A power board and motherboard connection structure

Abstract

This application relates to the field of new energy electronic manufacturing, and in particular to a power board and motherboard connection structure. It includes a power board and a motherboard, wherein the power board has pins, which serve as power pins or signal pins; the motherboard has slots; and the motherboard has connectors located at the slots that are connected to the power pins or signal pins for signal connection. The power board and motherboard connection structure provided by this application can effectively solve the solder bridging problem caused by excessively dense pins, and achieve a fast and accurate connection between the power board and the motherboard.

Description

Technical Field

[0001] This application relates to the field of new energy electronic manufacturing, and in particular to a power board and motherboard connection structure. Background Technology

[0002] A CDU (On-board Charging and Control Unit) is a highly integrated power electronic device and a key product in the evolution of modern new energy vehicle architecture. It typically integrates an on-board charger, a high-voltage DC-DC converter, and a power distribution unit. The physical structure of a CDU usually consists of multiple power boards interconnected with a main board to achieve integration. Current new energy vehicles place even higher demands on the integration of CDUs.

[0003] Interconnect technology on printed circuit boards (PCBs) is crucial for the integration of computer-controlled digital arrays (CDUs). The reliability and efficiency of connections between PCBs directly affect the performance and stability of the product. Good PCB interconnect technology ensures stable transmission of electronic signals, reduces signal interference and loss, and thus improves the performance of the entire electronic system.

[0004] For the interconnection between the power board and the mainboard of a CDU, connectors are typically used. Specifically, connectors are soldered onto the power board, and corresponding openings are made on the mainboard for the connector pins. After assembly, selective wave soldering is used. This method satisfies PCB interconnection requirements to a certain extent and is widely used in the electronics manufacturing industry.

[0005] However, existing connector connection methods have significant drawbacks. Because power boards have a large number of pins, ranging from a dozen to several dozen, the number of corresponding connectors on the motherboard is also large, resulting in an overly dense pin distribution. When connectors are soldered onto the motherboard, solder bridging between the motherboard pins is likely to occur. Furthermore, manufacturing tolerances exist in the motherboard PCB drilling, and the connector positions may drift after soldering. This can lead to misalignment when the power board is mated with the connector, making accurate insertion and assembly difficult in one go. Utility Model Content

[0006] To address the solder bridging issue caused by excessively dense pins and to achieve a fast and accurate connection between the power board and the motherboard, this application provides a connection structure between the power board and the motherboard.

[0007] The power board and motherboard connection structure provided in this application adopts the following technical solution: A power board and motherboard connection structure includes a power board and a motherboard, wherein the power board has pins that serve as power pins or signal pins. The motherboard has a slot; the motherboard has a connector that is connected to the power pin or signal pin (12) and the connector is located in the slot.

[0008] By adopting the above technical solution, the motherboard does not need to be designed with too many connector pads, thus reducing the likelihood of solder bridging after soldering. As a single soldered unit, the power board does not need to consider the assembly alignment tolerances of individual pins, ensuring efficient and accurate connection. Furthermore, it saves on connector materials, reducing material costs.

[0009] Preferably, the power pin is configured as a protruding structure at the edge of the power board and is provided with a metal edging.

[0010] By adopting the above technical solution, the probability of poor soldering can be reduced through metal edging, thus meeting the requirements of high-power transmission. This ensures connection quality and power transmission performance while achieving the connection between the power board and the motherboard.

[0011] Preferably, the connectors corresponding to the power pins of the power board use through-hole pads.

[0012] By adopting the above technical solution, the connectors corresponding to the power pins use through-hole pads, which facilitates soldering and ensures the stability of the soldering.

[0013] Preferably, the connector corresponding to the signal pin is a surface mount pad.

[0014] By adopting the above technical solution, the connectors corresponding to the signal pins are set as surface mount pads, which meets the signal connection requirements of the power board and the motherboard and facilitates processing.

[0015] Preferably, the signal pin is also configured as a protruding structure at the edge of the power board.

[0016] By adopting the above technical solution, the signal pins can be directly plugged into the slot, which can provide a certain degree of support, improve the stability of pin soldering, and reduce the possibility of breakage later.

