Semiconductor heater water passing heating device

Abstract

The utility model belongs to the technical field of semiconductor heater, concretely is a kind of semiconductor heater water heating device, including heat exchange tube and its outside the outer sheath of set, it is characterized in that, still include: heat exchange cover, with the fixed connection of outer sheath, heat exchange cover and the outer wall of heat exchange tube closely adhere to, outer sheath is inlayed and is equipped with the multiple PTC heating sheet of circumferential arrangement, and PTC heating sheet and the outer wall of heat exchange cover closely adhere to;Heat exchange rib, with the fixed connection of heat exchange tube outer wall, the position of heat exchange rib corresponds with PTC heating sheet, and it is fixedly arranged with equalizing rib between adjacent heat exchange rib;Heat exchange sheet, it is fixedly arranged in heat exchange tube, and heat exchange sheet has multiple spiral structure;The utility model improves the uniformity of heat exchange tube external thermal field, improves the heat exchange uniformity of heat exchange tube;While heat exchange sheet directly acts on water body, shorten the heat exchange path of water body and heat source far from the side wall of heat exchange tube, by spiral structure induction water flow rotation mixing, further improve the heat exchange uniformity of water flow in pipe.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor heater technology, and in particular relates to a semiconductor heater water heating device. Background Technology

[0002] A water heating device is a fluid processing equipment designed to heat water in a flowing pipeline instantly and efficiently. Semiconductor heaters, with their advantages of small size, high power density, fast heating speed, and safety and reliability, have become the core heat source choice for water heating devices.

[0003] Currently, the heating elements of existing semiconductor heaters are usually arranged circumferentially. The temperature between the elements is lower than the temperature of the area directly opposite the elements, resulting in uneven temperature distribution on the outer wall of the heat exchange tube and reducing the overall heat exchange efficiency. In addition, when the fluid flows in the pipe, heat transfer mainly depends on the heat conduction through the pipe wall. Only the thin layer of water near the pipe wall can absorb heat and rise in temperature quickly, while the water in the central area is far from the pipe wall and has low heat exchange efficiency. This eventually leads to a stratification phenomenon of "high temperature at the pipe wall and low temperature at the center", resulting in poor consistency of the outlet water temperature and low overall heat utilization.

[0004] To address the aforementioned problems, this application proposes a semiconductor heater water heating device. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor heater water heating device that solves the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0007] This utility model relates to a semiconductor heater water heating device, including a heat exchange tube and an outer sheath thereof, and further comprising:

[0008] A heat exchange jacket is fixedly connected to an outer sheath. The heat exchange jacket is tightly fitted to the outer wall of the heat exchange tube. The outer sheath is embedded with a plurality of PTC heating elements arranged circumferentially, and the PTC heating elements are tightly fitted to the outer wall of the heat exchange jacket.

[0009] Heat exchange ribs are fixedly connected to the outer wall of the heat exchange tube. The positions of the heat exchange ribs correspond to the PTC heating elements. Heat equalization ribs are fixedly provided between adjacent heat exchange ribs.

[0010] The heat exchange plate is fixed inside the heat exchange tube, and the heat exchange plate has multiple spiral structures.

[0011] Furthermore, the inner wall of the heat exchange jacket is provided with groove one and groove two, which respectively fit with the heat exchange rib and the heat distribution rib. The gap between the heat exchange rib and the heat distribution rib and their corresponding groove is filled with thermally conductive silicone grease or metal thermally conductive paste.

[0012] Furthermore, the adjacent spiral structures of the heat exchange plates have opposite spiral directions.

[0013] Furthermore, the heat exchange rib has a trapezoidal cross-sectional shape.

[0014] Furthermore, standardized interfaces are fixed at both ends of the heat exchange tube.

[0015] Furthermore, the heat exchange tube, heat exchange fin, and heat distribution fin are made of the same material.

[0016] Furthermore, the heat exchange plate is made of copper.

[0017] This utility model has the following beneficial effects:

[0018] This invention forms a three-dimensional heat-equalizing structure by combining heat-equalizing ribs with heat-exchange ribs, which diffuses heat to the area between the PTC heating elements, improves the uniformity of the external heat field of the heat exchange tube, reduces the local low temperature area on the outer wall caused by the gap of the PTC heating elements, and improves the uniformity of heat exchange in the heat exchange tube.

