Liquid-cooled mainframe and energy storage system

Abstract

The application discloses a liquid-cooled main machine and an energy storage system, and belongs to the technical field of thermal management. The liquid-cooled main machine comprises a shell, one side of which is provided with an air inlet, and the other side of which is provided with an air outlet; a liquid cooling device is installed on the shell; a fan is installed at the air inlet of the shell; at least one radiator is installed on the shell and located between the outlet of the fan and the air outlet, and the radiator has a plurality of channels. According to the liquid-cooled main machine, the cross-sectional area difference formed by the channels of the radiator and the downstream area constitutes a physical structure based on the expansion cavity noise reduction principle, so that effective passive noise reduction can be realized without adding additional noise reduction elements, and the integration and economy of the liquid-cooled main machine can be improved.

Description

Technical Field

[0001] This application belongs to the field of thermal management technology, and in particular relates to a liquid cooling host and energy storage system. Background Technology

[0002] In energy storage systems, liquid-cooled chillers can provide cooling for the energy storage devices. However, the fans in liquid-cooled chillers are quite noisy, which can affect the environment around the energy storage system. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the related art. To this end, this application proposes a liquid-cooled host and energy storage system that can achieve effective noise reduction without adding additional noise reduction components.

[0004] In a first aspect, this application provides a liquid-cooled host computer, comprising: The casing has an air inlet on one side and an air outlet on the other side; Liquid-cooled components, mounted in the housing; A fan is installed at the air inlet of the housing; At least one radiator is mounted on the housing and located between the outlet of the fan and the air outlet, the radiator having multiple channels.

[0005] According to the liquid-cooled host of this application, by utilizing the cross-sectional area difference formed by the channel of the heat sink and the downstream area, a physical structure based on the sound-absorbing principle of the expansion cavity is formed. Without adding additional noise reduction components, effective passive noise reduction can be achieved, which can improve the integration and economy of the liquid-cooled host.

[0006] According to one embodiment of this application, The radiator is spaced apart from the outlet of the fan and the air outlet. or, The radiator is located at the air outlet.

[0007] According to one embodiment of this application, The radiator is arranged parallel to the air outlet; or, The radiator is tilted relative to the air outlet.

[0008] According to one embodiment of this application, the liquid-cooled host further includes: An air collecting plate is disposed inside the housing and located between the outlet of the fan and the air outlet. The air collecting plate and the housing form an exhaust port that connects the outlet of the fan and the channel. The flow cross-sectional area of ​​the exhaust port is smaller than the flow cross-sectional area of ​​the downstream air duct.

[0009] According to one embodiment of this application, the liquid-cooled host further includes: A flow guide is provided at the exhaust port.

[0010] According to one embodiment of this application, the housing forms an air duct between the outlet of the fan and the air outlet, the housing is provided with a liquid cooling device mounting compartment, and the flow cross-sectional area of ​​the air duct at the liquid cooling device mounting compartment is smaller than the flow cross-sectional area downstream.

[0011] According to one embodiment of this application, the cross-sectional area of ​​the liquid cooling device mounting compartment facing the outlet of the fan is smaller than the cross-sectional area facing the air outlet.

[0012] According to one embodiment of this application, the radiator is provided between the liquid cooling device mounting compartment and the outlet of the fan.

[0013] According to one embodiment of this application, multiple sets of liquid cooling device mounting chambers are provided along the distance from the outlet of the fan to the air outlet. The heat sink is provided between adjacent sets of liquid cooling device mounting chambers and between the set of liquid cooling device mounting chambers closest to the outlet of the fan and the outlet of the fan.

[0014] According to one embodiment of this application, The liquid cooling device mounting compartment is integrally formed with at least a portion of the housing; or, The housing of the liquid-cooled device mounting compartment is an independently molded structure.

[0015] According to one embodiment of this application, The liquid cooling device mounting compartment is located at the edge of the air duct; or, The liquid cooling device mounting compartment is located in the middle of the air duct and divides the air duct into multiple sub-air ducts.

[0016] According to one embodiment of this application, the liquid cooling device mounting compartment has a through hole for connecting the interior of the liquid cooling device mounting compartment with the air duct.

[0017] According to one embodiment of this application, the radiator is the condenser in the compressor cycle of the liquid-cooled host.

[0018] Secondly, this application provides an energy storage system, comprising: Energy storage devices; Liquid-cooled host as described in any of the above.

[0019] According to the energy storage system of this application, by adopting the above-mentioned liquid-cooled host, the cross-sectional area difference formed by the channel of the heat sink and the downstream area can be used to form a physical structure based on the principle of expansion cavity noise reduction. Without adding additional noise reduction components, effective passive noise reduction can be achieved, thereby improving the integration and economy of the energy storage system.

[0020] According to one embodiment of this application, The liquid cooling unit is installed outside the energy storage device and is located at the end or side of the energy storage device.

[0021] According to one embodiment of this application, The liquid cooling host includes multiple units, which are arranged side by side at the end or side of the energy storage device; or, The liquid cooling host includes multiple units, which are respectively located at different ends or different sides of the energy storage device.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is one of the structural schematic diagrams of the energy storage system provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the energy storage system provided in the embodiments of this application; Figure 3 This is the third schematic diagram of the energy storage system provided in the embodiments of this application; Figure 4 This is the fourth schematic diagram of the energy storage system provided in the embodiments of this application; Figure 5 This is one of the structural schematic diagrams of the liquid-cooled host provided in the embodiments of this application; Figure 6 This is a second schematic diagram of the structure of the liquid-cooled host provided in the embodiments of this application; Figure 7 This is the third schematic diagram of the structure of the liquid-cooled host provided in the embodiments of this application; Figure 8 This is the fourth schematic diagram of the structure of the liquid-cooled host provided in the embodiments of this application; Figure 9 This is the fifth schematic diagram of the structure of the liquid-cooled host provided in the embodiments of this application; Figure 10 This is the sixth schematic diagram of the liquid-cooled host provided in the embodiments of this application; Figure 11 This is the seventh schematic diagram of the structure of the liquid-cooled host provided in the embodiments of this application; Figure 12 This is a schematic diagram of the liquid cooling device mounting compartment provided in the embodiments of this application; Figure 13 This is a schematic diagram of the shell structure provided in the embodiments of this application; Figure 14 This is a schematic diagram of the structure of the heat sink provided in the embodiment of this application.

