Fluid control assembly and thermal management system

Abstract

The application provides a kind of fluid control assembly and heat management system, it is related to heat management system technical field.The fluid control assembly includes motor, control module and LIN interface circuit;Wherein, motor is controlled to control module;LIN interface circuit includes: transient voltage suppression diode, magnetic bead and low pass filter;Transient voltage suppression diode is electrically connected between the LIN port of fluid control assembly and ground;LIN port is electrically connected LIN pin of control module by low pass filter and magnetic bead.In the communication line connected to LIN port, when there is interference, not only can be discharged through transient voltage suppression diode in LIN interface circuit, but also can realize timely discharge of interference energy through low pass filter in LIN interface circuit, to improve the anti-interference degree of LIN communication, improve the communication stability of fluid control assembly in the application process.

Description

Technical Field

[0001] This application relates to the field of thermal management system technology, and in particular to a fluid control component and a thermal management system. Background Technology

[0002] In automobiles, electronic modules can use LIN (Local Interconnect Network) to achieve low-cost communication. For example, fluid control components such as electric valves can communicate with the controller, which is the master node, via LIN. Moreover, in order to resist a certain degree of interference, LIN interface circuits can be set in the fluid control components to improve their communication anti-interference capability.

[0003] However, the LIN interface circuit in related technologies has poor anti-interference capabilities and is prone to communication errors. Utility Model Content

[0004] In view of the above problems, embodiments of this application provide a fluid control component and a thermal management system to improve the immunity of LIN communication. The specific solution is as follows:

[0005] A fluid control component includes: a motor, a control module, and a LIN interface circuit; wherein the motor is controlled by the control module; the LIN interface circuit includes: a transient voltage suppression diode, a ferrite bead, and a low-pass filter; the transient voltage suppression diode is electrically connected between the LIN port of the fluid control component and ground; the LIN port is electrically connected to the LIN pin of the control module through the low-pass filter and the ferrite bead.

[0006] The fluid control component provided in this application can not only discharge interference through the transient voltage suppression diode in the LIN interface circuit when there is interference on the communication line connected to the LIN port, but also discharge the interference energy in a timely manner through the low-pass filter in the LIN interface circuit, thereby improving the immunity of LIN communication and enhancing the communication stability of the fluid control component in the application process.

[0007] A thermal management system includes: a domain controller and a fluid control component as described above; the domain controller includes: a control unit; wherein, the control module in the fluid control component is communicatively connected to the control unit via a LIN interface circuit.

[0008] The thermal management system provided in this application can, when interference exists on the communication line connected to the LIN port of its fluid control component, not only discharge through the transient voltage suppression diode in the LIN interface circuit, but also through the low-pass filter in the LIN interface circuit to promptly discharge the interference energy, thereby improving the immunity of LIN communication and enhancing the communication stability of the fluid control component during application. Attached Figure Description

[0009] The above and other features, advantages, and aspects of the embodiments of this application will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0010] Figure 1 This is a schematic diagram of the structure of the LIN communication system provided in the embodiments of this application;

[0011] Figure 2 A circuit diagram of a fluid control component provided in an embodiment of this application;

[0012] Figure 3 This is a test layout diagram of DBCI provided in an embodiment of this application;

[0013] Figure 4 This is a test layout diagram of CBCI provided in an embodiment of this application;

[0014] Figure 5 for Figure 3 A schematic diagram of the noise loop under the structure shown;

[0015] Figure 6 for Figure 4 A schematic diagram of the noise loop under the structure shown;

[0016] Figure 7 This is a simplified impedance model diagram for performing BCI immunity tests, provided in an embodiment of this application.

[0017] Figure 8 This is a layout diagram for electrostatic discharge operation of the LIN port provided in an embodiment of this application;

[0018] Figure 9 A simplified model diagram of the ESD generator provided in the embodiments of this application;

[0019] Figure 10 This is a schematic diagram of the current waveform of ESD provided in an embodiment of this application;

[0020] Figure 11 A circuit diagram of a fluid control component provided in an embodiment of this application;

[0021] Figure 12 Another specific circuit diagram of the fluid control component provided in the embodiments of this application;

[0022] Figure 13 for Figure 11 The equivalent circuit diagram of the structure shown is used for ESD testing.

