High thermal conductive adhesive structure

Abstract

The utility model relates to a kind of heat-conducting glue, specifically a kind of high heat-conducting glue structure, the high heat-conducting glue structure includes substrate layer and the filler layer being set on substrate layer, the inside of substrate layer is formed with accommodating chamber, filler layer is filled in accommodating chamber, filler layer fills the space in accommodating chamber, and filler layer includes center filler structure layer and the edge filler structure layer being set on center filler structure layer, edge filler structure layer is combined with center filler structure layer as a whole, and edge filler structure layer surrounds the outside of center filler structure layer.The high heat-conducting glue structure can make the center filler structure layer in central region to be in close contact with the center heat-conducting area of electronic component or radiator when using, better heat-conducting effect is realized, while avoiding the powderization or fragmentation of the edge position of substrate layer after being subjected to pressure Angle material, to avoid the heat-conducting efficiency of this part of area to drop substantially.

Description

Technical Field

[0001] This utility model relates to a thermally conductive adhesive, specifically a high thermal conductivity adhesive structure. Background Technology

[0002] High thermal conductivity adhesive is an adhesive material with excellent thermal conductivity, mainly used to fill the tiny gaps between heat-generating electronic components and heat sinks in electronic devices, improving heat conduction efficiency and thus solving heat dissipation problems. It is typically composed of high thermal conductivity fillers (such as metal oxides) and adhesives, effectively transferring heat and maintaining stable performance in high-temperature environments.

[0003] Existing high thermal conductivity adhesives have complex structures and unreasonable designs. The filler layer is usually placed on the surface of the substrate layer. During use, it disperses rapidly under pressure, preventing the thermally conductive filler layer from concentrating in the central area of ​​electronic components or heat sinks, thus reducing thermal conductivity. Furthermore, under pressure, the scrap material at the edges will powder or fragment, resulting in a significant decrease in thermal conductivity at the edges. To address these issues, the inventors have improved the structure of the high thermal conductivity adhesive. Utility Model Content

[0004] The purpose of this invention is to provide a high thermal conductivity adhesive structure. This high thermal conductivity adhesive structure has the advantages of simple structure and reasonable design, which allows the central filler structure layer in the central region to make close contact with the central thermally conductive area of ​​electronic components or heat sinks, thereby achieving better thermal conductivity. At the same time, it avoids the corner pieces at the edge of the substrate layer from becoming powdery or fragmented after being subjected to pressure, thus avoiding a significant decrease in the thermal conductivity of this area. This invention solves the problems mentioned in the above-mentioned technical background.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high thermal conductivity adhesive structure, which includes a substrate layer and a filler layer disposed on the substrate layer. The substrate layer has an internal cavity, and the filler layer fills the cavity. The filler layer fills the space within the cavity. The filler layer includes a central filler structure layer and an edge filler structure layer disposed on the central filler structure layer. The edge filler structure layer is integrated with the central filler structure layer and surrounds the outer side of the central filler structure layer. The materials of the central filler structure layer and the edge filler structure layer are exactly the same.

[0006] Preferably, the accommodating room is provided with two inner walls, which are arranged opposite to each other.

[0007] Preferably, the inner wall is arc-shaped, and the depth of the inner wall gradually decreases from the center to the edge.

[0008] Preferably, the depth of the central packing structure layer is greater than the depth of the edge packing structure layer, and the depth of the central packing structure layer is between 2.5 mm and 3.5 mm.

[0009] Preferably, a heat-conducting sheet layer is provided on the outside of the substrate layer, the heat-conducting sheet layer is wrapped around the substrate layer, and an external groove is provided through the heat-conducting sheet layer.

[0010] Preferably, an extended inner groove is provided inside the heat-conducting sheet layer, the depth of the extended inner groove is greater than the depth of the outer groove, the edge portion of the substrate layer is filled in the extended inner groove, and the edge portion of the substrate layer is integrated with the heat-conducting sheet layer.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. This utility model provides a high thermal conductivity adhesive structure, which includes a substrate layer and a filler layer disposed on the substrate layer. The overall structure is simple and reasonably designed. The substrate layer has a receiving chamber inside, and the filler layer fills the receiving chamber. The filler layer includes a central filler structure layer and an edge filler structure layer disposed on the central filler structure layer. The edge filler structure layer is integrated with the central filler structure layer and surrounds the outside of the central filler structure layer. In use, when the filler layer is compressed, its components will disperse and come into contact with electronic components and heat sinks. Since the depth of the central filler structure layer is greater than that of the edge filler structure layer, the central filler structure layer is more fully concentrated in the central area of ​​the electronic component or heat sink, so that the central filler structure layer in the central area can make close contact with the central heat-conducting area of ​​the electronic component or heat sink, thereby achieving a better heat conduction effect.

[0012] 2. In this utility model, a heat-conducting sheet layer is provided on the outer side of the substrate layer, the heat-conducting sheet layer is wrapped around the substrate layer, and an external groove is provided through the heat-conducting sheet layer. An extended inner groove is provided inside the heat-conducting sheet layer, the depth of the extended inner groove is greater than the depth of the external groove, and the edge part of the substrate layer is filled in the extended inner groove. The heat-conducting sheet layer wraps and protects the edge position of the substrate layer, preventing the substrate layer from overflowing to the outside, and preventing the corner material at the edge position of the substrate layer from becoming powdered or fragmented after being subjected to pressure, thereby preventing a significant decrease in the heat conduction efficiency of this area.

[0013] 3. When this utility model is used, the substrate layer, filler layer and heat-conducting sheet layer will all be compressed. When the heat-conducting sheet layer is under pressure, its upper and lower sides will be closer together, and both its upper and lower sides will play a role in heat conduction, which enhances the heat conduction efficiency at the edge position and has strong practicality. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the internal structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the internal structure of the substrate layer of this utility model.

