Adapter, control component and electric appliance product
Patent Information
- Application Number
- CN202521869024.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-08-29
AI Technical Summary
[0003]但是，半导体器件粘接在产品壳体上的这种安装方式位置精度低
[0015]由上述技术方案可知，适配器包括基板和至少一个连接柱，基板位于壳体的第一侧壁和第二侧壁之间，且与壳体的目标侧壁连接，基板的第一端部插接在第一侧壁上开设的第一插槽内，基板的第二端部插接在第二侧壁上开设的第二插槽内，连接柱连接在基板上，内部开设有螺纹孔，连接柱通过螺纹孔与半导体器件连接。由此，本申请中是适配器包括的基板通过壳体上的第一插槽和第二插槽插接在壳体上，适配器包括的连接柱与半导体器件连接，以使半导体器件通过适配器连接在壳体上，相比于半导体器件直接粘接在壳体上的方案，连接柱与半导体器件的螺纹连接可以使半导体器件相对于适配器的位置更加精准，基板与壳体的插接配合可以使适配器相对于壳体的位置更加精准，进而，适配器可以使半导体器件安装在壳体上的安装位置精度更高。
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Figure CN224844372U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of assembly and processing technology, and in particular to an adapter, control component and electrical product. Background Technology
[0002] In products containing semiconductor devices, the semiconductor devices are typically bonded to the product housing via adhesive on their backplate. Examples of semiconductor devices include Insulated Gate Bipolar Transistors (IGBTs).
[0003] However, this mounting method of attaching semiconductor devices to the product housing results in low positional accuracy. Utility Model Content
[0004] In view of this, the adapter, control component and electrical product provided in this application enable higher accuracy in the mounting position of semiconductor devices on the housing.
[0005] In a first aspect, this application provides an adapter for connecting a semiconductor device to a housing. The adapter includes a substrate and at least one connecting post. The substrate has a thickness direction parallel to the thickness direction of a target sidewall of the housing, abuts against and is connected to the target sidewall. The substrate is located between a first sidewall and a second sidewall of the housing, the first sidewall and the second sidewall being two opposing sidewalls adjacent to the target sidewall in the housing. A first end of the substrate near the first sidewall is inserted into a first slot opened on the first sidewall, and a second end of the substrate near the second sidewall is inserted into a second slot opened on the second sidewall. The connecting post is connected to the substrate and has a threaded hole. The connecting post is connected to the semiconductor device through the threaded hole.
[0006] In one possible implementation, the substrate includes a first sub-board, a second sub-board, and a third sub-board; the first sub-board, the second sub-board, and the third sub-board are located in the same plane, the length directions of the first sub-board and the second sub-board are parallel to each other, and the third sub-board is connected between the first sub-board and the second sub-board.
[0007] In one possible implementation, the first end is the end of the first sub-board away from the second sub-board, the second end is the end of the second sub-board away from the first sub-board, the end face of the first end is parallel to the end face of the second end, the length direction of the first slot is parallel to the length direction of the second slot, the first slot penetrates the first sidewall along the length direction of the first slot, the second slot penetrates the second sidewall along the length direction of the second slot, and the third sub-board is detachably connected to the target sidewall.
[0008] In one possible implementation, the housing further includes a bottom wall adjacent to the first sidewall, the second sidewall, and the target sidewall. The bottom wall blocks the first port of the first slot and the first port of the second slot. A locking block is connected to the target sidewall that abuts against the substrate. The locking block is located at the edge of the target sidewall away from the bottom wall. A latch is provided at the end of the third sub-plate away from the bottom wall. The third sub-plate is engaged with the locking block through the latch.
[0009] In one possible implementation, the connecting post is parallel to the thickness direction of the substrate along its length and is located on the side of the substrate away from the target sidewall. The first end of the connecting post is connected to the substrate, and the threaded hole passes through the second end of the connecting post.
