A silicon wafer cleaning device

Abstract

The application discloses a silicon wafer cleaning device, and belongs to the technical field of silicon wafer cleaning. The silicon wafer cleaning device comprises a cleaning tank, a first through hole is arranged on the cleaning tank, the first through hole is used for injecting liquid into the cleaning tank, the cleaning tank is provided with an opening, and the opening is used for overflowing cleaning liquid in the cleaning tank; a cleaning agent tank is in communication with the cleaning tank, the cleaning agent tank is used for containing cleaning agent supplied to the cleaning tank; a first valve body assembly is connected between the cleaning agent tank and the cleaning tank; a first control member is electrically connected with the first valve body assembly, and the first control member is used for controlling opening and closing of the first valve body assembly, so that the amount of the cleaning agent injected into the cleaning tank is controlled.

Description

Technical Field

[0001] This application relates to the field of silicon wafer cleaning technology, specifically to a silicon wafer cleaning device. Background Technology

[0002] During the silicon wafer manufacturing process, the silicon wafers need to be cleaned to remove contaminants and impurities from the surface, ensuring the stability of subsequent processing techniques and product quality.

[0003] In related technologies, ultrasonic water baths can be used to clean silicon wafers. Before cleaning, water and cleaning agent are added to the ultrasonic water bath to form a cleaning agent mixture. The silicon wafers are then placed in the cleaning bath for cleaning. During the cleaning process, the cleaning bath needs to be replenished periodically to increase the concentration of the cleaning agent mixture and ensure the cleaning quality of the silicon wafers. Once the concentration of the cleaning agent mixture in the cleaning bath reaches a certain level, all the solution in the cleaning bath is drained and the entire liquid in the cleaning bath is replaced.

[0004] However, the above cleaning methods consume a lot of water and cleaning agents, resulting in excessively high cleaning costs for silicon wafers. Utility Model Content

[0005] This application discloses a silicon wafer cleaning apparatus to solve, or at least partially solve, the problem in the related art where excessive water and cleaning agents are consumed during the silicon wafer cleaning process, resulting in excessively high cleaning costs for silicon wafers.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows:

[0007] This application discloses a silicon wafer cleaning apparatus, comprising a cleaning tank with a first through hole for injecting liquid into the cleaning tank, the cleaning tank having an opening for overflowing the cleaning liquid; a cleaning agent tank connected to the cleaning tank for holding cleaning agent supplied to the cleaning tank; a first valve assembly connected between the cleaning agent tank and the cleaning tank; and a first control component electrically connected to the first valve assembly for controlling the opening and closing of the first valve assembly to control the amount of cleaning agent injected into the cleaning tank.

[0008] In some embodiments, the silicon wafer cleaning apparatus further includes a second valve body assembly connected to the cleaning tank; and a second control component electrically connected to the second valve body assembly, the second control component being used to control the opening and closing of the second valve body assembly to control the overflow rate of the cleaning fluid in the cleaning tank.

[0009] In some embodiments, the silicon wafer cleaning apparatus further includes an infrared sensor or a camera, the infrared sensor or the camera being disposed around the cleaning tank, the infrared sensor being used to sense the amount of silicon wafers cleaned in the cleaning tank per unit time; and a third control component, the third control component being electrically connected to the infrared sensor or the camera, and the third control component being electrically connected to the first valve body assembly and the second valve body assembly, the third control component being used to obtain the amount of silicon wafers cleaned in the cleaning tank per unit time, and to control the opening and closing of the first valve body assembly and / or the second valve body assembly according to the amount of silicon wafers cleaned in the cleaning tank per unit time.

[0010] In some embodiments, the silicon wafer cleaning apparatus further includes a support device, on which the cleaning agent tank is disposed; a sensor connected to the support device, the sensor being used to acquire the weight of the cleaning agent in the cleaning agent tank; a fourth control component electrically connected to the sensor and the first valve body assembly, the fourth control component being used to acquire the weight of the cleaning agent in the cleaning agent tank and control the opening and closing of the first valve body assembly based on the weight of the cleaning agent; or, a liquid level monitor disposed in the cleaning agent tank, the liquid level monitor being used to monitor the liquid level height of the cleaning agent in the cleaning agent tank; and a fifth control component electrically connected to the liquid level monitor and the first valve body assembly, the fifth control component being used to acquire the liquid level height of the cleaning agent in the cleaning agent tank and control the opening and closing of the first valve body assembly based on the liquid level height of the cleaning agent.

[0011] In some embodiments, the silicon wafer cleaning apparatus further includes a display element electrically connected to a control element.

[0012] In some embodiments, each of the cleaning tanks is configured with at least one of the cleaning agent tanks, and each of the cleaning agent tanks is configured with one of the first valve body assemblies.