[0023] Figure 14 A structural diagram of a fluid control assembly provided in an embodiment of this application;

[0024] Figure 15 Another structural diagram of the fluid control assembly provided in the embodiments of this application;

[0025] Figure 16 A schematic diagram of a thermal management system provided in an embodiment of this application;

[0026] Explanation of reference numerals in the attached figures:

[0027] 101 - Control module, 102 - LIN interface circuit, 103 - Motor control circuit, 121 - Low-pass filter, C1 - First capacitor, C2 - Second capacitor, C3 - Third capacitor, M - Motor, R - Resistor, L - Ferrite bead, TVS - Transient voltage suppressor diode, C - Equivalent capacitance outside the LIN port of the fluid control component, R1 - Equivalent resistance of the communication line, ZL1 - Impedance of R1, R2 - Resistance of the LIN port harness to ground, ZL2 - Impedance of R2, R3 - Artificial power network, ZL3 - Impedance of R3, Rc - Transmission resistance, Cs - Energy storage capacitor. Rd - Discharge resistor, RMCU-LIN input impedance, VLIN-LIN pin voltage, VESD - Discharge voltage in discharge model, RSD - Discharge resistor in discharge model, 10 - First circuit board assembly, 20 - Valve core assembly, 21 - Lead screw, 22 - Valve core, 30 - Nut seat, 40 - Valve port, 50 - Stator assembly, 51 - Stator, 52 - Stator pin, 60 - Magnetic rotor assembly, 61 - Rotor, 62 - Connecting plate, 70 - First connector, 71 - First external pin, 80 - Impeller, 100 - Fluid control assembly, 200 - Domain controller. Detailed Implementation

[0028] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is for explaining specific embodiments only and is not intended to limit the scope of this application.

[0029] The embodiments of this application are described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Those skilled in the art will understand that with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0030] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0031] LIN communication is used for communication between master and slave control systems. Typically, a master system can support up to 16 subsystems, and each subsystem only has the ability to communicate with the master system; subsystems cannot communicate with each other or with modules outside the LIN network. Fluid control components such as electric valves typically use LIN for control communication. During communication, due to changes in inductive loads, circuit induction, and other environmental factors, to avoid interference between electronic products during operation, or to enable the fluid control components to withstand a certain degree of interference, the vehicle imposes higher requirements on the anti-interference capabilities of the in-vehicle fluid control components to ensure normal operation under certain interference conditions. Therefore, such as... Figure 1 As shown, the control chip in the fluid control assembly, acting as a slave control chip, needs to communicate with the master control chip through a corresponding LIN interface circuit to improve communication anti-interference capability. However, the LIN interface circuits in related technologies typically have the following problems:

[0032] 1. Fluid control components, such as three-way water valves, are used in high-current applications, therefore they typically require BCI (Bulk Current Injection) immunity testing. However, when facing higher-level BCI immunity tests, due to the power lines of the fluid control components (such as...) Figure 1 The lines connected to the VCC pin shown in the diagram) and communication lines (such as...) Figure 1 There are distributed capacitance and distributed inductance between the lines connected to the LIN pin shown in the diagram. When the injected frequency reaches the resonant frequency of the distributed capacitance and distributed inductance, a coupling path will be formed. However, the alternating energy in the experiment is relatively large, and the circuit cannot discharge it immediately, which in turn affects the LIN communication, causing the LIN communication to malfunction or be interrupted.

[0033] 2. When performing contact discharge in power-on mode on the communication line, since the contact discharge directly hits the communication line, the device implementing ESD (Electrostatic Discharge) in the LIN interface circuit of the fluid control component cannot absorb or release all the energy to ground. The high-frequency current pulse is conducted to the fluid control component through the wiring harness, causing erroneous frames in the LIN communication.