[0010] In one possible implementation, a first card plate and a second card plate are connected to the bottom wall. The first card plate and the second card plate are located on the same plane. The thickness directions of the first card plate and the second card plate are both parallel to the thickness direction of the target sidewall. A first slot is formed at the end of the first card plate away from the bottom wall, and the first slot penetrates the first card plate along its thickness direction. A second slot is formed at the end of the second card plate away from the bottom wall, and the second slot penetrates the second card plate along its thickness direction. The end of the first sub-plate near the bottom wall is located between the first card plate and the target sidewall. The side of the first sub-plate away from the target sidewall is called the first sidewall. The first end of the first connecting post of the at least one connecting post is connected to the first sidewall near the bottom wall, and the first connecting post passes through the first slot. The end of the second sub-plate near the bottom wall is located between the second card plate and the target sidewall. The side of the second sub-plate away from the target sidewall is called the second sidewall. The first end of the second connecting post of the at least one connecting post is connected to the second sidewall near the bottom wall, and the second connecting post passes through the second slot.
[0011] In one possible implementation, the surface of the first card away from the target sidewall and the surface of the second card away from the target sidewall are on the same plane; the first sidewall protrudes along the thickness direction of the target sidewall away from the bottom wall to form a first protruding surface, and the first end of the third connecting post of the at least one connecting post is connected to the first protruding surface; the second sidewall protrudes along the thickness direction of the target sidewall away from the bottom wall to form a second protruding surface, and the first end of the fourth connecting post of the at least one connecting post is connected to the second protruding surface; both the second protruding surface and the first protruding surface are on the same plane as the surface of the first card away from the target sidewall, so that the first protruding surface, the second protruding surface, the surface of the first card away from the target sidewall, and the surface of the second card away from the target sidewall all abut against the back plane of the backplate of the semiconductor device.
[0012] In one possible implementation, the backplate of the semiconductor device has through holes corresponding to each of the connecting posts along the thickness direction of the backplate, and the adapter also includes bolts corresponding to each of the connecting posts; the connecting posts pass through the corresponding through holes through the backplate, and the bolts are threadedly connected to the connecting posts at the second end of the corresponding connecting posts through the threaded holes of the connecting posts, so that the backplate is located between the head of the bolts and the substrate.
[0013] Secondly, this application also provides a control component, including the adapter, housing, and semiconductor device described in the first aspect or any implementation thereof.
[0014] Thirdly, this application also provides an electrical product including the control component described in the second aspect above.
[0015] As can be seen from the above technical solution, the adapter includes a substrate and at least one connecting post. The substrate is located between the first and second sidewalls of the housing and is connected to the target sidewall of the housing. The first end of the substrate is inserted into a first slot opened on the first sidewall, and the second end of the substrate is inserted into a second slot opened on the second sidewall. The connecting post is connected to the substrate and has a threaded hole inside. The connecting post is connected to the semiconductor device through the threaded hole. Thus, in this application, the substrate of the adapter is inserted into the housing through the first and second slots on the housing, and the connecting post of the adapter is connected to the semiconductor device, so that the semiconductor device is connected to the housing through the adapter. Compared with the solution of directly bonding the semiconductor device to the housing, the threaded connection between the connecting post and the semiconductor device can make the position of the semiconductor device relative to the adapter more accurate. The insertion and mating of the substrate and the housing can make the position of the adapter relative to the housing more accurate. Therefore, the adapter can make the installation position of the semiconductor device on the housing more accurate. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of an adapter according to an embodiment of this application;
[0017] Figure 2 This is a schematic diagram of the structure of a control component according to an embodiment of this application;
[0018] Figure 3 This is an exploded view of a control component according to an embodiment of this application.
