A substrate for an optical assembly

Abstract

The utility model discloses a kind of substrate for optical assembly, belong to substrate field, including mounting plate, the mounting plate is fixedly connected with heat dissipation disc, the heat dissipation disc is symmetrically arranged with assembly plate and heat dissipation piece along the center of circle, the assembly plate is equipped with rectangular cavity, first graphite heat conduction sheet in the heat dissipation piece is installed in the rectangular cavity, the first graphite heat conduction sheet is connected with second graphite heat conduction sheet, and the second graphite heat conduction sheet is connected on heat dissipation side plate;By symmetrically arranging assembly plate and heat dissipation piece along the center of circle on heat dissipation disc, first graphite heat conduction sheet is directly embedded in the rectangular cavity of assembly plate, and first graphite heat conduction sheet and second graphite heat conduction sheet connected with heat dissipation side plate directly link, compared with prior art only graphite heat conduction strip is arranged in the outer edge of aluminum substrate, heat needs to be conducted transversely through the design of aluminum substrate, the direct connection of the present scheme through heat conduction sheet and heat dissipation side plate, avoids the thermal resistance bottleneck brought by aluminum substrate insulating layer.

Description

Technical Field

[0001] This utility model belongs to the field of substrate technology, and specifically relates to a substrate for optical components. Background Technology

[0002] Optical component substrates are the core carriers and functional carriers of optoelectronic devices. Essentially, they are specialized basic components that integrate multiple functions such as mechanical support, electrical interconnection, optical adaptation, and heat dissipation management. They are widely used in fields that rely on optical signal transmission / detection, such as communications, data centers, industrial control, medical equipment, and consumer electronics.

[0003] According to the authorization announcement number CN203857423U, a mounting substrate for LED light-emitting components is known prior art. Although the patent has a simple and reasonable structure, is easy to install and use, and adopts a design of setting graphite heat-conducting strips on the outside of an elliptical aluminum substrate, which effectively improves the heat conduction speed and allows the heat emitted by the LED light-emitting components to dissipate quickly, making it less likely for heat island effects to occur in the middle, thus slowing down the aging speed of the LED light-emitting components and ensuring the lighting effect and service life of LED lamps, the technical solution of this patent still has the following defects in actual use: the graphite heat-conducting strips in this patent are only arranged along the outer edge of the elliptical aluminum substrate, and the LED light-emitting components are distributed around the circular opening. The heat in the middle area needs to be conducted through the aluminum substrate to the outer edge heat-conducting strips, resulting in a long conduction path, low efficiency, and a tendency for local heat accumulation. Utility Model Content

[0004] The purpose of this invention is to provide a substrate for optical components to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a substrate for optical components, including a mounting plate, a heat sink fixedly connected to the mounting plate, an assembly plate and a heat sink symmetrically arranged around the center of the heat sink, a rectangular cavity formed in the assembly plate, a first graphite thermal conductive sheet of the heat sink installed in the rectangular cavity, a second graphite thermal conductive sheet connected to the first graphite thermal conductive sheet, the second graphite thermal conductive sheet connected to a heat dissipation side plate, a heat dissipation fin array arranged at one end of the heat dissipation side plate, an insert plate mounted on the assembly plate, and an LED light-emitting plate mounted on the insert plate.

[0006] In a preferred embodiment, the rectangular cavity sidewall of the assembly plate has a connecting cavity, through which the second graphite heat-conducting sheet passes and connects to the first graphite heat-conducting sheet.

[0007] In a preferred embodiment, the second graphite heat-conducting sheet extends outward to form a third graphite heat-conducting sheet, the outer dimensions of which match the top dimensions of the heat dissipation side plate, and the third graphite heat-conducting sheet is in close contact with the top surface of the heat dissipation side plate.

[0008] In a preferred embodiment, the heat dissipation side plate has snap-fit ​​blocks extending from both ends. The snap-fit ​​blocks on both sides snap into the slots opened on both sides of the mounting plate and are installed in a detachable manner with bolts.