[0034] Therefore, embodiments of this application provide a fluid control component to improve the immunity of LIN communication. The specific solution is as follows:

[0035] like Figure 2 As shown, the fluid control assembly includes: a motor M, a control module 101, and a LIN interface circuit 102; wherein:

[0036] Motor M is controlled by control module 101; in practical applications, this control module 101 can control motor M through a motor control circuit, such as... Figure 2 As shown, the PWM pin of the control module 101 is electrically connected to the control terminal of the motor control circuit 103. The input terminal of the motor control circuit 103 receives power, and the output terminal of the motor control circuit 103 is electrically connected to the motor M. This fluid control component can be an electric pump or an electric valve, such as any electric pump or electric valve used in an automotive thermal management system; the electric pump can be an electronic water pump or an electronic oil pump, and this is not limited to any particular type.

[0037] like Figure 2 As shown, the LIN interface circuit 102 includes: a transient voltage suppressor diode (TVS), a ferrite bead L, and a low-pass filter 121; the transient voltage suppressor diode (TVS) is electrically connected between the LIN port of the fluid control component and ground; the LIN port is electrically connected to the LIN pin of the control module 101 through the low-pass filter 121 and the ferrite bead L.

[0038] The fluid control component provided in this embodiment can, when interference exists on the communication line, not only discharge interference through the transient voltage suppression diode in the LIN interface circuit, but also through the low-pass filter in the LIN interface circuit to promptly discharge interference energy, thereby improving the immunity of LIN communication and enhancing the communication stability of the fluid control component during application. Specifically:

[0039] The BCI immunity test system mainly consists of a signal source, power amplifier, power meter, current coupling clamp, and control system. According to electromagnetic theory and principles, the current coupling clamp generates an induced magnetic field. When a conductor passes through the induced magnetic field, an induced voltage is generated on the conductor. If the conductor has a closed loop, an induced current can be formed. The magnitude of the induced current on the conductor is related not only to the strength of the induced magnetic field but also to the impedance of the closed loop. When the induced magnetic field is constant, the smaller the impedance of the closed loop, the larger the induced current. Therefore, for the coupling solution of BCI immunity testing, cutting off the coupling path and increasing the loop impedance are important means to prevent and solve interference.

[0040] When conducting BCI anti-interference tests, there are two injection methods: one is common-mode injection (CBCI) and the other is differential-mode injection (DBCI). The energy of the injected current and the interference path are different under the two injection methods, and the test results will also differ significantly. Figure 3 This is the test layout diagram for DBCI. Figure 4 This is the test layout diagram for CBCI. Figure 3 and Figure 4 In this diagram, 1 represents the DUT (Device Under Test), 2 represents the current injection probe, 3 represents the test load, 4 represents the DUT power return line (e.g., ground), and 5 represents the insulator. Figure 5 As shown, DBCI is characterized by noise forming loops between wire harnesses, with the loop path primarily consisting of wire harnesses or pathways with lower impedance. For example... Figure 6 As shown, common-mode injection is characterized by noise forming a loop between the wiring harness and ground (GND as shown in the figure), and forming a loop with ground through spatial coupling. Figure 5 and Figure 6 It can be seen that the entire circuit of the two injection methods is completely different.

[0041] Figure 7 The diagram shows a simplified impedance model for BCI anti-interference testing. Here, C is the equivalent capacitance outside the LIN port of the fluid control component; R1 is the equivalent resistance of the communication line, with an impedance of ZL1; R2 is the resistance of the LIN port harness to ground, with an impedance of ZL2; and R3 is the artificial power network, with an impedance of ZL3. The impedance relationships are set to satisfy ZL1 << ZL2 and ZL1 << ZL3. When alternating energy is injected into the line, due to the smaller impedance ZL1, the alternating energy is converted into current flowing through the equivalent resistance R1. Furthermore, because there are distributed parameters, namely distributed inductance and distributed capacitance, between the circuit board traces, a coupling path is formed when the injected frequency reaches the resonant frequency of the distributed capacitance and distributed inductance.

[0042] In this embodiment, by setting a low-pass filter 121, a smaller impedance loop is added to the coupling path to transfer and discharge the coupled alternating energy nearby, so that noise is no longer injected into the control module 101 through the LIN interface circuit.

[0043] In other words, when facing a high level of BCI anti-interference test, if the injection frequency reaches the resonant frequency of the distributed capacitance and distributed inductance between the power line and the communication line, thus forming a coupling path between the power line and the communication line, the low-pass filter 121 can also be used to timely discharge the large alternating energy in the test, thereby improving the anti-interference ability of LIN communication and enhancing the communication stability of the fluid control component in the application process.