[0019] List of reference numerals in the attached diagram:
[0020] 1: Semiconductor device 11: Backplane 111: Back plane
[0021] 112: Through hole 2: Shell 21: Target sidewall
[0022] 211: Block 22: First sidewall 221: First slot
[0023] 23: Second sidewall; 231: Second slot; 24: Bottom wall
[0024] 241: First card plate; 2411: First card slot; 242: Second card plate
[0025] 2421: Second slot; 3: Substrate; 31: First sub-board
[0026] 311: First side surface; 3111: First raised surface; 32: Second sub-plate
[0027] 321: Second side surface; 3211: Second raised surface; 33: Third sub-plate
[0028] 331: Bayonet; 4: Connecting post; 41: Threaded hole
[0029] 5: Bolts Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0031] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0032] As mentioned earlier, in products with semiconductor devices mounted on them, the semiconductor devices are usually bonded to the product housing by adhesive on their backing. Semiconductor devices are, for example, insulated gate bipolar transistors (IGBTs). However, this mounting method of bonding semiconductor devices to the product housing results in low positional accuracy.
[0033] In this embodiment, the adapter includes a substrate and at least one connecting post. The substrate is located between the first and second sidewalls of the housing and is connected to the target sidewall of the housing. The first end of the substrate is inserted into a first slot on the first sidewall, and the second end of the substrate is inserted into a second slot on the second sidewall. The connecting post is connected to the substrate and has a threaded hole inside. The connecting post is connected to the semiconductor device through the threaded hole. Thus, in this application, the substrate of the adapter is inserted into the housing through the first and second slots on the housing, and the connecting post of the adapter is connected to the semiconductor device, so that the semiconductor device is connected to the housing through the adapter. Compared with the solution of directly bonding the semiconductor device to the housing, the threaded connection between the connecting post and the semiconductor device can make the position of the semiconductor device relative to the adapter more accurate. The insertion and mating of the substrate and the housing can make the position of the adapter relative to the housing more accurate. Therefore, the adapter can make the installation position of the semiconductor device on the housing more accurate.
[0034] The adapter, control component, and electrical product provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0035] This application provides an adapter for connecting a semiconductor device to a housing so that the semiconductor device can be fixed to the housing. The semiconductor device is, for example, an Insulated Gate Bipolar Transistor (IGBT). Based on this, the housing is, for example, the housing of a control component included in an electrical product. The electrical product is, for example, a DC contactor product with an IGBT or other control electrical product. The control component is a component in the electrical product used to realize electronic control. The embodiments of this application do not limit the specific types of semiconductor devices, control components, and electrical products.
[0036] Figure 1 This is a schematic diagram of the structure of an adapter according to an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a control component according to an embodiment of this application. Figure 3 This is an exploded view of a control component according to an embodiment of this application. Figure 1 , Figure 2 and Figure 3 As shown, the adapter includes a substrate 3 and at least one connecting post 4. The substrate 3 has a thickness direction parallel to the thickness direction of the target sidewall 21 of the housing 2, abuts against and is connected to the target sidewall 21. This connection can be a detachable connection. The substrate 3 is located between the first sidewall 22 and the second sidewall 23 of the housing 2. The first sidewall 22 and the second sidewall 23 are two opposing sidewalls of the housing 2 that are adjacent to the target sidewall 21. The first end of the substrate 3 near the first sidewall 22 is inserted into the first slot 221 opened on the first sidewall 22, and the second end of the substrate 3 near the second sidewall 23 is inserted into the second slot 231 opened on the second sidewall 23. The connecting post 4 is connected to the substrate 3. The connecting post 4 has a threaded hole 41. The connecting post 4 is connected to the semiconductor device 1 through the threaded hole 41. This connection is specifically a threaded connection.