[0013] In some embodiments, the silicon wafer cleaning apparatus further includes a flow guide channel, wherein the cleaning tank is disposed within the flow guide channel, and the flow guide channel is used to guide the liquid overflowing from the cleaning tank to a liquid recovery point.

[0014] In some embodiments, the cleaning tank includes a plurality of cleaning tanks, which are spaced apart within the guide channel.

[0015] In some embodiments, the guide channel is provided with a second through hole for injecting liquid into the cleaning tank.

[0016] In some embodiments, the first valve body assembly includes a pump body connected between the cleaning agent tank and the cleaning tank; a drive member pulsatorically connected to the pump body; and a first control member electrically connected to the drive member. The first control member is used to control the rotation of the drive member to drive the pump body to open and close, thereby controlling the amount of cleaning agent injected into the cleaning tank.

[0017] This application discloses a silicon wafer cleaning apparatus, comprising a cleaning tank with a first through hole for injecting liquid into the cleaning tank, the cleaning tank having an opening for overflowing the cleaning liquid; a cleaning agent tank connected to the cleaning tank for holding cleaning agent supplied to the cleaning tank; a first valve assembly connected between the cleaning agent tank and the cleaning tank; and a first control component electrically connected to the first valve assembly for controlling the opening and closing of the first valve assembly to control the amount of cleaning agent injected into the cleaning tank.

[0018] The silicon wafer cleaning apparatus disclosed in this application includes a cleaning tank with a first through hole through which liquid (such as water) can be injected. A cleaning agent tank is connected to the cleaning tank and contains cleaning agent supplied to the cleaning tank. A first valve assembly is connected between the cleaning agent tank and the cleaning tank. A first control component is electrically connected to the first valve assembly and can control the opening and closing of the valve assembly to control the amount of cleaning agent injected into the cleaning tank, so that the cleaning agent and water are injected into the cleaning tank in a certain ratio to clean the silicon wafers in the cleaning tank.

[0019] In other words, the silicon wafer cleaning apparatus disclosed in this application allows for the continuous injection of water and cleaning solution into the cleaning tank, maintaining the concentration and impurities of the cleaning solution within a certain range. This avoids problems such as excessively high concentrations of cleaning solution or excessive impurities in the cleaning tank. Furthermore, this setup eliminates the need to replace all the liquid in the cleaning tank at once, helping to reduce the amount of water and cleaning agent used, thereby lowering the cleaning cost of silicon wafers and enhancing their market competitiveness. Attached Figure Description

[0020] Figure 1 This diagram illustrates the structure of the silicon wafer cleaning apparatus described in the embodiments of this application. Figure 1 ;

[0021] Figure 2 This diagram illustrates the structure of the silicon wafer cleaning apparatus described in the embodiments of this application. Figure 2 .

[0022] Figure label:

[0023] 10: Cleaning tank; 11: Opening; 12: First cleaning tank; 13: Second cleaning tank;

[0024] 20: Cleaning agent tank; 21: First cleaning agent tank; 22: Second cleaning agent tank; 23: Third cleaning agent tank;

[0025] 30: First valve body assembly; 31: Pump body; 32: Drive unit; 321: Servo motor; 322: Servo driver; 33: First sub-valve body assembly; 34: Second sub-valve body assembly;

[0026] 40: First control element;

[0027] 50: Supporting device;

[0028] 60: Sensor;

[0029] 70: Display component. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the fixed scope of the present utility model.

[0031] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0032] Before introducing the silicon wafer cleaning apparatus disclosed in the embodiments of this application, a brief introduction to the application scenarios of the silicon wafer cleaning apparatus will be given first.

[0033] During the silicon wafer processing, a silicon wafer cleaning device is needed to clean the silicon wafer to remove contaminants and impurities from the surface of the silicon wafer, ensuring the stability of subsequent processing and product quality.

[0034] In related technologies, ultrasonic water baths are commonly used to clean silicon wafers. Before cleaning, a liquid (such as water, an acidic solution, or an alkaline solution) and a cleaning agent are added to the ultrasonic water bath to form a cleaning solution. The silicon wafer is then placed in the cleaning bath for cleaning. During the cleaning process, the cleaning agent needs to be added to the cleaning bath periodically to increase the concentration of the cleaning solution and ensure the cleaning effect on the silicon wafer. Once the concentration of the cleaning solution in the cleaning bath reaches a certain level, all the cleaning solution in the cleaning bath is drained at once, and the entire solution in the cleaning bath is replaced.

[0035] It should be noted that when the concentration of the cleaning solution in the cleaning tank reaches a certain level, the solution will corrode the silicon wafers, affecting the cleaning effect. Furthermore, excessive impurities in the cleaning solution will also affect the cleanliness of the silicon wafers. Therefore, the cleaning solution in the cleaning tank needs to be replaced completely at once to ensure the cleaning effect on the silicon wafers.

