A pushing mechanism for semiconductor laser production

Abstract

The utility model discloses a kind of pushing mechanism of semiconductor laser production, including auxiliary rolling rack, the auxiliary rolling rack is installed on external support by screw;Telescopic pushing mechanism, the telescopic pushing mechanism sleeve joint is installed in the upper end inside of auxiliary rolling rack;Semiconductor laser induction pushing mechanism, the telescopic pushing mechanism of the utility model can be placed stably on auxiliary rolling rack and telescopic, and in telescopic pushing, through the movement of rolling, so that it is more flexible when moving pushing material, semiconductor laser induction pushing mechanism can carry out the induction of material, and then semiconductor laser induction pushing mechanism is telescopic by telescopic pushing mechanism, so that position can be changed, when semiconductor laser production workpiece is located at the outside of semiconductor laser induction pushing mechanism, semiconductor laser induction pushing mechanism can push semiconductor laser production workpiece and carry when moving forward.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser manufacturing technology, specifically to a feeding mechanism for semiconductor laser manufacturing. Background Technology

[0002] A semiconductor laser, also known as a laser diode, is a device that uses semiconductor materials as the working medium to generate laser light. Its working principle is based on the special electronic band structure of semiconductor materials. By injecting current, the population inversion distribution of particles is achieved, thereby generating stimulated emission and emitting a laser beam with high coherence, directionality and monochromaticity.

[0003] Existing Chinese patent CN216233427U, disclosed on April 8, 2022, discloses a servo motor pushing mechanism, including a fixed base, an adjusting base, a baffle plate, and a push plate. The adjusting base is disposed on the fixed base, and a pushing component is disposed on the adjusting base. The baffle plate is connected to the pushing component, and the push plate is disposed on the baffle plate. The pushing component includes a driver and a sliding block. The driver is disposed on one side of the adjusting base, and a ball screw is disposed on the other side of the adjusting base. The ball screw is connected to the driver. Guide rods are disposed on both sides of the ball screw, and the sliding block is disposed on the guide rods and connected to the ball screw, and slides on the guide rods driven by the ball screw.

[0004] However, when the above-mentioned device pushes the material, it pushes the material by pushing the component. However, it lacks a corresponding auxiliary rolling structure, which makes it not very flexible when moving the material. Utility Model Content

[0005] The purpose of this invention is to provide a feeding mechanism for semiconductor laser production, in order to solve the problem mentioned in the background art that when the above-mentioned device pushes the material by pushing the component, it lacks a corresponding auxiliary rolling structure, which makes it not very flexible when moving the feeding device.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a feeding mechanism for semiconductor laser production, comprising: An auxiliary rolling placement rack is mounted on an external bracket by screws; A telescopic pushing mechanism is sleeved and installed on the inner side of the upper end of the auxiliary rolling placement frame; A semiconductor laser sensing and driving mechanism is mounted on the front end of a telescopic driving mechanism and is located on the outside of the workpiece produced by the semiconductor laser.

[0007] The auxiliary rolling placement frame includes a right-angle mounting plate, with a concave frame fixed to the upper end of the right-angle mounting plate. A telescopic cylinder mounting cavity is formed between the right-angle mounting plate and the concave frame. A telescopic pushing mechanism is installed inside the telescopic cylinder mounting cavity. Positioning sleeve holes are formed on the inner sides of both ends of the concave frame. Rolling balls are rotatably installed on the inner side of the positioning sleeve holes on the concave frame. A positioning screw is rotatably connected to the middle of the upper end of the concave frame.

[0008] The telescopic pushing mechanism includes a first electric telescopic cylinder, which is sleeved between a right-angle mounting plate and a concave frame. A screw mounting disc is fixed to the telescopic rod end of the first electric telescopic cylinder. An adjustable sleeve plate is mounted on the front end of the screw mounting disc via screws. A cross-shaped adjustment groove is formed in the middle of the front end of the adjustable sleeve plate. A semiconductor laser sensing and pushing mechanism is mounted on the adjustable sleeve plate through the cross-shaped adjustment groove. A locking bolt is threaded and rotatably connected to the inner side of the cross-shaped adjustment groove on the adjustable sleeve plate. Positioning sleeve rods are symmetrically fixed to both sides of the rear end of the adjustable sleeve plate. The positioning sleeve rods are sleeved in the positioning sleeve holes of the concave frame. The first electric telescopic cylinder is electrically connected to an external controller via a connecting wire.