[0037] In this embodiment, the adapter includes a substrate 3 and at least one connecting post 4. The substrate 3 is located between the first sidewall 22 and the second sidewall 23 of the housing 2 and is connected to the target sidewall 21 of the housing 2. The first end of the substrate 3 is inserted into a first slot 221 opened on the first sidewall 22, and the second end of the substrate 3 is inserted into a second slot 231 opened on the second sidewall 23. The connecting post 4 is connected to the substrate 3 and has a threaded hole 41 inside. The connecting post 4 is connected to the semiconductor device 1 through the threaded hole 41. Thus, in this application, the substrate 3 of the adapter is inserted into the housing 2 through the first slot 221 and the second slot 231 on the housing 2, and the connecting post 4 of the adapter is connected to the semiconductor device 1, so that the semiconductor device 1 is connected to the housing 2 through the adapter. Compared with the solution of directly bonding the semiconductor device 1 to the housing 2, the threaded connection between the connecting post 4 and the semiconductor device 1 can make the position of the semiconductor device 1 relative to the adapter more accurate. The insertion and cooperation between the substrate 3 and the housing 2 can make the position of the adapter relative to the housing 2 more accurate. Therefore, the adapter can make the installation position of the semiconductor device 1 on the housing 2 more accurate.
[0038] Furthermore, the adapter in this application enables the semiconductor device 1 to be mounted on the housing 2 with higher precision, which can facilitate assembly in automated production processes.
[0039] In addition, compared with the adhesive mounting method to install the semiconductor device 1 on the housing 2, the present application uses an adapter to realize the structural connection between the semiconductor device 1 and the housing 2. This structural connection can make the connection between the semiconductor device 1 and the housing 2 more secure, reduce the possibility of the semiconductor device 1 shaking relative to the housing 2, and at the same time, the smaller size of the adapter can reduce the installation space between the semiconductor device 1 and the housing 2.
[0040] Optionally, the connecting post 4 can be made of metal, which can make the connecting post 4 stronger and more dimensionally accurate than plastic threaded holes 41. Based on this, the substrate 3 can also be made of metal, and the adapter can be a stamped structure for easy processing.
[0041] In one possible implementation, such as Figure 3 As shown, the substrate 3 includes a first sub-plate 31, a second sub-plate 32, and a third sub-plate 33. Optionally, the first sub-plate 31, the second sub-plate 32, and the third sub-plate 33 can be three parts of the substrate 3 integrally stamped. The first sub-plate 31, the second sub-plate 32, and the third sub-plate 33 are located on the same plane. The length directions of the first sub-plate 31 and the second sub-plate 32 are parallel to each other. The third sub-plate 33 is connected between the first sub-plate 31 and the second sub-plate 32. The length direction of the third sub-plate 33 can be perpendicular to the length direction of the first sub-plate 31. Thus, the structure of the substrate 3 is relatively simple.
[0042] In one possible implementation, the first end of the substrate 3 is the end of the first sub-board 31 away from the second sub-board 32, and the second end of the substrate 3 is the end of the second sub-board 32 away from the first sub-board 31. The end faces of the first end and the second end are parallel to each other. The length direction of the first slot 221 is parallel to the length direction of the second slot 231. The first slot 221 passes through the first sidewall 22 along the length direction of the first slot 221, and the second slot 231 passes through the second sidewall 23 along the length direction of the second slot 231. The third sub-board 33 is detachably connected to the target sidewall 21.
[0043] In this embodiment, when mounting the substrate 3 relative to the housing 2, the first sub-board 31 can be inserted into the first slot 221 along the length of the first slot 221 from the port of the first slot 221, and the second sub-board 32 can be inserted into the second slot 231 along the length of the second slot 231 from the port of the second slot 231. The third sub-board 33 can also be detachably connected to the target sidewall 21. Thus, the insertion and engagement of the first sub-board 31 with the housing 2, the insertion and engagement of the second sub-board 32 with the housing 2, and the detachable connection of the third sub-board 33 with the housing 2 can facilitate the connection between the substrate 3 and the housing 2, making the adapter more suitable for automated production process assembly.
