PCBA tin furnace pad shielding tooling dismounting equipment

Abstract

The application discloses a PCBA tin furnace pad shielding tool dismounting and mounting equipment, which comprises a rack, first and second PCBA conveying mechanisms arranged on the rack, the first PCBA conveying mechanism being used for conveying PCBA to be dismounted, and the second PCBA conveying mechanism being used for conveying PCBA to be mounted; a shielding tool dismounting mechanism and a shielding tool mounting mechanism arranged on the rack, the shielding tool dismounting mechanism being located on a conveying path of the first PCBA conveying mechanism, and the shielding tool mounting mechanism being located on a conveying path of the second PCBA conveying mechanism; and a shielding tool transfer mechanism arranged on the rack and used for transferring the dismounted shielding tool to the PCBA to be mounted on the second PCBA conveying mechanism and mounting the dismounted shielding tool on the PCBA to be mounted in cooperation with the shielding tool mounting mechanism. The application can automatically dismount the shielding tool of the tin furnace pad on the PCBA, mount the shielding tool on the PCBA to be mounted, reduce the number of PCBA circulation, simplify the manufacturing process of the PCBA, improve the manufacturing efficiency, and guarantee the consistency and manufacturing quality of the batch-manufactured PCBA.

Description

Technical Field

[0001] This application relates to the field of PCB technology, and more specifically, to a PCBA solder pot pad shielding fixture assembly and disassembly device. Background Technology

[0002] The control panel of the outdoor unit of the inverter air conditioner has a double-sided panel structure. During the manufacturing of this double-sided PCBA, electronic components are inserted on side A, and the pins of the electronic components inserted on side A are on side B. The pins on side B are then soldered by wave soldering. However, during wave soldering, the wave solder will contact all through-hole pads. In order to prevent the solder joints on side A from clogging the holes and making it impossible for electronic components to be inserted on side B, a solder pot pad shielding fixture needs to be assembled on side B of the PCBA before wave soldering to protect the local area of ​​the PCBA. Then, side B is soldered by wave soldering.

[0003] Currently, the main method for assembling solder pot pad shielding fixtures on the B-side of PCBAs is manual assembly. Furthermore, after the B-side soldering is completed and the PCBA passes through the cooling dock at the back end of the wave soldering process, the solder pot pad shielding fixtures on the B-side of the PCBA are also manually removed for reuse by other PCBAs. However, this manual assembly and removal method requires multiple PCBA turnovers, lengthening the PCBA manufacturing process. Moreover, manual assembly and removal is inefficient and prone to instability, affecting the protection of the PCBA and reducing the consistency and manufacturing quality of mass-produced PCBAs. Utility Model Content

[0004] The purpose of this application is to provide a PCBA solder pot pad shielding fixture disassembly and assembly equipment, which can automatically disassemble the solder pot pad shielding fixture on the PCBA and assemble it onto the PCBA to be assembled, thereby reducing the number of PCBA turnovers, simplifying the PCBA manufacturing process, improving PCBA manufacturing efficiency, and ensuring the consistency and manufacturing quality of mass-produced PCBAs.

[0005] To achieve the above objectives, this application provides a PCBA solder pot pad shielding fixture assembly and disassembly device, comprising:

[0006] frame;

[0007] A first PCBA conveying mechanism and a second PCBA conveying mechanism are disposed on the frame. The first PCBA conveying mechanism is used to convey PCBAs to be disassembled, and the second PCBA conveying mechanism is used to convey PCBAs to be assembled.

[0008] The shielding fixture disassembly mechanism and the shielding fixture assembly mechanism are mounted on the frame. The shielding fixture disassembly mechanism is located on the conveying path of the first PCBA conveying mechanism, and the shielding fixture assembly mechanism is located on the conveying path of the second PCBA conveying mechanism.

[0009] A shielding fixture transfer mechanism is provided on the frame and located between the first PCBA conveying mechanism and the second PCBA conveying mechanism. It is used to transfer the disassembled shielding fixture to the PCBA to be assembled on the second PCBA conveying mechanism, and cooperate with the shielding fixture assembly mechanism to assemble the disassembled shielding fixture to the PCBA to be assembled.

[0010] In a preferred embodiment of this application, both the first PCBA conveying mechanism and the second PCBA conveying mechanism include a PCBA conveying mechanism body, a PCBA blocking assembly, and a PCBA pressing assembly.

[0011] The main body of the PCBA conveying mechanism is mounted on the frame, and the PCBA pressing assembly and the PCBA blocking assembly are sequentially mounted on the main body of the PCBA conveying mechanism along the conveying direction of the main body of the PCBA conveying mechanism.

[0012] The PCBA blocking assembly is used to block the conveyed PCBA, and the PCBA pressing assembly is used to press the blocked PCBA.

[0013] In a preferred embodiment of this application, the main body of the PCBA conveying mechanism includes a PCBA conveying assembly and a transmission drive assembly.

[0014] There are two PCBA conveying assemblies, which are arranged in parallel on the frame; each of the two PCBA conveying assemblies is provided with a PCBA pressing assembly and a PCBA blocking assembly.

[0015] The two PCBA conveying assemblies are connected by a drive, and the drive assembly is connected by a drive to one of the PCBA conveying assemblies.

[0016] In a preferred embodiment of this application, the PCBA blocking assembly includes a first lifting cylinder and a blocking block. The first lifting cylinder is disposed on the main body of the PCBA conveying mechanism, and the blocking block is disposed on the first lifting cylinder.

[0017] The PCBA clamping assembly includes a second lifting cylinder and a clamping block. The second lifting cylinder is disposed on the main body of the PCBA conveying mechanism, and the clamping block is disposed on the second lifting cylinder.

[0018] In a preferred embodiment of this application, both the shielding fixture disassembly mechanism and the shielding fixture assembly mechanism include a mounting bracket, a pressure rod drive assembly, and a pressure rod assembly.