[0044] Additionally, for ESD testing of the connection harness of the fluid control components, the layout diagram for electrostatic discharge operation of the LIN port can be found here. Figure 8 The fluid control component serves as the DUT, with one side connected to the DUT tester and the other end connected to the communication bus or remote I / O. The DUT tester is typically powered by a battery.

[0045] Figure 9 The ESD generator (i.e., the DUT tester mentioned above) was demonstrated. Figure 8 The simplified model of the DUT Exerciser shown uses a DC high-voltage power supply that discharges through a transmission resistor Rc = 50~100MΩ. The voltage on the energy storage capacitor Cs is transmitted through the discharge resistor Rd and the discharge switch, and finally outputs an electrostatic signal to the communication line of the fluid control component through the discharge head. This electrostatic signal returns to the energy storage capacitor Cs through the discharge loop connection point after passing through the communication line, thus realizing the ESD test of the fluid control component. In the discharge circuit, Cs = 150pF and Rd = 330Ω are selected, which are currently recognized parameters for simulating human body discharge models and are sufficiently stringent test settings.

[0046] Figure 10 The waveform of the ESD current is shown. As can be seen from the waveform, the discharge speed is very fast. The bandwidth of the ESD generator output signal is in the range of tens to 500MHz, which is a high-frequency signal. Through the low-pass filter 121 set in this embodiment, the high-frequency signal can be quickly discharged to ground, thereby preventing it from being conducted to the control module 101 and avoiding erroneous frames in LIN communication.

[0047] As can be seen from the above, through experiments, the configuration of the LIN interface circuit 102 has been verified, and this embodiment can achieve relatively high communication quality for the fluid control components.

[0048] Based on the previous embodiment, this embodiment provides an example of the specific structure of the low-pass filter 121, such as:

[0049] like Figure 11 As shown, the low-pass filter 121 may include: a resistor R, a first capacitor C1 and a second capacitor C2; one end of the resistor R is electrically connected to the LIN port, and the other end of the resistor R is electrically connected to one end of the ferrite bead L and one end of the first capacitor C1; the other end of the ferrite bead L is electrically connected to one end of the second capacitor C2 and the LIN pin; the other end of the first capacitor C1 and the other end of the second capacitor C2 are respectively grounded.

[0050] The first capacitor C1 and the second capacitor C2 are connected in parallel. The resistor R and the two together form a first-stage RC absorption circuit, which can provide a lower impedance loop for noise, discharge the noise to ground, and prevent the noise from being injected into the control module 101.

[0051] In practical applications, the ground connected to the transient voltage suppressor diode (TVS) and the first capacitor C1 for filtering can be placed close to the LIN port so that it can directly return to the wiring harness; the ground connected to the second capacitor C2 for filtering can be adjusted to be inside the circuit board and share a ground with the control module 101; but it is not limited to this.

[0052] Or, such as Figure 12 As shown, the low-pass filter 121 may also include: a resistor R and a third capacitor C3; one end of the resistor R is electrically connected to the LIN port, and the other end of the resistor R is electrically connected to one end of the ferrite bead L; the other end of the ferrite bead L is electrically connected to the LIN pin and one end of the third capacitor C3; the other end of the third capacitor C3 is grounded.

[0053] contrast Figure 11 and Figure 12 , Figure 11 The first capacitor C1, the ferrite bead L, and the second capacitor C2 can form a third-order CLC filter structure, while Figure 12 The ferrite bead L and the third capacitor C3 can form a second-order LC filter structure. The capacitors in both structures ( Figure 11 The first capacitor C1 and the second capacitor C2 are connected in parallel, or... Figure 12 The third capacitor (C3) in the circuit can form an RC absorption circuit with the resistor R to discharge noise.

[0054] The low-pass filter 121 structure provided in this embodiment can enhance the anti-interference capability of the fluid control component when performing LIN communication, suppress noise interference on the communication line, improve the quality of the bus signal, and also reduce electromagnetic radiation.

