical engine 100.

[0050] In a first aspect, embodiments of this application provide a light source heat dissipation structure for an endoscope light source optical engine 100. The light source heat dissipation structure includes a main housing 10 and a plurality of heat-conducting components 30. The heat-conducting components 30 are configured to correspond one-to-one with the light-emitting elements 20, and the heat-conducting components 30 are connected to the corresponding light-emitting elements 20. The heat-conducting components 30 are connected to the main housing 10.

[0051] The heat-conducting component 30 can be connected to the main housing 10 by means of screws, bolts, or magnetic connections. In order not to affect the installation and adjustment of each light-emitting element 20 in the mounting plane, that is, usually in order to maximize the light efficiency of the entire endoscope light source optical engine 100, the position of each light-emitting element 20 relative to the central axis of its corresponding collimating lens group 50 in the mounting plane needs to be adjusted. Since the collimating lens group 50 is generally fixedly connected to the main housing 10, it is necessary to adjust the position of the corresponding light-emitting element 20 relative to the main housing 10.

[0052] When fine-tuning the position of the heat-conducting component 30 relative to the main housing 10, since the light-emitting element 20 is connected to the heat-conducting component 30, the position of the corresponding light-emitting element 20 relative to the main housing 10 can be adjusted. The light-emitting element 20 can be an LED (Light Emitting Diode) light-emitting assembly, etc. The heat-conducting component 30 can be made of aluminum alloy or copper alloy with high thermal conductivity, etc.

[0053] Please refer to this as well. Figures 4 to 6 , Figure 4 yes Figure 1 The diagram shows the structure of the main housing 10, the light-emitting element 20, and the heat-conducting component 30 in the endoscope light source optical engine 100. Figure 5 yes Figure 1 The diagram shows the front view of the heat dissipation module 40 in the endoscope light source optical engine 100. Figure 6 yes Figure 1 A three-dimensional structural diagram of the heat dissipation module 40 in the endoscope light source optical engine 100 shown.

[0054] The heat dissipation structure of the light source also includes a heat dissipation module 40, which is connected to the main housing 10 and is in contact with the heat-conducting component 30.

[0055] The heat dissipation module 40 may include a heat sink, a heat spreader, or multiple heat pipe assemblies. The heat dissipation module 40 can be connected to the main housing 10 by means of snap-fit, adhesive, welding, clip-on connection, screw connection, bolt connection, or magnetic connection.

[0056] When assembling the heat dissipation structure of the light source provided in this application embodiment, the light-emitting element 20 can be connected to the corresponding heat-conducting component 30 first. Then, the position of each corresponding light-emitting element 20 can be adjusted individually by adjusting the position of the heat-conducting component 30 relative to the main housing 10 to ensure that its position relative to the central axis of the collimating lens group 50 meets the requirements. After the adjustment is completed, the heat-conducting component 30 is connected to the main housing 10, and then the heat dissipation module 40 is connected to the main housing 10 so that the heat dissipation module 40 and the heat-conducting component 30 are in contact. The heat generated by the light-emitting element 20 can be conducted to the heat dissipation module 40 through the corresponding heat-conducting component 30 and dissipated into the external environment, ensuring its heat dissipation effect and ensuring the stability of the system. Moreover, the position of each light-emitting element 20 relative to the main housing 10 can be adjusted individually, which achieves high heat dissipation efficiency without affecting the assembly and adjustment of the light-emitting element 20.

[0057] As can be seen from the above, the light source heat dissipation structure provided in this application embodiment includes a main housing 10 and multiple heat-conducting components 30. The heat-conducting components 30 are configured to correspond one-to-one with the light-emitting elements 20 and are connected to the corresponding light-emitting elements 20. The heat-conducting components 30 are connected to the main housing 10. The light source heat dissipation structure also includes a heat dissipation module 40, which is connected to the main housing 10 and is in contact with the heat-conducting components 30. Therefore, the heat generated by the light-emitting elements 20 can be conducted to the heat dissipation module 40 through the corresponding heat-conducting components 30, ensuring its heat dissipation effect. Furthermore, the position of each corresponding light-emitting element 20 can be adjusted individually by adjusting the position of the heat-conducting components 30 relative to the main housing 10 before connecting the heat-conducting components 30 to the main housing 10.

