Semiconductor device assembly jig and semiconductor device assembly assembly

Abstract

The application relates to the field of semiconductors, and discloses a semiconductor device assembly clamp and a semiconductor device assembly assembly. The semiconductor device assembly clamp comprises a positioning plate, a bearing plate and a plurality of foolproof components. The positioning plate comprises a plurality of positioning portions arranged at intervals. The positioning portions are provided with a plurality of positioning channels arranged along the thickness direction of the positioning portions. The plurality of positioning channels are arranged in an array. The bearing plate can be stacked on the positioning plate along the thickness direction. The bearing plate comprises a bearing surface. Part of the foolproof components can be accommodated in the positioning channels, and part of the foolproof components can protrude from one side of the positioning plate away from the bearing plate. The foolproof components can abut against the bearing surface. The semiconductor device assembly accuracy can be improved, the reverse assembly situation can be reduced, and the product scrapping probability can be reduced.

Description

Technical Field

[0001] This application belongs to the field of semiconductors, and in particular relates to a semiconductor device assembly fixture and a semiconductor device assembly assembly. Background Technology

[0002] Semiconductor devices are electronic components that utilize the conductivity of semiconductor materials to perform functions such as electrical signal processing and energy conversion. Common semiconductor devices include DBC (Direct Bonded Copper) modules and packaging housings. DBC modules typically consist of a direct bonded copper substrate (DBC), a chip, and a frame with pins.

[0003] When assembling DBC components and packaging housings, assembly fixtures are usually required. However, existing assembly fixtures only position the orientation of the packaging housing, which can lead to the DBC components being installed backwards, resulting in the scrapping of the assembled product. Utility Model Content

[0004] This application provides a semiconductor device assembly fixture and a semiconductor device assembly assembly assembly, which can improve the accuracy of semiconductor device assembly, reduce the occurrence of reverse assembly, and reduce the probability of product scrap.

[0005] On one hand, embodiments of this application provide a semiconductor device assembly fixture, including a positioning plate, a receiving plate, and a plurality of anti-misalignment components. The positioning plate includes a plurality of positioning portions spaced apart, each positioning portion having a plurality of positioning channels arranged along its own thickness direction, the plurality of positioning channels being arranged in an array. The receiving plate is arranged along its thickness direction and can be stacked on the positioning plate, the receiving plate including a receiving surface. A portion of the anti-misalignment component can be accommodated in the positioning channel, and a portion can protrude from the side of the positioning plate opposite to the receiving plate, the anti-misalignment component being able to abut against the receiving surface.

[0006] In some alternative embodiments, the anti-mistake component includes an extension and a limiting portion connected along the thickness direction. The extension is accommodated in the positioning channel and a portion protrudes from the side of the positioning plate opposite to the receiving plate. The end of the limiting portion opposite to the extension is able to abut against the receiving surface, and the outer diameter of the limiting portion is larger than the inner diameter of the positioning channel.

[0007] In some alternative embodiments, the positioning part further includes a receiving channel located on the side of the plurality of positioning channels near the receiving plate, and the receiving channel is connected to the plurality of positioning channels; the limiting part can be accommodated within the receiving channel.

[0008] In some alternative embodiments, the depth of the receiving channel is greater than or equal to the height of the limiting portion.

[0009] In some alternative embodiments, the positioning plate has a functional surface facing away from the receiving plate, the functional surface being a flat surface, and the positioning channel includes a foolproof hole formed on the functional surface.

[0010] In some alternative embodiments, the receiving plate includes a plurality of first positioning posts, and the positioning plate includes a plurality of first positioning holes, which are located on opposite sides of a plurality of positioning portions; a portion of the first positioning post is received in the first positioning hole, and another portion protrudes from the positioning plate.

[0011] In some alternative embodiments, the positioning part includes a second positioning post connected to one end of the positioning plate away from the receiving plate; and / or, a plurality of positioning channels are located around the second positioning post.

[0012] In some alternative embodiments, the semiconductor device assembly fixture further includes a carrier that can be stacked along the thickness direction on the side of the positioning plate opposite to the receiving plate. The carrier includes a plurality of placement holes that are opposite to the positioning part and can expose the positioning part.

[0013] In some alternative embodiments, the carrier includes a second positioning hole, and the receiving plate includes a plurality of first positioning posts, a portion of which is received in the second positioning hole.

[0014] On the other hand, some embodiments of this application also provide a semiconductor device assembly assembly, including a semiconductor device and the aforementioned semiconductor device assembly fixture. The semiconductor device includes a plurality of pins. In the assembled state, in a plane perpendicular to the thickness direction, the orthographic projection of the plurality of pins is located within the orthographic projection of the positioning channel and is offset from the orthographic projection of the anti-fooling component.

[0015] The semiconductor device assembly fixture and semiconductor device assembly assembly of this application embodiment provide a positioning channel on the positioning plate for the passage of the error-proof component, and a receiving plate keeps the error-proof component protruding from the positioning plate. When the semiconductor device is installed backwards, the pins on the semiconductor device will abut against the error-proof component, thereby creating a gap between the DBC component and the package shell, thus achieving error prevention, facilitating timely adjustment of position, ensuring correct assembly of the semiconductor device, improving the accuracy of semiconductor device assembly, reducing the occurrence of reverse installation, and reducing the probability of product scrap. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor device assembly fixture according to some embodiments of this application; Figure 2 for Figure 1 A sectional view; Figure 3 Show Figure 1Top view of the positioning plate in the middle; Figure 4 for Figure 3 A cross-sectional view along the AA direction; Figure 5 Show Figure 1 Another structural diagram of the positioning plate in the middle; Figure 6 Show Figure 1 Schematic diagram of the middle support plate; Figure 7 This is a schematic diagram of another structure of the semiconductor device assembly fixture according to some embodiments of this application; Figure 8 for Figure 7 A sectional view.

