Intelligent box-type substation

Abstract

The application discloses an intelligent box-type substation, and relates to the field of box-type substation monitoring, comprising a box-type substation and a data monitoring system, wherein the box-type substation comprises high-voltage complete equipment, a transformer and low-voltage switch equipment; a first end of the high-voltage complete equipment is used for connecting high-voltage electricity of a power grid; a second end of the high-voltage complete equipment is connected with a primary side of the transformer; a secondary side of the transformer is connected with a first end of the low-voltage switch equipment; and a second end of the low-voltage switch equipment is connected with next-stage power distribution equipment; the data monitoring system is connected with a monitoring platform through LoRa wireless communication; the data monitoring system is used for monitoring operation data of the box-type substation in real time, and sending monitoring data to the monitoring platform; and the application realizes real-time monitoring of the operation condition of a remote box-type substation through the monitoring platform.

Description

Technical Field

[0001] This application relates to the field of prefabricated substation monitoring, and in particular to an intelligent prefabricated substation. Background Technology

[0002] Prefabricated substations, due to their compact structure, flexible configuration, reliable performance, and rapid installation, are now widely used in various scenarios requiring power supply, such as urban and residential power distribution, industrial and enterprise power consumption, transportation, and infrastructure. They are an indispensable piece of equipment in modern power systems.

[0003] With the development of IoT technology, most power distribution rooms are now equipped with monitoring platforms (such as operation and maintenance platforms or integrated automation platforms) to increase the convenience of operation and maintenance and the real-time nature of data monitoring. Therefore, it is necessary to connect the data from measuring instruments and relay protection devices to the monitoring platform to achieve remote data monitoring. Currently, most measuring instruments and relay protection devices use RS485 interfaces for communication. When the prefabricated substation is close to the power distribution room, shielded cables can be used to connect the measuring instruments and relay protection devices of the prefabricated substation to the monitoring platform. However, in practical applications, many prefabricated substations are far from the power distribution room, and the length of the shielded cable (maximum 1.2km) does not meet the distance requirements, making it impossible to monitor the operation of remote prefabricated substations in real time through the monitoring platform. Summary of the Invention

[0004] The purpose of this application is to provide an intelligent prefabricated substation that enables real-time monitoring of the operation of a remote prefabricated substation via a monitoring platform.

[0005] To achieve the above objectives, this application provides the following solution: In a first aspect, this application provides an intelligent prefabricated substation, including the prefabricated substation and a data monitoring system, wherein: The prefabricated substation includes high-voltage complete equipment, a transformer, and low-voltage switchgear. The first end of the high-voltage complete equipment is used to connect to the high-voltage power grid. The second end of the high-voltage complete equipment is connected to the primary side of the transformer. The secondary side of the transformer is connected to the first end of the low-voltage switchgear. The second end of the low-voltage switchgear is connected to the next-level power distribution equipment. The data monitoring system and the monitoring platform are connected via LoRa wireless communication. The data monitoring system is used to monitor the operation data of the prefabricated substation in real time and send the monitoring data to the monitoring platform.

[0006] Optionally, the data monitoring system includes a first data acquisition device, which includes: A multi-functional digital display module for collecting electrical parameters of the prefabricated substation; wherein the electrical parameters include at least voltage, current, power, frequency and power factor; A microcomputer-based integrated protection device for relay protection of the high-voltage complete set of equipment and for acquiring the position signals of the high-voltage circuit breakers of the high-voltage complete set of equipment, wherein the position signals include open position signals and closed position signals; A temperature monitoring module for collecting temperature data from the transformer; A temperature and humidity acquisition device for collecting the temperature and humidity of the internal environment of the prefabricated substation.

[0007] Optionally, the multi-functional digital display module, the microcomputer integrated protection device, the temperature monitoring module, and the temperature and humidity acquisition device are connected to the second data acquisition device, and the second data acquisition device is connected to the monitoring platform via LoRa wireless communication.

[0008] Optionally, the monitoring platform includes a data receiving device, a data reading and uploading device, and a display terminal connected in sequence, wherein: The data receiving device is connected to the second data acquisition device via LoRa wireless communication; The data reading and uploading device is used to upload the received monitoring data to the display terminal.

[0009] Optionally, both the second data acquisition device and the data receiving device adopt a LoRa data transmission terminal; The LORA data transmission terminal includes a processing module, a power supply module, a radio frequency module, and an external communication circuit, wherein: The first output terminal of the processing module is connected to the drive signal input terminal of the radio frequency module, and the second output terminal of the processing module is connected to the transmit / receive direction control signal input terminal of the external communication circuit. The power module is connected to the operating voltage input terminal of the processing module, the radio frequency module, and the external communication circuit. The radio frequency module of the second data acquisition device communicates wirelessly with the radio frequency module of the data receiving device via LoRa. The external communication circuit of the second data acquisition device is connected to the internal communication interface of the multi-functional digital display module, the microcomputer integrated protection device, the temperature monitoring module, and the temperature and humidity acquisition device.

