Semiconductor device wafer transport positioning calibration structure

Abstract

The utility model discloses a kind of semiconductor equipment wafer transmission positioning calibration structure, belong to semiconductor equipment technical field, including down mechanism and positioning calibration mechanism, down mechanism includes piston cylinder, slide column, lifting frame and press plate, piston cylinder drives press plate, press plate is guided stable lifting by slide column and lifting frame, positioning calibration mechanism includes rotary cylinder, rotating block, connecting rod, sliding block and positioning claw, rotary cylinder drives rotating block, rotating block is linked to multiple sliding blocks via connecting rod, so that positioning claw centripetally moves synchronously to complete wafer calibration.The utility model solves the problem of the precision of down pressure swing, improves the motion stability, through the linkage design of positioning calibration mechanism, realizes compact and reliable centripetal positioning synchronously, simple structure, calibration accurate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a wafer transport positioning and calibration structure for semiconductor equipment. Background Technology

[0002] In semiconductor manufacturing, the wafer serves as the substrate for integrated circuits, and its processing precision directly determines the chip's performance and yield. Therefore, accurate transfer and positioning of the wafer between various processes are crucial for ensuring production quality. Before photolithography, etching, and inspection, the wafer needs to be transferred from the transport device and placed on the processing platform. A specialized positioning and calibration structure is then used to precisely calibrate the wafer's center position to ensure that the coordinate system on the wafer is accurately aligned with the equipment coordinate system. Existing positioning and calibration structures include movable positioning mechanisms. These mechanisms first need to move to the vicinity of the wafer's edge and then calibrate the wafer to a preset reference center by clamping and pushing. During the process of the positioning mechanism approaching the wafer, especially during the vertical downward movement, some existing structures have relatively simple guide designs. Due to the influence of guide gaps and friction, the entire mechanism may experience slight wobbling and tilting during descent. This unstable movement directly affects the initial accuracy of subsequent calibration actions, thereby reducing the final positioning accuracy.

[0003] Furthermore, in order to achieve the center positioning of a circular wafer, multiple positioning claws are used to move synchronously from the periphery to the center. Existing technologies use transmission mechanisms that convert the motion of a single power source into the synchronous centripetal motion of multiple positioning claws. These mechanisms often have complex structures due to their complex gear sets and cam linkage systems. This not only increases manufacturing costs and assembly difficulty, but also accumulates errors due to the excessive length of the transmission chain, affecting the accuracy of synchronization and the long-term reliability of the mechanism.

[0004] Therefore, this invention proposes a semiconductor device wafer transport positioning and calibration structure to address the shortcomings of existing technologies. Summary of the Invention

[0005] In view of the problems in the existing semiconductor equipment wafer transfer positioning and calibration structure, such as the positioning mechanism wobbling due to unstable guidance during vertical pressing, which affects the positioning accuracy, and the complex and unreliable transmission mechanism for converting a single power source into multi-point synchronous centripetal motion, this utility model aims to provide a semiconductor equipment wafer transfer positioning and calibration structure with an improved structure that can effectively solve the above problems.

[0006] This utility model provides a semiconductor device wafer transport positioning and calibration structure, including a base frame and a housing fixed on the top of the base frame; a pressing mechanism is fixed inside the housing, and a positioning and calibration mechanism is fixed at the moving end of the pressing mechanism.

[0007] The pressing mechanism includes a piston cylinder, multiple sliding columns, a lifting frame, and a pressure plate. The piston cylinder is fixed to the top of the outer shell, the pressure plate is fixed to the output end of the piston cylinder, the sliding columns are fixed inside the outer shell and around the top of the base frame, the lifting frame is slidably connected to the sliding columns, and the pressure plate is fixed to the lifting frame.

[0008] Furthermore, the positioning calibration mechanism includes a mounting plate, multiple slides, multiple sliders, multiple positioning claws, multiple connecting rods, a rotating block, and a rotating cylinder; the rotating cylinder is fixed to the bottom of the pressure plate, the output end of the rotating cylinder passes through the mounting plate and is fixedly connected to the rotating block, the slides are fixed to the bottom of the mounting plate, the sliders are slidably connected to the slides, the positioning claws are fixed to the bottom of the sliders, and the connecting rods are rotatably connected to the rotating block and the sliders.

[0009] Preferably, the lifting frame has internal rotatable rollers that contact the sliding column.

[0010] Preferably, the positioning calibration mechanism also includes a protective shell, which is fixed to the bottom of the mounting plate to protect the internal transmission components.

[0011] Preferably, a conveyor belt is fixed inside the base frame for carrying and transporting the wafers.

[0012] Preferably, the positioning claw is made of rubber.

