Power module, electronic device, and vehicle

Abstract

The present disclosure relates to a power module, an electronic device and a vehicle, the power module comprising: a heat dissipation substrate, the heat dissipation substrate being internally provided with a cooling channel, and a cooling fluid being introduced into the cooling channel; a plurality of switching chips, the plurality of switching chips being arranged on the heat dissipation substrate, and the plurality of switching chips being distributed along a flow direction of the cooling fluid in the cooling channel; wherein a threshold voltage of at least one switching chip located on an upstream side of the flow direction is higher than a threshold voltage of at least one switching chip located on a downstream side of the flow direction. Thus, the power device of the present disclosure arranges switching chips with different threshold voltages at different positions of the heat dissipation substrate according to the flow characteristics of the cooling fluid in the cooling channel and the electrical characteristics of the switching chips themselves, effectively resolving the overheating problem of the switching chips in the power module caused by uneven current distribution, and improving the reliability and output capacity of the power module.

Description

Technical Field

[0001] This disclosure relates to the field of power module technology, and more particularly to a power module, electronic device, and vehicle. Background Technology

[0002] Due to inherent variations in semiconductor manufacturing processes, differences in threshold voltages between different switching chips are unavoidable. Directly connecting these switching chips in parallel can lead to uneven current distribution, causing some chips to overheat due to excessive current flow, thus affecting the reliability and output capability of the power module. Utility Model Content

[0003] This disclosure provides a power module, electronic device, and vehicle. The power device of this disclosure, based on the flow characteristics of the cooling fluid within the cooling channel and the electrical characteristics of the switching chip itself, places switching chips with different threshold voltages at different positions on the heat dissipation substrate. This effectively resolves the overheating problem caused by uneven current distribution in the switching chips of the power module, improving the reliability and output capability of the power module. The technical solution of this disclosure is as follows:

[0004] The first aspect of this disclosure provides a power module, comprising:

[0005] A heat dissipation substrate, wherein a cooling channel is provided inside the heat dissipation substrate and a cooling fluid is introduced into the cooling channel;

[0006] Multiple switching chips are disposed on the heat dissipation substrate and distributed along the flow direction of the cooling fluid in the cooling channel;

[0007] Among the plurality of switching chips, at least one of the switching chips located upstream of the flow direction has a threshold voltage higher than at least one of the switching chips located downstream of the flow direction.

[0008] A second aspect of this disclosure provides an electronic device comprising: a power module as described in the first aspect.

[0009] A third aspect of this disclosure provides a vehicle comprising: a power module as described in the first aspect.

[0010] The technical solutions provided by the embodiments of this disclosure have at least the following beneficial effects:

[0011] This disclosure discloses a power module, electronic device, and vehicle. The power module includes: a heat dissipation substrate with a cooling channel inside, through which a cooling fluid flows; and a plurality of switching chips disposed on the heat dissipation substrate, distributed along the flow direction of the cooling fluid within the cooling channel. At least one of the switching chips located upstream in the flow direction has a threshold voltage higher than at least one of the switching chips located downstream in the flow direction. Therefore, this power device, based on the flow characteristics of the cooling fluid within the cooling channel and the electrical characteristics of the switching chips themselves, places switching chips with different threshold voltages at different positions on the heat dissipation substrate, effectively mitigating the overheating problem caused by uneven current distribution in the switching chips within the power module, and improving the reliability and output capability of the power module.

[0012] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0013] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure, and are not intended to unduly limit this disclosure.

[0014] Figure 1 This is a top view of a power module according to an embodiment of this disclosure;

[0015] Figure 2 This is a side view of a power module according to an embodiment of the present disclosure;

[0016] Figure 3 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure;

[0017] Figure 4 This is a schematic diagram of the structure of a vehicle according to an embodiment of the present disclosure. Detailed Implementation

[0018] To enable those skilled in the art to better understand the technical solutions of this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings.

[0019] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0020] The power module, electronic device, and vehicle according to embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0021] Figure 1 This is a top view of a power module according to an embodiment of the present disclosure.

[0022] like Figure 1 As shown, the power module 100 of this embodiment includes a heat dissipation substrate 110 and a plurality of switching chips 120.

[0023] The heat dissipation substrate 110 has a cooling channel inside, through which cooling fluid flows; multiple switch chips 120 are disposed on the heat dissipation substrate 110, and the multiple switch chips 120 are distributed along the flow direction of the cooling fluid in the cooling channel (flow from the inlet to the outlet); wherein, at least one of the multiple switch chips 120 located upstream of the flow direction has a threshold voltage higher than at least one of the switch chips located downstream of the flow direction.