[0019] This invention uses heat exchange plates to directly exchange heat with the fluid inside the heat exchange jacket, reducing the distance between the water body far from the heat source and the heat exchange tube wall, thus improving the overall heat exchange uniformity of the water flow. At the same time, the spiral structure guides the water body to rotate and mix, effectively breaking down and thinning the thermal boundary layer near the tube wall, further improving the heat exchange uniformity of the water flow.

[0020] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall appearance structure of this utility model;

[0023] Figure 2 This is a schematic cross-sectional view of the outer sheath of this utility model;

[0024] Figure 3 This is a cross-sectional view of the outer sheath and heat exchanger jacket of this utility model;

[0025] Figure 4 This is a schematic cross-sectional view of the heat exchange tube of this utility model;

[0026] Figure 5 This is a cross-sectional view of the heat exchanger jacket of this utility model;

[0027] The attached diagram lists the components represented by each number as follows:

[0028] In the diagram: 1. Heat exchange tube; 2. Outer sheath; 3. Heat exchange jacket; 301. Tank 1; 302. Tank 2; 4. PTC heating element; 5. Heat exchange rib; 6. Heat distribution rib; 7. Heat exchange element. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around" and other terms indicating orientation or positional relationship are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0031] Please see Figures 1 to 5 As shown, this utility model is a semiconductor heater water heating device, including a heat exchange tube 1 and an outer sheath 2. It is characterized by further comprising: a heat exchange sleeve 3, fixedly connected to the outer sheath 2, the heat exchange sleeve 3 being tightly fitted to the outer wall of the heat exchange tube 1, and the outer sheath 2 having multiple circumferentially arranged PTC heating elements 4 embedded within it, the PTC heating elements 4 being tightly fitted to the outer wall of the heat exchange sleeve 3; heat exchange ribs 5, fixedly connected to the outer wall of the heat exchange tube 1, the positions of the heat exchange ribs 5 corresponding to the PTC heating elements 4, and heat equalization ribs 6 fixedly provided between adjacent heat exchange ribs 5; and heat exchange elements 7, fixedly disposed inside the heat exchange tube 1, the heat exchange elements 7 having multiple spiral structures.

[0032] This embodiment provides a semiconductor heater water heating device. The heat exchange jacket 3 is made of aluminum alloy. The PTC heating element 4 transfers heat to the heat exchange jacket 3, and then conducts it efficiently through the heat exchange ribs 5. The heat equalization ribs 6 between adjacent heat exchange ribs 5 promote the rapid and uniform diffusion of heat in the circumference. The heat is transferred to the heat exchange ribs 5 through the heat exchange jacket 3, and then the heat is rapidly diffused in the circumference through the heat equalization ribs 6, which improves the overall heating uniformity of the heat exchange tube 1. When water flows through the heat exchange tube 1, the heat exchange element 7 concentrates the heating of the water in the area near the central axis of the tube, which makes up for the lack of heat exchange in the central area. The spiral structure of the heat exchange element 7 induces the water flow to generate rotating turbulence, which effectively destroys the thermal boundary layer and improves the uniformity and efficiency of water heat exchange.

[0033] The inner wall of the heat exchange jacket 3 is provided with groove 301 and groove 302, which respectively fit with the heat exchange rib 5 and the heat distribution rib 6. The gap between the heat exchange rib 5 and the heat distribution rib 6 and their corresponding grooves is filled with thermally conductive silicone grease or metal thermal paste. The groove 301 and groove 302 allow the heat exchange rib 5 and the heat distribution rib 6 to be precisely embedded. The thermally conductive silicone grease or metal thermal paste effectively fills the micro-voids. The thermally conductive silicone grease and metal thermal paste can also serve as a highly efficient flexible thermally conductive buffer layer, actively adapting to the thermal expansion and contraction between the components (heat exchange jacket 3, heat exchange rib 5, heat distribution rib 6) caused by changes in working temperature. By absorbing small relative displacements through their own deformation, they effectively avoid mechanical stress concentration caused by the difference in thermal expansion coefficients of different materials.