[0024] Figure label: Energy storage system 10, liquid cooling unit 100; Housing 110, air inlet 111, air outlet 112; Fan 120; Radiator 130, Channel 131; Air collection plate 140, air outlet 141; 150mm airflow deflector; Liquid-cooled device mounting compartment 160, through hole 161, first resonant cavity 162, second resonant cavity 163; Protective netting 170; Air duct 180, sub-air duct 181; Energy storage device 200. Detailed Implementation

[0025] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0026] The following is for reference. Figures 1-14 This application describes an energy storage system 10 and a liquid-cooled host 100 according to embodiments thereof.

[0027] Energy storage system 10 is an integrated system capable of storing energy and releasing it as needed.

[0028] like Figures 1-4 As shown, the energy storage system 10 includes an energy storage device 200 and a liquid cooling host 100.

[0029] Energy storage device 200 is a device in energy storage system 10 that can store energy and release it when needed. Energy storage device 200 can be an energy storage battery box, which may include battery cabinets, battery management systems, and fire protection systems, etc.

[0030] The liquid-cooled host 100 is the execution unit of the thermal management system, which can absorb the heat generated by the energy storage device 200, enabling the energy storage device 200 to operate within a suitable temperature range.

[0031] like Figures 5-11 As shown, the liquid-cooled host 100 may include a housing 110, liquid cooling components, a fan 120, and a heat sink 130.

[0032] The housing 110 is the main frame and external structure of the liquid-cooled host 100, which can be used to house, fix and protect the internal components. The housing 110 can be a metal or high-strength plastic enclosure.

[0033] like Figure 13 As shown, an air inlet 111 is provided on one side of the housing 110, and an air outlet 112 is provided on the other side of the housing 110.

[0034] When the fan 120 is an axial flow fan, the air inlet 111 and the air outlet 112 can be located on opposite sides of the housing 110; when the fan 120 is a centrifugal fan, the air inlet 111 and the air outlet 112 can be located on adjacent sides of the housing 110.

[0035] The positional design of the air inlet 111 and air outlet 112 of the housing 110 determines the airflow path inside the liquid cooling unit 100. Air can flow in from the air inlet 111 and be discharged from the air outlet 112.

[0036] Liquid cooling devices are components within the liquid cooling unit 100. For example, when the thermal management system includes a compressor cycle, the liquid cooling devices may include a compressor, a condenser, an expansion valve, and an evaporator; when the thermal management system includes a water pump cycle, the liquid cooling devices may include a water pump and an evaporator; when the thermal management system includes both a compressor cycle and a water pump cycle, the liquid cooling devices may include a compressor, a condenser, an expansion valve, a water pump, and an evaporator, and the compressor cycle and the water pump cycle can be coupled through heat exchange via the evaporator.

[0037] Liquid cooling devices can be installed in housing 110.

[0038] The fan 120 is a power source that blows or draws air from outside the liquid-cooled host 100 into or into the housing 110.

[0039] like Figures 5-11 As shown, the fan 120 is installed at the air inlet 111 of the housing 110.

[0040] A medium can circulate in the radiator 130, and the medium in the radiator 130 can exchange heat with the air blown into the housing 110 by the fan 120.

[0041] like Figures 5-9 and Figure 11As shown, the liquid-cooled main unit 100 may include one heat sink 130. The liquid-cooled main unit 100 may also include multiple heat sinks 130, such as... Figure 10 As shown, the liquid-cooled host 100 may include two heat sinks 130.

[0042] like Figures 5-11 As shown, the radiator 130 is mounted on the housing 110. The radiator 130 can be located between the outlet and the air outlet 112 of the fan 120. The radiator 130 has multiple channels 131.

[0043] The multiple channels 131 of the radiator 130 allow air to circulate, enabling heat exchange between the air and the medium inside the radiator 130.

[0044] In this way, a large amount of air can enter the housing 110 from the air inlet 111 driven by the fan 120, and be blown from the fan 120 outlet to the multiple channels 131 of the radiator 130. The air in the multiple channels 131 of the radiator 130 can absorb the heat of the medium in the radiator 130 and cool the medium in the radiator 130. The air blown through the multiple channels 131 of the radiator 130 can be blown out of the housing 110 from the air outlet 112. The fan 120 can increase the heat exchange efficiency between the medium and the air in the radiator 130.

[0045] Because the radiator 130 has pipes for the flow medium, the airflow cross-sectional area formed by the multiple channels 131 of the radiator 130 is smaller than the airflow cross-sectional area of ​​its downstream region. This structure can acoustically form an expansion cavity. According to the principle of expansion cavity noise reduction, when a sound wave passes through the cavity with an expanded cross-section, due to the sudden change in acoustic impedance, part of the sound wave will continue to propagate forward, while another part of the sound wave will be reflected back. These reflected waves have opposite frequencies and phase misalignments with the incident waves, thus causing acoustic interference at the entrance of the expansion cavity, which cancels each other out. The energy of specific frequency bands in the sound wave will be attenuated due to reflection interference, especially the noise energy attenuation of the wavelength corresponding to its peak frequency, which is related to the size of the expansion cavity. This can effectively reduce the noise after the airflow passes through the channels 131 of the radiator 130.