[0018] Explanation of reference numerals in the attached figures: 100. Positioning plate; 101. Functional surface; 110. Positioning part; 111. Positioning channel; 111a. Anti-fooling hole; 112. Receiving channel; 113. Second positioning post; 120. First positioning hole; 200. Receiving plate; 201. Receiving surface; 210. First positioning post; 300. Anti-foolproof component; 310. Extension part; 320. Limiting part; 400, carrier; 401, storage hole; 402, second positioning hole; 500, semiconductor device; Z, thickness direction. Detailed Implementation

[0019] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0021] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0022] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0024] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0025] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0026] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0027] Common semiconductor devices include DBC components and package housings. DBC components typically consist of a direct-bonded copper substrate (DBC), a chip, and a frame with leads. Package housings typically have holes that expose the leads.

[0028] When assembling DBC components and their housings, an assembly fixture is typically required. The housing is mounted on the fixture, and then the DBC component is mounted onto it. The pins of the DBC component should correspond one-to-one with the holes in the housing and pass through those holes, ensuring a perfect fit between the DBC component and the housing. However, because the DBC component and housing can easily be installed incorrectly, some pins may not be properly aligned with the holes, leading to product failure and ultimately rendering the assembled product unusable.

[0029] In view of this, this application provides a semiconductor device assembly fixture. By setting a positioning channel on a positioning plate for the passage of a foolproof component, and by using a receiving plate to keep the foolproof component protruding from the positioning plate, when the semiconductor device is installed backwards, the pins on the semiconductor device will abut against the foolproof component, thereby creating a gap between the DBC component and the package housing, thus achieving foolproofing, facilitating timely adjustment of position, ensuring correct assembly of the semiconductor device, improving the accuracy of semiconductor device assembly, reducing the occurrence of backwards installation, and reducing the probability of product scrap.

[0030] The following combination Figures 1 to 8 This application provides a detailed description of the semiconductor device assembly fixture and semiconductor device assembly components provided in the embodiments of this application.

[0031] like Figure 1 and Figure 2 As shown, some embodiments of this application provide a semiconductor device assembly fixture, including a positioning plate 100, a receiving plate 200, and a plurality of anti-misalignment components 300. The positioning plate 100 includes a plurality of positioning portions 110 spaced apart, each positioning portion 110 having a plurality of positioning channels 111 arranged along its own thickness direction Z, the plurality of positioning channels 111 being arranged in an array. The receiving plate 200 is arranged along the thickness direction Z, and the receiving plate 200 can be stacked on the positioning plate 100. The receiving plate 200 includes a receiving surface 201. A portion of the anti-misalignment component 300 can be accommodated in the positioning channel 111, and a portion can protrude from the side of the positioning plate 100 away from the receiving plate 200. The anti-misalignment component 300 can abut against the receiving surface 201.

[0032] The positioning plate 100 serves as the basic support structure of the semiconductor device assembly fixture. Exemplarily, the material of the positioning plate 100 can be high-strength aluminum alloy, stainless steel, engineering plastics, or ceramic materials. In some examples, the positioning plate 100 is rectangular flat, which facilitates alignment and stacking with subsequent structures such as the receiving plate 200 and carrier 400, and offers mature processing technology and low cost. In other examples, the positioning plate 100 is circular flat, suitable for batch assembly of circular semiconductor devices, maximizing the utilization of the support area. In still other examples, the positioning plate 100 is an irregular polygon, which can be adapted to the spatial layout of specific assembly stations, improving space utilization.

[0033] The number of positioning portions 110 matches the number of semiconductor devices to be assembled. For example, there may be two, four, six or more positioning portions 110. As an example, multiple positioning portions 110 are spaced apart along the length or width direction of the positioning plate 100. In some examples, the positioning portions 110 are spaced apart on the positioning plate 100 in a manner that allows for equal spacing along the length direction, equal spacing along the width direction, or a matrix-like spacing along both the length and width directions. When the positioning portions 110 are arranged in a matrix-like manner, simultaneous batch assembly of multiple semiconductor devices can be achieved.

[0034] The number of positioning channels 111 should cover the number of pins in most semiconductor devices. In some examples, the array configuration includes rectangular arrays, circular arrays, diamond arrays, etc. In some examples, the multiple positioning channels 111 arrays are arranged in a circumferential uniform array along the positioning portion 110, a linear array along the length of the positioning portion 110, or an interleaved array along the plane of the positioning portion 110. Circumferential uniform arrays are suitable for circular semiconductor devices, and linear arrays are suitable for strip semiconductor devices.

[0035] In some examples, the positioning channel 111 is a cylindrical hole with a smooth inner wall, facilitating the smooth insertion, removal, and positioning of the anti-misoperation component 300. In some examples, the positioning channel 111 is a square hole, which, in conjunction with the square structure of the anti-misoperation component 300, restricts the circumferential rotation of the anti-misoperation component 300, improving anti-misoperation stability. In other examples, the positioning channel 111 is a stepped hole, with the larger diameter section of the stepped hole near the receiving plate 200, which can be used to accommodate the limiting structure of the anti-misoperation component 300, and the smaller diameter section near the functional surface 101, which guides the extension 310 of the anti-misoperation component 300 to extend.

[0036] The receiving plate 200 serves as a structure that supports the anti-foolproof component 300 and cooperates with the positioning plate 100. For example, the material of the receiving plate 200 may be the same as that of the positioning plate 100, or a lighter alloy material with a lower density, in order to reduce the overall weight of the fixture.

[0037] In some examples, the shape of the receiving plate 200 is the same as that of the positioning plate 100, both being rectangular, which facilitates precise alignment and stacking of the two; in some examples, the shape of the receiving plate 200 is annular, and the annular receiving plate 200 only covers the edge area of ​​the positioning plate 100, which can reduce material usage and space occupation; in other examples, the shape of the receiving plate 200 is irregular, and its outline is adapted to the distribution area of ​​the positioning part 110 on the positioning plate 100, with the support structure only set at the position corresponding to the positioning part 110.

[0038] In some examples, the receiving plate 200 is stacked on the positioning plate 100 along the thickness direction Z by means of direct bonding, stacking assisted by positioning pins, or detachable stacking via a snap-fit ​​structure. Among these, direct bonding is simple and efficient in assembly, stacking assisted by positioning pins can improve stacking accuracy, and detachable stacking via snap-fit ​​structure facilitates the disassembly and maintenance of the fixture.