[0058] In this embodiment, the heat-conducting element 30 is located between the heat dissipation module 40 and the main housing 10, and the heat-conducting element 30 is used to fit against a portion of the surface of the heat dissipation module 40.

[0059] By adopting the above scheme, it is easy to set the position of the heat-conducting component 30, and the heat-conducting area of ​​the heat-conducting component 30 and the heat dissipation module 40 can be larger.

[0060] Optionally, a thermally conductive material is filled between the thermally conductive element 30 and the heat dissipation module 40.

[0061] This design avoids the situation where the surfaces of the heat dissipation module 40 are not on the same plane due to manufacturing and installation errors, which would prevent all the heat-conducting components 30 from being in contact with the surface of the heat dissipation module 40, and improves the heat transfer efficiency.

[0062] For example, the thermally conductive material can be a thermal pad, thermal grease, or thermal gel.

[0063] As another possible implementation, the heat-conducting component 30 is provided with a boss 31 on the side facing the heat dissipation module 40, and the boss 31 abuts against the heat dissipation module 40.

[0064] This design avoids the situation where the surfaces of the heat dissipation module 40 are not on the same plane due to manufacturing and installation errors, which would prevent all the heat-conducting components 30 from adhering to the surface of the heat dissipation module 40.

[0065] It should be noted that when the heat-conducting component 30 cannot be attached to the surface of the heat dissipation module 40, there is an air gap between the heat-conducting component 30 and the heat dissipation module 40. Since air is a poor conductor of heat, the heat of the light-emitting element 20 corresponding to the heat-conducting component 30 cannot be transferred to the heat dissipation module 40 in time and dissipated to the outside.

[0066] It is understandable that thermally conductive material can also be placed between the boss 31 and the heat dissipation module 40.

[0067] In order to improve heat transfer efficiency, a heat-conducting material can also be placed between the light-emitting element 20 and the mounting plate.

[0068] Please refer to Figures 1 to 6 In this embodiment, the main housing 10 is provided with a plurality of mounting holes 11, and the mounting holes 11 are provided one-to-one with the light-emitting elements 20, with the light-emitting elements 20 located inside the corresponding mounting holes 11.

[0069] By adopting the above solution, the position of the light-emitting element 20 can be better restricted, and the light-emitting element 20 can be protected by placing it inside the corresponding mounting hole 11.

[0070] It should be noted that a collimating lens group 50 corresponding to the light-emitting element 20 can also be set in the mounting hole 11. When adjusting the position of the light-emitting element 20 relative to the main housing 10, it is equivalent to adjusting the relative position of the light-emitting element 20 and the collimating lens group 50.

[0071] The main housing 10 is also provided with a threaded hole, which is located on the periphery of the mounting hole 11 and the axis of the threaded hole is parallel to the axis of the mounting hole 11. The heat-conducting component 30 is provided with a through hole 32, the axis of which is parallel to the axis of the mounting hole 11. The heat dissipation structure of the light source includes a threaded connector, which is inserted into the through hole 32 and the threaded hole to connect the heat-conducting component 30 to the main housing 10.

[0072] With this configuration, when assembling the heat dissipation structure of the light source provided in this application embodiment, the light-emitting element 20 can be connected to the corresponding heat-conducting component 30 first, and then the position of each corresponding light-emitting element 20 can be adjusted individually by adjusting the position of the heat-conducting component 30 relative to the main housing 10. After the adjustment is completed, the threaded connector is inserted into the through hole 32 and the threaded hole to connect the heat-conducting component 30 to the main housing 10. Then, the heat dissipation module 40 is connected to the main housing 10 so that the heat dissipation module 40 contacts the heat-conducting component 30.

[0073] It is understandable that, since the fitting accuracy between the threaded connector and the threaded hole is not as high as that between the locating pin hole and the locating pin, even after fine-tuning the position of the heat-conducting component 30 relative to the main housing 10, the threaded connector can still be fitted into the through hole 32 and the threaded hole.

[0074] For example, threaded connections can be screws, etc.

[0075] Optionally, one mounting hole 11 corresponds to multiple threaded holes, and the threaded holes, through holes 32 and threaded connectors are set in a one-to-one correspondence.