[0044] In one possible implementation, such as Figure 3 As shown, the housing 2 also includes a bottom wall 24 adjacent to the first sidewall 22, the second sidewall 23, and the target sidewall 21. The bottom wall 24 blocks the first port of the first slot 221 and the first port of the second slot 231. A locking block 211 is connected to the target sidewall 21 that abuts against the substrate 3. The locking block 211 is located at the edge of the target sidewall away from the bottom wall 24. Based on this:
[0045] The end of the third sub-plate 33 away from the bottom wall 24 has a latch 331, and the third sub-plate 33 is engaged with the latch block 211 through the latch 331.
[0046] In this embodiment, during the insertion of the first daughter board 31 into the first slot 221 and the insertion of the second daughter board 32 into the second slot 231, the locking block 211 at least partially abuts against one side of the third daughter board 33 and slides relative to the third daughter board 33, so that the locking block 211 gradually approaches the slot 331. The housing 2 is made of a material with a certain elasticity, and thus, during this sliding process, the housing 2 undergoes elastic deformation relative to the adapter, so as to minimize the interference of the locking block 211 with the insertion of the first daughter board 31 and the second daughter board 32 into the housing 2. After the first sub-board 31 is fully inserted into the first slot 221 and the second sub-board 32 is fully inserted into the second slot 231, the first sub-board 31 abuts against the bottom wall 24 of the housing 2, and the second sub-board 32 also abuts against the bottom wall 24 of the housing 2. The locking block 211 automatically engages with the third sub-board 33 through the locking slot 331, so that the base plate 3 is limited by the locking block 211 and the bottom wall 24. Thus, the design of the locking block 211 and the locking slot 331 allows the locking block 211 to automatically engage with the base plate 3 during the process of inserting the first sub-board 31 and the second sub-board 32 into the housing 2, which facilitates the connection between the adapter and the housing 2.
[0047] In one possible implementation, the connecting post 4, whose length direction is parallel to the thickness direction of the substrate 3, is located on the side of the substrate 3 away from the target sidewall 21. The first end of the connecting post 4 is connected to the substrate 3. This connection can be a fixed connection or an integral connection, etc. The threaded hole 41 passes through the second end of the connecting post 4. Thus, the connecting post 4 is located on the side of the substrate 3 away from the target sidewall 21, which can minimize the possibility of the connecting post 4 being damaged when the adapter is installed on the housing 2.
[0048] In one possible implementation, such as Figure 3 As shown, a first locking plate 241 and a second locking plate 242 are connected to the bottom wall 24. The first locking plate 241 and the second locking plate 242 are located in the same plane. The thickness direction of the first locking plate 241 and the thickness direction of the second locking plate 242 are both parallel to the thickness direction of the target side wall 21. A first locking groove 2411 is formed at the end of the first locking plate 241 away from the bottom wall 24. The first locking groove 2411 penetrates the first locking plate 241 along the thickness direction of the first locking plate 241. A second locking groove 2421 is formed at the end of the second locking plate 242 away from the bottom wall 24. The second locking groove 2421 penetrates the second locking plate 242 along the thickness direction of the second locking plate 242. Based on this:
[0049] The end of the first sub-plate 31 near the bottom wall 24 is located between the first clamping plate 241 and the target side wall 21. The side of the first sub-plate 31 away from the target side wall 21 is the first side 311. The first end of the first connecting post 4 is connected to the first side 311 near the bottom wall 24, and the first connecting post passes through the first clamping groove 2411. The end of the second sub-plate 32 near the bottom wall 24 is located between the second clamping plate 242 and the target side wall 21. The side of the second sub-plate 32 away from the target side wall 21 is the second side 321. The first end of the second connecting post 4 is connected to the second side 321 near the bottom wall 24, and the second connecting post passes through the second clamping groove 2421.
[0050] It should be noted that the first connecting post and the second connecting post mentioned above are two different connecting posts 4. Therefore, this implementation is based on the case where the adapter has multiple connecting posts 4.
[0051] Therefore, the first slot 2411 on the first card plate 241 can limit the first connecting post, and the second slot 2421 on the second card plate 242 can limit the second connecting post. Thus, the first slot 2411 and the second slot 2421 can make the installation position of the adapter relative to the housing 2 more accurate.