[0039] The receiving surface 201 of the receiving plate 200 is the surface that contacts the anti-misalignment component 300. In some examples, the receiving surface 201 is a smooth plane, which can reduce the frictional resistance between it and the anti-misalignment component 300 and facilitate the position adjustment of the anti-misalignment component 300. In some examples, the receiving surface 201 is provided with tiny anti-slip textures, which can increase the friction with the anti-misalignment component 300 and prevent the anti-misalignment component 300 from shifting during assembly. In other examples, the receiving surface 201 is provided with a recessed area corresponding to the position of each positioning part 110. The shape of the recessed area matches the shape of the limiting part 320 of the anti-misalignment component 300, which can further improve the positioning accuracy of the anti-misalignment component 300.

[0040] In some examples, the way the anti-fooling component 300 abuts against the receiving surface 201 can be surface contact, line contact, or point contact. Surface contact abuts the force evenly, which can avoid damage caused by excessive local force on the anti-fooling component 300. Line contact and point contact abuts can reduce the contact area and reduce frictional resistance.

[0041] For example, the material of the foolproof component 300 can be rigid plastic, metal or ceramic. For example, the metal foolproof component 300 has high strength and good wear resistance, and is suitable for high-frequency assembly scenarios. The plastic foolproof component 300 has low cost, light weight and a certain degree of elasticity, which can avoid damage to semiconductor devices.

[0042] In some examples, the anti-mistake component 300 is cylindrical in shape. The cylindrical anti-mistake component 300 is easy to process and fits tightly with the cylindrical positioning channel 111, providing a stable anti-mistake effect. In some examples, the anti-mistake component 300 is stepped in shape. The stepped anti-mistake component 300 includes two sections with different diameters. The larger diameter section abuts against the receiving surface 201, and the smaller diameter section is accommodated in the positioning channel 111, which can enhance the installation stability of the anti-mistake component 300. In other examples, the anti-mistake component 300 is conical in shape. The tip of the conical anti-mistake component 300 faces the functional surface 101 of the positioning plate 100, which facilitates quick contact with the pins when the semiconductor device is installed incorrectly, thereby improving the anti-mistake response speed.

[0043] The length of the anti-mistake component 300 is set according to the thickness of the positioning plate 100 and the anti-mistake requirements, ensuring that part of it can be accommodated in the positioning channel 111, and the other part protrudes from the side of the positioning plate 100 away from the receiving plate 200. As an example, the protrusion height can ensure effective contact with the reversed pin without affecting the normal installation of the semiconductor device.

[0044] In some examples, the lower half of the anti-mistake component 300 is accommodated in the positioning channel 111 and the upper half protrudes from the functional surface 101, or the middle part of the anti-mistake component 300 is accommodated in the positioning channel 111 and the two ends protrude from the functional surface 101 and towards the receiving surface 201, respectively; among these, the method of accommodating the lower half and protruding the upper half is the most structurally stable and facilitates contact with the receiving surface 201.

[0045] In this embodiment, the positioning plate 100 provides a positioning base for the semiconductor device through a plurality of positioning parts 110 spaced apart, and the array of multiple positioning channels 111 can adapt to the distribution position of multiple pins on the semiconductor device. The receiving plate 200 is stacked on the positioning plate 100 along the thickness direction Z, providing stable support for the foolproof component 300, keeping the foolproof component 300 protruding from the functional surface 101 of the positioning plate 100. Part of the foolproof component 300 is accommodated in the positioning channel 111, and part of it protrudes from the functional surface 101, and can abut against the receiving surface 201, ensuring the installation stability and positional accuracy of the foolproof component 300. When the package shell of the semiconductor device and the DBC assembly are installed in reverse, the pins on the DBC assembly will abut against the foolproof component 300 protruding from the functional surface 101, creating a clear gap between the DBC assembly and the package shell. Operators can quickly detect the installation problem and make timely adjustments, effectively avoiding assembly failure or damage to the semiconductor device caused by installation in reverse. The array arrangement of multiple positioning parts 110 and positioning channels 111 enables the batch assembly of multiple semiconductor devices, improving assembly efficiency. At the same time, the various structural implementations of the positioning plate 100, the receiving plate 200, and the foolproof component 300 can adapt to semiconductor devices of different specifications and shapes, enhancing the versatility of the fixture and avoiding product defects.

[0046] Continue to refer to Figure 2 In one specific embodiment of this application, the anti-mistake component 300 includes an extension 310 and a limiting portion 320 connected along the thickness direction Z. The extension 310 can be accommodated in the positioning channel 111, and a portion protrudes from the side of the positioning plate 100 opposite to the receiving plate 200. The end of the limiting portion 320 opposite to the extension 310 can abut against the receiving surface 201. The outer diameter of the limiting portion 320 is larger than the inner diameter of the positioning channel 111.

[0047] In one example, the material of the foolproof component 300 is the same as that of the main body of the foolproof component 300, and can be metal, plastic, or ceramic. In some examples, the extension 310 is cylindrical in shape, and the outer diameter of the cylindrical extension 310 is adapted to the inner diameter of the positioning channel 111. It is accommodated in the positioning channel 111 by means of clearance fit or transition fit, which ensures smooth movement and avoids excessive shaking. In some examples, the extension 310 is square prism in shape. The square prism extension 310 fits with the square positioning channel 111, which can limit the circumferential rotation of the extension 310 and ensure that the protrusion of the foolproof component 300 is consistent. In other examples, the extension 310 is polygonal prism in shape. The polygonal prism extension 310 can further improve the positioning accuracy of the foolproof component 300 and avoid torsional offset during assembly.

[0048] The material of the limiting portion 320 may be the same as or different from that of the extension portion 310. For example, when different materials are selected, the limiting portion 320 may be made of a material with higher hardness to enhance the wear resistance of the contact with the receiving surface 201. In some examples, the limiting portion 320 is in the shape of a circular plate, and the outer diameter of the circular plate-shaped limiting portion 320 is larger than the inner diameter of the positioning channel 111, so that it can reliably abut against the receiving surface 201 and prevent the extension portion 310 from overextending into the positioning channel 111. In some examples, the limiting portion 320 is in the shape of a square plate, and the diagonal length of the square plate-shaped limiting portion 320 is larger than the inner diameter of the positioning channel 111, so that its edge can fit against the surface of the positioning portion 110 to improve the support stability. In other examples, the limiting portion 320 is in the shape of an annular protrusion, and the annular protrusion is arranged around the outer periphery of the extension portion 310, which can both limit the movement and reduce the amount of material used and the overall weight.