[0019] The mounting bracket is mounted on the frame, the pressure rod drive assembly is mounted on the mounting bracket, and the pressure rod assembly is mounted on the pressure rod drive assembly. The pressure rod drive assembly is used to drive the pressure rod assembly to perform lifting and lowering movements.

[0020] In a preferred embodiment of this application, the lever drive assembly includes a lever drive mounting plate and a third lifting cylinder. The lever drive mounting plate is disposed on the mounting bracket, and the third lifting cylinder is disposed on the lever drive mounting plate.

[0021] The pressure rod assembly includes a pressure rod mounting plate and a lifting pressure rod. The pressure rod mounting plate is disposed on the third lifting cylinder, and the lifting pressure rod is disposed on the pressure rod mounting plate.

[0022] In a preferred embodiment of this application, the shielding tooling transfer mechanism includes a shielding tooling receiving and conveying assembly, a shielding tooling conveying and lifting assembly, and a shielding tooling transfer assembly.

[0023] The shielding fixture receiving and conveying assembly is mounted on the frame and connected to the first PCBA conveying mechanism, and is used to receive and convey the disassembled shielding fixture.

[0024] The shielding fixture transfer assembly is disposed on the frame and located between the first PCBA conveying mechanism and the second PCBA conveying mechanism, and is used to transfer the disassembled shielding fixture from the shielding fixture receiving and conveying assembly to the shielding fixture conveying and lifting assembly.

[0025] The shielding fixture conveying and lifting assembly is mounted on the frame and connected to the second PCBA conveying mechanism. It is used to convey and lift the disassembled shielding fixture and, in conjunction with the shielding fixture assembly mechanism, assemble the disassembled shielding fixture onto the PCBA to be assembled on the second PCBA conveying mechanism.

[0026] In a preferred embodiment of this application, the shielding fixture receiving and conveying assembly includes a shielding fixture conveying mechanism, a lifting drive assembly, and a shielding fixture receiving jig.

[0027] There are two shielding tooling conveyor components, which are arranged in parallel on the frame and are connected by a drive.

[0028] The lifting drive assembly is mounted on the frame and located between the two shielding tooling conveyor components, and below the first PCBA conveying mechanism;

[0029] The shielding fixture receiving jig is mounted on the lifting drive assembly; when the lifting drive assembly drives the shielding fixture receiving jig to descend, the shielding fixture receiving jig descends onto the two shielding fixture conveyor components.

[0030] In a preferred embodiment of this application, the shielding fixture transfer assembly includes a three-dimensional moving module, a lifting drive cylinder, a rotary drive cylinder, and a shielding fixture suction mechanism.

[0031] The three-dimensional moving module is mounted on the frame, the lifting drive cylinder is mounted on the three-dimensional moving module, the rotary drive cylinder is mounted on the lifting drive cylinder, and the shielding tooling suction component is mounted on the rotary drive cylinder.

[0032] In a preferred embodiment of this application, the shielding fixture conveying and lifting assembly includes a linear drive module, a lifting drive cylinder, and a shielding fixture positioning fixture.

[0033] The linear drive module is mounted on the frame and located below the second PCBA conveying mechanism;

[0034] The lifting drive cylinder is slidably mounted on the linear drive module, and the shielding fixture positioning jig is mounted on the lifting drive cylinder for placing and positioning the shielding fixture of the PCBA to be assembled onto the second PCBA conveying mechanism.

[0035] This application discloses a PCBA solder pot pad shielding fixture assembly and disassembly device, which, compared with the prior art, has at least the following advantages:

[0036] The PCBA solder pot pad shielding fixture disassembly and assembly equipment of this application is used to disassemble the solder pot pad shielding fixture on a PCBA with soldered B-side, and to assemble the disassembled solder pot pad shielding fixture onto a PCBA with soldered B-side that requires wave soldering. In practical application, the PCBA with soldered B-side (i.e., the PCBA to be disassembled) is placed on a first PCBA conveying mechanism for transport. When it is transported to the shielding fixture disassembly mechanism, the shielding fixture disassembly mechanism removes the solder pot pad shielding fixture from the PCBA to be disassembled. The PCBA is then transferred via a shielding fixture transfer mechanism to the second PCBA conveying mechanism to the PCBA with soldered B-side that requires wave soldering (i.e., the PCBA to be assembled). When the PCBA to be assembled is conveyed on the second PCBA conveying mechanism to the shielding fixture assembly mechanism, the shielding fixture assembly mechanism, in cooperation with the shielding fixture transfer mechanism, assembles the disassembled solder pot pad shielding fixtures onto the PCBA to be assembled. This completes the automated disassembly and assembly of the solder pot pad shielding fixtures. In this way, the solder pot pad shielding fixtures on the PCBA can be automatically disassembled and assembled onto the PCBA to be assembled, thereby reducing the number of times the PCBA is turned over, eliminating the need for a large amount of manual labor, simplifying the PCBA manufacturing process, and greatly improving the PCBA manufacturing efficiency. This effectively ensures the consistency and manufacturing quality of PCBAs produced in batches. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a three-dimensional structural schematic diagram of the solder pot pad shielding fixture provided in the embodiments of this application;

[0039] Figure 2 This is one of the three-dimensional structural diagrams of the solder pot pad shielding fixture assembled on the PCBA according to the embodiments of this application;

[0040] Figure 3 This is the second three-dimensional structural diagram of the solder pot pad shielding fixture assembled on the PCBA according to the embodiments of this application;

[0041] Figure 4 This is a three-dimensional structural schematic diagram of the PCBA solder pot pad shielding tooling disassembly and assembly equipment provided in the embodiments of this application;

[0042] Figure 5This is a three-dimensional structural schematic diagram of the first PCBA conveying mechanism and the second PCBA conveying mechanism provided in the embodiments of this application;

[0043] Figure 6 yes Figure 4 Enlarged view of a local structure in the image;

[0044] Figure 7 This is a three-dimensional structural diagram of the shielding tooling disassembly mechanism and the shielding tooling assembly mechanism provided in the embodiments of this application;

[0045] Figure 8 This is a three-dimensional structural diagram of the shielding tooling receiving and conveying assembly provided in the embodiments of this application;

[0046] Figure 9 This is a three-dimensional structural schematic diagram of the shielding tooling transfer assembly provided in the embodiments of this application;

[0047] Figure 10 This is a three-dimensional structural diagram of the shielding tooling conveying and lifting assembly provided in the embodiments of this application.

