A floating transfer station device for wafer polishing equipment
Patent Information
- Application Number
- CN202522668963.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-17
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2035-12-17
AI Technical Summary
[0004]本实用新型就是为了解决上述技术问题,而提供了一种用于晶圆抛光设备的浮动中转站装置,它实现了在晶圆抛光中转的过程中,抛光头与中转站的柔性接触,解决了现有设备成本偏高、晶圆容易破损的技术问题
本实用新型提供了一种用于晶圆抛光设备的浮动中转站装置,它实现了在晶圆抛光中转的过程中,抛光头与中转站的柔性接触,解决了现有设备成本偏高、晶圆容易破损的技术问题,其结构简单,可靠性高,提高了设备的稳定性和加工效率,降低了设备成本和晶圆破损的概率。
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Figure CN224751000U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a floating transfer station device for wafer polishing equipment. It belongs to the field of wafer polishing machine technology and is applicable to the photovoltaic and semiconductor industries. Background Technology
[0002] Chemical mechanical polishing (CMP) of wafers is one of the core processes in chip manufacturing. Essentially, it combines chemical etching with mechanical abrasion to remove material and achieve an ultra-smooth, damage-free surface through "global planarization." The equipment typically consists of multiple stations, including rough polishing, semi-fine polishing, and fine polishing. Each station is equipped with a polishing head and a polishing disc. The rotation of the polishing disc and the pressure applied to the wafer by the polishing head, along with the addition of a chemical polishing slurry, achieve micro-removal of material from the wafer surface. A wafer transfer station is located between every two stations. After polishing at one station, the wafer is picked up by the polishing head and sent to the transfer station. After cleaning and purging, the wafer is picked up by the polishing head at the next station for the next stage of polishing.
[0003] If the transfer station is fixed in position, extremely high machining and assembly precision is required to ensure that the center of the polishing head perfectly aligns with the transfer station's axis, significantly increasing the equipment's manufacturing cost. In fact, perfect alignment is difficult to achieve; even small errors can cause slight impacts and vibrations between the polishing head and the transfer station, easily leading to wafer breakage. Therefore, there is an urgent need for flexible contact between the polishing head and the transfer station, becoming a critical technical problem that those skilled in the art must solve. Summary of the Invention
[0004] The present invention aims to solve the above-mentioned technical problems by providing a floating transfer station device for wafer polishing equipment. It realizes flexible contact between the polishing head and the transfer station during the wafer polishing transfer process, thus solving the technical problems of high cost and easy damage to wafers in existing equipment.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A floating transfer station device for wafer polishing equipment has the following structure: a tray assembly for wafer transfer is fixed on an upper mounting plate; the upper mounting plate and an intermediate mounting plate are slidably connected by an upper linear guide slider assembly; the intermediate mounting plate and a lower mounting plate are slidably connected by a lower linear guide slider assembly; the lower linear guide slider assembly has the same structure as the upper linear guide slider assembly, but their installation directions are opposite and they are perpendicular to each other; the intermediate mounting plate is connected to the upper mounting plate by an upper spring assembly, and the intermediate mounting plate is connected to the lower mounting plate by a lower spring assembly; the upper spring assembly and the lower spring assembly have opposite installation directions and are perpendicular to each other.
[0006] Preferably, the upper and lower spring groups have the same structure, consisting of two springs arranged in a V-shape.
[0007] Preferably, the intermediate mounting plate is connected to the upper mounting plate via an upper spring assembly, the specific structure of which is as follows: one end of the upper spring assembly is hung on the upper shoulder screw assembly, the upper shoulder screw assembly is installed on the upper mounting plate, and the other end of the upper spring assembly is hung on the upper bracket; the upper bracket is installed on the upper screw, the thread on the upper screw engages with the thread at the center of the upper knob, and together they are installed in the slot hole opened on the intermediate mounting plate.
[0008] Preferably, the upper rack has a fork-shaped structure.
[0009] Preferably, the aforementioned upper shoulder screw assembly is mounted on the side wall of the upper mounting plate.
[0010] Preferably, the intermediate mounting plate is connected to the lower mounting plate via a lower spring assembly, the specific structure of which is as follows: one end of the lower spring assembly is hung on the lower shoulder screw assembly, the lower shoulder screw assembly is installed on the lower mounting plate, and the other end of the lower spring assembly is hung on the lower bracket; the lower bracket is installed on the lower screw, the thread on the lower screw engages with the thread at the center of the lower knob, and together they are installed in the slot hole opened on the intermediate mounting plate.