[0049] In some examples, the connection between the extension 310 and the limiting portion 320 along the thickness direction Z can be integral molding, welding, bonding, or threaded connection. As an example, the integral molding connection method has a compact structure, high strength, no assembly gap, and can prevent the two from separating during use.

[0050] In some examples, 70%-90% of the total length of the extension 310 is accommodated in the positioning channel 111, with the remaining 10%-30% protruding from the functional surface 101, which is suitable for semiconductor devices with shorter leads; or 50%-70% of the total length of the extension 310 is accommodated in the positioning channel 111, with the remaining 30%-50% protruding from the functional surface 101, which is suitable for semiconductor devices with longer leads.

[0051] In some examples, the entire end face of the limiting part 320 is in full contact with the receiving surface 201, or the edge of the end face of the limiting part 320 is in contact with the receiving surface 201. Full contact results in more even force distribution, while edge contact reduces the contact area and lowers assembly resistance.

[0052] In this embodiment, the foolproof component 300 employs a segmented structural design with an extension 310 and a limiting portion 320. The extension 310 is accommodated within the positioning channel 111 and partially protrudes, fulfilling the core function of foolproofing. The limiting portion 320, with its outer diameter larger than the inner diameter of the positioning channel 111, provides a reliable limiting effect. The connection between the extension 310 and the limiting portion 320 along the thickness direction Z ensures the overall structural strength of the foolproof component 300, preventing breakage or separation during assembly. The end of the limiting portion 320 facing away from the extension 310 abuts against the receiving surface 201, transferring the force on the foolproof component 300 to the receiving plate 200, improving the support stability of the foolproof component 300, and preventing bending or displacement of the foolproof component 300 when in contact with the pin. When the semiconductor device is installed backwards, the pins abut against the portion of the extension 310 that protrudes from the functional surface 101. Due to the limiting effect of the limiting portion 320, the extension 310 cannot move further into the positioning channel 111, thereby creating a gap between the DBC component and the housing, making the foolproof effect more reliable.

[0053] Furthermore, in some embodiments of this application, the positioning part 110 further includes a receiving channel 112, which is located on the side of the plurality of positioning channels 111 near the receiving plate 200 and is connected to the plurality of positioning channels 111; the limiting part 320 can be accommodated in the receiving channel 112.

[0054] For example, the receiving channel 112 is a through-hole structure. In some examples, the receiving channel 112 and the positioning channel 111 are integrally formed.

[0055] In some examples, the receiving channel 112 is a cylindrical hole, which is adapted to the circular sheet-like limiting part 320, allowing the limiting part 320 to be stably received therein, and the processing technology is simple; in some examples, the receiving channel 112 is a square hole or a stepped hole.

[0056] In some examples, the number of receiving channels 112 is the same as the number of positioning parts 110. Each positioning part 110 is provided with one receiving channel 112, or each positioning part 110 is provided with multiple receiving channels 112. The multiple receiving channels 112 are respectively connected to the multiple positioning channels 111 of the positioning part 110.

[0057] In some examples, each positioning part 110 is provided with a receiving channel 112, which is connected to all positioning channels 111 of the positioning part 110 to form a unified receiving space, which facilitates processing and overall reception of the limiting part 320.

[0058] As an example, the central axis of the receiving channel 112 is set parallel to the central axis of the positioning channel 111 to ensure that the extension 310 and the limiting part 320 of the anti-foolproof part 300 can be installed along the same axis, resulting in more even force distribution.

[0059] In some examples, the receiving channel 112 is connected to multiple positioning channels 111 in such a way that the inner wall of the receiving channel 112 is directly connected to the end of the positioning channel 111 to form a continuous channel structure, or the receiving channel 112 is connected to the positioning channel 111 through a transition hole, the inner diameter of which is between the receiving channel 112 and the positioning channel 111, so as to play a smooth transition role.

[0060] In some examples, the limiting part 320 can be accommodated in the receiving channel 112 in the following ways: the limiting part 320 is completely accommodated in the receiving channel 112, that is, one end of the limiting part 320 away from the extension 310 does not exceed the opening end face of the receiving channel 112; or the limiting part 320 is partially accommodated in the receiving channel 112, that is, a part of the limiting part 320 is located in the receiving channel 112, and another part protrudes from the opening end face of the receiving channel 112. The complete accommodation method can reduce the overall height of the fixture, while the partial accommodation method facilitates the contact between the limiting part 320 and the receiving surface 201.

[0061] In this embodiment, the positioning part 110 provides a dedicated receiving space for the limiting part 320 of the foolproof component 300 by providing a receiving channel 112, thus avoiding structural interference or damage caused by the exposure of the limiting part 320. The receiving channel 112 is connected to multiple positioning channels 111, ensuring that the extension part 310 of the foolproof component 300 can pass smoothly through the positioning channel 111, while the limiting part 320 can be stably received within the receiving channel 112, thereby improving the installation stability and positioning accuracy of the foolproof component 300.

[0062] Furthermore, in one embodiment of this application, the depth of the receiving channel 112 is greater than or equal to the height of the limiting portion 320.

[0063] For example, the depth of the receiving channel 112 is the distance from the end face of the positioning part 110 near the receiving plate 200 to the bottom of the receiving channel 112. The height of the limiting part 320 is the distance along the thickness direction Z from the end face of the limiting part 320 near the extension 310 to the end face away from the extension 310.

[0064] In some examples, the depth of the receiving channel 112 is equal to the height of the limiting part 320. In this case, the limiting part 320 is completely contained within the receiving channel 112, and the end face of the limiting part 320 away from the extension part 310 is flush with the end face of the positioning part 110 near the receiving plate 200. This can minimize the gap between the positioning plate 100 and the receiving plate 200, making the two stack more tightly and improving the overall structural stability of the fixture.