[0013] Preferably, the connecting rod is rotatably connected to the bottom of the rotating block and the bottom front side of the slider.

[0014] Preferably, the output end of the rotary cylinder passes through the top of the mounting plate and is fixedly connected to the top of the rotating block.

[0015] Preferably, multiple sliding platforms are fixed around the bottom of the mounting plate.

[0016] This utility model has the following beneficial effects: 1. This utility model, by setting up a pressing mechanism, uses a piston cylinder to drive the pressure plate, and makes the pressure plate slide on multiple fixed sliding columns through a lifting frame. At the same time, rollers that roll with the sliding columns are set inside the lifting frame, which transforms the sliding friction of vertical movement into rolling friction. This solves the problem in the prior art that the positioning calibration mechanism shakes due to unstable guidance and high frictional resistance during vertical pressing, affecting the positioning accuracy. It achieves the technical effect of improving the stability and smoothness of the vertical movement of the positioning calibration mechanism, and ensuring the accuracy and reliability of the positioning pre-action.

[0017] 2. This utility model, by setting up a positioning calibration mechanism, uses a rotating cylinder to drive the rotating block, and through the connecting rods connecting the rotating block and multiple sliders, cleverly converts the single rotational motion of the rotating block into the synchronous centripetal linear motion of multiple positioning claws. This solves the problems of complex structure, unreliable transmission, and difficulty in synchronization of existing mechanisms used to achieve multi-point synchronous centering, and achieves the technical effect of compact structure, precise linkage, and high reliability of positioning calibration action. Attached Figure Description

[0018] Figure 1 This is a perspective view of a semiconductor device wafer transport positioning and calibration structure proposed in this utility model; Figure 2 This is a front view of a semiconductor device wafer transport positioning and calibration structure proposed in this utility model; Figure 3 This is an exploded view of the positioning and calibration mechanism in a semiconductor device wafer transport positioning and calibration structure proposed in this utility model; Figure 4 This is an exploded view of the pressing mechanism in a semiconductor device wafer transport positioning calibration structure proposed in this utility model.

[0019] Legend: 1. Base frame; 2. Outer shell; 3. Positioning and calibration mechanism; 31. Mounting plate; 32. Slide table; 33. Slider; 34. Positioning claw; 35. Connecting rod; 36. Rotating block; 37. Rotating cylinder; 38. Protective shell; 4. Pressing mechanism; 41. Piston cylinder; 42. Sliding column; 43. Lifting frame; 44. Roller; 45. Pressure plate; 46. Conveyor belt. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the protection scope of this utility model.

[0021] Example: Please refer to Figure 1 and Figure 2As shown, a semiconductor equipment wafer transport positioning and calibration structure includes a base frame 1, a housing 2 fixed to the top of the base frame 1, a pressing mechanism 4 fixed inside the housing 2, and a positioning calibration mechanism 3 fixed to the moving end of the pressing mechanism 4. The base frame 1 serves as the mounting support for the entire equipment, the housing 2 is fixed to the top of the base frame 1, and a conveyor belt 46 is fixed inside the base frame 1. The conveyor belt 46 is used to transport the wafer to the bottom end of the positioning calibration mechanism 3. The pressing mechanism 4 is fixed inside the housing 2, allowing the positioning calibration mechanism 3 to properly contact the wafer and perform positioning calibration on the wafer. Figure 2 and Figure 4 As shown, the pressing mechanism 4 includes a piston cylinder 41, multiple sliding columns 42, lifting frames 43 slidably connected to the sliding columns 42, rollers 44, and a pressure plate 45. The piston cylinder 41 is fixed to the top of the outer shell 2, and the pressure plate 45 is fixed to the output end of the piston cylinder 41, so that the piston cylinder 41 can drive the pressure plate 45 to press down when it outputs. The multiple sliding columns 42 are fixed inside the outer shell 2 and around the top of the base frame 1. The multiple sliding columns 42 provide guidance for the movement of the pressure plate 45. The rollers 44 are rotatably connected inside the multiple lifting frames 43. The rollers 44 directly contact the sliding columns 42, reducing the resistance of the lifting frames 43 sliding on the sliding columns 42. The multiple lifting frames 43 are slidably connected to the outer wall of the multiple sliding columns 42, and the same pressure plate 45 is fixed between adjacent multiple lifting frames 43.