[0034] Among them, the spiral directions of adjacent spiral structures of heat exchange plate 7 are opposite. This bidirectional spiral arrangement can cause the water flow to generate alternating spiral directions, forming strong internal disturbances, thereby maximizing the water flow disturbance and mixing effect, and further improving the heat exchange uniformity.

[0035] Among them, the heat exchange rib 5 has a trapezoidal cross-section, which helps to distribute stress evenly and reduce thermal stress concentration.

[0036] Both ends of the heat exchange tube 1 are fixed with standardized interfaces. These interfaces adopt standard sizes and connection methods (such as threads or flanges) to facilitate quick installation and disassembly with external piping systems, thereby improving the equipment's versatility and interchangeability.

[0037] Among them, heat exchange tube 1, heat exchange rib 5 and heat soaking rib 6 are made of the same material, which is copper alloy, and are formed by one-piece die casting.

[0038] Among them, the heat exchange plate 7 is made of copper, which can quickly transfer heat from the PTC heating plate 4 to the fluid.

[0039] It is understood that this utility model improves the uniformity of the external thermal field of the heat exchange tube 1 and enhances the heat exchange uniformity of the heat exchange tube 1; at the same time, the heat exchange plate 7 acts directly on the water, shortening the heat exchange path between the water and the heat source away from the side wall of the heat exchange tube 1, and further improving the heat exchange uniformity of the water flow inside the tube by inducing water flow rotation and mixing through the spiral structure.

[0040] A specific application of the operation process in this embodiment is as follows: The heat exchange tube 1 is added to the pipeline through a standard structure. During operation, the PTC heating element 4 is activated, and water flows in from one end of the heat exchange tube 1. The heat is transferred to the heat exchange jacket 3 through the PTC heating element 4. The heat exchange jacket 3 transfers the heat to the three-dimensional heat-spreading frame formed by the heat exchange ribs 5 and the heat-spreading ribs 6, thereby improving the uniformity of heat exchange in the heat exchange tube 1.

[0041] When the water flows inside the heat exchange tube 1, it passes through the heat exchange plate 7. The heat exchange plate 7 can not only guide the water flow to rotate and mix, improving the uniformity of heat exchange, but also change the flow pattern and path of the water flow, indirectly extending the effective residence time of the water flow in the tube and extending the heating time.

[0042] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor heater water heating device, comprising a heat exchange tube (1) and an outer sheath (2) thereof, characterized in that, Also includes: The heat exchange sleeve (3) is fixedly connected to the outer sheath (2). The heat exchange sleeve (3) is tightly fitted to the outer wall of the heat exchange tube (1). The outer sheath (2) is embedded with a plurality of PTC heating elements (4) arranged in a circumferential direction, and the PTC heating elements (4) are tightly fitted to the outer wall of the heat exchange sleeve (3). Heat exchange ribs (5) are fixed to the outer wall of heat exchange tube (1). The position of the heat exchange ribs (5) corresponds to the PTC heating element (4). Heat equalization ribs (6) are fixed between adjacent heat exchange ribs (5). The heat exchange plate (7) is fixed inside the heat exchange tube (1), and the heat exchange plate (7) has multiple spiral structures.

2. The semiconductor heater water heating device according to claim 1, characterized in that: The inner wall of the heat exchange jacket (3) is provided with a groove one (301) and a groove two (302) that are respectively fitted with the heat exchange rib (5) and the heat distribution rib (6). The gap between the heat exchange rib (5) and the heat distribution rib (6) and their corresponding grooves is filled with thermally conductive silicone grease or metal thermally conductive paste.

3. The semiconductor heater water heating device according to claim 1, characterized in that: The adjacent spiral structures of the heat exchange plates (7) have opposite spiral directions.

4. The semiconductor heater water heating device according to claim 1, characterized in that: The heat exchange rib (5) has a trapezoidal cross-sectional shape.

5. A semiconductor heater water heating device according to claim 1, characterized in that: Both ends of the heat exchange tube (1) are fixed with standardized interfaces.

6. The semiconductor heater water heating device according to claim 1, characterized in that: The heat exchange tube (1), heat exchange rib (5) and heat distribution rib (6) are made of the same material.

7. A semiconductor heater water heating device according to claim 1, characterized in that: The heat exchange plate (7) is made of copper.

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