[0046] When the fan 120 rotates, it cuts through the air, generating vortices and turbulence. This results in uneven distribution and turbulent flow of the airflow from the fan 120 outlet within the casing 110. This turbulent, high-speed airflow is the main source of aerodynamic noise. When the radiator 130 is placed downstream of the fan 120 outlet, the airflow passes through the narrow channels 131 of the radiator 130. Large vortices and turbulence are dispersed or cut by the radiator 130, making the airflow smoother and more orderly, thus reducing noise caused by vortex shedding and turbulent pulsation.

[0047] Furthermore, the radiator 130 increases flow resistance. According to the principle of fluid continuity, after the airflow passes through the channel 131 of the radiator 130, the static pressure changes, and the airflow velocity decreases and becomes more balanced. According to Lighthill's Eighth Law, the sound power of aerodynamic noise generated by turbulence is proportional to a high power of the airflow velocity. Therefore, reducing the airflow velocity can reduce noise, and the radiator 130's effect of slowing down the airflow also achieves a noise reduction effect.

[0048] In this way, while completing the heat exchange between air and medium, the radiator 130 can effectively reduce the noise generated by airflow by virtue of its own channel 131 characteristics.

[0049] According to the liquid-cooled host 100 provided in the embodiments of this application, by utilizing the cross-sectional area difference formed by the channel 131 of the heat sink 130 and the downstream area, a physical structure based on the principle of expansion cavity noise reduction is formed. Without the need to add additional noise reduction components, effective passive noise reduction can be achieved, which can improve the integration and economy of the liquid-cooled host 100.

[0050] Correspondingly, the energy storage system 10 provided in the embodiments of this application, by adopting the above-mentioned liquid-cooled host 100, can utilize the cross-sectional area difference formed by the channel 131 of the radiator 130 and the downstream area to form a physical structure based on the principle of expansion cavity noise reduction. Without adding additional noise reduction components, it can achieve effective passive noise reduction, thereby improving the integration and economy of the energy storage system 10.

[0051] The mounting location of the heat sink 130 can be at least one of the following: Firstly, such as Figure 5 As shown, the outlet of the radiator 130 is separated from the outlet of the fan 120, and the radiator 130 is separated from the air outlet 112.

[0052] In this embodiment, the radiator 130 is located between the outlet of the fan 120 and the air outlet 112, and there is a certain gap between the outlet of the fan 120 and the radiator 130, and a certain gap between the radiator 130 and the air outlet 112.

[0053] A certain gap is left between the outlet of the fan 120 and the radiator 130, which allows the airflow to diffuse and mix, becoming more uniform in the lateral direction, so that all parts of the radiator 130 can be effectively utilized, thereby improving the overall heat dissipation efficiency.

[0054] In other words, the radiator 130 divides the airflow cavity between the outlet of the fan 120 and the air outlet 112 into multiple sub-cavities. Adjacent sub-cavities are connected by a channel 131, and the flow cross-sectional area of ​​the channel 131 is smaller than the flow cross-sectional area of ​​the next downstream sub-cavity.

[0055] In this way, when air flows from one sub-cavity to the channel 131 of the radiator 130, the air is rectified and decelerated through the channel 131; when the air flows from the channel 131 to the next sub-cavity, the flow cross-sectional area increases. According to the principle of expansion cavity noise reduction, the noise energy related to the wavelength of the peak frequency in the sound wave and the size of the expansion cavity is attenuated, which can effectively reduce airflow noise.

[0056] Secondly, such as Figure 7 As shown, the radiator 130 is located at the air outlet 112.

[0057] In this embodiment, the space between the outlet of the fan 120 and the radiator 130 is relatively large, which allows the airflow to diffuse and mix more effectively, becoming more uniform in the lateral direction, so that all parts of the radiator 130 can be effectively utilized, thereby improving the overall heat dissipation efficiency.

[0058] Before exiting the liquid-cooled main unit 100, the airflow generated by the fan 120 first flows through the dense, fine channels 131 of the radiator 130. The channels 131 of the radiator 130 can rectify the turbulent airflow, making its flow smoother and more uniform. Simultaneously, the channels 131 of the radiator 130 can reduce the airflow velocity. Based on the high-order proportionality between aerodynamic noise power and flow velocity, reducing the flow velocity can weaken the aerodynamic noise generated when the airflow exits the liquid-cooled main unit 100.

[0059] Meanwhile, when air flows from the dense, fine channels 131 of the radiator 130 to the external environment of the air outlet 112 of the housing 110, the dense, fine channels of the radiator 130 and the external space of the air outlet 112 of the housing 110 form an expansion cavity. According to the principle of expansion cavity noise reduction, the noise energy corresponding to the wavelength of the peak frequency in the sound wave is related to the size of the expansion cavity and is attenuated, which can effectively reduce airflow noise.

[0060] In addition, the radiator 130 is located at the air outlet 112 to reduce the recirculation of hot air.

[0061] In the actual application of radiator 130, the installation position of radiator 130 can be reasonably arranged according to factors such as airflow resistance, heat source distribution, spatial layout and noise requirements.

[0062] The heatsink 130 can be installed in at least one of the following positions: Firstly, such as Figure 5 and Figure 7 As shown, the radiator 130 is arranged parallel to the air outlet 112.

[0063] In this embodiment, airflow can pass more smoothly through the channels 131 of the radiator 130, reducing collisions with the surface of the radiator 130. This smoother airflow path helps reduce noise caused by airflow collisions.