[0076] This configuration allows the heat-conducting component 30 to be tightly connected to the main housing 10.

[0077] Please refer to Figures 1 to 6 In this embodiment, the heat dissipation module 40 includes a heat-conducting substrate 41 and a main body 42. The heat-conducting substrate 41 is in contact with the heat-conducting component 30. The main body 42 is provided with a mounting groove 421. The heat-conducting substrate 41 is located in the mounting groove 421. The surface of the main body 42 is provided with heat dissipation protrusions 422.

[0078] By adopting the above solution, the material of the heat-conducting substrate 41 can be set to a material with high thermal conductivity, so that the heat from different heat-conducting components 30 can be quickly conducted to different parts of the heat-conducting substrate 41. It can also set the heat dissipation protrusion 422 on the main body component 42, which is easy to process, since it is not convenient to process the heat dissipation protrusion 422 on the heat-conducting substrate 41.

[0079] For example, the heat-conducting substrate 41 and the main body 42 can be welded together to ensure efficient heat transfer from the heat-conducting substrate 41 to the main body 42. The heat-conducting substrate 41 can be a heat spreader or formed by flattening multiple heat pipe assemblies, and its thermal conductivity is generally 5000W / (mK)-10000W / (mK), which is much greater than the thermal conductivity of pure aluminum (217W / (mK) or 401W / (mK), allowing for rapid heat dissipation. The main body 42 can be made of aluminum alloy or copper alloy, and the heat dissipation protrusions 422 can be configured as flat fins, or they can be processed into a needle-like arrangement as needed.

[0080] In the light source heat dissipation structure provided in this application embodiment, multiple light-emitting elements 20 are dissipated through the same heat dissipation module 40. Compared with installing them on corresponding individual heat sinks, when one of the light-emitting elements 20 is not working or has low power consumption, the high-power light-emitting elements 20 can share the heat dissipation module 40 of other paths, which greatly improves the heat dissipation efficiency. At the same time, the thermally conductive substrate 41 can improve the thermal conductivity of heat in the long side direction of the thermally conductive substrate 41. It has the characteristics of high thermal conductivity and low diffusion thermal resistance. Even if there are multiple heat sources that are far apart on the thermally conductive substrate 41, the thermally conductive substrate 41 made of heat spread plate can quickly diffuse heat to the entire thermally conductive substrate 41, which improves the heat dissipation efficiency.

[0081] Secondly, embodiments of this application provide an endoscope light source optical engine 100, which includes a light source heat dissipation structure as described in the first aspect and a plurality of light-emitting elements 20.

[0082] The endoscope light source optical engine 100 provided in this application embodiment has a heat dissipation structure including a main housing 10 and multiple heat-conducting components 30. The heat-conducting components 30 are configured to correspond one-to-one with the light-emitting elements 20 and are connected to the corresponding light-emitting elements 20. The heat-conducting components 30 are connected to the main housing 10. The heat dissipation structure also includes a heat dissipation module 40, which is connected to the main housing 10 and is in contact with the heat-conducting components 30. Therefore, the heat generated by the light-emitting elements 20 can be conducted to the heat dissipation module 40 through the corresponding heat-conducting components 30, ensuring its heat dissipation effect. Furthermore, the position of each corresponding light-emitting element 20 can be adjusted individually by adjusting the position of the heat-conducting components 30 relative to the main housing 10 before connecting the heat-conducting components 30 to the main housing 10.

[0083] The endoscope light source optical engine 100 provided in this embodiment may further include a collimating lens group 50 and a dichroic lens group 60. The collimating lens group 50 is set inside the mounting hole 11 and the light-emitting elements 20 correspond one-to-one, so as to realize the precise positioning of the collimating lens group 50 in the main housing of the optical engine. The dichroic lens group 60 is set inside the main housing 10 and the light-emitting elements 20 correspond one-to-one. The dichroic lens group 60 may be a dichroic mirror. The dichroic mirror may be installed in the corresponding connecting groove at the bottom of the main housing 10, and the corresponding mounting hole 11 or connecting groove has an adjustment gap to facilitate the adjustment of the light path during installation in order to achieve the best light effect.