[0009] The outer wall of the positioning sleeve makes rolling contact with the outer wall of the rolling ball.

[0010] The semiconductor laser sensing and pushing mechanism includes an adjustable push plate, with infrared sensors sleeved on the inner sides of both ends of the adjustable push plate. The infrared sensors are mounted on the adjustable push plate by screws on a screw mounting plate.

[0011] The adjustable push plate includes a cross-shaped adjusting sleeve, which is fitted into the cross-shaped adjusting groove of the adjustable sleeve. A semiconductor laser pusher plate is fixedly connected to the front end of the cross-shaped adjusting sleeve. An installation sleeve is fixedly connected to the inner sides of both ends of the semiconductor laser pusher plate. An infrared sensor is installed inside the installation sleeve, and the infrared sensor is electrically connected to an external controller through a connecting wire.

[0012] The infrared sensor in question is model HC-SR501.

[0013] In summary, due to the adoption of the above-mentioned technologies, the beneficial effects of this utility model are: In this invention, the telescopic pushing mechanism can be stably placed on the auxiliary rolling placement frame for telescopic movement. Moreover, the rolling movement during telescopic pushing makes the material pushing process more flexible. This rolling action is achieved by the mutual rolling cooperation between the rolling ball and the positioning sleeve rod in the concave frame.

[0014] In this invention, the semiconductor laser sensing and pushing mechanism can sense materials, and then the semiconductor laser sensing and pushing mechanism can change its position through the extension and retraction of the telescopic pushing mechanism. When the semiconductor laser production workpiece is located outside the semiconductor laser sensing and pushing mechanism, the semiconductor laser sensing and pushing mechanism can push the semiconductor laser production workpiece for transportation when it moves forward. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural schematic diagram of a feeding mechanism for semiconductor laser production according to the present invention; Figure 2 This is a schematic diagram of the combined structure of the induction pushing mechanism and the telescopic pushing mechanism of the pushing mechanism for semiconductor laser production according to this utility model. Figure 3 This is a schematic diagram of the telescopic pushing mechanism of a feeding mechanism for semiconductor laser production according to this utility model. Figure 4 This is a schematic diagram of the auxiliary rolling placement frame structure of the feeding mechanism for semiconductor laser production according to this utility model. Figure 5 This is a schematic diagram of an adjustable pusher plate structure for a semiconductor laser manufacturing pusher mechanism according to the present invention.

[0016] In the diagram: 1. Semiconductor laser pusher plate; 11. Cross adjustment sleeve plate; 12. Cross adjustment groove; 13. Mounting sleeve; 2. Infrared sensor; 21. Screw mounting plate; 3. Adjustable sleeve plate; 31. Locking bolt; 32. Positioning sleeve rod; 4. Right-angle mounting base plate; 5. First electric telescopic cylinder; 51. Screw mounting disc; 52. Telescopic cylinder mounting cavity; 6. Concave frame; 61. Rolling ball; 62. Positioning screw; 63. Positioning sleeve hole. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0018] Example 1 Reference Figure 1 Figure 5A feeding mechanism for semiconductor laser production includes an auxiliary rolling placement rack, a telescopic pushing mechanism, and a semiconductor laser sensing pushing mechanism.

[0019] The auxiliary rolling placement frame is mounted on the external bracket with screws, facilitating installation, removal, and position adjustment. The telescopic pushing mechanism is sleeved on the inner side of the upper end of the auxiliary rolling placement frame. The telescopic pushing mechanism can be stably placed on the auxiliary rolling placement frame for telescopic movement, and the rolling movement during telescopic pushing makes it more flexible. The semiconductor laser sensing pushing mechanism is installed on the front end of the telescopic pushing mechanism. The semiconductor laser sensing pushing mechanism can sense the material, and then its position can be changed through the telescopic pushing mechanism. The semiconductor laser sensing pushing mechanism is located on the outside of the semiconductor laser production workpiece, and when it moves forward, it can push the semiconductor laser production workpiece for transport.