[0036] However, frequently replacing all the cleaning fluid in the cleaning tank consumes a large amount of liquid and cleaning agent, increasing the cleaning cost of silicon wafers, raising the manufacturing cost of silicon wafers, and affecting their market competitiveness. In view of this, this application discloses a silicon wafer cleaning apparatus to reduce the consumption of liquid and cleaning agent during the silicon wafer cleaning process, thereby reducing the cleaning cost of silicon wafers and improving their market competitiveness.

[0037] like Figure 1 As shown in the figure, this application discloses a silicon wafer cleaning device, which includes a cleaning tank 10 with a first through hole for injecting liquid into the cleaning tank 10. The cleaning tank 10 has an opening 11 for overflowing the cleaning liquid in the cleaning tank 10; a cleaning agent tank 20 connected to the cleaning tank 10 for holding the cleaning agent supplied to the cleaning tank 10; a first valve body assembly 30 connected between the cleaning agent tank 20 and the cleaning tank 10; and a first control component 40 electrically connected to the first valve body assembly 30 for controlling the opening and closing of the first valve body assembly 30 to control the amount of cleaning agent injected into the cleaning tank 10.

[0038] like Figure 1 As shown in the illustration, the silicon wafer cleaning apparatus disclosed in this application includes a cleaning tank 10, which is used to hold a cleaning solution, which is a mixture of liquid and cleaning agent. In this application embodiment, there is no specific limitation on the ratio of liquid to cleaning agent in the cleaning solution. In practical applications, technicians can set it according to the needs of silicon wafer cleaning.

[0039] The cleaning tank 10 is provided with a first through hole, which is connected to an external facility so that liquid supplied by the external facility can be injected into the cleaning tank 10 through the first through hole. For example, the first through hole is connected to an external liquid supply facility so that liquid from the external water supply facility can be injected into the cleaning tank 10 through the first through hole.

[0040] The first through hole can be located at the bottom of the cleaning tank 10, or it can be located on the side wall of the cleaning tank 10. No specific restrictions are placed on the exact location of the first through hole; in practical applications, technicians can set it as needed.

[0041] It should be noted that, in this embodiment of the application, the flow rate of water in the first through hole can be controlled to control the amount of liquid injected into the cleaning tank 10 per unit time.

[0042] like Figure 1 As shown in the illustration, the silicon wafer cleaning apparatus disclosed in this application also includes a cleaning agent tank 20. The cleaning agent tank 20 can be spaced apart from the cleaning tank 10 and is connected to the cleaning tank 10. The cleaning agent tank 20 is used to hold the cleaning agent supplied to the cleaning tank 10. The cleaning agent includes, but is not limited to, alkaline hydrogen peroxide, acidic hydrogen peroxide, dilute hydrofluoric acid, hydrogen peroxide, etc. Here, no specific restrictions are placed on the specific type of cleaning agent. In practical applications, technicians can select according to their needs.

[0043] It should be noted that a first valve body assembly 30 is connected between the cleaning tank 10 and the cleaning agent tank 20. The first control component 40 is electrically connected to the first valve body assembly 30. The first control component 40 can control the opening and closing of the first valve body assembly 30, thereby controlling the amount of cleaning agent injected into the cleaning tank 10 from the cleaning agent tank 20 per unit time. This ensures that the amount of water injected into the cleaning tank 10 and the amount of cleaning agent injected reach a preset ratio, and the concentration of the cleaning solution formed by the mixture of liquid and cleaning agent can be controlled within a certain range.

[0044] The cleaning tank 10 has an opening 11, through which the cleaning fluid overflows from the cleaning tank 10. For example... Figure 1 As shown, the opening 11 is located at the top of the cleaning tank 10. When the cleaning tank 10 is full of cleaning fluid, water and cleaning agent are continuously being injected into the cleaning tank 10. The cleaning fluid can overflow from the opening 11 of the cleaning tank 10, so that the concentration and impurities of the cleaning fluid in the cleaning tank 10 are always maintained within a certain range. This can avoid the problem of excessive concentration of cleaning fluid and excessive impurities in the cleaning tank 10, and ensure the cleaning effect of silicon wafers.

[0045] It is understandable that the above settings adjust the intermittent reaction vessel in the existing technology to, as... Figure 1 and Figure 2The continuous reactor shown, from the perspective of silicon wafer production, currently makes the cleaning process of each cleaning tank 10 more similar to a batch reactor due to the liquid replenishment method in the silicon wafer cleaning process. However, in the continuous cleaning process of silicon wafers, the continuous reactor disclosed in this application continuously replenishes the cleaning solution into the cleaning tank 10, so that the cleaning solution and impurities in the cleaning tank 10 are always maintained within a certain concentration range. This not only ensures the stability of the cleaning solution in the cleaning tank 10 and the cleanliness of the silicon wafers, but also saves cleaning agents, water, electricity, etc., making the management of the silicon wafer cleaning process more refined and scientific.