[0022] Please refer to Figure 1 , Figure 2 and Figure 3The positioning calibration mechanism 3 is fixed to the bottom of the pressure plate 45 of the pressing mechanism 4, and moves vertically up and down with the pressure plate 45. The positioning calibration mechanism 3 includes a rotating cylinder 37, a mounting plate 31, a rotating block 36, multiple connecting rods 35, multiple sliding tables 32, multiple sliders 33, multiple positioning claws 34, and a protective shell 38. The rotating cylinder 37 is fixed to the bottom of the pressure plate 45 as a power source. The mounting plate 31 is fixed to the bottom of the pressure plate 45 and is located below the rotating cylinder 37. The output end of the rotating cylinder 37 passes through the top of the mounting plate 31 and extends downward. The rotating block 36 is fixedly connected to the end of the output end of the rotating cylinder 37 and is located below the mounting plate 31. Multiple sliding tables 32 are fixed around the bottom of the mounting plate 31. Multiple sliders 33 are slidably connected to the bottom of the multiple sliding tables 32. The sliding tables 32 are sliders. 33 provides guidance for radial linear motion. The bottom of each slider 33 is fixed with a positioning claw 34. The positioning claw 34 is made of rubber and is used to protect the wafer during physical contact. Multiple connecting rods 35 are rotatably connected to the bottom of the rotating block 36 and the front side of the bottom of the sliders 33. The connecting rods 35 are used to convert the rotational motion of the rotating block 36 into the linear motion of the sliders 33. When the rotating cylinder 37 is started, the output end of the rotating cylinder 37 drives the rotating block 36 to rotate. The rotating block 36 pushes the sliders 33 through the multiple connecting rods 35, so that the sliders 33 slide synchronously along the multiple slides 32, thereby driving the multiple positioning claws 34 to move from the periphery to the center point. Finally, a protective shell 38 is fixed to the bottom of the mounting plate 31. The protective shell 38 protects the internal transmission components such as the rotating block 36, connecting rods 35, and sliders 33.

[0023] As a preferred embodiment, in order to reduce the resistance of the lifting frame 43 sliding on the sliding column 42, please refer to... Figure 4 Rollers 44 are rotatably connected inside multiple lifting frames 43. The rollers 44 directly contact the sliding column 42, converting sliding friction into rolling friction and improving the smoothness of the vertical movement of the pressing mechanism 4. As a preferred embodiment, in order to provide physical protection for the internal transmission components of the positioning calibration mechanism 3 and prevent the entry of external debris, please refer to... Figure 3 The positioning and calibration mechanism 3 also includes a protective shell 38, which is fixed to the bottom of the mounting plate 31 and covers the rotating block 36, connecting rod 35, etc. inside. As a preferred embodiment, to achieve automatic wafer transfer, please refer to... Figure 1 The base frame 1 has a conveyor belt 46 fixed inside. The conveying plane of the conveyor belt 46 is located directly below the positioning and calibration mechanism 3, and is used to carry the wafer and transport the wafer to the predetermined position. As a preferred embodiment, in order to directly contact the wafer during positioning and calibration without damaging the wafer, the positioning claw 34 is made of rubber, and the elasticity of the rubber protects the wafer edge. As a preferred implementation method, please refer to the following for clarifying the power transmission path. Figure 3 The connecting rod 35 is rotatably connected to the bottom of the rotating block 36 and the bottom front side of the slider 33; As a preferred embodiment, to clarify the installation and driving method of the rotary cylinder 37, please refer to... Figure 3 The output end of the rotating cylinder 37 passes through the top of the mounting plate 31 and is fixedly connected to the top of the rotating block 36. As a preferred embodiment, in order to define the mounting position and movement trajectory of the slider 33, please refer to... Figure 3 Multiple slides 32 are fixed around the bottom of the mounting plate 31, and the number of slides 32 corresponds to the number of sliders 33.