[0009] In a preferred embodiment, the mounting plate has a heat-conducting cavity, in which multiple sets of graphite heat-conducting pillars are installed. The tops of the multiple sets of graphite heat-conducting pillars abut against a heat-conducting base, and the LED light-emitting plate is fixedly connected to the heat-conducting base.

[0010] In a preferred embodiment, the heat-conducting base has a conductive cavity, the size of which is adapted to the size of the LED light-emitting panel.

[0011] In a preferred embodiment, a heat dissipation groove is provided at the center of the heat dissipation plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are: The substrate for this optical component uses an assembly plate and a heat sink symmetrically arranged along the center of the heat sink. The first graphite thermal conductive sheet is directly embedded in the rectangular cavity of the assembly plate, and the first graphite thermal conductive sheet is directly connected to the second graphite thermal conductive sheet connected to the heat sink side plate. Compared with the existing technology where only graphite thermal conductive strips are arranged on the outer edge of the aluminum substrate and heat needs to be conducted laterally through the aluminum substrate, this solution avoids the thermal resistance bottleneck caused by the insulation layer of the aluminum substrate by directly connecting the thermal conductive sheet to the heat sink side plate. The substrate of this optical component is attached to the conductive cavity of the heat-conducting seat through an LED light-emitting plate. The core heat generated in the center is directly transferred to multiple sets of graphite heat-conducting pillars through the heat-conducting seat, and then quickly introduced into the first graphite heat-conducting sheet in the rectangular cavity by the graphite heat-conducting pillars, so that the heat in the center is directly connected with the outer heat dissipation system, thereby improving the heat dissipation efficiency. Attached Figure Description

[0013] Figure 1 This is a first-view view of the overall structure of this utility model; Figure 2 This is a second-view view of the overall structure of this utility model; Figure 3 This is a schematic diagram of the heat-conducting base installation structure of this utility model; Figure 4 This is a schematic diagram of the heat dissipation component of the present invention.

[0014] In the diagram: 1. Mounting plate; 11. Slot; 2. Heat sink; 3. Heat sink groove; 4. Assembly plate; 41. Rectangular cavity; 411. Connecting cavity; 5. Heat sink component; 51. First graphite heat-conducting sheet; 52. Second graphite heat-conducting sheet; 521. Third graphite heat-conducting sheet; 53. Heat sink side plate; 531. Snap-fit ​​block; 54. Heat sink fin assembly; 6. Mounting plate; 61. Heat conduction cavity; 611. Graphite heat conduction column; 62. Heat conduction base; 621. Conduction cavity; 7. LED light-emitting board. Detailed Implementation

[0015] The present invention will be further described below with reference to the embodiments.

[0016] The following embodiments are used to illustrate the present invention, but should not be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.

[0017] Please see Figures 1-4 This utility model provides a substrate for optical components, including a mounting plate 1, a heat sink 2 fixedly connected to the mounting plate 1, an assembly plate 4 and a heat sink 5 symmetrically arranged around the center of the heat sink 2, a rectangular cavity 41 is formed in the assembly plate 41, a first graphite heat-conducting sheet 51 of the heat sink 5 is installed in the rectangular cavity 41, a second graphite heat-conducting sheet 52 is connected to the first graphite heat-conducting sheet 51, the second graphite heat-conducting sheet 52 is connected to a heat dissipation side plate 53, a heat dissipation fin group 54 is arranged in an array at one end of the heat dissipation side plate 53, and an embedding plate 6 is mounted on the assembly plate 4, and an LED light-emitting plate 7 is mounted on the embedding plate 6.