[0020] The auxiliary rolling placement frame includes a right-angle mounting plate 4, which can be installed in a designated position by screws. A concave frame 6 is fixed to the upper end of the right-angle mounting plate 4. After installation, the right-angle mounting plate 4 can drive the concave frame 6 to be placed stably. A telescopic cylinder mounting cavity 52 is opened between the right-angle mounting plate 4 and the concave frame 6. The telescopic cylinder mounting cavity 52 between the right-angle mounting plate 4 and the concave frame 6 can limit the installation. A telescopic pushing mechanism is installed inside the telescopic cylinder mounting cavity 52. ​​A positioning screw 62 is rotatably connected to the middle of the upper end of the concave frame 6. The telescopic pushing mechanism can be stably placed in the telescopic cylinder mounting cavity 52 for telescopic movement by fixing it with the positioning screw 62. Positioning sleeve holes 63 are opened on the inner sides of both ends of the concave frame 6. The area of ​​the positioning sleeve holes 63 plays a limiting role. A rolling ball 61 is rotatably installed on the concave frame 6 inside the positioning sleeve holes 63. The rolling ball 61 can roll in the positioning sleeve holes 63 of the concave frame 6, so as to play a rolling auxiliary role. The outer wall of the positioning sleeve 32 rolls into contact with the outer wall of the rolling ball 61, making the positioning sleeve 32 more flexible during positioning and movement.

[0021] The telescopic pushing mechanism includes a first electric telescopic cylinder 5, which is sleeved between the right-angle mounting plate 4 and the concave frame 6. The first electric telescopic cylinder 5 can be positioned in a limited manner. A screw mounting disc 51 is fixedly connected to the telescopic rod end of the first electric telescopic cylinder 5. When the telescopic rod of the first electric telescopic cylinder 5 extends or retracts, it can change the position of the screw mounting disc 51. An adjustable sleeve plate 3 is mounted to the front end of the screw mounting disc 51 by screws. The screw mounting disc 51 can change the position of the adjustable sleeve plate 3. Positioning sleeve rods 32 are symmetrically fixed to both sides of the rear end of the adjustable sleeve plate 3. The positioning sleeve rods 32 are sleeved in the positioning sleeve holes 63 of the concave frame 6. When the adjustable sleeve plate 3 moves, it moves through the positioning sleeve rods 32 in the positioning sleeve holes 63, so that the adjustable sleeve plate 3 can be positioned in a fixed manner. The adjustable sleeve 3 has a cross-shaped adjustment groove 12 at the front center. The adjustable sleeve 3 can be installed in a limited position through the area of ​​the cross-shaped adjustment groove 12. A semiconductor laser sensing and pushing mechanism is installed on the adjustable sleeve 3 through the cross-shaped adjustment groove 12. The semiconductor laser sensing and pushing mechanism can be positioned and adjusted in the cross-shaped adjustment groove 12 of the adjustable sleeve 3. A locking bolt 31 is threadedly connected to the adjustable sleeve 3 on the inner side of the cross-shaped adjustment groove 12. The locking bolt 31 can lock and fix the cross-shaped adjustment sleeve 11 on the inner side of the cross-shaped adjustment groove 12, so that the cross-shaped adjustment sleeve 11 can be stably placed on the adjustable sleeve 3. The first electric telescopic cylinder 5 is electrically connected to an external controller through a connecting line and can be operated and controlled by the external controller.

[0022] Working principle: The auxiliary rolling placement frame is mounted on the external bracket with screws, making it easy to install, remove, and adjust its position. The telescopic pushing mechanism can be stably placed on the auxiliary rolling placement frame for telescopic movement. Moreover, the rolling movement during telescopic pushing makes the movement more flexible. The semiconductor laser sensing pushing mechanism can sense the material, and then the semiconductor laser sensing pushing mechanism can change its position through the telescopic pushing mechanism. When the semiconductor laser production workpiece is located outside the semiconductor laser sensing pushing mechanism, the semiconductor laser sensing pushing mechanism can push the semiconductor laser production workpiece for conveying when it moves forward.

[0023] Example 2 Reference Figure 1 , Figure 2 , Figure 3 and Figure 5A feeding mechanism for semiconductor laser production. Compared with embodiment one, the semiconductor laser sensing and pushing mechanism includes an adjustable push plate. The adjustable push plate can move and push materials. Infrared sensors 2 are sleeved on the inner sides of both ends of the adjustable push plate. The adjustable push plate can emit infrared light to sense the workpiece through the infrared sensors 2 at both ends. The infrared sensors 2 are mounted on the adjustable push plate by screws on the screw mounting plate 21. The infrared sensors 2 facilitate sensing and pushing materials on the adjustable push plate. The infrared sensor 2 is model HC-SR501.