[0048] Reference numerals: 10, frame; 21, first PCBA conveying mechanism; 22, second PCBA conveying mechanism; 201, main body of PCBA conveying mechanism; 2011, PCBA conveying assembly; 2012, transmission drive assembly; 202, PCBA blocking assembly; 2021, first lifting cylinder; 2022, blocking block; 203, PCBA clamping assembly; 2031, second lifting cylinder; 2032, clamping block; 31, shielding tooling disassembly mechanism; 32, shielding tooling assembly mechanism; 301, mounting bracket; 302, pressure rod drive assembly; 3021, pressure rod drive component mounting plate; 3022, third lifting... Cylinder; 303, Pressure bar assembly; 3031, Pressure bar mounting plate; 3032, Lifting pressure bar; 40, Shielding tooling transfer mechanism; 41, Shielding tooling receiving and conveying assembly; 411, Shielding tooling conveyor; 412, Lifting drive assembly; 413, Shielding tooling receiving fixture; 42, Shielding tooling conveying and lifting assembly; 421, Linear drive module; 422, Lifting drive cylinder; 423, Shielding tooling positioning fixture; 43, Shielding tooling transfer assembly; 431, Three-dimensional moving module; 432, Lifting drive cylinder; 433, Rotary drive cylinder; 434, Shielding tooling suction mechanism; 51, Solder pot pad shielding tooling. Detailed Implementation

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0050] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0051] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0052] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or a point connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0053] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0054] Currently, the main method for assembling solder pot pad shielding fixtures on the B-side of PCBAs is manual assembly. Furthermore, after the B-side soldering is completed and the PCBA passes through the cooling dock at the back end of the wave soldering process, the solder pot pad shielding fixtures on the B-side of the PCBA are also manually removed for reuse by other PCBAs. However, this manual assembly and removal method requires multiple PCBA turnovers, lengthening the PCBA manufacturing process. Moreover, manual assembly and removal is inefficient and prone to instability, affecting the protection of the PCBA and reducing the consistency and manufacturing quality of mass-produced PCBAs.

[0055] To address the problems in the prior art, this application provides a PCBA solder pot pad shielding fixture disassembly and assembly device, which can automatically disassemble the solder pot pad shielding fixture on the PCBA and assemble it onto the PCBA to be assembled, reducing the number of PCBA turnovers, simplifying the PCBA manufacturing process, improving PCBA manufacturing efficiency, and ensuring the consistency and manufacturing quality of PCBAs produced in batches.

[0056] Example 1

[0057] See Figure 4 The PCBA solder pot pad shielding fixture disassembly and assembly equipment of this application includes:

[0058] Rack 10;

[0059] The first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22 are mounted on the frame 10. The first PCBA conveying mechanism 21 is used to convey PCBAs to be disassembled, and the second PCBA conveying mechanism 22 is used to convey PCBAs to be assembled.

[0060] The shielding tooling disassembly mechanism 31 and the shielding tooling assembly mechanism 32 are mounted on the frame 10. The shielding tooling disassembly mechanism 31 is located on the conveying path of the first PCBA conveying mechanism 21, and the shielding tooling assembly mechanism 32 is located on the conveying path of the second PCBA conveying mechanism 22.

[0061] The shielding tooling transfer mechanism 40 is mounted on the frame 10 and located between the first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22. It is used to transfer the disassembled shielding tooling to the PCBA to be assembled on the second PCBA conveying mechanism 22, and cooperate with the shielding tooling assembly mechanism 32 to assemble the disassembled shielding tooling to the PCBA to be assembled.

[0062] In this embodiment, the solder pot pad shielding fixture 51 is as follows: Figure 1 As shown, Figure 1 The solder pot pad shielding fixture 51 is equipped with two fixture spring heads. The solder pot pad shielding fixture 51 is assembled onto the PCBA via the two fixture spring heads, as shown below. Figure 2 and Figure 3 As shown, Figure 2 and Figure 3 These are schematic diagrams of the solder pot pad shielding fixture 51 assembled on the PCBA from different perspectives. Figure 2 and Figure 3 In this embodiment, the area covered by the solder pot pad shielding fixture 51 on the PCBA is the local area on the PCBA that needs to be protected. The two fixture spring heads on the solder pot pad shielding fixture 51 adopt the feature of spring extension and retraction, which can facilitate the disassembly and assembly of the solder pot pad shielding fixture 51 on the PCBA.

[0063] In this embodiment, the PCBA solder pot pad shielding fixture disassembly and assembly equipment can be used to disassemble the solder pot pad shielding fixture 51 on the PCBA with the B side soldered (i.e., the PCBA to be disassembled), and can also be used to assemble the disassembled solder pot pad shielding fixture 51 onto the PCBA with the B side that needs to be wave soldered (i.e., the PCBA to be assembled).

[0064] In this embodiment, an installation platform is formed on the rack 10, and the first PCBA conveying mechanism 21, the second PCBA conveying mechanism 22, the shielding tooling disassembly mechanism 31, the shielding tooling assembly mechanism 32 and the shielding tooling transfer mechanism 40 are all disposed on the installation platform of the rack 10.

[0065] The first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22 are arranged parallel to each other on both sides of the mounting platform of the frame 10, and the conveying directions of the first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22 are opposite. The first PCBA conveying mechanism 21 is used to place and convey the PCBA to be disassembled, and the second PCBA conveying mechanism 22 is used to place and convey the PCBA to be assembled. It can be understood that the first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22 are two independent conveying mechanisms, and the two conveying mechanisms do not interfere with each other.