[0064] At the same time, it can reduce the eddies or turbulence generated by the airflow on the surface of the radiator 130 or in the channel 131 of the radiator 130, which helps to maintain the stability and uniformity of the airflow, thereby reducing noise.

[0065] In addition, because the airflow path is more direct and the resistance is lower, the fan 120 can push the airflow through the radiator 130 more efficiently, which helps to reduce the load and speed of the fan 120, thereby reducing the noise generated by the fan 120.

[0066] Secondly, such as Figure 6 As shown, the radiator 130 is tilted relative to the air outlet 112.

[0067] In this embodiment, the length of the airflow cavity inside the housing 110 can be changed by adjusting the tilt angle of the radiator 130 relative to the air outlet 112, thereby improving the turbulence of the flow field and reducing aerodynamic noise.

[0068] The airflow direction can be optimized by adjusting the tilt angle of the radiator 130 relative to the air outlet 112. At the same time, the length of each sub-cavity of the airflow in the housing 110 can be changed to improve the turbulence of the flow field in a gradient manner.

[0069] In addition, an appropriate tilt angle can reduce the eddies and turbulence generated by the airflow on the surface of the radiator 130. By adjusting the tilt angle of the radiator 130 relative to the air outlet 112, the airflow may form a more stable laminar flow, which is beneficial to reducing the noise level.

[0070] When parallel placement of the radiator 130 may cause specific noise problems such as airflow resonance, tilting the radiator 130 can effectively reduce these specific noise problems.

[0071] In the actual application of radiator 130, the installation posture of radiator 130 can be reasonably arranged according to factors such as airflow resistance, heat source distribution, spatial layout and noise requirements.

[0072] In practical applications, multiple radiators 130 can be installed in the liquid cooling host 100 according to the actual heat dissipation requirements of the energy storage device 200. For example, multiple radiators 130 can be installed parallel to the air outlet 112; or, multiple radiators 130 can be installed inclined to the air outlet 112; or, one or more radiators 130 can be installed parallel to the air outlet 112, and one or more radiators 130 can be installed inclined to the air outlet 112.

[0073] In some embodiments, such as Figure 9 As shown, the liquid cooling unit 100 includes an air collection plate 140.

[0074] The air intake plate 140 is a plate-shaped structure used to manage and optimize airflow paths.

[0075] like Figure 9 As shown, the air collecting plate 140 is disposed inside the housing 110 and is located between the outlet of the fan 120 and the air outlet 112. An exhaust port 141 is formed between the air collecting plate 140 and the housing 110. The exhaust port 141 is connected to the outlet of the fan 120 and the channel 131. The flow cross-sectional area of ​​the exhaust port 141 is smaller than the flow cross-sectional area of ​​the downstream air duct 180.

[0076] According to the principle of expansion cavity silencing, when the airflow enters the downstream large cross-sectional area air duct 180 from the small cross-sectional area exhaust port 141, the expansion of the airflow flow cross-sectional area will cause sound waves to reflect and interfere with each other, thereby effectively attenuating aerodynamic noise.

[0077] In addition, when the airflow flows out of the fan 120 outlet and passes through the exhaust port 141 with a smaller cross-sectional area, the vortex generated by the blade tip of the fan 120 can be weakened, and the airflow passing through the exhaust port 141 will become more uniform and stable, which can reduce airflow noise.

[0078] In some embodiments, such as Figure 9 As shown, the liquid-cooled host 100 includes a flow guide 150.

[0079] The air guide 150 may consist of a series of inclined blades, which can guide the direction and state of airflow discharged from the exhaust port 141 by adjusting the installation angle of the blades.

[0080] The guide 150 can "cut" the airflow, reduce its tangential velocity, reduce eddies, and transform the airflow from a rotating and turbulent state to a more uniform flow state. At the same time, it can guide the airflow more evenly to the downstream flow space.

[0081] In this way, when the airflow passes through the radiator 130, the central and edge areas of the radiator 130 can receive a relatively uniform airflow for heat exchange, reducing local overheating of the radiator 130.

[0082] Meanwhile, the guide 150 reduces noise by reducing eddies and making the airflow more uniform.

[0083] In some embodiments, the housing 110 forms an air duct 180 between the outlet and the air outlet 112 of the fan 120.

[0084] That is, the air duct 180 is the path through which air flows from the outlet of the fan 120 to the air outlet 112 within the housing 110.

[0085] like Figures 8-11 As shown, the housing 110 is provided with a liquid cooling device mounting compartment 160. The liquid-cooled component mounting compartment 160 is an area or compartment used to fix, house, and protect liquid-cooled components. By fixing the liquid-cooled components within the area or compartment, the liquid-cooled component mounting compartment 160 can reduce the impact of the liquid-cooled component's vibration on other components, and at the same time help to isolate the heat generated by the liquid-cooled component from the air duct 180 to a certain extent.

[0086] Meanwhile, the liquid cooling device installation compartment 160 encapsulates the liquid cooling equipment that may need to be repaired or replaced in a relatively independent space. This layout allows maintenance personnel to quickly access the liquid cooling equipment that needs to be repaired or replaced without disassembling the entire liquid cooling host 100 structure, simplifying the operation process, reducing maintenance time and labor costs, and effectively reducing interference or damage to other sensitive components during maintenance, thereby ensuring the efficiency and safety of maintenance operations.

[0087] like Figures 8-11 As shown, the flow cross-sectional area of ​​the air duct 180 at the liquid cooling device mounting compartment 160 is smaller than the flow cross-sectional area downstream.

[0088] That is, when air flows through the air duct 180 at the liquid cooling device installation chamber 160 to the downstream air duct 180, the cross-sectional area of ​​the airflow changes from small to large.