[0018] In this embodiment, the assembly plate 4 and the heat sink 5 are symmetrically arranged around the center of the heat sink 2. The first graphite heat-conducting sheet 51 is directly embedded in the rectangular cavity 41 of the assembly plate 4, and the first graphite heat-conducting sheet 51 is directly connected to the second graphite heat-conducting sheet 52 connected to the heat dissipation side plate 53. The heat conduction path is constructed as "LED light-emitting board 7 → embedding plate 6 → assembly plate 4 → first graphite heat-conducting sheet 51 → second graphite heat-conducting sheet 52 → heat dissipation side plate 53 → heat dissipation fin group 54". Compared with the prior art, which only arranges heat-conducting strips on the outer edge of the aluminum substrate and the heat needs to be conducted laterally through the aluminum substrate, this solution avoids the thermal resistance of the aluminum substrate insulation layer and improves the heat conduction efficiency.

[0019] Please see Figures 1 to 3 The rectangular cavity 41 of the assembly plate 4 has a connecting cavity 411 through its side wall, and the second graphite heat-conducting sheet 52 passes through the connecting cavity 411 and connects with the first graphite heat-conducting sheet 51.

[0020] In this embodiment, a connecting cavity 411 is provided on the side wall of the rectangular cavity 41, so that the second graphite heat-conducting sheet 52 can pass through the connecting cavity 411 laterally along the side wall and connect with the first graphite heat-conducting sheet 51 of the rectangular cavity 41. Through this connection path, the compact assembly of the heat sink 5 and the mounting plate 4 is ensured, and spatial interference with components such as the mounting plate 6 and the LED light-emitting plate 7 is avoided.

[0021] Please see Figures 2 to 4 The second graphite heat-conducting sheet 52 extends outward to form a third graphite heat-conducting sheet 521. The outer dimensions of the third graphite heat-conducting sheet 521 match the top dimensions of the heat dissipation side plate 53, and the third graphite heat-conducting sheet 521 is in close contact with the top surface of the heat dissipation side plate 53.

[0022] In this embodiment, the third graphite heat-conducting sheet 521 is integrally extended from the second graphite heat-conducting sheet 52, and its external dimensions match the top of the heat dissipation side plate 53. After the two are tightly bonded together with thermal grease, the contact area is increased. With the help of the high thermal conductivity of graphite material, the heat conducted by the second graphite heat-conducting sheet 52 can be quickly transferred to the heat dissipation side plate 53, and then efficiently dissipated through the heat dissipation fin assembly 54.

[0023] Please see Figure 3 The heat dissipation side plate 53 has snap-fit ​​blocks 531 extending from both ends. The snap-fit ​​blocks 531 on both sides snap into the slots 11 opened on both sides of the mounting plate 1 and are installed in a detachable manner with bolts.

[0024] In this embodiment, when the heat sink fin assembly 54 is dusty or damaged, or when the density of the heat sink fins needs to be adjusted according to the power of the LED light-emitting board 7, the bolts can be loosened directly to remove the heat sink side plate 53, making it easy to replace the heat sink side plate 53.

[0025] Please see Figure 1 and Figure 3 The mounting plate 6 has a heat conduction cavity 61, and multiple sets of graphite heat conduction columns 611 are installed in the heat conduction cavity 61. The top of the multiple sets of graphite heat conduction columns 611 abuts against a heat conduction seat 62. The LED light-emitting board 7 is fixedly connected to the heat conduction seat 62. The heat conduction seat 62 has a conduction cavity 621, and the size of the conduction cavity 621 is adapted to the size of the LED light-emitting board 7.

[0026] In this embodiment, the heat generated in the central core of the LED light-emitting plate 7 is directly transferred to multiple sets of graphite heat-conducting columns 611 through the heat-conducting seat 62 via the heat-conducting seat 62. Then, the heat is quickly introduced into the first graphite heat-conducting sheet 51 in the rectangular cavity 41 by the graphite heat-conducting columns 611, so that the heat in the center is directly connected with the outer heat dissipation system, thereby improving the heat dissipation efficiency.