[0046] In some embodiments, the silicon wafer cleaning apparatus disclosed in this application further includes a second valve body assembly, which is connected to the cleaning tank 10 and a second control component. The second control component is electrically connected to the second valve body assembly and is used to control the opening and closing of the second valve body assembly to control the overflow rate of the cleaning fluid in the cleaning tank 10.

[0047] In this embodiment, the second valve body assembly is connected to the cleaning tank 10, and the second control component is electrically connected to the second valve body assembly. The second control component controls the opening and closing of the second valve body assembly to control the overflow rate of the cleaning fluid in the cleaning tank 10, so as to ensure the cleaning effect of the silicon wafers by adjusting the cleaning fluid flow rate and the number of silicon wafers cleaned in the cleaning tank 10.

[0048] It should be noted that the silicon wafer cleaning apparatus disclosed in this application embodiment can also be equipped with a flow meter, which is connected to the second valve assembly to monitor the overflow rate of the cleaning fluid in the cleaning tank 10. The second control component is electrically connected to the flow meter, and can obtain the flow rate of the second valve assembly, and adjust the opening or closing of the second valve assembly according to the flow rate of the second valve assembly to ensure that the concentration of the cleaning fluid in the cleaning tank 10 is within a preset range, thereby ensuring the cleaning effect of the silicon wafer.

[0049] In some embodiments, the silicon wafer cleaning apparatus further includes an infrared sensor disposed around the cleaning tank 10, which is used to sense the amount of silicon wafers cleaned in the cleaning tank 10 per unit time; and a third control component electrically connected to the infrared sensor, and electrically connected to the first valve body assembly 30 and the second valve body assembly, which is used to obtain the amount of silicon wafers cleaned in the cleaning tank 10 per unit time, and control the opening and closing of the first valve body assembly 30 and / or the second valve body assembly according to the amount of silicon wafers cleaned in the cleaning tank 10 per unit time.

[0050] In this embodiment, infrared sensors or cameras are installed around the cleaning tank 10 to count the number of silicon wafers cleaned in the cleaning tank 10 per unit time. A third control unit is electrically connected to the infrared sensors or cameras, and also electrically connected to the first valve assembly 30 and / or the second valve assembly. The third control unit can obtain the number of silicon wafers cleaned in the cleaning tank 10 per unit time and control the opening and closing of the first valve assembly 30 and / or the second valve assembly based on this count. This ensures that the amount of cleaning agent injected into the cleaning tank 10 per unit time is within a preset ratio range, and that the overflow rate of the cleaning liquid in the cleaning tank 10 per unit time is also controlled within a certain range, thereby forming a cleaning liquid of a preset concentration in the cleaning tank 10 to ensure the cleaning effect on the silicon wafers.

[0051] It should be noted that the amount of cleaning agent flowing into the cleaning tank 10, the amount of water flowing into the cleaning tank 10, and the amount of cleaning liquid flowing out of the cleaning tank 10 in this embodiment can all be adjusted according to the number of silicon wafers being cleaned in the cleaning tank 10, the size of the silicon wafers, etc., to ensure the cleanliness of the silicon wafers. Further details will not be elaborated here.

[0052] In some embodiments, such as Figure 2 As shown, the silicon wafer cleaning device also includes a support device 50, on which a cleaning agent tank 20 is disposed; a sensor 60 connected to the support device 50, used to obtain the weight of the cleaning agent in the cleaning agent tank 20; and a fourth control component electrically connected to the sensor 60, used to obtain the weight of the cleaning agent in the cleaning agent tank 20 and control the opening and closing of the first valve body assembly 30 according to the weight of the cleaning agent.

[0053] like Figure 2 As shown, the silicon wafer cleaning apparatus disclosed in this application embodiment further includes a support device 50, and a cleaning agent tank 20 is disposed on the support device 50 to support the cleaning tank 20. A sensor 60 is connected to the support device 50. Exemplarily, the sensor 60 is connected to the bottom of the support device 50 away from the cleaning agent tank 20 to obtain the weight of the cleaning agent in the cleaning agent tank 20.

[0054] It should be noted that the sensor 60 in this embodiment can periodically acquire the weight of the cleaning agent in the cleaning agent tank 20. For example, the sensor 60 can acquire the weight of the cleaning agent in the cleaning agent tank 20 every 5 minutes. Or, the sensor 60 can acquire the weight of the cleaning agent in the cleaning agent tank 20 every 10 minutes. Or, the sensor 60 can acquire the weight of the cleaning agent in the cleaning agent tank 20 every hour. Of course, in this embodiment, there is no specific limitation on the frequency at which the sensor 60 acquires the weight of the cleaning agent in the cleaning agent tank 20; in practical applications, those skilled in the art can set it according to their needs.

[0055] The sensors 60 include, but are not limited to, hydraulic load cells, magnetic pole changing load cells, strain gauge load cells, and capacitive load cells. The load-bearing device 50 includes, but is not limited to, a pallet.