[0089] According to the principle of expansion cavity noise reduction, when the airflow enters the downstream large flow cross-sectional area airflow duct 180 from the small flow cross-sectional area airflow duct 180 at the liquid cooling device installation compartment 160, it is equivalent to entering an expansion cavity. This structure can effectively attenuate airflow noise.

[0090] In some embodiments, such as Figures 8-10 As shown, the cross-sectional area of ​​the liquid cooling device mounting compartment 160 facing the outlet of the fan 120 is smaller than the cross-sectional area facing the air outlet 112.

[0091] The side of the liquid cooling device mounting compartment 160 facing the outlet of the fan 120 can be configured as streamlined or wedge-shaped, which can guide the air flowing to the air duct 180 at the liquid cooling device mounting compartment 160, reduce impact resistance and eddies, and reduce noise when the air flows to the air duct 180 at the liquid cooling device mounting compartment 160.

[0092] In some embodiments, such as Figures 8-11 As shown, a radiator 130 is provided between the liquid cooling device mounting compartment 160 and the outlet of the fan 120.

[0093] That is, the radiator 130 is located between the outlet of the fan 120 and the liquid cooling device mounting compartment 160.

[0094] The air exiting the fan 120 can first flow through the channel 131 of the radiator 130, and then through the air duct 180 at the liquid cooling device mounting compartment 160. In this way, the air is first blown into the channel 131 of the radiator 130, allowing the air to exchange heat with the medium in the radiator 130. Then, the air that has absorbed a certain amount of heat flows through the air duct 180 at the liquid cooling device mounting compartment 160, allowing the air that has absorbed a certain amount of heat to absorb the heat from the liquid cooling device. This can reduce the impact of the heat from the liquid cooling device on the medium inside the radiator 130, and help improve the heat dissipation efficiency of the medium inside the radiator 130.

[0095] In some embodiments, such as Figure 10 As shown, multiple sets of liquid cooling device installation chambers 160 are provided between the outlet of the fan 120 and the air outlet 112. Heat sinks 130 are provided between adjacent sets of liquid cooling device installation chambers 160 and between the set of liquid cooling device installation chambers 160 closest to the outlet of the fan 120 and the outlet of the fan 120.

[0096] Each group of liquid-cooled components and its heat sink 130 located near the outlet side of the fan 120 can belong to the same liquid-cooling module. Each group of liquid-cooling modules can be used to dissipate heat from different heat sources, such as batteries or power conversion systems (PCS). Alternatively, each group of liquid-cooling modules can be used to dissipate heat from the same heat source.

[0097] Different groups of liquid cooling devices can be liquid cooling devices with different performance, and different groups of heat sinks 130 can be heat sinks 130 with different performance, in order to meet different heat dissipation requirements and achieve customized configuration.

[0098] Air in the air duct 180 can flow sequentially through the heat sink 130 of each group of liquid cooling modules and the liquid cooling device mounting compartment 160. During this process, it can pass through the expansion cavity structure with varying cross-sections multiple times, achieving gradual attenuation of airflow noise.

[0099] The structural design of the liquid-cooled component mounting compartment 160 can be at least one of the following: Firstly, such as Figure 9 As shown, the liquid cooling device mounting compartment 160 is integrally formed with at least a portion of the housing 110.

[0100] In this embodiment, the liquid cooling device mounting compartment 160 may not be a separately manufactured component. During the manufacturing process of the housing 110, grooves, compartments, or bosses can be formed through die casting or injection molding, or through sheet metal processing methods such as stamping or bending, so that the liquid cooling device mounting compartment 160 and at least a portion thereof are integrally formed with the housing 110. Specifically, the housing 110 and the liquid cooling device mounting compartment 160 can be integrally formed; or, a portion thereof can be integrally formed.

[0101] This approach reduces the need for additional fasteners, seals, and separate mounting parts, simplifying the supply chain and assembly process. Simultaneously, it minimizes seams, allowing the liquid-cooled main unit 100 to better withstand vibration and shock.

[0102] Secondly, such as Figure 8 As shown, the liquid cooling device mounting compartment 160 and the housing 110 are independently molded structures.

[0103] In this embodiment, the liquid cooling device mounting compartment 160 can be a separately manufactured component, such as one that can be die-cast or injection molded separately and then installed into the interior of the housing 110 by means of threaded connection, welding, snap-fit ​​or bonding.

[0104] This method uses simple molds, offers flexible production, and results in a low scrap rate. The liquid cooling component mounting compartment 160 can be disassembled and replaced independently, reducing maintenance costs and time. Furthermore, the structure of the liquid cooling component mounting compartment 160 can be independently designed and optimized without modifying the housing 110, facilitating the design of different models of liquid cooling component mounting compartments 160 to accommodate different liquid cooling components.

[0105] During the production of the liquid cooling device installation chamber 160 and the shell 110, the structural design of the liquid cooling device installation chamber 160 and the shell 110 can be reasonably selected based on factors such as manufacturing cost, maintenance convenience and structural strength.

[0106] The installation location of the liquid-cooled component mounting compartment 160 can be at least one of the following: Firstly, such as Figure 8 -picture Figure 10 As shown, the liquid cooling device mounting compartment 160 is located at the edge of the air duct 180.

[0107] In this embodiment, the liquid cooling device mounting compartment 160 can be disposed on a single side wall of the housing 110, and does not need to be connected to the two side walls opposite to the housing 110 at the same time.

[0108] In this way, the liquid cooling device mounting chamber 160 located at the edge of the air duct 180 allows most of the airflow to pass through smoothly and with low resistance, while the direct impact on the liquid cooling device mounting chamber 160 is small, reducing the additional turbulence and eddies generated by the airflow hitting the surface of the liquid cooling device mounting chamber 160, thereby reducing noise.