[0011] Preferably, the lower hanging rack has a fork-shaped structure.
[0012] Preferably, the aforementioned lower shoulder screw assembly is mounted on the side wall of the lower mounting plate.
[0013] By adopting the above technical solution, this utility model has the following beneficial effects: This invention provides a floating transfer station device for wafer polishing equipment. It achieves flexible contact between the polishing head and the transfer station during the wafer polishing transfer process, solving the technical problems of high cost and easy wafer breakage of existing equipment. Its structure is simple, highly reliable, improves the stability and processing efficiency of the equipment, and reduces the equipment cost and the probability of wafer breakage. Attached Figure Description
[0014] Figure 1 This is an isometric view of the present invention.
[0015] Figure 2 This is a front view structural diagram of the parts between the upper and lower mounting plates of this utility model.
[0016] Figure 3 This is a right-side structural schematic diagram of the parts between the upper and lower mounting plates of this utility model.
[0017] The components are: 1. Tray assembly; 2. Upper mounting plate; 3. Middle mounting plate; 4. Lower mounting plate; 5. Upper linear guide slider assembly; 6. Lower linear guide slider assembly; 7. Upper spring assembly; 8. Upper bracket; 9. Upper screw; 10. Upper knob; 11. Upper shoulder screw assembly; 12. Lower spring assembly; 13. Lower bracket; 14. Lower screw; 15. Lower knob; 16. Lower shoulder screw assembly. Detailed Implementation
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] like Figure 1 As shown, this utility model is a floating transfer station device for wafer polishing equipment, with the following structure: a tray assembly 1 for wafer transfer is fixed on an upper mounting plate 2; the upper mounting plate 2 and the middle mounting plate 3 are slidably connected by an upper linear guide slider assembly 5, allowing the upper mounting plate 2 and the middle mounting plate 3 to slide relative to each other along the guide rail direction; the middle mounting plate 3 and the lower mounting plate 4 are slidably connected by a lower linear guide slider assembly 6, allowing the middle mounting plate 3 and the lower mounting plate 4 to slide relative to each other along the guide rail direction; the upper linear guide slider assembly 5 and the lower linear guide slider assembly 6 have the same structure, and the lower linear guide slider assembly 5... The guide rail slider group 6 is installed in the opposite direction to the upper linear guide rail slider group 5. The lower linear guide rail slider group 6 is inverted and is installed perpendicular to the upper linear guide rail slider group 5 at 90°. The intermediate mounting plate 3 is connected to the upper mounting plate 2 through the upper spring group 7, and the intermediate mounting plate 3 is connected to the lower mounting plate 4 through the lower spring group 12. The upper spring group 7 and the lower spring group 12 have the same structure, consisting of two springs arranged in a V-shape to achieve reset in two directions. The upper spring group 7 and the lower spring group 12 are installed in the opposite direction and are perpendicular to each other at 90°.
[0020] like Figure 2 As shown, the intermediate mounting plate 3 is connected to the upper mounting plate 2 via the upper spring assembly 7. Its specific structure is as follows: one end of the upper spring assembly 7 is hung on the upper shoulder screw assembly 11, which is installed on the side wall of the upper mounting plate 2. The other end of the upper spring assembly 7 is hung on the fork-shaped upper bracket 8. The upper bracket 8 is installed on the upper screw 9, and the thread on the upper screw 9 engages with the thread in the center of the upper knob 10. They are installed together in the slot on the intermediate mounting plate 3.
[0021] like Figure 3As shown, the intermediate mounting plate 3 is connected to the lower mounting plate 4 via the lower spring assembly 12. Its specific structure is as follows: one end of the lower spring assembly 12 is hung on the lower shoulder screw assembly 16, which is installed on the side wall of the lower mounting plate 4. The other end of the lower spring assembly 12 is hung on the fork-shaped lower bracket 13. The lower bracket 13 is installed on the lower screw 14, and the thread on the lower screw 14 engages with the thread at the center of the lower knob 15. They are installed together in the slot on the intermediate mounting plate 3.