[0056] like Figure 2 As shown, in this embodiment, the fourth control component is electrically connected to the sensor 60. The fourth control component can obtain the weight of the cleaning agent in the cleaning agent tank 20, and then control the opening and closing of the first valve assembly 30 according to the weight of the cleaning agent in the cleaning agent tank 20. This ensures that the weight of the cleaning agent injected into the cleaning tank 10 and the weight of the water injected into the cleaning tank 10 are within a preset ratio range per unit time, thereby forming a cleaning solution of a preset concentration in the cleaning tank 10.

[0057] Furthermore, by monitoring the weight of the cleaning agent in the cleaning agent tank 20 per unit time, the stability of the cleaning agent injection into the cleaning tank 10 is monitored, so that the cleaning agent in the cleaning agent tank 20 can be injected into the cleaning tank 10 according to the preset flow rate.

[0058] In some embodiments, the silicon wafer cleaning apparatus further includes a liquid level monitor disposed in the cleaning agent tank 20, which is used to monitor the liquid level of the cleaning agent in the cleaning agent tank 20; and a fifth control component electrically connected to the liquid level monitor and the first valve body assembly 30, which is used to obtain the liquid level of the cleaning agent in the cleaning agent tank 20 and control the opening and closing of the first valve body assembly 30 according to the liquid level of the cleaning agent.

[0059] In other words, in the implementation of this application, a liquid level monitor can be installed in the cleaning agent tank 20 to monitor the change in the liquid level of the cleaning agent in the cleaning agent tank 20 within a unit time, determine the amount of cleaning agent used, and ensure that the amount of cleaning agent injected into the cleaning tank 10 and the amount of water injected into the cleaning tank 10 within a preset ratio range within a unit time, thereby forming a cleaning solution of a preset concentration in the cleaning tank 10.

[0060] In some embodiments, such as Figure 2As shown, the silicon wafer cleaning apparatus also includes a display unit 70, which is electrically connected to the control unit. The control unit includes, but is not limited to, a first control unit 40, a second control unit, a third control unit, a fourth control unit, and a fifth control unit. The display unit 70 can display multiple quantities, including but not limited to the weight of the cleaning agent in the cleaning agent tank 20, the overflow rate of the cleaning liquid in the cleaning tank 10, the amount of silicon wafers cleaned in the cleaning tank 10 per unit time, the weight of the cleaning agent injected into the cleaning tank 10 per unit time, the weight of the water injected into the cleaning tank 10 per unit time, and the liquid level in the cleaning agent tank 20.

[0061] Of course, when the flow rate of cleaning agent in the cleaning agent tank 20 into the cleaning tank 10 exceeds the preset range, the display unit 70 can also issue an alarm to remind the operator that the flow rate of cleaning agent is abnormal and needs to be inspected.

[0062] It should be noted that the display 70 can also display any other information required during the silicon wafer cleaning process. In this embodiment, no excessive restrictions are placed on the specific content displayed by the display 70. In practical applications, technicians can set the display content of the display 70 as needed.

[0063] In some embodiments, such as Figure 1 As shown, each cleaning tank 10 is equipped with at least one cleaning agent tank 20, and each cleaning agent tank 20 is equipped with a first valve body assembly 30.

[0064] like Figure 1 As shown in this embodiment, each cleaning tank 10 is equipped with at least one cleaning agent tank 20 to supply cleaning agent to the corresponding cleaning tank 10. A first valve assembly 30 is provided between each cleaning agent tank 20 and the corresponding cleaning tank 10 to regulate the amount of cleaning agent flowing from the cleaning agent tank 20 into the cleaning tank 10, thereby forming a cleaning solution of a preset concentration within the cleaning tank 10, resulting in better cleaning of the silicon wafers.

[0065] In some embodiments, the silicon wafer cleaning apparatus further includes a guide channel, with the cleaning tank 10 disposed within the guide channel, which is used to guide the liquid overflowing from the cleaning tank 10 to the liquid recovery point.

[0066] The silicon wafer cleaning apparatus disclosed in this application embodiment also includes a guide channel. A cleaning tank 10 is disposed within the guide channel, allowing cleaning fluid overflowing from the cleaning tank 10 to flow into the guide channel. The guide channel directs the overflowing cleaning fluid from the cleaning tank 10 to a liquid recovery point for recycling. This improves the cleaning fluid recovery efficiency and prevents overflowing cleaning fluid from flowing to other parts of the silicon wafer cleaning apparatus, thus avoiding pollution of the silicon wafer cleaning apparatus and the workshop environment.

[0067] In some embodiments, the cleaning tank 10 includes a plurality of cleaning tanks 10, which are spaced apart within the guide channel.