[0109] Secondly, such as Figure 11 As shown, the liquid cooling device mounting compartment 160 is located in the middle of the air duct 180.

[0110] In this embodiment, the liquid cooling device mounting compartment 160 can be connected to the two side walls opposite to the housing 110 simultaneously.

[0111] like Figure 11 As shown, the liquid cooling device mounting compartment 160 divides the air duct 180 into multiple sub-air ducts 181.

[0112] In this way, the liquid cooling device mounting compartment 160 located in the middle of the air duct 180 can divert air to multiple sub-air ducts 181.

[0113] The cross-sectional area of ​​the middle part of the liquid cooling device mounting compartment 160 can be set to be smaller than the cross-sectional area of ​​the side of the liquid cooling device mounting compartment 160 facing the outlet of the fan 120.

[0114] In this way, the cross-sectional area of ​​the inlet of sub-duct 181 is smaller than that of its downstream sub-duct 181, and sub-duct 181 can form an expansion cavity. According to the principle of expansion cavity noise reduction, sub-duct 181 can reduce airflow noise. Multiple sub-ducts 181 can form parallel expansion cavities, and airflow noise can be reduced in each sub-duct 181.

[0115] When the airflow from the sub-duct 181 flows out from the outlet of the sub-duct 181 to the downstream duct 180, the cross-sectional area at the outlet of the sub-duct 181 is smaller than the cross-sectional area of ​​the downstream duct 180. The sub-duct 181 and the downstream duct 180 can form an expansion cavity. According to the principle of noise reduction of the expansion cavity, the noise of the airflow flowing out from the sub-duct 181 is reduced.

[0116] During the production of the liquid cooling device mounting compartment 160 and the shell 110, the installation position of the liquid cooling device mounting compartment 160 can be reasonably selected based on factors such as manufacturing cost, maintenance convenience, and structural strength.

[0117] In some embodiments, such as Figure 12 As shown, the liquid cooling device mounting compartment 160 has a through hole 161, which is used to connect the interior of the liquid cooling device mounting compartment 160 with the air duct 180.

[0118] The through hole 161 is located on the wall of the liquid cooling device mounting compartment 160. The through hole 161 allows the internal space of the liquid cooling device mounting compartment 160 to be connected to the external air duct 180 without being completely isolated.

[0119] When airflow noise in the duct 180 propagates into the liquid-cooled device mounting chamber 160 through the through-hole 161, the sound waves can disturb the gas in the liquid-cooled device mounting chamber 160, giving the gas a certain amount of kinetic energy. The gas in the liquid-cooled device mounting chamber 160 can move within the chamber, and its kinetic energy can be dissipated by converting sound energy into heat energy due to viscous resistance.

[0120] like Figure 12 As shown, the liquid-cooled device mounting chamber 160 may be provided with a first resonant cavity 162 and a second resonant cavity 163. A through-hole 161 may be located on the wall of a cavity with a smaller cross-sectional area in the liquid-cooled device mounting chamber 160. The cross-sectional areas of the first resonant cavity 162 and the second resonant cavity 163 are larger than the cross-sectional area of ​​the cavity at the through-hole 161. Thus, when sound waves propagate into the liquid-cooled device mounting chamber 160 through the through-hole 161, they can propagate from the cavity at the through-hole 161 towards the first resonant cavity 162, or from the cavity at the through-hole 161 towards the second resonant cavity 163. According to the principle of expansion cavity noise reduction, the noise inside the liquid-cooled device mounting chamber 160 is reduced.

[0121] In some embodiments, the radiator 130 is the condenser in the compressor cycle of the liquid-cooled host 100.

[0122] The liquid-cooled unit 100 can integrate a compressor cycle and a water pump cycle. The compressor cycle may include a compressor, condenser, expansion valve, and evaporator (first path). The water pump cycle may include an evaporator (second path), a water pump, and a load flow path. The water pump cycle can absorb heat from the energy storage device 200 through the load flow path and transfer the heat to the compressor cycle. The compressor cycle can ultimately discharge the heat to the air through the radiator 130. The water pump cycle and the compressor cycle can exchange heat in the evaporator, but the medium of the water pump cycle and the medium of the compressor cycle can be physically isolated.

[0123] In some embodiments, the liquid-cooled host 100 may include a protective mesh cover 170.

[0124] The protective mesh cover 170 can be honeycomb or grid-like.

[0125] The protective net cover 170 can be installed at the air outlet 112.

[0126] The protective mesh cover 170 can effectively block larger debris such as paper, plastic packaging, leaves, tool parts, etc. from the outside of the liquid cooling host 100, reducing the risk of these items being sucked into the liquid cooling host 100, interfering with the operation of the fan 120, blocking the channel 131 of the radiator 130, or causing an electrical short circuit.

[0127] In the energy storage system 10 of this application embodiment, such as Figures 1-4 As shown, the liquid-cooled host 100 is installed outside the energy storage device 200.

[0128] That is, the liquid cooling host 100 is not integrated into the energy storage device 200, but is set up relatively independently outside the energy storage device 200.

[0129] In this way, when the liquid cooling host 100 malfunctions or requires regular maintenance, operators can more easily and quickly approach the liquid cooling host 100 to perform various operations without disassembling parts of the energy storage device 200, thus reducing maintenance difficulty and time costs.

[0130] Meanwhile, placing the liquid-cooled host 100 externally in the energy storage device 200 can reduce the space occupied inside the energy storage device 200, allowing for a more reasonable and compact layout of core components such as batteries inside the energy storage device 200, thereby improving the energy density and overall performance of the energy storage device 200.