[0052] In one possible implementation, such as Figure 3 As shown, the surface of the first card plate 241 away from the target sidewall 21 and the surface of the second card plate 242 away from the target sidewall 21 are on the same plane. Based on this:
[0053] The first side surface 311 protrudes along the thickness direction of the target side wall 21 away from the bottom wall 24 to form a first protruding surface 3111. The first end of the third connecting post of the at least one connecting post 4 is connected to the first protruding surface 3111. The second side surface 321 protrudes along the thickness direction of the target side wall 21 away from the bottom wall 24 to form a second protruding surface 3211. The first end of the fourth connecting post of the at least one connecting post 4 is connected to the second protruding surface 3211. The second protruding surface 3211 and the first protruding surface 3111 are both on the same plane as the plate surface of the first card plate 241 away from the target side, so that the first protruding surface 3111, the second protruding surface 3211, the plate surface of the first card plate 241 away from the target side wall 21, and the plate surface of the second card plate 242 away from the target side wall 21 all abut against the back plane 111 of the back plate 11 of the semiconductor device 1.
[0054] It should be noted that the first connecting post, the second connecting post, the third connecting post and the fourth connecting post mentioned above are four different connecting posts 4. Therefore, this implementation is also based on the case where the adapter has multiple connecting posts 4.
[0055] Therefore, the first protruding surface 3111, the second protruding surface 3211, the plate surface of the first clamping plate 241 away from the target sidewall 21, and the plate surface of the second clamping plate 242 away from the target sidewall 21 are all on the same plane. After the semiconductor device 1 is connected to the housing 2, the back plane 111 of the back plate 11 of the semiconductor device 1 can abut against multiple surfaces on the same plane (specifically the first protruding surface 3111, the second protruding surface 3211, the plate surface of the first clamping plate 241 away from the target sidewall 21, and the plate surface of the second clamping plate 242 away from the target sidewall 21), thereby improving the connection stability of the semiconductor device 1 relative to the housing 2.
[0056] In one possible implementation, such as Figure 3 As shown, the end faces of the second ends of the first connecting post, the second connecting post, the third connecting post, and the fourth connecting post are on the same plane to make the adapter more aesthetically pleasing and facilitate connection of the semiconductor device 1 relative to the adapter.
[0057] In one possible implementation, such as Figure 3 As shown, the end face of the first sub-plate 31 away from the bottom wall 24, the end face of the second sub-plate 32 away from the bottom wall 24, and the end face of the third sub-plate 33 away from the bottom wall 24 are on the same plane, so as to simplify the structure of the substrate 3 and facilitate the processing of the substrate 3.
[0058] In one possible implementation, such as Figure 3 As shown, the back plate 11 of the semiconductor device 1 has through holes 112 corresponding to each connecting post 4 through the thickness direction of the back plate 11. The adapter also includes bolts 5 corresponding to each connecting post 4. The connecting post 4 passes through the corresponding through hole 112 through the back plate 11. The bolt 5 is threadedly connected to the connecting post 4 at the second end of the corresponding connecting post 4 through the threaded hole 41 of the connecting post 4, so that the back plate 11 is located between the head of the bolt 5 and the substrate 3.
[0059] Based on the above-mentioned scheme of at least one connecting post 4 including a first connecting post, a second connecting post, a third connecting post and a fourth connecting post, after each bolt 5 is threadedly connected to the corresponding connecting post 4, the back plate 11 abuts against the bolt head of the bolt 5 corresponding to the first connecting post and the plate surface of the first clamping plate 241 away from the target side wall 21, and the back plate 11 abuts against the bolt head of the bolt 5 corresponding to the second connecting post and the plate surface of the second clamping plate 242 away from the target side wall 21. The back plate 11 also abuts against the bolt head of the bolt 5 corresponding to the third connecting post and the first protruding surface 3111, and at the same time, the back plate 11 also abuts against the bolt head of the bolt 5 corresponding to the fourth connecting post and the second protruding surface 3211. At this time, the back surface 111 of the back plate 11 abuts against the first protruding surface 3111, the second protruding surface 3211, the plate surface of the first clamping plate 241 away from the target side wall 21, and the plate surface of the second clamping plate 242 away from the target side wall 21.