[0068] In this embodiment, multiple cleaning tanks 10 can be provided within the guide channel, with the multiple cleaning tanks 10 spaced apart, so that different batches of silicon wafers can be cleaned simultaneously through multiple cleaning tanks 10, thereby improving the cleaning efficiency of the silicon wafers. Alternatively, multiple cleaning tanks 10 can be used to clean the same batch of silicon wafers at different angles to improve the cleanliness of the silicon wafers.

[0069] Furthermore, by arranging multiple cleaning tanks 10 at intervals within the same guide channel, the overflowing cleaning fluid from multiple cleaning tanks 10 can be recovered through a single guide channel, thereby improving the cleaning fluid recovery efficiency.

[0070] For example, such as Figure 1 As shown, two first cleaning tanks 12 and one second cleaning tank 13 are spaced apart within the guide channel. The leftmost first cleaning tank 12 is connected to the first cleaning agent tank 21 and the second cleaning agent tank 22 via two first valve body assemblies 30. The middle first cleaning tank 12 is connected to the first cleaning agent tank 21 and the second cleaning agent tank 22 via two first valve body assemblies 30. The rightmost second cleaning tank 13 is connected to the third cleaning agent tank 23 via one first valve body assembly 30.

[0071] The cleaning agents in the first cleaning agent tank 21, the second cleaning agent tank 22, and the third cleaning agent tank 23 are of different types. This arrangement ensures that the two leftmost and middle first cleaning tanks 12 contain the same type of cleaning agent, including the same cleaning agent found in the first cleaning agent tanks 21 and 22, while the cleaning agent in the rightmost second cleaning tank 13 is different from the other two. Therefore, the two leftmost and middle first cleaning tanks 12 can perform the same type of cleaning operation on different batches of silicon wafers, while the rightmost second cleaning tank 13 can perform different types of cleaning operations on the same batch of silicon wafers.

[0072] In other words, the above setup allows the silicon wafer cleaning device to perform different types of cleaning operations on silicon wafers, ensuring that the cleanliness of the silicon wafers meets the standards. This eliminates the need for additional cleaning devices to continue cleaning the silicon wafers, thereby improving the cleaning efficiency of the silicon wafer cleaning device.

[0073] In some embodiments, the guide channel is provided with a second through hole for injecting liquid into the cleaning tank 10.

[0074] In this embodiment of the application, a second through hole is opened on the guide channel and a first through hole is opened on the cleaning tank 10. The second through hole is connected to the first through hole, and water injected by the external water supply facility can flow through the second through hole and the first through hole into the cleaning tank 10, thereby injecting water into the cleaning tank 10.

[0075] For example, the first through hole can be opened at or near the bottom of the cleaning tank 10, and the second through hole can be opened at or near the bottom of the guide channel. The second through hole is connected to the first through hole. Water from the external water supply facility can be injected into the bottom of the cleaning tank 10 through the second through hole and the first through hole. The cleaning liquid with higher concentration and higher impurities at the top of the cleaning tank 10 overflows from the opening of the cleaning tank 10, so that the cleaning liquid in the cleaning tank 10 is always kept within a certain concentration range and with fewer impurities, thereby cleaning the silicon wafer better and making the silicon wafer cleaner.

[0076] In some embodiments, such as Figure 1 As shown, the first valve body assembly 30 includes a pump body 31 connected between the cleaning agent tank 20 and the cleaning tank 10; a drive member 32 connected to the pump body 31; and a first control member 40 electrically connected to the drive member 32. The first control member 40 is used to control the rotation of the drive member 32 to drive the pump body 31 to open and close, thereby controlling the amount of cleaning agent injected into the cleaning tank 10.

[0077] like Figure 1 As shown, the first valve body assembly 30 in this embodiment includes a pump body 31 and a drive member 32. The pump body 21 is connected between the cleaning agent tank 20 and the cleaning tank 10, the drive member 32 is drively connected to the pump body 31, and the first control member 40 is electrically connected to the drive member 31. The first control member 40 can control the rotation of the drive member 32, causing the drive member 32 to drive the pump body 31 to open or close, thereby controlling the amount of cleaning agent injected into the cleaning tank 10 from the cleaning agent tank 20. This ensures that the amount of cleaning agent injected into the cleaning tank 10 is within a certain ratio range to the amount of water injected into the cleaning tank 10, allowing the water and cleaning agent to mix and form a cleaning solution of a preset concentration.

[0078] The pump body 31 in this embodiment can be a continuous liquid-feeding magnetic pump, a high-pressure plunger pump, an electromagnetic metering pump, a variable frequency constant pressure centrifugal pump, etc. In this embodiment, no specific restrictions are placed on the type of pump body 31. In practical applications, those skilled in the art can choose according to their needs.

[0079] It should be noted that when the pump body 31 is in the open state, the drive component 32 can also adjust the opening degree of the pump body 31 to adjust the flow rate of the cleaning agent flowing through the pump body 31 per unit time, so that the cleaning agent injected into the cleaning tank 10 per unit time can be within a preset range.