[0131] In addition, the liquid cooling host 100 is externally placed in the energy storage device 200, so that the airflow blown out from the air outlet 112 of the housing 110 will not flow into the energy storage device 200. At the same time, it reduces the adverse effects of noise and vibration generated during the operation of the liquid cooling host 100 on the sensitive components inside the energy storage device 200, making the working environment inside the energy storage device 200 more stable and suitable.

[0132] like Figure 1 , Figure 3 and Figure 4 As shown, the liquid cooling unit 100 can be located at the end of the energy storage device 200. Alternatively, the liquid cooling unit 100 can be located on the side of the energy storage device 200.

[0133] During the actual installation of the liquid cooling host 100, the position of the liquid cooling host 100 can be reasonably planned and flexibly adjusted according to the actual conditions such as the external spatial layout of the energy storage device 200, the location of the load flow path interface, and the convenience of pipeline installation.

[0134] In some embodiments, such as Figure 3 and Figure 4 As shown, the liquid-cooled host 100 may include multiple units.

[0135] In practical applications, the number of liquid cooling units 100 can be reasonably set according to the heat dissipation requirements of the energy storage device 200.

[0136] The multiple liquid cooling units 100 can be installed in at least one of the following ways: Firstly, such as Figure 3 As shown, multiple liquid-cooled main units 100 are arranged side by side at the end of the energy storage device 200.

[0137] In this embodiment, multiple liquid cooling units 100 are disposed at the end of the energy storage device 200, forming a modular unit with a larger cooling capacity near the end of the energy storage device 200. This arrangement allows for centralized and organized piping wiring, and facilitates inspection, maintenance, and operation by operators. This embodiment is suitable when there is sufficient space at the end of the energy storage device 200 for placing the liquid cooling units 100, or when the load flow path is located near the end of the energy storage device 200.

[0138] Secondly, multiple liquid-cooled main units 100 are arranged side by side on the side of the energy storage device 200.

[0139] In this embodiment, multiple liquid-cooled units 100 are disposed on the side of the energy storage device 200, forming a modular unit with a larger cooling capacity located near the side of the energy storage device 200. This arrangement allows for centralized and organized piping wiring, and facilitates inspection, maintenance, and operation by operators. This embodiment is suitable when there is sufficient space on the side of the energy storage device 200 for placing the liquid-cooled units 100, or when the load flow path is located near the side of the energy storage device 200.

[0140] Thirdly, such as Figure 4 As shown, multiple liquid-cooled main units 100 are respectively installed at different ends or different sides of the energy storage device 200.

[0141] In this embodiment, the liquid cooling units 100 can be placed near different areas of the load flow path according to actual needs, which can reduce the pipe length. Simultaneously, the liquid cooling units 100 are distributed, and their air outlets 112 are also distributed, allowing hot air to be discharged to different areas, reducing heat recirculation and localized heat accumulation, improving heat dissipation efficiency, and reducing noise caused by eddies formed by the mutual interference of airflows from each air outlet 112. This embodiment is suitable for situations where there is sufficient space on different sides and at different ends of the energy storage device 200 for placing the liquid cooling units 100, or where the load flow path is located near different sides or ends of the energy storage device 200.

[0142] During the actual installation of multiple liquid cooling units 100, the positions of the multiple liquid cooling units 100 can be reasonably planned and flexibly adjusted according to the actual conditions such as the external spatial layout of the energy storage device 200, the location of the load flow path interface, and the convenience of pipeline installation.

[0143] The following is combined with Figures 1-14 This application describes a liquid-cooled host 100 according to an embodiment of the present application.

[0144] The liquid-cooled main unit 100 includes a housing 110, a fan 120, a radiator 130, an air collection plate 140, a flow guide 150, a liquid-cooled component mounting compartment 160, and liquid-cooled components.

[0145] like Figure 13 As shown, an air inlet 111 is provided on one side of the housing 110, and an air outlet 112 is provided on the other side of the housing 110. An air duct 180 is formed between the outlet of the fan 120 and the air outlet 112 in the housing 110.

[0146] like Figures 5-11 As shown, the fan 120 is installed at the air inlet 111 of the housing 110.

[0147] like Figures 5-9 and Figure 11 As shown, the heat sink 130 can be a single unit; or, as shown... Figure 10 As shown, there can be multiple heat sinks 130. Figures 5-11 As shown, the heat sink 130 is mounted on the housing 110. Figure 14 As shown, the radiator 130 has multiple channels 131. The radiator 130 is located between the outlet and the air outlet 112 of the fan 120, and its installation position can be as follows: Figure 5 As shown, the outlet and air outlet 112 of the radiator 130 and the fan 120 are spaced apart; or, as Figure 7 As shown, the radiator 130 is located at the air outlet 112. The radiator 130 can be installed in the following positions: Figure 5 and Figure 7 As shown, the radiator 130 is arranged parallel to the air outlet 112; or, as... Figure 5 As shown, the radiator 130 is inclined relative to the air outlet 112. The radiator 130 is the condenser in the compressor cycle of the liquid-cooled host 100.

[0148] like Figure 9 As shown, the air collecting plate 140 is disposed inside the housing 110 and is located between the outlet of the fan 120 and the air outlet 112. The air collecting plate 140 and the housing 110 form an exhaust port 141 connecting the outlet of the fan 120 and the channel 131. The flow cross-sectional area of ​​the exhaust port 141 is smaller than the flow cross-sectional area of ​​the downstream air duct 180.

[0149] like Figure 9As shown, the air guide 150 is located at the exhaust port 141.