[0024] For example, a power module 100 comprising three switching chips (a first switching chip PM1, a second switching chip PM2, and a third switching chip PM3) will be described. The threshold voltage of the first switching chip PM1 is Vth1, the threshold voltage of the second switching chip PM2 is Vth2, and the threshold voltage of the third switching chip PM3 is Vth3, satisfying Vth1 > Vth2 > Vth3.

[0025] This disclosure arranges switching chips with different threshold voltages based on the flow direction of the cooling fluid (such as water, ethylene glycol solution, etc., which have good thermal conductivity and can efficiently remove the heat generated by the power module 100) within the cooling channel. Furthermore, based on the position of the switching chips in the cooling fluid flow direction, the cooling channel is divided into an upstream side and a downstream side. In the power module 100 of this disclosure, the cooling fluid flows from the inlet to the outlet, i.e., from left to right.

[0026] The first switching chip PM1 (threshold voltage Vth1), which has the highest threshold voltage, is placed at the upstream water inlet, i.e., on the left. During the operation of the power module 100, the on-resistance of the switching chip is positively correlated with the threshold voltage; that is, the higher the threshold voltage, the greater the on-resistance and the greater the conduction loss. The cooling fluid at the water inlet is at a lower temperature, which can effectively remove the heat generated by the high on-resistance of the first switching chip PM1, thereby effectively avoiding the problem of excessive conduction loss caused by its highest on-resistance. This ensures that the first switching chip PM1 operates within a safe and stable temperature range, extending its service life.

[0027] The second switch chip PM2 (with a threshold voltage of Vth2) with a middle threshold voltage is placed between the inlet and outlet. This arrangement allows the second switch chip PM2 to benefit from the initial cooling of the relatively low-temperature cooling fluid at the inlet, and to maintain a suitable operating temperature during the further flow of the cooling fluid by means of the heat dissipation substrate 110 and the surrounding environment, thus ensuring stable performance.

[0028] The third switch chip PM3 (threshold voltage Vth3), which has the lowest threshold voltage, is placed at the downstream outlet, i.e., on the right side. Because the third switch chip PM3 has the lowest threshold voltage, its on-resistance is also the lowest, resulting in minimal conduction loss. Although the cooling fluid temperature at the outlet is relatively high, the third switch chip PM3 itself generates less heat, ensuring it remains within a reasonable operating temperature range at this location.

[0029] Therefore, the power device disclosed herein, based on the flow characteristics of the cooling fluid in the cooling channel and the electrical characteristics of the switching chip itself, places switching chips with different threshold voltages at different positions on the heat dissipation substrate, effectively resolving the overheating problem caused by uneven current distribution of the switching chips in the power module, and improving the reliability and output capability of the power module.

[0030] In the heat dissipation design of the power module 100, the heat dissipation substrate 110 plays an important role. It is equipped with multiple heat dissipation units 130, each corresponding to one of the multiple switching chips 120. These heat dissipation units 130 are located on the side away from the contact surface between the heat dissipation substrate 110 and the switching chips 120. For example... Figure 2 As shown, multiple heat dissipation units 130 are used to cool the corresponding switching chips in a targeted manner to ensure that the switching chips can work stably in a suitable temperature environment.

[0031] like Figure 2 As shown, each heat dissipation unit 130 includes a plurality of heat dissipation pins, wherein the heat dissipation pin density of at least one of the plurality of switch chips 120 located on the upstream side of the heat dissipation unit 130 is higher than the heat dissipation pin density of at least one of the switch chips located on the downstream side of the heat dissipation unit 130.

[0032] The following explanation will continue using the power module 100, which contains three switching chips (the first switching chip PM1, the second switching chip PM2, and the third switching chip PM3), as an example.

[0033] The first switch chip PM1 is located at the water inlet and will be the first to come into contact with the cooler cooling fluid. At this time, the cooling fluid has a strong heat dissipation capacity and can efficiently remove heat. The third switch chip PM3 is located at the water outlet. The cooling fluid that the third switch chip PM3 comes into contact with has already absorbed some heat when it flows through the first switch chip PM1 at the water inlet and the second switch chip PM2 in the middle, and its temperature has increased, so its heat dissipation capacity is relatively weakened. The second switch chip PM2 is in the middle position, and its heat dissipation conditions are between those of the first switch chip PM1 and the third switch chip PM3.