[0066] The shielding fixture disassembly mechanism 31 is located on the conveying path of the first PCBA conveying mechanism 21, specifically on one side of the first PCBA conveying mechanism 21. It is used to disassemble the solder pot pad shielding fixture 51 on the PCBA to be disassembled when the first PCBA conveying mechanism 21 conveys the PCBA to be disassembled to the matching shielding fixture disassembly mechanism 31. Disassembly is performed by the action of two fixture spring heads on the solder pot pad shielding fixture 51. The shielding fixture assembly mechanism 32 is located on the conveying path of the second PCBA conveying mechanism 22, specifically on one side of the second PCBA conveying mechanism 22. It is used to cooperate with the shielding fixture transfer mechanism 40 to assemble the disassembled solder pot pad shielding fixture 51 onto the PCBA to be assembled when the second PCBA conveying mechanism 22 conveys the PCBA to be assembled to the matching shielding fixture assembly mechanism 32. Assembly is performed by the two fixture spring heads on the solder pot pad shielding fixture 51.

[0067] The shielding fixture transfer mechanism 40 is located between the parallel first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22, that is, in the middle area of ​​the mounting platform of the frame 10. The shielding fixture transfer mechanism 40 is used to receive the disassembled solder pot pad shielding fixture 51, transfer it to the PCBA to be assembled on the second PCBA conveying mechanism 22, and cooperate with the shielding fixture assembly mechanism 32 to assemble the disassembled solder pot pad shielding fixture 51 onto the PCBA to be assembled.

[0068] The PCBA solder pot pad shielding fixture disassembly and assembly equipment of this application embodiment is used to disassemble the solder pot pad shielding fixture 51 on the PCBA with soldered B side, and to assemble the disassembled solder pot pad shielding fixture 51 onto the PCBA with soldered B side requiring wave soldering. In practical application, the PCBA with soldered B side (i.e., the PCBA to be disassembled) is placed on the first PCBA conveying mechanism 21 for conveying. When it is conveyed to the shielding fixture disassembly mechanism 31, the shielding fixture disassembly mechanism 31 removes the solder pot pad shielding fixture 51 from the PCBA to be disassembled, and then it is transferred through the shielding fixture transfer mechanism 40 to the second PCBA conveying mechanism 22 to the PCBA with soldered B side requiring wave soldering (i.e., the PCBA to be assembled). At the second PCBA conveying mechanism 22, when the PCBA to be assembled is conveyed to the shielding fixture assembly mechanism 32, the shielding fixture assembly mechanism 32, in cooperation with the shielding fixture transfer mechanism 40, assembles the disassembled solder pot pad shielding fixture 51 onto the PCBA to be assembled, thereby completing the automated disassembly and assembly of the solder pot pad shielding fixture 51. In this way, the solder pot pad shielding fixture 51 on the PCBA can be automatically disassembled and assembled onto the PCBA to be assembled, thereby reducing the number of times the PCBA is turned over, eliminating the need for a large amount of manual labor, simplifying the PCBA manufacturing process, and greatly improving the PCBA manufacturing efficiency, effectively ensuring the consistency and manufacturing quality of PCBAs produced in batches.

[0069] Example 2

[0070] See Figures 4 to 6 Based on the above embodiment one, the PCBA solder pot pad shielding fixture assembly and disassembly equipment of this embodiment includes a PCBA conveying mechanism body 201, a PCBA blocking component 202, and a PCBA pressing component 203, both of which are part of the first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22.

[0071] The PCBA conveying mechanism body 201 is mounted on the frame 10, and the PCBA pressing component 203 and the PCBA blocking component 202 are sequentially mounted on the PCBA conveying mechanism body 201 along the conveying direction of the PCBA conveying mechanism body 201.

[0072] PCBA blocking assembly 202 is used to block the conveyed PCBA, and PCBA clamping assembly 203 is used to clamp the blocked PCBA.

[0073] In this embodiment, the first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22 adopt a basically identical structure; wherein, the main body 201 of the PCBA conveying mechanism is used for placing and conveying PCBA; the PCBA blocking component 202 is used to block the conveyed PCBA, so that the conveyed PCBA stops at a specific position to align with the shielding tooling disassembly mechanism 31 or the shielding tooling assembly mechanism 32; the PCBA pressing component 203 is used to press the PCBA after it has been blocked by the PCBA blocking component 202, so as to facilitate the disassembly or assembly of the shielding tooling disassembly mechanism 31 or the shielding tooling assembly mechanism 32.

[0074] In the implementation of the above technical solution, a PCBA clamping component 203 and a PCBA blocking component 202 are sequentially arranged on the main body 201 of the PCBA conveying mechanism. The cooperation between the PCBA clamping component 203 and the PCBA blocking component 202 achieves the positioning and limiting of the conveyed PCBA, causing the conveyed PCBA to remain at a specific position. For the shielding tooling disassembly mechanism 31 or the shielding tooling assembly mechanism 32, this structural arrangement can avoid the PCBA conveying mechanism main body 201 from frequently starting and stopping, thus preventing the conveyed PCBA from being stopped. A stops at a specific position, which facilitates the processing of PCBA and ensures the continuity of the PCBA solder pot pad shielding fixture disassembly and assembly equipment. In addition, this structure can ensure that the transported PCBA is accurately positioned in the shielding fixture disassembly mechanism 31 or the shielding fixture assembly mechanism 32, which is beneficial to the disassembly and assembly of the solder pot pad shielding fixture 51. At the same time, the clamping action of the PCBA clamping component 203 can ensure the smoothness of disassembly and assembly, and ensure the effect of disassembly and assembly, and also prevent the PCBA from shifting or falling during disassembly or assembly.

[0075] Furthermore, in this embodiment, the PCBA conveying mechanism body 201 includes a PCBA conveying assembly 2011 and a transmission drive assembly 2012.

[0076] There are two PCBA conveying assemblies 2011, which are arranged in parallel on the frame 10; each of the two PCBA conveying assemblies 2011 is provided with a PCBA pressing assembly 203 and a PCBA blocking assembly 202.