[0027] Please see Figure 1 , Figure 2 A heat dissipation groove 3 is provided at the center of the heat dissipation plate 2.

[0028] In this embodiment, the heat dissipation groove 3 forms a hollow heat conduction channel, which accelerates the air circulation in the central area of ​​the heat dissipation plate 2.

[0029] Working principle and usage process of this utility model: When the LED light-emitting board 7 is working, the heat generated is divided into the central core heat and the outer edge heat. The central heat is received by the heat conduction cavity 621 of the heat conduction seat 62 adapted to the LED light-emitting board 7, and is quickly introduced into the heat sink 2 through multiple sets of high thermal conductivity graphite heat conduction columns 611. Some of the heat is directly dissipated through the hollow channel formed by the heat dissipation groove 3 at the center of the heat sink 2 by means of air convection. The other part of the heat is transferred to the first graphite heat conduction sheet 51 in the rectangular cavity 41, and merges with the outer edge heat. Heat from the outer edge is transferred to the mounting plate 4 via the mounting plate 6, absorbed by the first graphite heat-conducting sheet 51 in the rectangular cavity 41, connected to the second graphite heat-conducting sheet 52 via the connecting cavity 411, and then quickly introduced into the heat dissipation side plate 53 via the integrally extended third graphite heat-conducting sheet 521 (closely attached to the heat dissipation side plate 53), and finally efficiently dissipated by the array-type heat dissipation fin group 54.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A substrate for an optical component, comprising a mounting plate (1), characterized in that: A heat sink (2) is fixedly connected to the mounting plate (1). The heat sink (2) is symmetrically arranged with an assembly plate (4) and a heat sink (5) along the center. The assembly plate (4) has a rectangular cavity (41). The first graphite heat-conducting sheet (51) of the heat sink (5) is installed in the rectangular cavity (41). The first graphite heat-conducting sheet (51) is connected to a second graphite heat-conducting sheet (52). The second graphite heat-conducting sheet (52) is connected to a heat dissipation side plate (53). A heat dissipation fin group (54) is arranged in an array at one end of the heat dissipation side plate (53). An embedding plate (6) is mounted on the assembly plate (4). An LED light-emitting plate (7) is installed on the embedding plate (6).

2. The substrate for an optical component according to claim 1, characterized in that: The rectangular cavity (41) of the assembly plate (4) has a connecting cavity (411) on its side wall, through which the second graphite heat-conducting sheet (52) passes and connects to the first graphite heat-conducting sheet (51).

3. The substrate for an optical component according to claim 2, characterized in that: The second graphite heat-conducting sheet (52) extends outward to form a third graphite heat-conducting sheet (521). The outer dimensions of the third graphite heat-conducting sheet (521) match the top dimensions of the heat dissipation side plate (53), and the third graphite heat-conducting sheet (521) is in close contact with the top surface of the heat dissipation side plate (53).

4. The substrate for an optical component according to claim 3, characterized in that: The heat dissipation side plate (53) has snap-fit ​​blocks (531) extending from both ends. The snap-fit ​​blocks (531) on both sides are snapped into the slots (11) opened on both sides of the mounting plate (1) and can be installed in a detachable manner with bolts.

5. A substrate for an optical component according to claim 1, characterized in that: The mounting plate (6) has a heat-conducting cavity (61) and multiple sets of graphite heat-conducting columns (611) are installed in the heat-conducting cavity (611). The top of the multiple sets of graphite heat-conducting columns (611) abuts against a heat-conducting seat (62). The LED light-emitting plate (7) is fixedly connected to the heat-conducting seat (62).

6. A substrate for an optical component according to claim 5, characterized in that: The heat-conducting base (62) has a conductive cavity (621), the size of which is adapted to the size of the LED light-emitting plate (7).

7. A substrate for an optical component according to claim 1, characterized in that: The heat sink (2) has a heat dissipation groove (3) at its center.

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