[0080] In some embodiments, such as Figure 1As shown, the drive unit 32 includes a servo motor 321, which is connected to the pump body 31 in a transmission manner; and a servo driver 322, which is electrically connected between the first control unit 40 and the servo motor 321. The first control unit 40 is used to control the servo driver 322 to drive the servo motor 321 to rotate, so as to drive the pump body 31 to open and close.

[0081] like Figure 1 As shown, the driving component 32 in this embodiment includes a servo motor 321 and a servo driver 322. The servo driver 322 is electrically connected between the servo motor 321 and the first control component 40, and the servo motor 321 is drive-connected to the pump body 31. The first control component 40 can control the servo driver 322 to drive the servo motor 321 to rotate, and the servo motor 321 can drive the pump body 31 to open and close, thereby controlling the amount of cleaning agent injected into the cleaning tank 10 from the cleaning agent tank 20, ensuring that the amount of cleaning agent injected into the cleaning tank 10 is within a certain ratio range to the amount of water injected into the cleaning tank 10, allowing the water and cleaning agent to mix and form a cleaning solution of a preset concentration.

[0082] It should be noted that in this embodiment, the servo driver 322 can receive the rotation signal from the first control unit 40, driving the servo motor 321 to rotate, which in turn drives the pump body 31 to rotate. The rotation speed of the pump body 31 determines the amount of cleaning agent entering the cleaning tank 10. For example, the rotation speed of the pump body 31 can be set in the first control unit 40 via a program according to the number of silicon wafers cleaned per hour, so that the amount of cleaning agent entering the cleaning tank 10 varies with the production capacity, ensuring precise supply of cleaning agent to the cleaning tank 10 and avoiding waste. Furthermore, it can also prevent excessively high concentrations of cleaning agent from corroding the silicon wafer surface and affecting its reliability.

[0083] In some embodiments, such as Figure 1 As shown, the plurality of cleaning tanks 10 include at least one first cleaning tank 12, the cleaning agent tank 20 includes a first cleaning agent tank 21 and a second cleaning agent tank 22 arranged at intervals, the first cleaning agent tank 21 and the second cleaning agent tank 22 are used to hold different cleaning agents; the valve body assembly 30 includes two sets of first sub-valve body assemblies 33, one set of first sub-valve body assemblies 33 is connected between the first cleaning agent tank 21 and the first cleaning tank 12, and the other set of first sub-valve body assemblies 33 is connected between the second cleaning agent tank 22 and the first cleaning tank 12.

[0084] like Figure 1As shown, the first cleaning tank 12 includes two tanks, one located on the left and the other in the middle. The cleaning agent tank 20 also includes two tanks, one a first cleaning agent tank 21 and the other a second cleaning agent tank 22. The first cleaning agent tank 21 and the second cleaning agent tank 22 hold different types of cleaning agents. For example, the first cleaning agent tank 21 holds an alkaline cleaning agent, and the second cleaning agent tank 22 holds a surfactant.

[0085] The first cleaning agent tank 21 is connected to the first cleaning tank 12 located on the left side via a set of first sub-valve body assemblies 33, and the second cleaning agent tank 22 is connected to the first cleaning tank 12 located on the left side via another set of first sub-valve body assemblies 33. In other words, the cleaning agent in the first cleaning agent tank 21 and the cleaning agent in the second cleaning agent tank 22 can both flow into the first cleaning tank 12 located on the left side to clean the silicon wafer surface, thereby improving the cleanliness of the silicon wafer and ensuring cleaning efficiency.

[0086] In some embodiments, such as Figure 1 As shown, the plurality of cleaning tanks 10 also include a second cleaning tank 13, which is spaced apart from the first cleaning tank 12; the cleaning agent tank 20 also includes a third cleaning agent tank 23; the valve body assembly 30 also includes a second sub-valve body assembly 34, which is connected between the second cleaning tank 13 and the third cleaning agent tank 23.

[0087] like Figure 1 As shown, the cleaning tank 10 also includes a second cleaning tank 13 located on the far right, and the cleaning agent tank 20 also includes a third cleaning agent tank 23. The type of cleaning agent contained in the third cleaning agent tank 23 is different from the type of cleaning agent contained in the first cleaning agent tank 21 and the second cleaning agent tank 22. For example, the cleaning agent contained in the third cleaning agent tank 23 is hydrogen peroxide.

[0088] The third cleaning agent tank 23 is connected to the second cleaning tank 13 located on the far right through the second sub-valve assembly 34, so that the cleaning agent in the third cleaning agent tank 23 can be injected into the second cleaning tank 13 to clean the residual cleaning liquid on the surface of the silicon wafer, thereby further improving the cleanliness of the silicon wafer and preventing the cleaning liquid from remaining on the surface of the silicon wafer and causing contamination to the surface of the silicon wafer.

