Composite plating layer of electrically conductive terminal
Patent Information
- Application Number
- CN202522441619.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-18
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-11-18
AI Technical Summary
Existing terminal plating structures are insufficient to meet the requirements for wear resistance and corrosion resistance under frequent insertion and removal and harsh environments.
The composite plating structure employing conductive terminals includes a substrate, a solder section, and a functional section. The solder section exposes silver or a silver alloy, while the functional section forms a dense protective system with platinum or a platinum alloy and palladium or a palladium alloy. The partitioned electroplating layer enhances wear resistance and corrosion resistance.
It significantly improves the wear resistance and corrosion resistance of conductive terminals, and exhibits excellent performance, especially in frequent insertion and removal and harsh environments.
Smart Images
Figure CN224935031U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of terminal electroplating, and in particular to a composite plating layer for conductive terminals. Background Technology
[0002] The terminals used in connectors are metal components that enable the transmission of power and signals. Common terminal structures typically use a certain metal as the base material, and then add metal plating layers with various properties to the surface of the base material through electroplating to obtain good reliability and conductivity.
[0003] Currently, commonly used terminal plating structures are mostly simple double-layer or multi-layer structures, such as electroplated nickel / gold, nickel / palladium / gold, and other multi-layer metal material structures. However, as electronic devices are used more frequently, performance requirements are also increasing. For example, the requirements for wear resistance and corrosion resistance during frequent insertion and removal need to be further improved. Therefore, how to reasonably set the electroplating layer to achieve wear resistance and corrosion resistance is a technical problem that urgently needs to be solved. Utility Model Content
[0004] (a) Technical problems to be solved In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a composite coating for conductive terminals, which solves the technical problem of how to reasonably set the electroplating coating to achieve wear resistance and corrosion resistance.
[0005] (II) Technical Solution The purpose of this invention is to provide a composite plating layer for a conductive terminal, comprising a substrate and a composite plating layer disposed on the outer surface of the substrate. The substrate includes a welding segment and a functional segment, wherein the welding segment and the functional segment are integrally connected. The composite plating layer includes: A nickel or nickel alloy layer is disposed on the outer surface of the substrate; A silver or silver alloy layer is disposed on the outer surface of the nickel or nickel alloy layer; A platinum or platinum alloy layer is disposed at two-thirds of the outer surface of the silver or silver alloy layer, such that the exposed substrate portion of the silver or silver alloy layer forms a weld section; and A palladium or palladium alloy layer is disposed on the outer surface of the platinum or platinum alloy layer, and a functional segment is formed by the platinum or platinum alloy layer and the portion encapsulated by the palladium or palladium alloy.
[0006] Preferably, the length of the welded segment is configured to be one-third of the length of the substrate, and the functional segment is configured to be two-thirds of the length of the substrate.
[0007] Preferably, the nickel or nickel alloy layer is one of nickel-tungsten alloy, nickel-phosphorus alloy, nickel-cobalt alloy, or nickel-tin alloy.
[0008] Preferably, the silver or silver alloy layer is one of silver, silver-palladium alloy, and silver-antimony.
[0009] Preferably, the platinum or platinum alloy layer is one of platinum or platinum-ruthenium alloy.
[0010] Preferably, the palladium or palladium alloy layer is one of palladium or palladium-rhodium alloy.
[0011] Preferably, the substrate is made of copper or its alloy.
[0012] (III) Beneficial Effects The conductive terminals are partitioned, and electroplating layers are applied to the substrate surface in partitions. Specifically, the original exposed silver material is preserved in the welding section. Thanks to the excellent conductivity and solderability of silver or silver alloy, the welding interface resistance is lower and the connection is stronger. In the functional section, the platinum or platinum alloy layer and the outer palladium or palladium alloy layer form a dense composite protective system. This not only effectively blocks the migration of inner silver atoms, but also improves the hardness and chemical inertness of the conductive terminal surface, thereby significantly improving the wear resistance of the terminal under frequent insertion and removal conditions and the corrosion resistance in harsh environments. Attached Figure Description
[0013] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain the technical solution of this utility model, and do not constitute a limitation on the technical solution of this utility model.
[0014] Figure 1 This is a schematic diagram of the composite plating layer on the conductive terminal;
[0015] Explanation of reference numerals in the attached figures: 1. Substrate; 2. Welding section; 3. Functional section; 4. Composite coating; 40. Nickel or nickel alloy layer; 41. Silver or silver alloy layer; 42. Platinum or platinum alloy layer; 43. Palladium or palladium alloy layer. Detailed Implementation
[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.
[0017] The following is in conjunction with the appendix Figure 1To further describe, this utility model discloses a composite plating layer for a conductive terminal, including a substrate 1 and a composite plating layer 4 disposed on the outer surface of the substrate 1. The substrate 1 includes a welding section 2 and a functional section 3, which are integrally connected. The composite plating layer 4 includes a nickel or nickel alloy layer 40, a silver or silver alloy layer 41, a platinum or platinum alloy layer 42, and a palladium or palladium alloy layer disposed from the inside to the outside of the surface of the substrate 1. Specifically, the nickel or nickel alloy layer 40 is electroplated onto the outer surface of the substrate 1; the silver or silver alloy layer 41 is electroplated onto the outer surface of the nickel or nickel alloy layer 40; the platinum or platinum alloy layer 42 is electroplated onto two-thirds of the outer surface of the silver or silver alloy layer 41, forming the welding section 2 on the exposed portion of the substrate 1 of the silver or silver alloy layer 41; and the palladium or palladium alloy layer is electroplated onto the outer surface of the platinum or platinum alloy layer 42, forming the functional section 3 through the portion enclosed by the platinum or platinum alloy layer 42 and the palladium or palladium alloy layer.