[0024] Working principle: When wafer positioning is required, firstly, the conveyor belt 46 fixed inside the base frame 1 is started to transport the wafer directly below the positioning calibration mechanism 3. Then, the piston cylinder 41 of the pressing mechanism 4 is started. The piston cylinder 41 is fixed to the top of the housing 2. The output end of the piston cylinder 41 pushes the pressure plate 45 downward. Since the pressure plate 45 is fixed to multiple lifting frames 43, the pressure plate 45 drives the multiple lifting frames 43 and the entire positioning calibration mechanism 3 fixed to the bottom of the pressure plate 45 to slide downward synchronously. During the downward sliding process, multiple lifting frames 43 are slidably connected to the outer walls of multiple sliding columns 42. The multiple sliding columns 42 are fixed inside the outer shell 2 and around the top of the base frame 1. The sliding columns 42 provide stable and precise guidance for the vertical movement of the lifting frames 43 and the pressure plate 45. At the same time, the rollers 44 rotatably connected inside the lifting frames 43 roll in contact with the outer walls of the sliding columns 42. The rollers 44 convert the sliding friction between the lifting frames 43 and the sliding columns 42 into rolling friction, which significantly reduces the resistance of the lifting frames 43 sliding on the sliding columns 42. This structure of sliding columns 42, lifting frames 43 and rollers 44 ensures the high stability and smoothness of the pressing mechanism 4 when driving the positioning calibration mechanism 3 to descend vertically, and solves the shaking problem caused by unstable guidance in the inferred technical problem. Piston cylinder 41 continuously pushes pressure plate 45 down until multiple positioning claws 34 at the bottom of positioning calibration mechanism 3 descend to the height of the wafer's perimeter. At this point, rotating cylinder 37 of positioning calibration mechanism 3 is activated. Rotating cylinder 37 is fixed to the bottom of pressure plate 45, and its output end passes through the top of mounting plate 31 and rotates synchronously with the top of fixedly connected rotating block 36. Rotating block 36 is located below mounting plate 31. Since the bottom of rotating block 36 is rotatably connected to the bottom front of multiple sliders 33 via multiple connecting rods 35, the rotational motion of rotating block 36 is converted into linear motion of multiple sliders 33 through the transmission of connecting rods 35. Multiple sliders 33 slide on their respective slide tables 32, which are fixed around the bottom of mounting plate 31. 3. Provides synchronous centripetal linear motion guidance. The slider 33 drives the positioning claws 34 fixed at the bottom of the slider 33 to move synchronously from the periphery to the center point. The positioning claws 34 are made of rubber material. Utilizing the elasticity of the rubber material, multiple positioning claws 34 physically contact the wafer from the periphery of the wafer and gently push the wafer to the preset reference center position to complete the horizontal positioning calibration of the wafer. This linkage design through the rotating cylinder 37, rotating block 36, connecting rod 35 and slider 33 realizes the conversion of single rotational power into multi-point synchronous centripetal linear motion, solving the problem of complex calibration mechanism structure in the inference technical problem. Throughout the process, the protective shell 38 fixed at the bottom of the mounting plate 31 provides continuous physical protection for the transmission components such as rotating block 36 and connecting rod 35.

Claims

1. A semiconductor device wafer transport positioning calibration structure, comprising: The base frame (1) and the outer shell (2) fixed on the top of the base frame (1) are provided. A pressing mechanism (4) is fixed inside the outer shell (2). A positioning calibration mechanism (3) is fixed at the moving end of the pressing mechanism (4). Its features are, The pressing mechanism (4) includes a piston cylinder (41), multiple sliding columns (42), a lifting frame (43) slidably connected to the sliding columns (42), and a pressure plate (45). The piston cylinder (41) is fixed to the top of the outer shell (2), the pressure plate (45) is fixed to the output end of the piston cylinder (41), the sliding columns (42) are fixed inside the outer shell (2) and around the top of the base frame (1), and the pressure plate (45) is fixed to the lifting frame (43). The positioning calibration mechanism (3) includes a mounting plate (31), multiple slides (32), multiple sliders (33), multiple positioning claws (34), multiple connecting rods (35), a rotating block (36), and a rotating cylinder (37). The rotating cylinder (37) is fixed to the bottom of the pressure plate (45). The output end of the rotating cylinder (37) passes through the mounting plate (31) and is fixedly connected to the rotating block (36). The slides (32) are fixed to the bottom of the mounting plate (31). The sliders (33) are slidably connected to the slides (32). The positioning claws (34) are fixed to the bottom of the sliders (33). The connecting rods (35) are rotatably connected to the rotating block (36) and the sliders (33).

2. The semiconductor device wafer transport positioning calibration structure according to claim 1, characterized in that, The lifting frame (43) is internally connected to a roller (44), which is in contact with the sliding column (42).

3. The semiconductor device wafer transport positioning calibration structure of claim 1, wherein, The positioning calibration mechanism (3) also includes a protective shell (38), which is fixed to the bottom of the mounting plate (31).

4. The semiconductor device wafer transport positioning calibration structure according to claim 1, characterized in that, The base frame (1) has a conveyor belt (46) fixed inside.

5. The semiconductor device wafer transport positioning calibration structure according to claim 1, characterized in that, The positioning claw (34) is made of rubber.

6. The semiconductor device wafer transport positioning calibration structure according to claim 1, characterized in that, The connecting rod (35) is rotatably connected to the bottom of the rotating block (36) and the bottom front side of the slider (33).

7. The semiconductor device wafer transport positioning calibration structure according to claim 1, characterized in that, The output end of the rotating cylinder (37) passes through the top of the mounting plate (31) and is fixedly connected to the top of the rotating block (36).

8. The semiconductor device wafer transport positioning calibration structure according to claim 1, characterized in that, The mounting plate (31) has multiple sliding platforms (32) fixed around its bottom perimeter.

Images