[0089] It should be noted that the first control element 40, the second control element, the third control element, the fourth control element, and the fifth control element in the embodiments of this application can be different control elements. Alternatively, the first control element 40, the second control element, the third control element, the fourth control element, and the fifth control element can be integrated into a single main control element. For example, the first control element 40, the second control element, the third control element, the fourth control element, and the fifth control element can be integrated into a single PLC control element. It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably.

[0090] Although alternative embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make further changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the alternative embodiments as well as all changes and modifications falling within the scope of the present invention.

[0091] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between these entities. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or terminal device that includes that element.

[0092] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the principle and implementation of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A silicon wafer cleaning apparatus, characterized in that, include: A cleaning tank (10) is provided with a first through hole for injecting liquid into the cleaning tank (10). The cleaning tank (10) has an opening (11) for overflowing the cleaning liquid in the cleaning tank (10). A cleaning agent tank (20) is connected to the cleaning tank (10) and is used to hold the cleaning agent supplied to the cleaning tank (10). A first valve body assembly (30) is connected between the cleaning agent tank (20) and the cleaning tank (10); A first control element (40) is electrically connected to the first valve body assembly (30). The first control element (40) is used to control the opening and closing of the first valve body assembly (30) to control the amount of cleaning agent injected into the cleaning tank (10).

2. The silicon wafer cleaning apparatus according to claim 1, characterized in that, Also includes: The second valve body assembly is connected to the cleaning tank (10); The second control component is electrically connected to the second valve body assembly. The second control component is used to control the opening and closing of the second valve body assembly to control the overflow rate of the cleaning fluid in the cleaning tank (10).

3. The silicon wafer cleaning apparatus according to claim 2, characterized in that, Also includes: An infrared sensor or camera is provided around the cleaning tank (10). The infrared sensor or camera is used to sense the amount of silicon wafers cleaned in the cleaning tank (10) per unit time. The third control component is electrically connected to the infrared sensor or the camera, and is also electrically connected to the first valve body assembly (30) and the second valve body assembly. The third control component is used to obtain the amount of silicon wafers cleaned in the cleaning tank (10) per unit time, and to control the opening and closing of the first valve body assembly (30) and / or the second valve body assembly based on the amount of silicon wafers cleaned in the cleaning tank (10) per unit time.

4. The silicon wafer cleaning apparatus according to claim 1, characterized in that, Also includes: The carrier device (50) is provided with the cleaning agent tank (20) disposed on the carrier device (50); Sensor (60), the sensor (60) is connected to the support device (50), the sensor (60) is used to obtain the weight of the cleaning agent in the cleaning agent tank (20); The fourth control component is electrically connected to the sensor (60) and the first valve body assembly (30). The fourth control component is used to obtain the weight of the cleaning agent in the cleaning agent tank (20) and control the opening and closing of the first valve body assembly (30) according to the weight of the cleaning agent. or, A liquid level monitor is installed in the cleaning agent tank (20) and is used to monitor the liquid level of the cleaning agent in the cleaning agent tank (20). The fifth control component is electrically connected to the liquid level monitor and the first valve body assembly (30). The fifth control component is used to obtain the liquid level height of the cleaning agent in the cleaning agent tank (20) and control the opening and closing of the first valve body assembly (30) according to the liquid level height of the cleaning agent.

5. The silicon wafer cleaning apparatus according to any one of claims 1 to 4, characterized in that, Also includes: The display (70) is electrically connected to the control unit.

6. The silicon wafer cleaning apparatus according to claim 1, characterized in that, Each of the cleaning tanks (10) is provided with at least one of the cleaning agent tanks (20), and each of the cleaning agent tanks (20) is provided with one of the first valve body assemblies (30).

7. The silicon wafer cleaning apparatus according to claim 1, characterized in that, Also includes: The guide channel is provided in the cleaning tank (10), and the guide channel is used to guide the liquid overflowing from the cleaning tank (10) to the liquid recycling point.

8. The silicon wafer cleaning apparatus according to claim 7, characterized in that, The cleaning tank (10) includes a plurality of tanks, which are spaced apart within the guide channel.

9. The silicon wafer cleaning apparatus according to claim 7 or 8, characterized in that, The guide channel is provided with a second through hole, which is used to inject liquid into the cleaning tank (10).

10. The silicon wafer cleaning apparatus according to claim 1, characterized in that, The first valve body assembly (30) includes: Pump body (31), the pump body (31) is connected between the cleaning agent tank (20) and the cleaning tank (10); A drive unit (32) is connected to the pump body (31) in a transmission manner. A first control unit (40) is electrically connected to the drive unit (32). The first control unit (40) is used to control the rotation of the drive unit (32) to drive the pump body (31) to open and close, thereby controlling the amount of cleaning agent injected into the cleaning tank (10).

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