[0022] The working principle of this utility model: Because the upper linear guide slider group 5 and the lower linear guide slider group 6 are installed perpendicular to each other, the pallet assembly 1 gains two degrees of freedom in the plane; the lower mounting plate 4 is fixed to the base of the equipment, thus enabling the pallet assembly 1 to float in any direction relative to the equipment in the plane.
[0023] It should be noted that the upper linear guide slider group 5 and the lower linear guide slider group 6 are not preloaded, and only a small axial force is required for them to slide. When the tray assembly 1 floats, it stretches the upper spring group 7 and the lower spring group 12, which are arranged in a V-shape in the corresponding direction, and the spring force can make it automatically return to its original position.
[0024] After the equipment is assembled, the tray assembly 1 needs to be fine-tuned to align it as closely as possible with the polishing head. Taking the adjustment of the upper linear guide slider assembly 5 as an example... Figure 2 As shown, when the upper knob 10 is rotated, the engagement of the threads causes the upper screw 9 to move axially, thereby moving the upper bracket 8. This stretches one of the springs in the upper spring assembly 7, causing the upper linear guide slider assembly 5 to move until the two springs are balanced, thus shifting the initial position of the tray assembly 1 in one direction; similarly... Figure 3 As shown, rotating the lower knob 15 can shift the initial position of the tray assembly 1 in another direction.
[0025] This invention achieves flexible contact between the polishing head and the transfer station during wafer polishing, solving technical problems such as high cost and easy wafer breakage in existing equipment. Its simple structure and high reliability improve equipment stability and processing efficiency.
Claims
1. A floating transfer station device for wafer polishing equipment, characterized in that... The structure is as follows: The tray assembly (1) for wafer transfer is fixed on the upper mounting plate (2). The upper mounting plate (2) and the middle mounting plate (3) are slidably connected by the upper linear guide slider group (5). The middle mounting plate (3) and the lower mounting plate (4) are slidably connected by the lower linear guide slider group (6). The lower linear guide slider group (6) and the upper linear guide slider group (5) have the same structure, opposite installation directions and are perpendicular to each other. The middle mounting plate (3) is connected to the upper mounting plate (2) through the upper spring group (7). The middle mounting plate (3) is connected to the lower mounting plate (4) through the lower spring group (12). The upper spring group (7) and the lower spring group (12) have opposite installation directions and are perpendicular to each other.
2. The floating transfer station device for wafer polishing equipment according to claim 1, characterized in that... The upper spring assembly (7) and the lower spring assembly (12) have the same structure, consisting of two springs arranged in a V-shape.
3. A floating transfer station device for wafer polishing equipment according to claim 1, characterized in that... The intermediate mounting plate (3) is connected to the upper mounting plate (2) through the upper spring assembly (7). Its specific structure is as follows: one end of the upper spring assembly (7) is hung on the upper shoulder screw assembly (11), the upper shoulder screw assembly (11) is installed on the upper mounting plate (2), and the other end of the upper spring assembly (7) is hung on the upper bracket (8); the upper bracket (8) is installed on the upper screw (9), the thread on the upper screw (9) meshes with the thread in the center of the upper knob (10), and they are installed together in the slot on the intermediate mounting plate (3).
4. A floating transfer station device for wafer polishing equipment according to claim 3, characterized in that... The upper hanging rack (8) is a fork-shaped structure.
5. A floating transfer station device for wafer polishing equipment according to claim 3, characterized in that... The upper shoulder screw assembly is installed on the side wall of the upper mounting plate (2).
6. A floating transfer station device for wafer polishing equipment according to claim 1, characterized in that... The intermediate mounting plate (3) is connected to the lower mounting plate (4) through the lower spring assembly (12). Its specific structure is as follows: one end of the lower spring assembly (12) is hung on the lower shoulder screw assembly (16), the lower shoulder screw assembly (16) is installed on the lower mounting plate (4), and the other end of the lower spring assembly (12) is hung on the lower bracket (13); the lower bracket (13) is installed on the lower screw (14), the thread on the lower screw (14) meshes with the thread in the center of the lower knob (15), and they are installed together in the slot on the intermediate mounting plate (3).
7. A floating transfer station device for wafer polishing equipment according to claim 6, characterized in that... The lower hanging rack (13) is a fork-shaped structure.
8. A floating transfer station device for wafer polishing equipment according to claim 6, characterized in that... The lower shoulder screw assembly (16) is mounted on the side wall of the lower mounting plate (4).