[0055] Based on the above embodiments, this embodiment provides illustrative examples of the device parameters in the low-pass filter 121, such as:

[0056] According to the LIN standard, the standard value of the LIN capacitor in a slave node cannot exceed 250pF. Therefore, the total capacitance of all capacitors in the low-pass filter 121 can be set to be less than or equal to 250pF. That is, set... Figure 11 In the case of C1+C2≤250pF, or, Figure 12 C3 ≤ 250pF. Its specific value is not limited; you can refer to the following setting method:

[0057] by Figure 11 Taking the structure shown as an example, the equivalent circuit drawn based on a simplified discharge model and circuit design is as follows: Figure 13 As shown, where V LIN R is the voltage on the LIN pin; R is the impedance of the aforementioned resistor R; R MCU V is the LIN input impedance, i.e., the equivalent impedance of the LIN pin inside the control module 101; ESD It is the discharge voltage in the discharge model, that is Figure 9 The voltage across the energy storage capacitor Cs; R ESD It is the discharge resistance in the discharge model, that is... Figure 9 In this circuit, Rd = 330Ω; Z(C1 / / C2) is the parallel impedance of the capacitors, that is, the impedance after the first capacitor C1 and the second capacitor C2 are connected in parallel. Based on the circuit connection, we can obtain:

[0058] V LIN =V ESD ×[Z(C1 / / C2) / / R MCU ] / [R+R ESD + Z(C1 / / C2) / / R MCU ].

[0059] Furthermore, due to the LIN input impedance R MCU It can be considered as infinity, therefore, we can obtain:

[0060] V LIN =V ESD ×Z(C1 / / C2) / [R+R ESD + Z(C1 / / C2)].

[0061] Without considering the resistance R, the smaller the parallel impedance Z (C1 / / C2) of the capacitors, the lower the voltage V on the LIN pin. LIN The smaller it is.

[0062] Due to the characteristics of capacitors, the lower the frequency, the greater the capacitor impedance. According to Z(C1 / / C2) = 1 / [j×2π×f×(C1 / / C2)], the larger the capacitance, the greater the voltage V on the LIN pin. LINThe smaller the value, the better. Here, j is the imaginary unit, π is pi, and f is the frequency of the electrostatic signal, which in the worst case takes a minimum value of 50MHz.

[0063] Of course, the characteristics of the LIN interface circuit must also be considered, and the capacitor parameters cannot be set infinitely large; in one example, for Figure 11 In the structure, the capacitance values ​​of the first capacitor C1 and the second capacitor C2 can be set to 100pF each; that is, setting C1=C2=100pF can satisfy the requirement that C1+C2≤250pF. For Figure 12 In the structure, the capacitance of the third capacitor C3 can be set to 200pF; that is, setting C3=200pF can also satisfy the requirement of C3≤250pF.

[0064] In addition, for Figure 11 or Figure 12 The parameter settings for the resistor R can be based on the following considerations:

[0065] by Figure 11 Taking the structure shown as an example, the RC circuit formed by resistor R, first capacitor C1, and second capacitor C2 has a good filtering effect on high-frequency signals and can realize the function of low-pass filter 121. Since fc=1 / (2×πRC), it can be seen that the larger the resistor R is, the better the filtering effect on high-frequency signals. Here, fc is the cutoff frequency of the low-pass filter 121, π is pi, R is the impedance of resistor R, and C is the total capacitance C1 / / C2 after the first capacitor C1 and the second capacitor C2 are connected in parallel.

[0066] However, considering that the delay time T=RC of the RC circuit must not exceed 10% of the LIN communication period T1, that is, the resistance value of resistor R must satisfy: R≤10%T1 / C; where T1 is the LIN communication period, and C is the total capacitance of all capacitors in the low-pass filter 121, for example... Figure 11 The total capacitance of the first capacitor C1 and the second capacitor C2 connected in parallel is C1 / / C2.

[0067] Similarly, the LIN signal transmitted on the communication line should also be considered. Generally, the frequency of the LIN signal is 19.2K, so the LIN communication period T1 = 1 / 19.2K ≈ 5us. Therefore, the resistance value of the resistor R needs to satisfy R ≤ 25Ω. Considering the error, R can be set to 20Ω.