[0077] Two PCBA conveying assemblies 2011 are connected by a drive, and a drive component 2012 is connected by a drive to one PCBA conveying assembly 2011.

[0078] In this embodiment, each of the two PCBA conveying components 2011 includes a PCBA conveying bracket and a conveyor belt assembly disposed on the PCBA conveying bracket. When the conveyed PCBA is placed on the main body 201 of the PCBA conveying mechanism, it rests on the conveyor belt of the conveyor belt assembly on the two PCBA conveying brackets. The PCBA pressing component 203 and the PCBA blocking component 202 on the two PCBA conveying components 2011 are specifically disposed on the corresponding PCBA conveying brackets, and the positions of the PCBA pressing component 203 and the PCBA blocking component 202 on the two PCBA conveying components 2011 are corresponding, and they are used together to block and press the conveyed PCBA.

[0079] In this embodiment, the conveyor belt assemblies on the two PCBA conveyor supports are connected by a drive shaft. Specifically, the drive wheels of the conveyor belt assemblies on the two PCBA conveyor supports are connected by a drive shaft. The drive drive assembly 2012 includes a drive motor and a synchronous belt assembly. The synchronous belt assembly is connected to the output end of the drive motor and is connected to the drive shaft to drive the synchronous operation of the conveyor belt assemblies on the two PCBA conveyor supports.

[0080] In the implementation of the above technical solution, the structure of the PCBA conveying mechanism body 201 can save power components and simplify the structure of the PCBA conveying mechanism body 201 and the PCBA solder pot pad shielding tooling assembly and disassembly equipment by achieving synchronous operation through the transmission drive component 2012; in addition, each of the two PCBA conveying components 2011 is correspondingly provided with a PCBA pressing component 203 and a PCBA blocking component 202, which can apply blocking force and pressing force to the conveyed PCBA from both sides, thereby improving the effect of the PCBA conveyed by the PCBA pressing component 203 and the PCBA blocking component 202.

[0081] In this embodiment, an additional PCBA blocking component 202 may be provided before the positions where the PCBA pressing component 203 and the PCBA blocking component 202 are provided on at least one PCBA conveying component 2011. This PCBA blocking component 202 is used to block the next PCBA to be processed when the shielding tooling disassembly mechanism 31 or the shielding tooling assembly mechanism 32 disassembles or assembles the conveyed PCBA. The next PCBA to be processed is released and conveyed again after the shielding tooling disassembly mechanism 31 or the shielding tooling assembly mechanism 32 has completed the disassembly or assembly of the conveyed PCBA.

[0082] Furthermore, in this embodiment, the PCBA blocking assembly 202 includes a first lifting cylinder 2021 and a blocking block 2022. The first lifting cylinder 2021 is disposed on the PCBA conveying mechanism body 201, and the blocking block 2022 is disposed on the first lifting cylinder 2021.

[0083] PCBA clamping assembly 203 includes a second lifting cylinder 2031 and a clamping block 2032. The second lifting cylinder 2031 is mounted on the PCBA conveying mechanism body 201, and the clamping block 2032 is mounted on the second lifting cylinder 2031.

[0084] In this embodiment, the first lifting cylinder 2021 is specifically disposed on the PCBA conveying bracket. The first lifting cylinder 2021 is used to drive the blocking block 2022 to move up and down, so as to block or release the conveyed PCBA. The second lifting cylinder 2031 is specifically disposed on the PCBA conveying bracket. The second lifting cylinder 2031 is used to drive the pressing block 2032 to move up and down, so as to press or release the conveyed PCBA.

[0085] In the implementation of the above technical solution, the structure of this PCBA blocking component 202 and PCBA pressing component 203 is relatively simple, which makes it easy to set on the PCBA conveying bracket, and has a good blocking or pressing effect.

[0086] Example 3

[0087] See Figures 4 to 7 Based on the above embodiment one or embodiment two, the PCBA solder pot pad shielding fixture disassembly and assembly equipment of this embodiment includes a mounting bracket 301, a pressure rod drive assembly 302, and a pressure rod assembly 303.

[0088] Mounting bracket 301 is mounted on frame 10, pressure rod drive assembly 302 is mounted on mounting bracket 301, pressure rod assembly 303 is mounted on pressure rod drive assembly 302, and pressure rod drive assembly 302 is used to drive pressure rod assembly 303 to perform lifting and lowering movements.

[0089] In this embodiment, the shielding fixture disassembly mechanism 31 and the shielding fixture assembly mechanism 32 adopt the same structure; wherein, the mounting bracket 301 is disposed on the frame 10, and the mounting bracket 301 is inverted L-shaped; the pressure rod drive assembly 302 is used to drive the pressure rod assembly 303 to perform lifting and lowering movements, so that the pressure rod assembly 303 acts on the PCBA; in this embodiment, the pressure rod assembly 303 of the shielding fixture disassembly mechanism 31 is specifically used to push the solder pot pad shielding fixture 51 out of the PCBA to be disassembled through two fixture spring heads, and the pressure rod assembly 303 of the shielding fixture assembly mechanism 32 is specifically used to press down the PCBA to be assembled, and cooperate with the shielding fixture transfer mechanism 40 to assemble the disassembled solder pot pad shielding fixture 51 onto the PCBA to be assembled.

[0090] In the implementation of the above technical solution, the shielding fixture disassembly mechanism 31 and the shielding fixture assembly mechanism 32 adopt the same structure, which can reduce the complexity of the PCBA solder pot pad shielding fixture disassembly and assembly equipment and facilitate the production of the PCBA solder pot pad shielding fixture disassembly and assembly equipment; and, through this structure, it is easy to disassemble the solder pot pad shielding fixture 51 on the PCBA to be disassembled, and to assemble the disassembled solder pot pad shielding fixture 51 onto the PCBA to be assembled, so as to ensure the disassembly and assembly effect of the solder pot pad shielding fixture 51.

[0091] Furthermore, in this embodiment, the lever drive assembly 302 includes a lever drive mounting plate 3021 and a third lifting cylinder 3022. The lever drive mounting plate 3021 is disposed on the mounting bracket 301, and the third lifting cylinder 3022 is disposed on the lever drive mounting plate 3021.