[0065] In some examples, the depth of the receiving channel 112 is greater than the height of the limiting part 320. When the limiting part 320 is fully contained within the receiving channel 112, a certain gap is formed between the limiting part 320 and the bottom of the receiving channel 112. This gap can be used to accommodate small debris or dust generated during the assembly process, so as to avoid affecting the normal installation and contact of the limiting part 320.

[0066] In some examples, when the positioning part 110 is an integrally formed structure, the depth of the receiving channel 112 is directly determined during processing based on the preset height of the limiting part 320, ensuring that the depth is greater than or equal to the height. When the positioning part 110 is a detachable structure, the depth of the receiving channel 112 can be adjusted by replacing positioning part 110 modules of different thicknesses to adapt to limiting parts 320 of different heights. In some examples, the inner wall of the receiving channel 112 is provided with an adjustable limiting ring. The limiting ring can move and be fixed along the depth direction of the receiving channel 112. By adjusting the position of the limiting ring, the effective depth of the receiving channel 112 can be changed, so that the same receiving channel 112 can adapt to limiting parts 320 of different heights, improving the versatility of the fixture.

[0067] In this embodiment, the design that the depth of the receiving channel 112 is greater than or equal to the height of the limiting part 320 provides sufficient space for the limiting part 320, ensuring that the limiting part 320 can be smoothly installed in the receiving channel 112 without the limiting part 320 being unable to be fully accommodated or the anti-misalignment component 300 being installed at an angle due to insufficient space. When the depth of the receiving channel 112 is equal to the height of the limiting part 320, the end face of the limiting part 320 is flush with the end face of the positioning part 110, which can form a tight abutment with the receiving surface 201, improving the support stability of the anti-misalignment component 300; when the depth of the receiving channel 112 is greater than the height of the limiting part 320, the resulting gap or elastic buffer structure can both accommodate impurities and buffer impact forces, extending the service life of the fixture.

[0068] In some embodiments of this application, the positioning plate 100 has a functional surface 101 facing away from the receiving plate 200. The functional surface 101 is a flat surface, and the positioning channel 111 includes a foolproof hole 111a, which is formed on the functional surface 101.

[0069] In some examples, the flatness error of the functional surface 101 is controlled within the range of 0.01mm-0.1mm, which is suitable for semiconductor device assembly scenarios with high installation accuracy requirements and can ensure a tight fit between the semiconductor device and the positioning plate 100. In other examples, the functional surface 101 is provided with uniformly distributed micro protrusions with a protrusion height of 0.01mm-0.03mm. The micro protrusions can not only ensure the overall flatness of the functional surface 101, but also reduce the contact area between the semiconductor device and the functional surface 101, reduce frictional resistance, and facilitate the placement and removal of the semiconductor device.

[0070] For example, the structure of the functional surface 101 as a flat surface can be achieved by mechanical grinding and polishing, or by direct molding using high-precision casting. Mechanical grinding and polishing can achieve higher flatness accuracy, while casting is more suitable for mass production and reduces costs.

[0071] In some examples, the anti-mistake hole 111a is cylindrical with a smooth inner wall, facilitating the extension and retraction of the anti-mistake component 300 extension 310 and simplifying processing. In other examples, the anti-mistake hole 111a is conical with a large-diameter end opening onto the functional surface 101 and a small-diameter end communicating with the positioning channel 111. The conical hole guides the extension 310 of the anti-mistake component 300, preventing it from shifting when extended. In still other examples, the anti-mistake hole 111a is flared with a chamfered edge at the opening, with a chamfer angle of 30°-60°, preventing sharp edges from scratching semiconductor devices or operators.

[0072] The number of anti-misalignment holes 111a is the same as the number of positioning channels 111, with multiple anti-misalignment holes 111a corresponding one-to-one with the positioning channels 111, forming an array arrangement. In some examples, the inner diameter of the anti-misalignment hole 111a is the same as the inner diameter of the positioning channel 111, forming an equal-diameter channel structure, which simplifies the manufacturing process and facilitates the smooth movement of the anti-misalignment component 300. In other examples, the inner diameter of the anti-misalignment hole 111a is slightly larger than or slightly smaller than the inner diameter of the positioning channel 111, and it is fitted with the extension 310 of the anti-misalignment component 300 through interference fit or transition fit, thereby improving the positioning accuracy of the anti-misalignment component 300 and preventing movement during assembly.

[0073] In some examples, the anti-fool hole 111a is formed on the functional surface 101 in the following ways: the anti-fool hole 111a directly penetrates the functional surface 101 and is integrally formed with the positioning channel 111; or the anti-fool hole 111a is processed on the functional surface 101 by a subsequent drilling process and is connected to the pre-processed positioning channel 111.

[0074] In this embodiment, the functional surface 101 of the positioning plate 100 is a flat surface, providing a stable and flat positioning reference for the semiconductor device, ensuring that the semiconductor device can accurately fit onto the positioning plate 100 and improving assembly accuracy. A foolproof hole 111a is formed on the functional surface 101, allowing the extension 310 of the foolproof component 300 to protrude directly from the functional surface 101, shortening the distance between the foolproof component 300 and the semiconductor device pins, and improving the sensitivity of the foolproof response. When the semiconductor device is installed backwards, the pins can quickly contact the extension 310 of the foolproof component 300 protruding from the functional surface 101. Due to the flatness of the functional surface 101, the contact force between the pins and the foolproof component 300 is uniform, resulting in a stable spacing, making it easy for operators to quickly identify the installation error.

[0075] Specifically, such as Figures 3 to 6 As shown, in some embodiments of this application, the receiving plate 200 includes a plurality of first positioning posts 210, and the positioning plate 100 includes a plurality of first positioning holes 120, which are located on opposite sides of a plurality of positioning portions 110; a portion of the first positioning post 210 is accommodated in the first positioning hole 120, and another portion protrudes from the positioning plate 100.

[0076] The first positioning post 210 is a protruding structure disposed on the side of the receiving plate 200 facing the positioning plate 100. The material of the first positioning post 210 may be the same as or different from that of the receiving plate 200. In one example, the material of the first positioning post 210 may be a metal material with higher hardness to enhance positioning accuracy and wear resistance.