[0068] The parameter settings for the devices in the low-pass filter 121 in this embodiment are only some optional examples, and are not limited to these in actual applications.

[0069] Based on the above embodiments, in this fluid control component, the control module 101 may include a control chip, and the LIN interface circuit 102 and the motor control circuit 103 are both peripheral circuits of the control chip. Alternatively, the control module 101 and the LIN interface circuit 102 may also be integrated into the control chip. This depends on the specific application environment and is within the scope of protection of this application.

[0070] Figure 14 A specific example of the structure of the fluid control component when it is an electric valve is given, such as... Figure 14 As shown, the fluid control assembly includes a first circuit board assembly 10 and a first connector 70; the first circuit board assembly 10 includes a control module 101 and a LIN interface circuit 102; the motor M includes a stator assembly 50; the stator assembly 50 includes stator pins 52, and the stator pins 52 and the control module 101 are electrically connected through the first circuit board assembly 10; the first connector 70 includes a first external pin 71, and the first external pin 71 and the LIN interface circuit 102 are electrically connected through the first circuit board assembly 10.

[0071] In addition, such as Figure 14 As shown, the fluid control assembly includes a valve core assembly 20; the motor M includes a magnetic rotor assembly 60; the valve core assembly 20 is connected to the magnetic rotor assembly 60, and the stator assembly 50 can drive the magnetic rotor assembly 60 to rotate, thereby driving the valve core assembly 20 to adjust the flow cross-section size of the valve port 40 of the fluid control assembly.

[0072] Furthermore, such as Figure 14 As shown, the valve core assembly 20 includes a lead screw 21 and a valve core 22; the magnetic rotor assembly 60 includes a rotor 61 and a connecting plate 62; one end of the lead screw 21 is fixedly connected to the connecting plate 62, and the connecting plate 62 is fixedly connected to the rotor 61; the lead screw 21 and the valve core 22 are slidably engaged, allowing the lead screw 21 to drive the valve core 22 to move axially along the fluid control assembly, thereby opening or closing the valve port 40 of the fluid control assembly. In practical applications, the lead screw 21 can be threaded into the nut seat 30 of the fluid control assembly, but it is not limited to this, as long as it can drive the valve core 22 to move axially along the fluid control assembly.

[0073] Specifically, the control module 101 controls the motor control circuit 103 on the first circuit board assembly 10 to operate, so that the motor control circuit 103 outputs corresponding electrical energy; the electrical energy is transmitted to the stator 51 in the stator assembly 50 via the stator pin 52, and then the stator 51 drives the rotor 61 to rotate; the rotation of the rotor 61 is transmitted through the connecting plate 62 and the lead screw 21, which drives the valve core 22 to move along the axial direction of the fluid control assembly, thereby adjusting the flow cross section of the valve port 40.

[0074] Figure 15A specific example of the structure of the fluid control component when it is an electric pump is given, in addition to the aforementioned first circuit board assembly 10, first connector 70, stator assembly 50, and magnetic rotor assembly 60, as follows: Figure 15 As shown, the fluid control assembly may further include an impeller 80, which is fixedly connected to a magnetic rotor assembly 60. The magnetic rotor assembly 60 can drive the impeller 80 to rotate circumferentially along the fluid control assembly. In some embodiments not shown in the figures, the impeller and the magnetic rotor assembly may also be connected in a limiting manner.

[0075] like Figure 15 In the embodiment shown, the impeller 80 and the magnetic rotor assembly 60 are fixed by injection molding. In some embodiments not shown in the figures, the impeller and the magnetic rotor assembly may be fixed by other forms, such as bolts. This is not limited here and is within the scope of protection of this application.

[0076] For details on the structure and working principle of this fluid control component, please refer to the relevant technologies, which will not be elaborated here.

[0077] Another embodiment of this application also provides a thermal management system, such as Figure 16 As shown, it includes: a domain controller 200 and a fluid control component 100 as described in any of the above embodiments; the number of fluid control components 100 can be multiple ( Figure 16 (Two examples are shown below), and each fluid control component 100 can be an electric valve or an electric pump, and their types can be the same or different, depending on the specific application environment. The structure and working principle of the fluid control component 100 can be found in the above embodiments, and will not be repeated here.