[0092] The pressure bar assembly 303 includes a pressure bar mounting plate 3031 and a lifting pressure bar 3032. The pressure bar mounting plate 3031 is mounted on the third lifting cylinder 3022, and the lifting pressure bar 3032 is mounted on the pressure bar mounting plate 3031.

[0093] In this embodiment, the third lifting cylinder 3022 drives the lifting pressure rod 3032 to rise and fall by driving the pressure rod mounting plate 3031, thereby causing the lifting pressure rod 3032 to act on the PCBA. In this embodiment, two lifting pressure rods 3032 are provided on the pressure rod mounting plate 3031, and two tooling spring heads are provided on the solder pot pad shielding tool 51. When the pressure rod assembly 303 of the shielding tool disassembly mechanism 31 pushes the solder pot pad shielding tool 51 out of the PCBA to be disassembled, it presses down the two tooling spring heads through the two lifting pressure rods 3032, thereby causing the solder pot pad shielding tool 51 to be pushed out and disassembled from the PCBA to be disassembled. When the pressure rod assembly 303 of the shielding tool assembly mechanism 32 presses down the PCBA to be assembled, it acts on the PCBA to be assembled through the two lifting pressure rods 3032.

[0094] In the process of implementing the above technical solution, the structure of this pressure rod drive assembly 302 and pressure rod assembly 303 can better realize the disassembly and assembly of the solder pot pad shielding fixture 51, and ensure the effect of disassembly and assembly of the solder pot pad shielding fixture 51.

[0095] Example 4

[0096] See Figures 4 to 10 Based on any of the embodiments one to three above, the PCBA solder pot pad shielding fixture assembly and disassembly equipment of this embodiment includes a shielding fixture transfer mechanism 40 comprising a shielding fixture receiving and conveying assembly 41, a shielding fixture conveying and lifting assembly 42, and a shielding fixture transfer assembly 43.

[0097] The shielding fixture receiving and conveying assembly 41 is mounted on the frame 10 and connected to the first PCBA conveying mechanism 21, and is used to receive and convey the disassembled shielding fixture.

[0098] The shielding fixture transfer assembly 43 is mounted on the frame 10 and located between the first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22. It is used to transfer the disassembled shielding fixture from the shielding fixture receiving and conveying assembly 41 to the shielding fixture conveying and lifting assembly 42.

[0099] The shielding fixture conveying and lifting assembly 42 is mounted on the frame 10 and connected to the second PCBA conveying mechanism 22. It is used to convey and lift the disassembled shielding fixture, and cooperates with the shielding fixture assembly mechanism 32 to assemble the disassembled shielding fixture onto the PCBA to be assembled on the second PCBA conveying mechanism 22.

[0100] In this embodiment, the shielding fixture receiving and conveying assembly 41 is located below the first PCBA conveying mechanism 21 to receive the solder pot pad shielding fixture 51 removed from the PCBA to be disassembled and to convey the disassembled solder pot pad shielding fixture 51.

[0101] The shielding fixture transfer assembly 43 is located between the first PCBA conveying mechanism 21 and the second PCBA conveying mechanism 22, and also between the shielding fixture receiving and conveying assembly 41 and the shielding fixture conveying and lifting assembly 42. It is used to transfer the solder pot pad shielding fixture 51 conveyed by the shielding fixture receiving and conveying assembly 41 to the shielding fixture conveying and lifting assembly 42.

[0102] The shielding fixture conveying and lifting assembly 42 is located below the second PCBA conveying mechanism 22. It is used to convey the disassembled solder pot pad shielding fixture 51 to the PCBA to be assembled on the second PCBA conveying mechanism 22, lift the disassembled solder pot pad shielding fixture 51, and cooperate with the shielding fixture assembly mechanism 32 to assemble the disassembled solder pot pad shielding fixture 51 onto the PCBA to be assembled on the second PCBA conveying mechanism 22.

[0103] In the implementation of the above technical solution, this shielding fixture transfer mechanism 40 is divided into three independent components. Through the cooperation of the shielding fixture receiving and conveying component 41, the shielding fixture conveying and lifting component 42, and the shielding fixture transfer component 43, the disassembled solder pot pad shielding fixture 51 can be received, conveyed, transferred, conveyed, lifted, and assembled in a better manner. This ensures that the disassembled solder pot pad shielding fixture 51 can be smoothly and orderly assembled onto the PCBA to be assembled, and ensures the assembly effect.

[0104] Example 5

[0105] See Figures 4 to 10 Based on the above embodiment four, the PCBA solder pot pad shielding fixture assembly and disassembly equipment of this embodiment includes a shielding fixture receiving and conveying assembly 41 comprising a shielding fixture conveyor 411, a lifting drive assembly 412, and a shielding fixture receiving jig 413.

[0106] There are two shielding tooling conveyor components 411, which are arranged in parallel on the frame 10 and are connected by a drive.

[0107] The lifting drive assembly 412 is mounted on the frame 10 and is located between the two shielded tooling conveyor components 411 and below the first PCBA conveyor mechanism 21.

[0108] The shielding fixture receiving jig 413 is mounted on the lifting drive assembly 412; when the lifting drive assembly 412 drives the shielding fixture receiving jig 413 to descend, the shielding fixture receiving jig 413 descends onto the two shielding fixture conveyor components 411.

[0109] In this embodiment, both shielding tooling conveyor components 411 include a support bracket and a conveyor belt assembly disposed on the support bracket. The conveyor belt assemblies of the two shielding tooling conveyor components 411 are connected by a drive. The drive connection structure and driving action structure of the conveyor belt assemblies of the two shielding tooling conveyor components 411 can be referred to the drive connection structure and driving action structure of the two PCBA conveyor components 2011 described above, and will not be repeated here.