[0016] Figure 3 This is a schematic diagram of the heat-conducting sheet layer in Embodiment 1 of this utility model.

[0017] Figure 4 This is a schematic diagram of the heat-conducting sheet layer in Embodiment 2 of this utility model.

[0018] The reference numerals and names in the figure are as follows: 1. Substrate layer; 101. Reception chamber; 102. Inner wall; 2. Filler layer; 201. Central filler structure layer; 202. Edge filler structure layer; 3. Heat-conducting sheet layer; 301. External groove; 302. Extended inner groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the description of the embodiments of this utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments of this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0021] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0022] Example 1: Please see Figure 1 This utility model provides an embodiment of a high thermal conductivity adhesive structure, which includes a substrate layer 1 and a filler layer 2 disposed on the substrate layer 1. The filler layer 2 includes a central filler structure layer 201 and an edge filler structure layer 202 disposed on the central filler structure layer 201. The central filler structure layer 201 and the edge filler structure layer 202 are made of the same material. The edge filler structure layer 202 is integrated with the central filler structure layer 201, and the edge filler structure layer 202 surrounds the outside of the central filler structure layer 201. In use, when the filler layer 2 is compressed, it forms... The layers disperse and come into contact with electronic components and heat sinks. Since the depth of the central filler structure layer 201 is greater than the depth of the edge filler structure layer 202, the central filler structure layer 201 is more fully concentrated in the central area of ​​the electronic component or heat sink, so that the central filler structure layer 201 in the central area can make close contact with the central heat-conducting area of ​​the electronic component or heat sink, achieving a better heat conduction effect. In addition, the depth of the central filler structure layer 201 is greater than the depth of the edge filler structure layer 202, and the depth of the central filler structure layer 201 is between 2.5mm and 3.5mm.

[0023] Please refer to it again. Figure 1 A heat-conducting sheet layer 3 is provided on the outside of the substrate layer 1. The heat-conducting sheet layer 3 is wrapped around the substrate layer 1, and an external groove 301 is provided through the heat-conducting sheet layer 3.

[0024] Please see Figure 2 The substrate layer 1 has a receiving chamber 101 inside, and the filler layer 2 fills the receiving chamber 101. The filler layer 2 fills the space inside the receiving chamber 101. The receiving chamber 101 is provided with two inner walls 102, which are arranged opposite to each other. In this embodiment, the inner wall 102 is arc-shaped, and the depth of the inner wall 102 gradually decreases from the center to the edge.

[0025] Please see Figure 3In this embodiment, the heat-conducting sheet 3 is made of graphene. The heat-conducting sheet layer 3 is rectangular and suitable for electronic components and heat sinks with rectangular contact surfaces. An extended inner groove 302 is provided inside the heat-conducting sheet layer 3. The depth of the extended inner groove 302 is greater than the depth of the outer groove 301. The edge of the substrate layer 1 is filled in the extended inner groove 302, and the edge of the substrate layer 1 is integrated with the heat-conducting sheet layer 3. When the heat-conducting sheet layer 3 comes into contact with electronic components or heat sinks, the heat-conducting sheet layer 3 wraps and protects the edge of the substrate layer 1, preventing the substrate layer 1 from overflowing to the outside. This can prevent the corner pieces of the substrate layer 1 from becoming powdered or fragmented after being subjected to pressure, thereby preventing a significant decrease in the thermal conductivity of this area. In addition, when the heat-conducting sheet layer 3 is subjected to pressure, its upper and lower sides will be closer together, and both its upper and lower sides will play a role in heat conduction, enhancing the thermal conductivity of the edge.

[0026] Example 2: Please see Figure 4 The structure of this embodiment is basically the same as that of Embodiment 1. The difference is that the heat-conducting layer 3 is in the shape of a ring, which is suitable for electronic components and heat sinks with circular contact surfaces. Other parts not described in this embodiment refer to Embodiment 1 and will not be repeated here.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high thermal conductivity adhesive structure, characterized in that: The material includes a substrate layer (1) and a filler layer (2) disposed on the substrate layer (1). The substrate layer (1) has a receiving chamber (101) formed inside. The filler layer (2) fills the receiving chamber (101). The filler layer (2) includes a central filler structure layer (201) and an edge filler structure layer (202) disposed on the central filler structure layer (201). The edge filler structure layer (202) is integrated with the central filler structure layer (201) and surrounds the outside of the central filler structure layer (201).

2. The high thermal conductivity adhesive structure according to claim 1, characterized in that: The accommodating chamber (101) is provided with two inner walls (102), which are arranged opposite to each other.

3. The high thermal conductivity adhesive structure according to claim 2, characterized in that: The inner wall (102) is arc-shaped, and the depth of the inner wall (102) gradually decreases from the center to the edge.

4. The high thermal conductivity adhesive structure according to claim 1, characterized in that: The depth of the central packing structure layer (201) is greater than the depth of the edge packing structure layer (202), and the depth of the central packing structure layer (201) is between 2.5 mm and 3.5 mm.

5. The high thermal conductivity adhesive structure according to claim 1, characterized in that: A heat-conducting sheet layer (3) is provided on the outside of the substrate layer (1). The heat-conducting sheet layer (3) is wrapped around the substrate layer (1), and an external groove (301) is provided through the heat-conducting sheet layer (3).

6. The high thermal conductivity adhesive structure according to claim 5, characterized in that: The heat-conducting sheet layer (3) has an extended inner groove (302) inside, and the depth of the extended inner groove (302) is greater than the depth of the outer groove (301).

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