[0077] In some examples, the first positioning post 210 is cylindrical in shape. Cylindrical positioning posts are easy to process and provide uniform circumferential positioning, making it easy to mate with the first positioning hole 120. In some examples, the first positioning post 210 is square in shape. The square positioning post mates with the square first positioning hole 120, which can limit the relative rotation between the receiving plate 200 and the positioning plate 100 and improve the stacking accuracy. In other examples, the first positioning post 210 is conical in shape, with the tip of the conical positioning post facing the positioning plate 100, which facilitates the insertion of the positioning post into the first positioning hole 120 and improves assembly efficiency.

[0078] For example, the number of first positioning posts 210 is 2, 4, 6 or more, and the multiple first positioning posts 210 are symmetrically distributed on the edge area of ​​the receiving plate 200. In some examples, the number of first positioning posts 210 is 4, which are respectively set at the four corners of the receiving plate 200 to form a stable four-point positioning structure to ensure the precise alignment of the receiving plate 200 and the positioning plate 100; in some examples, the number of first positioning posts 210 is 2, which are symmetrically arranged on both sides of the length direction of the receiving plate 200, with a simple structure and convenient assembly.

[0079] In some examples, the length of the first positioning post 210 is 1.2 to 1.5 times the thickness of the positioning plate 100, with 70% to 80% of it accommodated in the first positioning hole 120 and 20% to 30% protruding from the positioning plate 100. The protruding portion can be used for subsequent positioning and mating with the carrier 400. In some examples, the length of the first positioning post 210 is 1.5 to 2 times the thickness of the positioning plate 100, with 50% to 60% of it accommodated in the first positioning hole 120 and 40% to 50% protruding from the positioning plate 100. This is suitable for scenarios requiring positioning and mating with multi-layer structures.

[0080] In some examples, the first positioning hole 120 is cylindrical and mates with the cylindrical first positioning post 210 using a clearance fit, which facilitates the insertion and removal of the positioning post. In some examples, the first positioning hole 120 is square and mates with the square first positioning post 210 using a transition fit, which improves positioning accuracy. In other examples, the first positioning hole 120 is stepped, with the larger diameter section of the stepped hole close to the receiving plate 200 to facilitate the insertion of the first positioning post 210, and the smaller diameter section mates with the main body of the first positioning post 210 to ensure positioning accuracy.

[0081] In some examples, the first positioning holes 120 are located on both sides of the positioning plate 100 along the length direction and are distributed in the same direction as the positioning part 110 along the length direction, ensuring that the receiving plate 200 and the positioning plate 100 are accurately aligned along the length direction; in some examples, the first positioning holes 120 are located on both sides of the positioning plate 100 along the width direction and are distributed in the same direction as the positioning part 110 along the width direction, ensuring the alignment accuracy along the width direction.

[0082] In some examples, the lower half of the first positioning post 210 is accommodated in the first positioning hole 120, and the upper half protrudes from the functional surface 101 of the positioning plate 100; or the upper half of the first positioning post 210 is accommodated in the first positioning hole 120, and the lower half protrudes from one side of the receiving plate 200 of the positioning plate 100. The former is suitable for positioning engagement with the carrier 400, and the latter is suitable for positioning engagement with other auxiliary structures.

[0083] In some examples, the first positioning pin 210 and the first positioning hole 120 can be fitted with a clearance fit, a transition fit, or an interference fit.

[0084] In this embodiment, the receiving plate 200 engages with the first positioning hole 120 of the positioning plate 100 via the first positioning post 210, achieving precise stacking and positioning of the receiving plate 200 and the positioning plate 100. This prevents misalignment during stacking, ensuring that the foolproof component 300 can accurately align with the positioning channel 111 and improving the reliability of the foolproof function. The first positioning post 210 protrudes from the positioning plate 100, providing a basis for subsequent positioning and engagement with the carrier 400 or other structures, facilitating precise assembly of multiple structures. Simultaneously, the adjustable length design of the first positioning post 210 enhances the versatility of the fixture, adapting to positioning plates 100 of different thicknesses and different assembly scenarios. Through the engagement of the first positioning post 210 and the first positioning hole 120, the stacking stability of the receiving plate 200 and the positioning plate 100 is significantly improved. During batch assembly, this ensures consistent positioning accuracy for each semiconductor device, improving the consistency and pass rate of assembled products.

[0085] Further, refer to Figures 1 to 4 In one optional embodiment of this application, the positioning part 110 includes a second positioning post 113, which is connected to one end of the positioning plate 100 away from the receiving plate 200; and / or, a plurality of positioning channels 111 are located around the second positioning post 113.

[0086] The second positioning post 113 is a protruding structure connected to the end of the positioning plate 100 opposite to the receiving plate 200. Exemplarily, the material of the second positioning post 113 may be the same as or different from that of the positioning part 110. For example, the second positioning post 113 can be made of a high-strength metal material to enhance the positioning effect and wear resistance. In some examples, the shape of the second positioning post 113 is cylindrical, polygonal, stepped, or similar.

[0087] For example, the number of second positioning posts 113 is one, two, three or more, and each positioning part 110 is provided with one or more second positioning posts 113. In some examples, each positioning part 110 is provided with one second positioning post 113, which is located at the center of the positioning part 110. This structure is simple and can realize the center positioning of the semiconductor device.

[0088] In some examples, the second positioning post 113 can be connected to the positioning plate 100 by integral molding, bolt connection, welding, plug-in or adhesive bonding. The second positioning post 113 can be connected to the end of the positioning plate 100 away from the receiving plate 200 by directly connecting to the end face of the positioning part 110, or connecting to the side of the positioning part 110 and extending in the direction away from the receiving plate 200.

[0089] In some examples, multiple positioning channels 111 are evenly distributed around the second positioning post 113 to form a ring array; in other examples, multiple positioning channels 111 are linearly distributed along the length of the second positioning post 113 to form a strip array.