[0060] Therefore, bolt 5 facilitates the connection between the connecting column 4 and the semiconductor device 1, reduces the possibility of the semiconductor device 1 wobbling in the assembly gap, and improves the firmness of the connection between the semiconductor device 1 and the housing 2.
[0061] This application also provides a control component, such as... Figure 2 and Figure 3 As shown, the control component includes the aforementioned adapter, housing 2, and semiconductor device 1. The adapter, housing 2, and semiconductor device 1 have been described in detail in the foregoing embodiments, and will not be repeated here.
[0062] It should be noted that the control component of this embodiment includes the adapter, housing 2 and semiconductor device 1 described in the foregoing embodiments, and has the corresponding beneficial effects of the foregoing embodiments, which will not be repeated here.
[0063] This application also provides an electrical product including the aforementioned control component. The foregoing embodiments have specifically described the adapter, housing 2 and semiconductor device 1 included in the control component, and will not be repeated here. Taking the electrical product as a DC contactor product as an example, the electrical product may also include devices such as iron core and contacts. This application does not limit this aspect.
[0064] It should be noted that the electrical product in this embodiment includes the control components described in the foregoing embodiments and has the corresponding beneficial effects of the foregoing embodiments, which will not be repeated here.
[0065] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element, and the nouns and pronouns relating to persons in this patent application are not limited to specific genders.
[0066] Finally, it should be noted that the above are merely preferred embodiments of this utility model, used only to illustrate the technical solution of this utility model, and are not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.
Claims
1. An adapter for connecting a semiconductor device (1) to a housing (2), characterized in that, The adapter includes a base plate (3) and at least one connecting post (4); The substrate (3) has a thickness direction parallel to the thickness direction of the target sidewall (21) of the housing (2), abuts against the target sidewall (21) and is connected to the target sidewall (21). The substrate (3) is located between the first sidewall (22) and the second sidewall (23) of the housing (2). The first sidewall (22) and the second sidewall (23) are two opposing sidewalls of the housing (2) that are adjacent to the target sidewall (21). The first end of the substrate (3) near the first sidewall (22) is inserted into the first slot (221) opened on the first sidewall (22), and the second end of the substrate (3) near the second sidewall (23) is inserted into the second slot (231) opened on the second sidewall (23). The connecting post (4) is connected to the substrate (3), and a threaded hole (41) is provided in the connecting post (4). The connecting post (4) is connected to the semiconductor device (1) through the threaded hole (41).
2. The adapter according to claim 1, characterized in that, The substrate (3) includes a first sub-board (31), a second sub-board (32), and a third sub-board (33); The first sub-plate (31), the second sub-plate (32) and the third sub-plate (33) are located on the same plane. The length directions of the first sub-plate (31) and the second sub-plate (32) are parallel to each other, and the third sub-plate (33) is connected between the first sub-plate (31) and the second sub-plate (32).
3. The adapter according to claim 2, characterized in that, The first end is the end of the first sub-plate (31) away from the second sub-plate (32), and the second end is the end of the second sub-plate (32) away from the first sub-plate (31). The end face of the first end is parallel to the end face of the second end. The length direction of the first slot (221) is parallel to the length direction of the second slot (231). The first slot (221) penetrates the first sidewall (22) along the length direction of the first slot (221). The second slot (231) penetrates the second sidewall (23) along the length direction of the second slot (231). The third sub-plate (33) is detachably connected to the target sidewall (21).