[0034] Based on the differences in heat dissipation conditions of the switch chips at different positions, this disclosure provides a targeted design for the heat dissipation pin density of the heat dissipation unit 130.

[0035] The heat dissipation unit 130 corresponding to the first switch chip PM1 located at the upstream water inlet has its heat dissipation pin density set to the highest level. The high density of heat dissipation pins can increase the contact area with the cooling fluid, and when the cooling fluid temperature is low and the heat dissipation capacity is strong, it can play a more effective role in heat dissipation, quickly conduct away the heat generated by the first switch chip PM1, and prevent it from being affected by excessive temperature or even damaged.

[0036] The third switch chip PM3 is located at the downstream outlet, and the density of the heat dissipation pins in its corresponding heat dissipation unit 130 is set to the minimum. Since the cooling fluid temperature is high at this point and its heat dissipation capacity is limited, even a low density of heat dissipation pins can still meet the heat dissipation requirements of the third switch chip PM3 to a certain extent. Furthermore, a lower density of heat dissipation pins can reduce the manufacturing cost and weight of the heat dissipation structure, while also reducing the resistance encountered by the cooling fluid during flow, preventing excessive resistance from slowing down the cooling fluid flow rate and thus affecting the overall heat dissipation efficiency of the power module.

[0037] The second switch chip PM2 is positioned in the middle, and the density of the heat dissipation pins in its corresponding heat dissipation unit 130 is between that of the first switch chip PM1 and the third switch chip PM3. This design takes into account that the temperature of the cooling fluid increases and the heat dissipation capacity decreases when flowing through the second switch chip PM2, requiring an appropriate increase in the density of heat dissipation pins to enhance the heat dissipation effect; while avoiding the use of excessively high heat dissipation pin density as in the first switch chip PM1, thus finding a suitable balance between cost, weight, and heat dissipation efficiency.

[0038] Therefore, the power device disclosed herein, by rationally setting the density of heat dissipation pins of the corresponding heat dissipation unit according to the position of the switching chip in the direction of cooling fluid flow, can effectively improve the heat dissipation efficiency of the power module, ensure that the three switching chips PM1, PM2 and PM3 can work stably in a suitable temperature environment, extend the service life of the power module, and improve the overall performance and reliability of the power module.

[0039] In one embodiment of this disclosure, the distribution of heat dissipation pins in each heat dissipation unit 130 can be selected in several ways. For example, they can be distributed in a regular array; or they can be distributed with a gradually varying density along the flow direction; or they can be distributed radially with the corresponding switch chip as the center.

[0040] It should be noted that the specific distribution of the heat dissipation pins in the heat dissipation unit 130 can be set according to actual needs. In addition to the methods listed here, there can be other distribution methods, which will not be illustrated here.

[0041] In one embodiment of this disclosure, the material of the heat dissipation pin can also be selected from a variety of options. For example, pure copper or copper alloy; for example, pure aluminum or aluminum alloy; for example, nickel-plated copper or silver-plated copper; and for example, copper or aluminum metal-based composite materials.

[0042] It should be noted that the material of the heat dissipation pin can be selected according to actual needs. In addition to the types listed here, other materials can also be used, which will not be listed here.

[0043] In one embodiment of this disclosure, to ensure the voltage connection stability and efficient thermal conductivity of the power device, such as Figure 2 As shown, multiple switch chips 120 are soldered to corresponding soldering positions 140 on the heat dissipation substrate 110 using solder.

[0044] In one embodiment of this disclosure, in order to improve the heat dissipation efficiency of power devices and enable the cooling fluid to exchange heat more fully with the heat-generating area, the distribution of cooling channels includes at least one of the following:

[0045] The curved distribution allows the cooling fluid to form a more complex flow path within the channel, increasing the contact time and area with the heat dissipation structure.

[0046] The linear distribution ensures that the cooling fluid flows through the heat dissipation area in a more direct and rapid manner, reducing flow resistance.

[0047] In one embodiment of this disclosure, to ensure the electrical insulation and efficient thermal conductivity of the power device 100, an insulating and thermally conductive layer (not shown in the figure) is added to the power device 100. This insulating and thermally conductive layer is made of thermally conductive gel, which has a high thermal conductivity and good insulation properties, and can fully fill the tiny gaps between the heat dissipation substrate 110 and the multiple switching chips 120.