[0090] In this embodiment, the second positioning post 113 is connected to the end of the positioning plate 100 opposite to the receiving plate 200. It can directly mate with the positioning holes of the semiconductor device, providing precise pre-positioning for the semiconductor device and ensuring accurate mounting position of the semiconductor device on the positioning plate 100, so that the pins correspond to the positions of the positioning channels 111. Multiple positioning channels 111 are located around the second positioning post 113, which can adapt to the common structure of semiconductor device pins distributed around the positioning holes, improving the versatility of the fixture. The setting of the second positioning post 113 simplifies the positioning operation of the semiconductor device, improves the assembly efficiency, and the multi-positioning structure ensures the stability and consistency of the assembly process.

[0091] Additionally, refer to Figure 7 and Figure 8 As shown (where, Figure 7 and Figure 8 (The semiconductor device shown in the figure only illustrates the package of the semiconductor device). In one embodiment of this application, the semiconductor device assembly fixture also includes a carrier 400. The carrier 400 can be stacked in the thickness direction Z on the side of the positioning plate 100 away from the receiving plate 200. The carrier 400 includes a plurality of placement holes 401, which are opposite to the positioning part 110 and can expose the positioning part 110.

[0092] In some examples, the vehicle 400 may be made of aluminum alloy, stainless steel, engineering plastics, or composite materials. In some examples, the vehicle 400 may be rectangular, flat, frame-like, or irregularly shaped.

[0093] In some examples, the carrier 400 is directly attached to and stacked on the functional surface 101 of the positioning plate 100, resulting in a compact structure and high positioning accuracy. In some examples, the carrier 400 is stacked with the positioning plate 100 through a positioning structure. In other examples, a portion of the carrier 400 is attached to the positioning plate 100, while a portion of the carrier 400 is spaced apart from the positioning plate 100. For example, the positioning part 110 is spaced apart from the carrier 400.

[0094] The storage hole 401 is a through-hole structure provided on the carrier 400, and its number is the same as the number of positioning parts 110, with each storage hole 401 corresponding to one positioning part 110. In some examples, the shape of the storage hole 401 is circular, square, or other polygonal, which is determined based on the structure of the packaging shell and is matched with the packaging shell.

[0095] For example, the carrier 400 can be stacked along the thickness direction Z on the side of the positioning plate 100 away from the receiving plate 200 by means of positioning pins and positioning holes to achieve stacking positioning, or by means of a snap-fit ​​structure to achieve detachable stacking, or by means of a magnetic structure to achieve rapid stacking.

[0096] In some examples, the placement hole 401 is opposite to the positioning part 110 and the positioning part 110 is exposed in such a way that the central axis of the placement hole 401 coincides with the central axis of the positioning part 110, ensuring that the positioning part 110 is completely exposed.

[0097] In this embodiment, the carrier 400 provides a dedicated support structure for the semiconductor device 500, facilitating the batch placement and transfer of the semiconductor device 500 and improving assembly efficiency. The carrier 400 is stacked along the thickness direction Z on the side of the positioning plate 100 opposite to the receiving plate 200, exposing the positioning part 110 through the placement hole 401. This ensures that the semiconductor device 500 can precisely mate with the positioning part 110 without affecting the error-proof function of the foolproof component 300. Through the support and positioning provided by the carrier 400, the positional stability of the semiconductor device 500 during assembly is significantly improved, preventing displacement or dropping during handling. It also facilitates batch operations by operators, reducing labor intensity and improving assembly consistency and pass rate.

[0098] Specifically, in some optional embodiments of this application, the carrier 400 includes a second positioning hole 402, and the receiving plate 200 includes a plurality of first positioning posts 210, a portion of which is accommodated in the second positioning hole 402.

[0099] The second positioning hole 402 is a through hole structure provided on the carrier 400. The second positioning hole 402 is adapted to the first positioning post 210 and is used to achieve precise positioning of the carrier 400 with the positioning plate 100 and the receiving plate 200. In some examples, the shape of the second positioning hole 402 is a cylindrical hole, a square hole, or a conical hole, etc.

[0100] For example, the number of second positioning holes 402 is the same as the number of first positioning posts 210, and the multiple second positioning holes 402 are distributed along the edge region of the carrier 400, corresponding to the distribution position of the first positioning posts 210.

[0101] In some examples, the inner diameter of the second positioning hole 402 is adapted to the outer diameter of the first positioning post 210. In some examples, the inner diameter of the second positioning hole 402 is larger than the outer diameter of the first positioning post 210, forming a clearance fit, which facilitates the quick assembly and disassembly of the carrier 400. In some examples, the inner diameter of the second positioning hole 402 is the same as the outer diameter of the first positioning post 210, forming a transition fit, which balances accuracy and convenience. In other examples, the inner diameter of the second positioning hole 402 is smaller than the outer diameter of the first positioning post 210, forming an interference fit, which is suitable for scenarios where frequent disassembly is not required and provides the highest positioning accuracy.

[0102] In some examples, the portion of the first positioning post 210 protruding from the positioning plate 100 is fully or partially accommodated in the second positioning hole 402. When fully accommodated, the lower surface of the carrier 400 fits against the functional surface 101 of the positioning plate 100, resulting in a compact structure; when partially accommodated, the portion of the first positioning post 210 protruding from the second positioning hole 402 can be used for positioning engagement with other structures or for limiting the position.

[0103] In some examples, the engagement between the first positioning pin 210 and the second positioning hole 402 can be achieved by direct insertion, or further secured by threaded connection, snap-fit ​​connection, etc. The direct insertion method is simple to operate, while the threaded connection and snap-fit ​​connection methods improve the connection stability.

[0104] In this embodiment, the carrier 400 engages with the first positioning post 210 of the receiving plate 200 via the second positioning hole 402, achieving precise positioning of the carrier 400, positioning plate 100, and receiving plate 200. This ensures that the placement hole 401 of the carrier 400 accurately exposes the positioning part 110, and that the semiconductor device 500 precisely corresponds to the positioning channel 111 and the foolproof component 300, improving the reliability of the foolproof function and assembly accuracy. The first positioning post 210 is partially or completely accommodated in the second positioning hole 402, ensuring both positioning effectiveness and flexible adaptation to different stacked structure requirements. Through precise positioning of the three components, the positional consistency of the semiconductor device 500 during assembly is significantly improved, avoiding misalignment of pins with the positioning channel 111 due to structural offset, ensuring the effective implementation of the foolproof function, and simultaneously improving the efficiency of batch assembly and product qualification rate.