[0110] In this embodiment, the lifting drive assembly 412 is used to drive the lifting and lowering movement of the shielding fixture receiving jig 413. When the shielding fixture receiving jig 413 receives the disassembled solder pot pad shielding fixture 51, the lifting drive assembly 412 can raise the shielding fixture receiving jig 413 to a suitable height. When the shielding fixture receiving jig 413 receives the disassembled solder pot pad shielding fixture 51, the lifting drive assembly 412 lowers the shielding fixture receiving jig 413 and lowers it onto the two shielding fixture conveyor components 411 for conveying. In this embodiment, a baffle plate is provided at the same end of the two shielding fixture conveyor components 411. The baffle plate is used to block the conveyed shielding fixture receiving jig 413.

[0111] In this embodiment, the shielding fixture receiving jig 413 is used to receive the disassembled solder pot pad shielding fixture 51. The shielding fixture receiving jig 413 can be set on the lifting drive assembly 412 by a suction cup. The suction cup can be used to hold the disassembled solder pot pad shielding fixture 51.

[0112] In the process of implementing the above technical solution, the shielding fixture receiving and conveying assembly 41 of this structure can better receive and convey the disassembled solder pot pad shielding fixture 51, and cooperate with the shielding fixture transfer assembly 43.

[0113] Furthermore, in this embodiment, the shielding fixture transfer assembly 43 includes a three-dimensional moving module 431, a lifting drive cylinder 432, a rotary drive cylinder 433, and a shielding fixture suction mechanism 434.

[0114] A three-dimensional moving module 431 is mounted on the frame 10, a lifting drive cylinder 432 is mounted on the three-dimensional moving module 431, a rotary drive cylinder 433 is mounted on the lifting drive cylinder 432, and a shielding tooling suction component 434 is mounted on the rotary drive cylinder 433.

[0115] In this embodiment, the lifting drive cylinder 432 is mounted on the three-dimensional moving module 431 via a mounting plate. The three-dimensional moving module 431 can adjust the position of the lifting drive cylinder 432 in three dimensions (X, Y, and Z), thereby adjusting the position of the shielding tooling suction component 434. The rotary drive cylinder 433 is mounted on the lifting drive cylinder 432 via a mounting plate. In this embodiment, the lifting drive cylinder 432 and the rotary drive cylinder 433 are actually used to adjust the shielding tooling suction component 434. The pneumatic cylinder 432 is used to adjust the height of the shielding fixture picking mechanism 434, and the rotary drive cylinder 433 is used to rotate the shielding fixture picking mechanism 434. After the shielding fixture picking mechanism 434 picks up the disassembled solder pot pad shielding fixture 51, the rotary drive cylinder 433 will cause the shielding fixture picking mechanism 434 to rotate 180 degrees, so that the disassembled solder pot pad shielding fixture 51 is rotated to a suitable angle for assembly, and then transferred to the shielding fixture conveying and lifting assembly 42 for assembly.

[0116] In this embodiment, the shielding tooling suction component 434 includes a mounting plate and two suction heads disposed on the mounting plate. The mounting plate is disposed on the rotary drive cylinder 433, and the mounting plate is provided with a sliding groove, which can be used to adjust the position of the two suction heads on the mounting plate.

[0117] In the process of implementing the above technical solution, the shielding fixture transfer assembly 43 of this structure can effectively transfer the disassembled solder pot pad shielding fixture 51. Furthermore, during the transfer process, the angle of the disassembled solder pot pad shielding fixture 51 will be adjusted to a suitable angle for assembly. It can be used in good coordination with the shielding fixture conveying and lifting assembly 42.

[0118] Furthermore, in this embodiment, the shielding fixture conveying and lifting assembly 42 includes a linear drive module 421, a lifting drive cylinder 422, and a shielding fixture positioning fixture 423.

[0119] The linear drive module 421 is mounted on the frame 10 and located below the second PCBA conveying mechanism 22;

[0120] The lifting drive cylinder 422 is slidably mounted on the linear drive module 421, and the shielding fixture positioning jig 423 is mounted on the lifting drive cylinder 422. It is used to place and position the shielding fixture of the PCBA to be assembled onto the second PCBA conveying mechanism 22.

[0121] In this embodiment, the lifting drive cylinder 422 is slidably mounted on the linear drive module 421 via a mounting plate. In actual application, the shielding fixture transfer assembly 43 places the disassembled solder pot pad shielding fixture 51 onto the shielding fixture positioning jig 423. The linear drive module 421 then drives the lifting drive cylinder 422 to slide to the bottom of the PCBA to be assembled, aligning it with the corresponding assembly position on the PCBA. The lifting drive cylinder 422 then lifts the shielding fixture positioning jig 423, and with the downward pressure of the shielding fixture assembly mechanism 32, the disassembled solder pot pad shielding fixture 51 is assembled onto the PCBA to be assembled, completing the assembly.

[0122] In the process of implementing the above technical solution, the shielding fixture conveying and lifting assembly 42 of this structure can effectively convey and lift the disassembled solder pot pad shielding fixture 51, and can also cooperate well with the shielding fixture assembly mechanism 32 to ensure the assembly effect and assembly quality of the solder pot pad shielding fixture 51.

[0123] In all the above embodiments, "large" and "small" are relative terms, "more" and "less" are relative terms, and "upper" and "lower" are relative terms. The embodiments of this application will not elaborate further on the expression of such relative terms.

[0124] It should be understood that phrases such as "in one embodiment," "in this embodiment," "in this application embodiment," or "as an optional implementation" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, phrases such as "in one embodiment," "in this embodiment," "in this application embodiment," or "as an optional implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0125] In the various embodiments of this application, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0126] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims

1. A PCBA solder pot pad shielding fixture assembly and disassembly device, characterized in that, include: frame; A first PCBA conveying mechanism and a second PCBA conveying mechanism are disposed on the frame. The first PCBA conveying mechanism is used to convey PCBAs to be disassembled, and the second PCBA conveying mechanism is used to convey PCBAs to be assembled. The shielding fixture disassembly mechanism and the shielding fixture assembly mechanism are mounted on the frame. The shielding fixture disassembly mechanism is located on the conveying path of the first PCBA conveying mechanism, and the shielding fixture assembly mechanism is located on the conveying path of the second PCBA conveying mechanism. A shielding fixture transfer mechanism is provided on the frame and located between the first PCBA conveying mechanism and the second PCBA conveying mechanism. It is used to transfer the disassembled shielding fixture to the PCBA to be assembled on the second PCBA conveying mechanism, and cooperate with the shielding fixture assembly mechanism to assemble the disassembled shielding fixture to the PCBA to be assembled.