[0048] It should be noted that the switching chip in this embodiment of the present disclosure can be a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET). Multiple switching chips 120 can be connected in parallel, and the threshold voltages of the multiple chips are in the same range, for example, 0.3V-0.5V.

[0049] In summary, the power module of this disclosure includes: a heat dissipation substrate with a cooling channel inside, through which a cooling fluid flows; and a plurality of switching chips disposed on the heat dissipation substrate, distributed along the flow direction of the cooling fluid in the cooling channel; wherein, at least one of the switching chips located upstream in the flow direction has a threshold voltage higher than at least one of the switching chips located downstream in the flow direction. Therefore, the power device of this disclosure, based on the flow characteristics of the cooling fluid in the cooling channel and the electrical characteristics of the switching chips themselves, places switching chips with different threshold voltages at different positions on the heat dissipation substrate, effectively mitigating the overheating problem caused by uneven current distribution in the switching chips of the power module, and improving the reliability and output capability of the power module.

[0050] Based on the above embodiments, this disclosure also proposes an electronic device including the above power module.

[0051] Figure 3 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure. In the embodiments of the present disclosure, the electronic device 300 may be a smartphone, tablet device, smart wearable device, vehicle, computer, digital broadcasting terminal, messaging device, game console, medical device, fitness equipment, personal digital assistant, etc.

[0052] Reference Figure 3 The electronic device 300 may include one or more of the following components: processing component 302, memory 304, power component 306, multimedia component 308, audio component 310, input / output (I / O) interface 312, sensor component 314, and communication component 316.

[0053] Processing component 302 typically controls the overall operation of electronic device 300, such as operations associated with display, telephone calls, data communication, camera operation, and recording operations. Processing component 302 may include one or more processors 320 to execute instructions to complete all or part of the steps of the methods described above. Furthermore, processing component 302 may include one or more modules to facilitate interaction between processing component 302 and other components. For example, processing component 302 may include a multimedia module to facilitate interaction between multimedia component 308 and processing component 302.

[0054] Memory 304 is configured to store various types of data to support the operation of electronic device 300. Examples of such data include instructions for any application or method operating on electronic device 300, contact data, phonebook data, messages, pictures, videos, etc. Memory 304 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0055] Power component 306 may include the power devices described above to provide power to the various components of electronic device 300. Power component 306 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 300.

[0056] Multimedia component 308 includes a screen that provides an output interface between the electronic device 300 and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a Touch Panel, the screen may be implemented as a touchscreen to receive input signals from the user. The Touch Panel includes one or more touch sensors to sense touches, swipes, and gestures on the Touch Panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 308 includes a front-facing camera and / or a rear-facing camera. When the electronic device 300 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0057] Audio component 310 is configured to output and / or input audio signals. For example, audio component 310 includes a microphone (MIC) configured to receive external audio signals when electronic device 300 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 304 or transmitted via communication component 316. In some embodiments, audio component 310 also includes a speaker for outputting audio signals.

[0058] I / O interface 312 provides an interface between processing component 302 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0059] Sensor assembly 314 includes one or more sensors for providing state assessments of various aspects of electronic device 300. For example, sensor assembly 314 may detect the on / off state of electronic device 300, the relative positioning of components such as the display and keypad of electronic device 300, changes in position of electronic device 300 or a component of electronic device 300, the presence or absence of user contact with electronic device 300, orientation or acceleration / deceleration of electronic device 300, and temperature changes of electronic device 300. Sensor assembly 314 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 314 may also include an optical sensor, such as a complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, sensor assembly 314 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0060] Communication component 316 is configured to facilitate wired or wireless communication between electronic device 300 and other devices. Electronic device 300 can access wireless networks based on communication standards, such as WiFi (Wireless Fidelity), 4G (Fourth Generation), or 5G (Fifth Generation), or combinations thereof. In one exemplary embodiment, communication component 316 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 316 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be based on Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra-Wideband (UWB), Bluetooth, and other technologies.

[0061] In an exemplary embodiment, the electronic device 300 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0062] Based on the above embodiments, this disclosure also proposes a vehicle including power devices.

[0063] Figure 4 This is a schematic diagram of the structure of a vehicle provided in an embodiment of this disclosure. For example, vehicle 400 can be a hybrid vehicle, a non-hybrid vehicle, an electric vehicle, a fuel cell vehicle, or other types of vehicles. Vehicle 400 can be an autonomous vehicle, a semi-autonomous vehicle, or a non-autonomous vehicle.