[0084] Thirdly, embodiments of this application provide an endoscope system, which includes an endoscope and an endoscope light source optical engine 100 as described in the second aspect.

[0085] The endoscope system provided in this application embodiment includes a main housing 10 and multiple heat-conducting components 30 in its light source heat dissipation structure. The heat-conducting components 30 are configured to correspond one-to-one with the light-emitting elements 20 and are connected to the corresponding light-emitting elements 20. The heat-conducting components 30 are connected to the main housing 10. The light source heat dissipation structure also includes a heat dissipation module 40, which is connected to the main housing 10 and contacts the heat-conducting components 30. Therefore, the heat generated by the light-emitting elements 20 can be conducted to the heat dissipation module 40 through the corresponding heat-conducting components 30, ensuring its heat dissipation effect. Furthermore, the position of each corresponding light-emitting element 20 can be adjusted individually by adjusting the position of the heat-conducting components 30 relative to the main housing 10 before connecting the heat-conducting components 30 to the main housing 10.

[0086] The endoscope provided in this application embodiment may also include an image processing device and a display, wherein the endoscope light source optical engine 100 and the display may be set separately or integrated, which will not be described in detail here.

[0087] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heat dissipation structure for a light source, characterized in that, For an endoscope light source optical engine (100), the light source heat dissipation structure includes a main housing (10) and a plurality of heat-conducting components (30). The heat-conducting components (30) are configured to correspond one-to-one with the light-emitting elements (20), and the heat-conducting components (30) are connected to the corresponding light-emitting elements (20). The heat-conducting components (30) are connected to the main housing (10). The light source heat dissipation structure also includes a heat dissipation module (40), which is connected to the main housing (10) and is in contact with the heat-conducting components (30).

2. The heat dissipation structure for the light source according to claim 1, characterized in that, The heat-conducting element (30) is located between the heat dissipation module (40) and the main housing (10), and the heat-conducting element (30) is used to be in contact with at least a portion of the surface of the heat dissipation module (40).

3. The heat dissipation structure for the light source according to claim 2, characterized in that, The space between the heat-conducting component (30) and the heat dissipation module (40) is filled with a heat-conducting material.

4. The heat dissipation structure for the light source according to claim 2, characterized in that, The heat-conducting component (30) has a boss (31) on the side facing the heat dissipation module (40), and the boss (31) abuts against the heat dissipation module (40).

5. The heat dissipation structure for the light source according to claim 2, characterized in that, The main housing (10) is provided with a plurality of mounting holes (11), and the mounting holes (11) are provided one-to-one with the light-emitting elements (20), and the light-emitting elements (20) are located inside the corresponding mounting holes (11).

6. The heat dissipation structure for the light source according to claim 5, characterized in that, The main housing (10) is also provided with a threaded hole, which is located on the periphery of the mounting hole (11), and the axis of the threaded hole is parallel to the axis of the mounting hole (11). The heat-conducting component (30) is provided with a through hole (32), the axis of the through hole (32) is parallel to the axis of the mounting hole (11). The heat dissipation structure of the light source includes a threaded connector, which is inserted into the through hole (32) and the threaded hole to connect the heat-conducting component (30) to the main housing (10).

7. The heat dissipation structure for the light source according to claim 6, characterized in that, One mounting hole (11) corresponds to multiple threaded holes, and the threaded holes, the through holes (32) and the threaded connectors are provided in a one-to-one correspondence.

8. The heat dissipation structure for the light source according to any one of claims 1 to 7, characterized in that, The heat dissipation module (40) includes a heat-conducting substrate (41) and a main body (42). The heat-conducting substrate (41) is in contact with the heat-conducting component (30). The main body (42) is provided with a mounting groove (421). The heat-conducting substrate (41) is located in the mounting groove (421). The surface of the main body (42) is provided with heat dissipation protrusions (422).

9. An endoscopic light source optical mechanism, characterized in that, The endoscope light source optical engine (100) includes a light source heat dissipation structure as described in any one of claims 1 to 8 and a plurality of light-emitting elements (20).

10. An endoscope system, characterized in that, The endoscope system includes an endoscope and an endoscope light source optical engine (100) as described in claim 9.

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