[0024] The adjustable pusher plate includes a cross-shaped adjustment sleeve 11, which is fitted into the cross-shaped adjustment groove 12 of the adjustable sleeve 3, so that the cross-shaped adjustment sleeve 11 can be positioned and adjusted in the cross-shaped adjustment groove 12. A semiconductor laser pusher plate 1 is fixedly connected to the front end of the cross-shaped adjustment sleeve 11. When the position of the cross-shaped adjustment sleeve 11 is changed, the position of the semiconductor laser pusher plate 1 can be changed to push the material. The inner sides of both ends of the semiconductor laser pusher plate 1 are connected to the mounting sleeves 13, so that the installation can be limited. An infrared sensor 2 is installed inside the mounting sleeve 13, so that it can be installed and placed accordingly. The infrared sensor 2 is electrically connected to an external controller through a connecting wire, so that it can be operated and controlled by the external controller.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

Claims

1. A pusher mechanism for semiconductor laser production, characterized by include: An auxiliary rolling placement rack is mounted on an external bracket by screws; A telescopic pushing mechanism is sleeved and installed on the inner side of the upper end of the auxiliary rolling placement frame; A semiconductor laser sensing and driving mechanism is mounted on the front end of a telescopic driving mechanism and is located on the outside of the workpiece produced by the semiconductor laser.

2. A pusher mechanism for semiconductor laser production according to claim 1, characterized in that: The auxiliary rolling placement frame includes a right-angle mounting plate (4), and a concave frame (6) is fixedly connected to the upper end of the right-angle mounting plate (4). A telescopic cylinder mounting cavity (52) is opened between the right-angle mounting plate (4) and the concave frame (6). A telescopic pushing mechanism is installed on the inner side of the telescopic cylinder mounting cavity (52). Positioning sleeve holes (63) are opened on the inner sides of both ends of the concave frame (6). A rolling ball (61) is rotatably installed on the inner side of the positioning sleeve hole (63) on the concave frame (6). A positioning screw (62) is rotatably connected to the middle of the upper end of the concave frame (6).

3. A pusher mechanism for semiconductor laser production according to claim 1 or 2, characterized in that: The telescopic pushing mechanism includes a first electric telescopic cylinder (5), which is sleeved between the right-angle mounting base plate (4) and the concave frame (6). The telescopic rod end of the first electric telescopic cylinder (5) is fixedly connected to a screw mounting disc (51). An adjustable sleeve plate (3) is installed at the front end of the screw mounting disc (51) by screws. A cross adjustment groove (12) is opened in the middle of the front end of the adjustable sleeve plate (3). A semiconductor laser sensing pushing mechanism is installed on the adjustable sleeve plate (3) through the cross adjustment groove (12). A locking bolt (31) is threaded and rotated on the inner side of the cross adjustment groove (12) on the adjustable sleeve plate (3). Positioning sleeve rods (32) are symmetrically fixed on both sides of the rear end of the adjustable sleeve plate (3). The positioning sleeve rods (32) are sleeved in the positioning sleeve holes (63) of the concave frame (6). The first electric telescopic cylinder (5) is electrically connected to an external controller through a connecting line.

4. A pusher mechanism for semiconductor laser production according to claim 3, characterized in that: The outer wall of the positioning sleeve (32) makes rolling contact with the outer wall of the rolling ball (61).

5. A pusher mechanism for semiconductor laser production according to claim 3, characterized in that: The semiconductor laser sensing and pushing mechanism includes an adjustable push plate, and infrared sensors (2) are sleeved on the inner sides of both ends of the adjustable push plate. The infrared sensors (2) are mounted on the adjustable push plate by screws on the screw mounting plate (21).

6. A pusher mechanism for semiconductor laser production according to claim 5, characterized in that: The adjustable push plate includes a cross-shaped adjustment sleeve (11), which is sleeved in the cross-shaped adjustment groove (12) of the adjustable sleeve (3). A semiconductor laser pusher plate (1) is fixedly connected to the front end of the cross-shaped adjustment sleeve (11). An installation sleeve (13) is fixedly connected to the inner sides of both ends of the semiconductor laser pusher plate (1). An infrared sensor (2) is installed inside the installation sleeve (13). The infrared sensor (2) is electrically connected to an external controller through a connecting wire.

7. The feeding mechanism for semiconductor laser production according to claim 5, characterized in that: The infrared sensor (2) is model HC-SR501.

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