[0078] The domain controller 200 includes a control unit; the control module 101 in the fluid control assembly 100 is communicatively connected to the control unit via a LIN interface circuit 102. That is, the domain controller 200 can act as a master node, and when its control unit includes a control chip, the control chip can act as... Figure 1 The main control chip shown is shown; and each fluid control component 100 can act as a slave node. When the control module 101 includes a control chip, the control chip can act as... Figure 1 The slave control chip shown is connected to the LIN bus through the corresponding LIN interface circuit 102 to realize the communication connection with the master control chip.

[0079] The domain controller 200 can refer to a body controller, front-end controller, or air conditioning controller, etc., and is not limited here. The structure and function of the control module 101 and the LIN interface circuit 102 can be found in the above embodiments, and will not be described in detail here. In practical applications, the domain controller 200 and the fluid control component 100 can be integrated on the same flow channel board, but are not limited to this.

[0080] The thermal management system provided in this embodiment uses the fluid control component 100 described in the above embodiment to communicate with the domain controller 200; through experiments, it is verified that the setting of the LIN interface circuit 102 makes the communication quality of the fluid control component 100 relatively high.

[0081] In practical applications, the domain controller 200 may include a second circuit board assembly and a second connector; wherein the second circuit board assembly includes the aforementioned control unit; the second connector includes a second external pin, the second external pin and the control unit are electrically connected through the second circuit board assembly, and the second external pin and the first external pin 71 of the fluid control component 100 are electrically connected through a wiring harness.

[0082] That is, the domain controller 200 and the fluid control component 100 can be equipped with corresponding circuit board assemblies. The two circuit board assemblies are connected to the two ends of the same wiring harness through their respective external connectors, thereby enabling the transmission and transmission of LIN communication data between the domain controller 200 and the fluid control component 100.

[0083] In addition, when the thermal management system includes at least two fluid control components 100, the wiring harness may include a master node interface and at least two slave node interfaces; wherein, the master node interface is electrically connected to the domain controller 200, specifically it may be electrically connected to the aforementioned second external pin; the at least two slave node interfaces are electrically connected to at least two fluid control components 100, for example, each slave node interface is electrically connected to each fluid control component 100 in a one-to-one correspondence, specifically each slave node interface may be electrically connected to the corresponding aforementioned first external pin 71.

[0084] The structure and working principle of the fluid control component can be found in the above embodiments or related technologies, and will not be repeated here.

[0085] Similar or identical parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the description of the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0086] The features described above regarding the disclosed embodiments can be substituted for or combined with each other to enable those skilled in the art to implement or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A fluid control component, characterized in that, include: The motor (M), control module (101), and LIN interface circuit (102) are included; among them, The motor (M) is controlled by the control module (101). The LIN interface circuit (102) includes: a transient voltage suppressor diode (TVS), a ferrite bead (L), and a low-pass filter (121). The transient voltage suppressor diode (TVS) is electrically connected between the LIN port of the fluid control component and ground; The LIN port is electrically connected to the LIN pin of the control module (101) through the low-pass filter (121) and the ferrite bead (L).

2. The fluid control assembly according to claim 1, characterized in that, The low-pass filter (121) includes: a resistor (R), a first capacitor (C1), and a second capacitor (C2); one end of the resistor (R) is electrically connected to the LIN port, and the other end of the resistor (R) is electrically connected to one end of the ferrite bead (L) and one end of the first capacitor (C1); the other end of the ferrite bead (L) is electrically connected to one end of the second capacitor (C2) and the LIN pin; the other ends of the first capacitor (C1) and the second capacitor (C2) are respectively grounded.

3. The fluid control assembly according to claim 1, characterized in that, The low-pass filter (121) includes a resistor (R) and a third capacitor (C3); one end of the resistor (R) is electrically connected to the LIN port, and the other end of the resistor (R) is electrically connected to one end of the ferrite bead (L); the other end of the ferrite bead (L) is electrically connected to the LIN pin and one end of the third capacitor (C3); the other end of the third capacitor (C3) is grounded.