[0150] like Figures 8-11 As shown, the liquid-cooled device mounting compartment 160 is mounted on the housing 110, and the flow cross-sectional area of ​​the air duct 180 at the liquid-cooled device mounting compartment 160 is smaller than the downstream flow cross-sectional area. The cross-sectional area of ​​the liquid-cooled device mounting compartment 160 facing the outlet of the fan 120 is smaller than the cross-sectional area facing the air outlet 112. A radiator 130 is provided between the liquid-cooled device mounting compartment 160 and the outlet of the fan 120. Figure 10 As shown, multiple sets of liquid-cooled device mounting chambers 160 are provided between the outlet of the fan 120 and the air outlet 112. Heat sinks 130 are provided between adjacent sets of liquid-cooled device mounting chambers 160, and between the set of liquid-cooled device mounting chambers 160 closest to the outlet of the fan 120 and the outlet of the fan 120. Figure 9 As shown, at least a portion of the liquid-cooled device mounting compartment 160 is integrally formed with the housing 110; or, as... Figure 8 As shown, the liquid-cooled device mounting compartment 160 and its housing 110 are independently molded structures. Figures 8-10 As shown, the liquid-cooled device mounting compartment 160 is located at the edge of the air duct 180; or, as... Figure 11 As shown, the liquid-cooled device mounting compartment 160 is located in the middle of the air duct 180 and divides the air duct 180 into multiple sub-air ducts 181. Figure 12 As shown, the liquid cooling device mounting compartment 160 has a through hole 161, which is used to connect the interior of the liquid cooling device mounting compartment 160 with the air duct 180.

[0151] The liquid cooling device is mounted on the housing 110 via the liquid cooling device mounting compartment 160.

[0152] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0153] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0154] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0155] In the description of this application, "multiple" means two or more.

[0156] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0157] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0158] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0159] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A liquid-cooled main unit (100), characterized in that, include: The housing (110) has an air inlet (111) on one side and an air outlet (112) on the other side. Liquid cooling device, mounted on housing (110). A fan (120) is installed at the air inlet (111) of the housing (110); At least one radiator (130) is mounted on the housing (110) and located between the outlet of the fan (120) and the air outlet (112), the radiator (130) having a plurality of channels (131).

2. The liquid-cooled host (100) according to claim 1, characterized in that, The outlet of the radiator (130) and the air outlet (112) of the fan (120) are spaced apart; or, The radiator (130) is located at the air outlet (112).

3. The liquid-cooled host (100) according to claim 1, characterized in that, The radiator (130) is arranged parallel to the air outlet (112); or, The radiator (130) is inclined relative to the air outlet (112).

4. The liquid-cooled host (100) according to claim 1, characterized in that, Also includes: An air collecting plate (140) is disposed inside the housing (110) and located between the outlet of the fan (120) and the air outlet (112). An exhaust port (141) is formed between the air collecting plate (140) and the housing (110) to connect the outlet of the fan (120) and the channel (131). The flow cross-sectional area of ​​the exhaust port (141) is smaller than the flow cross-sectional area of ​​the downstream air duct (180).

5. The liquid-cooled host (100) according to claim 4, characterized in that, Also includes: A flow guide (150) is provided at the exhaust port (141).

6. The liquid-cooled main unit (100) according to any one of claims 1-5, characterized in that, The housing (110) forms a duct (180) between the outlet of the fan (120) and the air outlet (112). The housing (110) is provided with a liquid cooling device mounting compartment (160), and the flow cross-sectional area of ​​the duct (180) at the liquid cooling device mounting compartment (160) is smaller than the flow cross-sectional area downstream.

7. The liquid-cooled host (100) according to claim 6, characterized in that, The cross-sectional area of ​​the liquid cooling device mounting compartment (160) facing the outlet of the fan (120) is smaller than the cross-sectional area facing the air outlet (112).

8. The liquid-cooled host (100) according to claim 6, characterized in that, The radiator (130) is provided between the liquid cooling device installation compartment (160) and the outlet of the fan (120).

9. The liquid-cooled host (100) according to claim 8, characterized in that, Multiple sets of liquid cooling device mounting chambers (160) are provided between the outlet of the fan (120) and the air outlet (112). The radiator (130) is provided between adjacent sets of liquid cooling device mounting chambers (160) and between the set of liquid cooling device mounting chambers (160) closest to the outlet of the fan (120) and the outlet of the fan (120).

10. The liquid-cooled host (100) according to claim 6, characterized in that, The liquid cooling device mounting compartment (160) is integrally formed with at least a portion of the housing (110); or, The liquid cooling device mounting compartment (160) and the housing (110) are independently molded structures.

11. The liquid-cooled host (100) according to claim 6, characterized in that, The liquid cooling device mounting compartment (160) is located at the edge of the air duct (180); or, The liquid cooling device mounting compartment (160) is located in the middle of the air duct (180) and divides the air duct (180) into multiple sub-air ducts (181).

12. The liquid-cooled host (100) according to claim 6, characterized in that, The liquid cooling device mounting compartment (160) has a through hole (161) for connecting the interior of the liquid cooling device mounting compartment (160) with the air duct (180).

13. The liquid-cooled main unit (100) according to any one of claims 1-5, characterized in that, The radiator (130) is the condenser in the compressor cycle of the liquid-cooled host (100).

14. An energy storage system (10), characterized in that, include: Energy storage device (200); The liquid-cooled host (100) as described in any one of claims 1-13.

15. The energy storage system (10) according to claim 14, characterized in that, The liquid-cooled host (100) is installed outside the energy storage device (200) and is located at the end or side of the energy storage device (200).

16. The energy storage system (10) according to claim 14, characterized in that, The liquid cooling host (100) includes multiple units, and the multiple liquid cooling hosts (100) are arranged side by side at the end or side of the energy storage device (200); or, The liquid cooling host (100) includes multiple units, and the multiple liquid cooling hosts (100) are respectively disposed at different ends or different sides of the energy storage device (200).

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