[0105] Some embodiments of this application provide a semiconductor device 500 assembly assembly, including a semiconductor device 500 and a semiconductor device assembly fixture of the above embodiments. The semiconductor device 500 includes a plurality of pins. In the assembled state, in a plane perpendicular to the thickness direction Z, the orthographic projection of the plurality of pins is located within the orthographic projection of the positioning channel 111 and is offset from the orthographic projection of the anti-fooling component 300.

[0106] In some examples, the pins of the semiconductor device 500 are raised structures disposed on the DBC assembly. The pins can be made of metal or alloy, and have good conductivity and structural strength. Exemplarily, the number of pins is 2, 4, 6 or more, and the distribution of the multiple pins is adapted to the positioning channel 111 array of the positioning plate 100.

[0107] In some examples, multiple pins are of the same length, which facilitates processing and assembly; in other examples, multiple pins are of different lengths, which can be flexibly set according to their distribution and mistaken-proofing priority, with longer pins in critical positions to improve mistaken-proofing reliability; in still other examples, the length of the pins can be adjusted by an adjustment structure to accommodate mistaken-proofing components 300 of different heights.

[0108] In one example, the orthographic projection of the pin is located exactly in the center of the orthographic projection of the positioning channel 111, ensuring that it is completely misaligned with the orthographic projection of the foolproof component 300, so as not to affect normal assembly.

[0109] In some examples, the orthographic projection of the pin is located within the orthographic projection of the positioning channel 111 by the positioning hole of the semiconductor device 500 and the second positioning post 113, ensuring that the pin can be accurately aligned with the positioning channel 111; or by the cooperation of the placement hole 401 of the carrier 400 and the positioning part 110, the alignment of the pin with the positioning channel 111 can be indirectly achieved.

[0110] In one example, the orthographic projection of the pin is offset from the orthographic projection of the anti-foolproof element 300 by adjusting the mounting position of the anti-foolproof element 300 within the positioning channel 111, such that the anti-foolproof element 300 is located on one side of the positioning channel 111 and the pin is located on the other side of the positioning channel 111.

[0111] In this embodiment, the semiconductor device 500 assembly assembly achieves a foolproof function during the assembly process by cooperating with the positioning channel 111 and the foolproof component 300 of the assembly fixture through the pins of the semiconductor device 500. In the correct assembly state, the orthogonal projection of the pin is located within the positioning channel 111 and offset from the foolproof component 300, preventing contact between the pin and the foolproof component 300, allowing the semiconductor device 500 to be smoothly installed in place. When the semiconductor device 500 is installed backwards, the pin position shifts and overlaps with the orthogonal projection of the foolproof component 300, causing the pin to abut against the foolproof component 300, creating a gap between the DBC assembly and the housing. This allows operators to quickly detect and adjust the installation, preventing assembly failure due to reverse installation. The projection relationship between the pins, the positioning channel 111, and the foolproof component 300 ensures the accurate implementation of the foolproof function without affecting the normal assembly process, thus improving assembly efficiency and product qualification rate.

[0112] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A semiconductor device assembly fixture, characterized in that, include: A positioning plate includes a plurality of positioning parts spaced apart, each positioning part having a plurality of positioning channels arranged along its own thickness direction, the plurality of positioning channels being arranged in an array; A receiving plate, which can be stacked on the positioning plate along the thickness direction, and the receiving plate includes a receiving surface; Multiple anti-mistake components are provided, a portion of which can be accommodated in the positioning channel, and a portion of which can protrude from the side of the positioning plate opposite to the receiving plate. The anti-mistake components can abut against the receiving surface.

2. The semiconductor device assembly fixture according to claim 1, characterized in that, The anti-mistake component includes an extension and a limiting portion connected along the thickness direction. The extension can be accommodated in the positioning channel, and a portion protrudes from the side of the positioning plate opposite to the receiving plate. The end of the limiting part that is away from the extension part can abut against the receiving surface, and the outer diameter of the limiting part is larger than the inner diameter of the positioning channel.

3. The semiconductor device assembly fixture according to claim 2, characterized in that, The positioning part further includes a receiving channel, which is located on the side of the plurality of positioning channels closer to the receiving plate, and the receiving channel is connected to the plurality of positioning channels; The limiting part can be accommodated within the accommodating channel.

4. The semiconductor device assembly fixture according to claim 3, characterized in that, The depth of the receiving channel is greater than or equal to the height of the limiting part.

5. The semiconductor device assembly fixture according to claim 1, characterized in that, The positioning plate has a functional surface facing away from the receiving plate. The functional surface is a flat surface. The positioning channel includes a foolproof hole, which is formed on the functional surface.

6. The semiconductor device assembly fixture according to any one of claims 1 to 5, characterized in that, The receiving plate includes a plurality of first positioning posts, and the positioning plate includes a plurality of first positioning holes, which are located on opposite sides of the plurality of positioning parts. A portion of the first positioning post is accommodated in the first positioning hole, and another portion protrudes from the positioning plate.

7. The semiconductor device assembly fixture according to any one of claims 1 to 5, characterized in that, The positioning part includes a second positioning post, which is connected to the end of the positioning plate away from the receiving plate; And / or, the plurality of positioning channels are located around the periphery of the second positioning post.

8. The semiconductor device assembly fixture according to any one of claims 1 to 5, characterized in that, It also includes a carrier that can be stacked along the thickness direction on the side of the positioning plate opposite to the receiving plate. The carrier includes a plurality of placement holes that are opposite to the positioning part and can expose the positioning part.

9. The semiconductor device assembly fixture according to claim 8, characterized in that, The carrier includes a second positioning hole, and the receiving plate includes a plurality of first positioning posts, a portion of which is accommodated in the second positioning hole.

10. A semiconductor device assembly, characterized in that, The invention includes a semiconductor device and a semiconductor device assembly fixture according to any one of claims 1 to 9, wherein the semiconductor device includes a plurality of pins; In the assembled state, in a plane perpendicular to the thickness direction, the orthographic projection of the plurality of pins lies within the orthographic projection of the positioning channel and is offset from the orthographic projection of the anti-foolproof component.

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