[0064] Reference Figure 4 The vehicle 400 may include various subsystems, such as an infotainment system 410, a perception system 420, a decision control system 430, a drive system 440, and a computing platform 450. The vehicle 400 may also include more or fewer subsystems, and each subsystem may include multiple components. Furthermore, each subsystem and each component of the vehicle 400 can be interconnected via wired or wireless means.

[0065] In some embodiments, the infotainment system 410 may include a communication system, an entertainment system, etc.

[0066] The perception system 420 may include several sensors for sensing information about the environment surrounding the vehicle 400. For example, the perception system 420 may include a global positioning system (which may be GPS, BeiDou, or other positioning systems), an inertial measurement unit (IMU), lidar, millimeter-wave radar, ultrasonic radar, and a camera device.

[0067] The decision control system 430 may include a computing system, a vehicle controller, a steering system, a throttle, and a braking system; wherein the vehicle controller and the braking system include at least power devices.

[0068] The drive system 440 may include components that provide powered motion to the vehicle 400. In one embodiment, the drive system 440 may include an engine, an energy source, a transmission system, and wheels. The engine may be one or a combination of internal combustion engines, electric motors, and compressed air engines. The engine is capable of converting energy provided by the energy source into mechanical energy.

[0069] Some or all of the functions of the vehicle 400 are controlled by a computing platform 450. The computing platform 450 may include at least one processor 451 and a memory 452, the processor 451 being able to execute instructions 453 stored in the memory 452.

[0070] Processor 451 can be any conventional processor, such as a central processing unit (CPU). Processor 451 may also include a graphics processing unit (GPU), a field-programmable gate array (FPGA), a system on chip (SOC), an application-specific integrated circuit (ASIC), or a combination thereof.

[0071] The memory 452 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory, electrically erasable programmable read-only memory, erasable programmable read-only memory, programmable read-only memory, read-only memory, magnetic memory, flash memory, magnetic disk or optical disk.

[0072] In addition to instruction 453, memory 452 can also store data, such as road maps, route information, vehicle position, direction, speed, and other data. The data stored in memory 452 can be used by computing platform 450.

[0073] In this embodiment of the disclosure, processor 451 may execute instructions 453 to complete all or part of the steps of the relevant control method embodiment in the vehicle.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0075] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0076] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

[0077] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A power module, characterized in that, include: A heat dissipation substrate, wherein a cooling channel is provided inside the heat dissipation substrate and a cooling fluid is introduced into the cooling channel; Multiple switching chips are disposed on the heat dissipation substrate and distributed along the flow direction of the cooling fluid in the cooling channel; Among the plurality of switching chips, at least one of the switching chips located upstream of the flow direction has a threshold voltage higher than at least one of the switching chips located downstream of the flow direction.

2. The power module according to claim 1, characterized in that, The heat dissipation substrate is provided with multiple heat dissipation units corresponding to the multiple switching chips, which are used to cool down the corresponding switching chips. The plurality of heat dissipation units are disposed on the side away from the contact surface between the heat dissipation substrate and the switching chip.

3. The power module according to claim 2, characterized in that, Each of the heat dissipation units includes: Multiple heat dissipation pins, wherein the heat dissipation pin density of at least one of the multiple switching chips located on the upstream side corresponding to the heat dissipation unit is higher than the heat dissipation pin density of at least one of the switching chips located on the downstream side corresponding to the heat dissipation unit.

4. The power module according to claim 3, characterized in that, The distribution of the plurality of heat dissipation pins includes at least one of the following: They are distributed in a regular array pattern; The density distribution varies gradually along the flow direction; They are arranged radially around the corresponding switch chip.

5. The power module according to claim 1, characterized in that, The multiple switch chips are soldered to their respective soldering positions on the heat sink substrate using solder.

6. The power module according to claim 1, characterized in that, The distribution of the cooling channels includes at least one of the following: It exhibits a curved distribution; It exhibits a linear distribution.

7. The power module according to claim 1, characterized in that, The power module also includes: An insulating and thermally conductive layer is disposed between the heat dissipation substrate and the plurality of switching chips.

8. An electronic device, characterized in that, include: The power module as described in any one of claims 1-7.

9. A vehicle, characterized in that, include: The power module as described in any one of claims 1-7.

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