[0018] In a preferred embodiment, the substrate 1 is an integral structure, the length of the welding segment 2 is configured to be one-third of the length of the substrate 1, and the functional segment 3 is configured to be two-thirds of the length of the substrate 1. The surface of the welding segment 2 is exposed silver or silver alloy, and the surface of the functional segment 3 is exposed palladium or palladium alloy.
[0019] In a preferred embodiment, the nickel or nickel alloy layer 40 is one of nickel-tungsten alloy, nickel-phosphorus alloy, nickel-cobalt alloy or nickel-tin alloy, and the thickness of the nickel or nickel alloy layer 40 is 0.5-5μm. In this embodiment, the nickel or nickel alloy layer 40 is a nickel-tungsten alloy with a thickness of 1μm, which prevents the atoms of the substrate 1 from diffusing outward and affecting the overall performance through its metallic properties.
[0020] In a preferred embodiment, the silver or silver alloy layer 41 is one of silver, silver-palladium alloy and silver-antimony, and the thickness of the silver or silver alloy is 0.125-3μm. In this embodiment, the silver or silver alloy is taken as silver with a thickness of 0.5μm. The properties of silver are used to reduce the overall contact resistance caused by other metal plating layers.
[0021] In a preferred embodiment, the platinum or platinum alloy layer 42 is one of platinum or platinum-ruthenium alloy, and the thickness of the platinum or platinum alloy layer 42 is 0.125-3μm. In this embodiment, the platinum or platinum alloy layer 42 is taken as a platinum-ruthenium alloy with a thickness of 1.5μm. Taking advantage of its hardness, wear resistance and high corrosion resistance, the plating layer layer 42 protects the interior of the plating structure, thereby significantly improving the service life of the terminal.
[0022] In a preferred embodiment, the palladium or palladium alloy layer 43 is one of palladium or palladium-rhodium alloy, and the thickness of the palladium or palladium alloy layer 43 is 0.125-3μm. In this embodiment, the palladium or palladium alloy layer 43 is taken as a palladium with a thickness of 1μm to further improve the service life of the terminal.
[0023] In a preferred embodiment, the material of the substrate 1 is copper or its alloy.
[0024] In a preferred embodiment, the conductive terminal is a blank terminal, a bent terminal, a spring pin terminal, or a crown spring terminal.
[0025] In summary, by partitioning the conductive terminals and electroplating layers on the substrate surface, the original exposed silver material is preserved in the welding section. The excellent conductivity and solderability of silver or silver alloys result in lower interface resistance and a stronger connection. In the functional section, the platinum or platinum alloy layer and the outer palladium or palladium alloy layer form a dense composite protective system. This not only effectively blocks the migration of inner silver atoms but also improves the surface hardness and chemical inertness of the conductive terminals, thereby significantly enhancing the wear resistance of the terminals under frequent insertion and removal conditions and their corrosion resistance in harsh environments.
[0026] Although embodiments of the present invention have been shown above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications and variations to the above embodiments, but such modifications are all included within the broad scope of the foregoing disclosure, drawings and claims.
Claims
1. A composite plating layer for a conductive terminal, comprising a substrate and a composite plating layer disposed on the outer surface of the substrate, wherein the substrate includes a welding section and a functional section, the welding section and the functional section being integrally connected, characterized in that: The composite coating includes: A nickel or nickel alloy layer is disposed on the outer surface of the substrate; A silver or silver alloy layer is disposed on the outer surface of the nickel or nickel alloy layer; A platinum or platinum alloy layer is disposed at two-thirds of the outer surface of the silver or silver alloy layer, such that the exposed substrate portion of the silver or silver alloy layer forms a weld section; and Palladium or a palladium alloy is disposed on the outer surface of the platinum or platinum alloy layer, and the portion enclosed by the platinum or platinum alloy layer and the palladium or palladium alloy forms a functional segment.
2. The composite plating layer of the conductive terminal according to claim 1, characterized in that: The length of the welded section is configured to be one-third of the substrate, and the length of the functional section is configured to be two-thirds of the substrate.
3. The composite plating layer of the conductive terminal according to claim 1, characterized in that: The nickel or nickel alloy layer is one of nickel-tungsten alloy, nickel-phosphorus alloy, nickel-cobalt alloy, or nickel-tin alloy.
4. The composite plating layer of the conductive terminal according to claim 1, characterized in that: The silver or silver alloy layer is one of silver, silver-palladium alloy, and silver-antimony.
5. The composite plating layer of the conductive terminal according to claim 1, characterized in that: The platinum or platinum alloy layer is one of platinum or platinum-ruthenium alloy.
6. The composite plating layer of the conductive terminal according to claim 1, characterized in that: The palladium or palladium alloy layer is one of palladium or palladium-rhodium alloy.
7. The composite plating layer of the conductive terminal according to claim 1, characterized in that: The substrate is made of copper or its alloy.