4. The fluid control assembly according to any one of claims 1 to 3, characterized in that, The control module (101) includes a control chip, or the control module (101) and the LIN interface circuit (102) are integrated in the control chip.

5. The fluid control assembly according to claim 4, characterized in that, The fluid control assembly includes a first circuit board assembly (10) and a first connector (70); the first circuit board assembly (10) includes the control module (101) and the LIN interface circuit (102); the motor (M) includes a stator assembly (50); the stator assembly (50) includes stator pins (52), the stator pins (52) and the control module (101) are electrically connected through the first circuit board assembly (10); the first connector (70) includes a first external pin (71), the first external pin (71) and the LIN interface circuit (102) are electrically connected through the first circuit board assembly (10).

6. The fluid control assembly according to claim 5, characterized in that, The fluid control assembly includes a valve core assembly (20); the motor (M) includes a magnetic rotor assembly (60); the valve core assembly (20) is connected to the magnetic rotor assembly (60), and the stator assembly (50) can drive the magnetic rotor assembly (60) to rotate, thereby driving the valve core assembly (20) to adjust the flow cross-section size of the valve port (40) of the fluid control assembly.

7. The fluid control assembly according to claim 6, characterized in that, The valve core assembly (20) includes a lead screw (21) and a valve core (22); the magnetic rotor assembly (60) includes a rotor (61) and a connecting plate (62); one end of the lead screw (21) is fixedly connected to the connecting plate (62), and the connecting plate (62) is fixedly connected to the rotor (61); the lead screw (21) and the valve core (22) are slidably engaged, so that the lead screw (21) can drive the valve core (22) to move along the axial direction of the fluid control assembly, thereby opening or closing the valve port (40) of the fluid control assembly.

8. The fluid control assembly according to any one of claims 1 to 3, characterized in that, The fluid control assembly includes a first circuit board assembly (10) and a first connector (70); the first circuit board assembly (10) includes the control module (101) and the LIN interface circuit (102); the motor (M) includes a stator assembly (50); the stator assembly (50) includes stator pins (52), the stator pins (52) and the control module (101) are electrically connected through the first circuit board assembly (10); the first connector (70) includes a first external pin (71), the first external pin (71) and the LIN interface circuit (102) are electrically connected through the first circuit board assembly (10).

9. The fluid control assembly according to claim 8, characterized in that, The fluid control assembly includes a valve core assembly (20); the motor (M) includes a magnetic rotor assembly (60); the valve core assembly (20) is connected to the magnetic rotor assembly (60), and the stator assembly (50) can drive the magnetic rotor assembly (60) to rotate, thereby driving the valve core assembly (20) to adjust the flow cross-section size of the valve port (40) of the fluid control assembly.

10. The fluid control assembly according to claim 9, characterized in that, The valve core assembly (20) includes a lead screw (21) and a valve core (22); the magnetic rotor assembly (60) includes a rotor (61) and a connecting plate (62); one end of the lead screw (21) is fixedly connected to the connecting plate (62), and the connecting plate (62) is fixedly connected to the rotor (61); the lead screw (21) and the valve core (22) are slidably engaged, so that the lead screw (21) can drive the valve core (22) to move along the axial direction of the fluid control assembly, thereby opening or closing the valve port (40) of the fluid control assembly.

11. A thermal management system, characterized in that, include: A domain controller (200) and a fluid control assembly (100) as described in any one of claims 1 to 10; the domain controller (200) includes: a control unit; wherein, The control module (101) in the fluid control assembly (100) is communicatively connected to the control unit via a LIN interface circuit (102).

12. The thermal management system according to claim 11, characterized in that, The domain controller (200) includes a second circuit board assembly and a second connector; the second circuit board assembly includes the control unit; the second connector includes a second external pin, the second external pin and the control unit are electrically connected through the second circuit board assembly, and the second external pin and the first external pin (71) of the fluid control assembly (100) are electrically connected through a wiring harness.

13. The thermal management system according to claim 12, characterized in that, The fluid control assembly (100) is at least two, and the wiring harness includes a master node interface and at least two slave node interfaces; the master node interface is electrically connected to the domain controller (200), and the at least two slave node interfaces are electrically connected to at least two of the fluid control assemblies (100).

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