[0017] In summary, this application includes at least one of the following beneficial technical effects: 1. The power board and motherboard connection structure adopted in this application eliminates the need for excessive connector pads on the motherboard, thus reducing the likelihood of solder bridging after soldering. As a single soldered unit, the power board eliminates the need to consider pin alignment tolerances, ensuring efficient and accurate connection. Furthermore, it saves on connector materials, reducing material costs. 2. By setting the power pins and signal pins as protruding structures at the edge of the power board and interlocking with the slots, the stability of the connection between the power board and the motherboard can be improved, and the stability of pin soldering can be improved, reducing the possibility of breakage later. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the power board structure, the motherboard structure, and the connection relationship between the two in the embodiments of this application; The following labels are used in the attached diagram: 1. Power board; 11. Power pin; 12. Signal pin; 2. Main board; 21. Slot; 3. Connector; 31. Through-hole pad; 32. Surface mount pad. Detailed Implementation

[0019] The following is in conjunction with the appendix Figure 1 This application will be described in further detail.

[0020] The power board and motherboard connection structure provided in this application includes a power board 1 and a motherboard 2. Pins are provided at the edge of the power board 1, and these pins are divided into power pins 11 and signal pins 12. A slot 21 is provided on the motherboard 2, and a connector 3 is provided at the slot 21. In this application, the connector 3 is a solder pad. One end of the pin of the power board 1 is connected to the internal circuitry of the power board 1, and the other end can be directly inserted into the slot 21 and soldered to the solder pad, thereby achieving interconnection between the power board 1 and the motherboard 2. By eliminating the connectors used in conventional technologies, the motherboard 2 does not need to design too many connector solder pads 31, and solder bridging is less likely to occur after soldering. The power board 1 and the pins are directly connected to the motherboard 2 as a single soldered unit. Through the insertion of the pins into the slot 21, there is no need to consider the assembly alignment tolerances of each pin, ensuring efficient and accurate connection.

[0021] Specifically, power pin 11 is a protruding structure at the edge of power board 1, forming a plug-in structure. Its shape is typically rectangular and flat, and its material is the same as the main body of power board 1, generally glass fiber reinforced epoxy resin or similar materials commonly used in printed circuit boards. Power pin 11 has a metal edging, typically made of a highly conductive metal, tightly wrapping around the outside of power pin 11. This metal edging connects to the leads on the power board PCB. Signal pin 12 is also a protruding structure at the edge of power board 1, with metal leads on it, forming a plug-in structure and directly soldered to the pads on the motherboard 2.

[0022] There are two types of pads on motherboard 2. The pad corresponding to power pin 11 is a through-hole pad 31, located in the corresponding slot 21. The pad corresponding to signal pin 12 is a surface-mount pad 32, located on the side of slot 21 for easy connection. After the pin is inserted into slot 21, selective wave soldering is used to solder the pin to the pad.

[0023] The implementation principle of this embodiment is as follows: This embodiment uses the protruding signal pins 12 and power pins 11 on the power board 1 to cooperate with the slots 21 on the motherboard 2, replacing the traditional pin-to-connector plug-in method. This reduces the pin density on the motherboard 2 and avoids the problem of solder bridging between pin solder joints. Simultaneously, the slots 21 provide guidance for pin insertion, enabling the power board 1 to connect to the motherboard 2 quickly and accurately. The metal edging of the power pins 11 reduces the probability of cold solder joints, meeting the requirements of high-power transmission. The through-hole pads 31 and surface-mount pads 32 are respectively connected to the power pins 11 and signal pins 12, ensuring stable power and signal transmission. Compared with existing technologies, this embodiment represents a significant improvement in connection reliability and convenience.

[0024] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A connection structure between a power board (1) and a main board (2), characterized in that: Includes a power board (1) and a main board (2), the power board (1) having pins that serve as power pins (11) or signal pins (12). The motherboard (2) has a slot (21); the motherboard (2) has a connector (3) that is connected to the power pin (11) or signal pin (12) respectively, and the connector (3) is located at the slot (21).

2. The connection structure between the power board (1) and the main board (2) according to claim 1, characterized in that: The power pin (11) is configured as a protruding structure at the edge of the power board (1) and is provided with a metal edging.

3. The connection structure between the power board (1) and the main board (2) according to claim 2, characterized in that: The connector (3) corresponding to the power pin (11) of the power board (1) adopts a plug-in pad (31).

4. The connection structure between the power board (1) and the main board (2) according to claim 1, characterized in that: The connector (3) corresponding to the signal pin (12) is a surface mount pad (32).

5. The connection structure between the power board (1) and the main board (2) according to claim 1 or 4, characterized in that: The signal pin (12) is also configured as a protruding structure at the edge of the power board (1).

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