2. The PCBA solder pot pad shielding fixture assembly and disassembly equipment according to claim 1, characterized in that, Both the first PCBA conveying mechanism and the second PCBA conveying mechanism include a PCBA conveying mechanism body, a PCBA blocking assembly, and a PCBA pressing assembly. The main body of the PCBA conveying mechanism is mounted on the frame, and the PCBA pressing assembly and the PCBA blocking assembly are sequentially mounted on the main body of the PCBA conveying mechanism along the conveying direction of the main body of the PCBA conveying mechanism. The PCBA blocking assembly is used to block the conveyed PCBA, and the PCBA pressing assembly is used to press the blocked PCBA.

3. The PCBA solder pot pad shielding fixture assembly and disassembly equipment according to claim 2, characterized in that, The main body of the PCBA conveying mechanism includes a PCBA conveying assembly and a transmission drive assembly. There are two PCBA conveying assemblies, which are arranged in parallel on the frame; each of the two PCBA conveying assemblies is provided with a PCBA pressing assembly and a PCBA blocking assembly. The two PCBA conveying assemblies are connected by a drive, and the drive assembly is connected by a drive to one of the PCBA conveying assemblies.

4. The PCBA solder pot pad shielding fixture disassembly and assembly equipment according to claim 2, characterized in that, The PCBA blocking assembly includes a first lifting cylinder and a blocking block. The first lifting cylinder is disposed on the main body of the PCBA conveying mechanism, and the blocking block is disposed on the first lifting cylinder. The PCBA clamping assembly includes a second lifting cylinder and a clamping block. The second lifting cylinder is disposed on the main body of the PCBA conveying mechanism, and the clamping block is disposed on the second lifting cylinder.

5. The PCBA solder pot pad shielding fixture assembly and disassembly equipment according to claim 1, characterized in that, Both the shielding fixture disassembly mechanism and the shielding fixture assembly mechanism include a mounting bracket, a pressure rod drive assembly, and a pressure rod assembly. The mounting bracket is mounted on the frame, the pressure rod drive assembly is mounted on the mounting bracket, and the pressure rod assembly is mounted on the pressure rod drive assembly. The pressure rod drive assembly is used to drive the pressure rod assembly to perform lifting and lowering movements.

6. The PCBA solder pot pad shielding fixture assembly and disassembly equipment according to claim 5, characterized in that, The lever drive assembly includes a lever drive component mounting plate and a third lifting cylinder. The lever drive component mounting plate is disposed on the mounting bracket, and the third lifting cylinder is disposed on the lever drive component mounting plate. The pressure rod assembly includes a pressure rod mounting plate and a lifting pressure rod. The pressure rod mounting plate is disposed on the third lifting cylinder, and the lifting pressure rod is disposed on the pressure rod mounting plate.

7. The PCBA solder pot pad shielding fixture disassembly and assembly equipment according to claim 1, characterized in that, The shielding fixture transfer mechanism includes a shielding fixture receiving and conveying component, a shielding fixture conveying and lifting component, and a shielding fixture transfer component. The shielding fixture receiving and conveying assembly is mounted on the frame and connected to the first PCBA conveying mechanism, and is used to receive and convey the disassembled shielding fixture. The shielding fixture transfer assembly is disposed on the frame and located between the first PCBA conveying mechanism and the second PCBA conveying mechanism, and is used to transfer the disassembled shielding fixture from the shielding fixture receiving and conveying assembly to the shielding fixture conveying and lifting assembly. The shielding fixture conveying and lifting assembly is mounted on the frame and connected to the second PCBA conveying mechanism. It is used to convey and lift the disassembled shielding fixture and, in conjunction with the shielding fixture assembly mechanism, assemble the disassembled shielding fixture onto the PCBA to be assembled on the second PCBA conveying mechanism.

8. The PCBA solder pot pad shielding fixture assembly and disassembly equipment according to claim 7, characterized in that, The shielding fixture receiving and conveying assembly includes a shielding fixture conveyor, a lifting drive assembly, and a shielding fixture receiving jig. There are two shielding tooling conveyor components, which are arranged in parallel on the frame and are connected by a drive. The lifting drive assembly is mounted on the frame and located between the two shielding tooling conveyor components, and below the first PCBA conveying mechanism; The shielding fixture is mounted on the lifting drive assembly. When the lifting drive assembly drives the shielding fixture to descend, the shielding fixture descends onto the two shielding fixture conveyor components.

9. The PCBA solder pot pad shielding fixture disassembly and assembly equipment according to claim 7, characterized in that, The shielding fixture transfer assembly includes a three-dimensional moving module, a lifting drive cylinder, a rotary drive cylinder, and a shielding fixture suction mechanism. The three-dimensional moving module is mounted on the frame, the lifting drive cylinder is mounted on the three-dimensional moving module, the rotary drive cylinder is mounted on the lifting drive cylinder, and the shielding tooling suction component is mounted on the rotary drive cylinder.

10. The PCBA solder pot pad shielding fixture disassembly and assembly equipment according to claim 7, characterized in that, The shielding fixture conveying and lifting assembly includes a linear drive module, a lifting drive cylinder, and a shielding fixture positioning fixture. The linear drive module is mounted on the frame and located below the second PCBA conveying mechanism; The lifting drive cylinder is slidably mounted on the linear drive module, and the shielding fixture positioning jig is mounted on the lifting drive cylinder for placing and positioning the shielding fixture of the PCBA to be assembled onto the second PCBA conveying mechanism.

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