4. The adapter according to claim 3, characterized in that, The housing (2) further includes a bottom wall (24) adjacent to the first side wall (22), the second side wall (23) and the target side wall (21). The bottom wall (24) blocks the first port of the first slot (221) and the first port of the second slot (231). The target side wall (21) is connected to the target side that abuts against the substrate (3) with a locking block (211). The locking block (211) is located at the edge of the target side away from the bottom wall (24). The third sub-plate (33) has a slot (331) at its end away from the bottom wall (24), and the third sub-plate (33) is engaged with the card block (211) through the slot (331).
5. The adapter according to claim 4, characterized in that, The length direction of the connecting post (4) is parallel to the thickness direction of the substrate (3) and is located on the side of the substrate (3) away from the target sidewall (21). The first end of the connecting post (4) is connected to the substrate (3), and the threaded hole (41) passes through the second end of the connecting post (4).
6. The adapter according to claim 5, characterized in that, A first card plate (241) and a second card plate (242) are connected to the bottom wall (24). The first card plate (241) and the second card plate (242) are located on the same plane. The thickness direction of the first card plate (241) and the thickness direction of the second card plate (242) are parallel to the thickness direction of the target side wall (21). A first card groove (2411) is provided at the end of the first card plate (241) away from the bottom wall (24). The first card groove (2411) penetrates the first card plate (241) along the thickness direction of the first card plate (241). A second card groove (2421) is provided at the end of the second card plate (242) away from the bottom wall (24). The second card groove (2421) penetrates the second card plate (242) along the thickness direction of the second card plate (242). The end of the first sub-plate (31) near the bottom wall (24) is located between the first card plate (241) and the target side wall (21). The side of the first sub-plate (31) away from the target side wall (21) is the first side (311). The first end of the first connecting post (4) of the at least one connecting post is connected to the first side (311) near the bottom wall (24). The first connecting post passes through the first card slot (2411). The end of the second sub-plate (32) near the bottom wall (24) is located between the second card plate (242) and the target side wall (21). The side of the second sub-plate (32) away from the target side wall (21) is the second side surface (321). The first end of the second connecting post (4) of the at least one connecting post (4) is connected to the second side surface (321) near the bottom wall (24). The second connecting post passes through the second card slot (2421).
7. The adapter according to claim 6, characterized in that, The surface of the first card plate (241) away from the target sidewall (21) and the surface of the second card plate (242) away from the target sidewall (21) are on the same plane; The first side (311) protrudes in a direction away from the target side wall (21) along the thickness direction of the target side wall (21) to form a first protruding surface (3111), and the first end of the third connecting post (4) of the at least one connecting post (4) is connected to the first protruding surface (3111). The second side (321) protrudes in the direction away from the target sidewall (21) along the thickness direction of the target sidewall (21) to form a second protruding surface (3211). The first end of the fourth connecting post (4) of the at least one connecting post (4) is connected to the second protruding surface (3211). The second protruding surface (3211) and the first protruding surface (3111) are both on the same plane as the plate surface of the first card plate (241) away from the target sidewall, so that the first protruding surface (3111), the second protruding surface (3211), the plate surface of the first card plate (241) away from the target sidewall (21), and the plate surface of the second card plate (242) away from the target sidewall (21) all abut against the back plane (111) of the back plate (11) of the semiconductor device (1).
8. The adapter according to any one of claims 5-7, characterized in that, The backplate (11) of the semiconductor device (1) has through holes (112) corresponding to each of the connecting posts (4) along the thickness direction of the backplate (11), and the adapter also includes bolts (5) corresponding to each of the connecting posts (4). The connecting post (4) passes through the back plate (11) through the corresponding through hole (112), and the bolt (5) is threadedly connected to the connecting post (4) at the second end of the corresponding connecting post (4) through the threaded hole (41) of the connecting post (4), so that the back plate (11) is located between the head of the bolt (5) and the base plate (3).
9. A control component, characterized in that, It includes the adapter, housing (2), and semiconductor device (1) as described in any one of claims 1-8.
10. An electrical appliance, characterized in that, Includes the control component as described in claim 9.