[0010] Optionally, the internal communication interfaces of the multi-functional digital display module, the microcomputer integrated protection device, the temperature monitoring module, and the temperature and humidity acquisition device are connected in series to the external communication circuit of the second data acquisition device.

[0011] Optionally, the radio frequency module includes a wireless transceiver, a temperature-compensated crystal oscillator, and a radio frequency switch, wherein: The temperature-compensated crystal oscillator is connected to the clock signal input terminal of the wireless transceiver; The signal transceiver of the wireless transceiver is connected to the antenna via the radio frequency switch. The radio frequency switch is used to switch the input / output state of the half-duplex wireless transceiver.

[0012] Optionally, the power module includes: A first power conversion module for converting the output voltage of an external power source to a first target voltage; A second power conversion module for converting the first target voltage into the operating voltage of the processing module and the radio frequency module; A third power conversion module for converting the first target voltage into the operating voltage of the external communication circuit.

[0013] Optionally, the processing module uses an STM32 microprocessor chip, and the external communication circuit uses a 485 communication circuit.

[0014] Optionally, the wireless transceiver is model SX1268 and the radio frequency switch is model PE4259.

[0015] This application provides an intelligent prefabricated substation. A data monitoring system is wirelessly connected to a monitoring platform via LoRa, avoiding the need for shielded cables. This allows monitoring data (operational data of the prefabricated substation) to be uploaded to the monitoring platform via LoRa communication. This enables real-time monitoring of the prefabricated substation's operation from a distance, allowing for analysis of visualized monitoring data to determine its operational status, prevent accidents, and further improve the safety of the prefabricated substation. Furthermore, wirelessly connecting the data monitoring system to the monitoring platform via LoRa communication achieves long-distance, low-power, low-cost, and easily deployable data transmission. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a functional module diagram of an intelligent prefabricated substation provided in an embodiment of this application; Figure 2A detailed functional module diagram of a data monitoring system and monitoring platform provided in an embodiment of this application; Figure 3 A detailed functional module diagram of a first data acquisition device provided in an embodiment of this application; Figure 4 A detailed functional module diagram of a LoRa data transmission terminal provided in an embodiment of this application; Figure 5 Provided for an embodiment of the application Figure 4 The circuit schematic of the processing module; Figure 6 Provided for an embodiment of the application Figure 4 The circuit schematic of the radio frequency module; Figure 7 A circuit schematic diagram of a first power conversion module provided in one embodiment of the application; Figure 8 A circuit schematic diagram of a second power conversion module provided in one embodiment of the application; Figure 9 A circuit schematic diagram of a third power conversion module provided in one embodiment of the application; Figure 10 A circuit schematic diagram of a 485 communication circuit provided in one embodiment of the application.

[0018] In the diagram, 1. Prefabricated substation, 11. High-voltage complete set of equipment, 12. Transformer, 13. Low-voltage switchgear, 2. Data monitoring system, 21. First data acquisition device, 211. Multifunctional digital display module, 212. Microcomputer integrated protection device, 213. Temperature monitoring module, 214. Temperature and humidity acquisition device, 22. Second data acquisition device, 3. Monitoring platform, 31. Data receiving device, 32. Data reading and uploading device, 33. Display terminal, 4. LoRa data transmission terminal, 41. Processing module, 42. Power supply module, 421. First power conversion module, 422. Second power conversion module, 423. Third power conversion module, 43. Radio frequency module, 44. External communication circuit. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] In one exemplary embodiment, such as Figure 1 As shown, an intelligent prefabricated substation is provided, including a prefabricated substation 1 and a data monitoring system 2. The prefabricated substation 1 includes a high-voltage switchgear 11, a transformer 12, and a low-voltage switchgear 13. The first terminal of the high-voltage switchgear 11 is used to connect to the high-voltage power grid, and the second terminal of the high-voltage switchgear 11 is connected to the primary side of the transformer 12. The secondary side of the transformer 12 is connected to the first terminal of the low-voltage switchgear 13, and the second terminal of the low-voltage switchgear 13 is connected to the next-level power distribution equipment. The data monitoring system 2 is wirelessly connected to a monitoring platform 3.

[0022] The data monitoring system 2 is used to monitor the operation data of the prefabricated substation 1 in real time and send the monitoring data (i.e. the monitored operation data of the prefabricated substation 1) to the monitoring platform 3.

[0023] In this embodiment, the high-voltage switchgear (such as a high-voltage switch cabinet) 11 is used to introduce high-voltage electricity (such as 10kV high-voltage electricity) from the power grid, the transformer 12 is used to convert the high-voltage electricity introduced by the high-voltage switchgear 11 into low-voltage electricity (such as 0.4kV general civil or general industrial electricity), and the low-voltage switchgear 13 is used to accurately divert the low-voltage electricity output by the transformer 12 to the next level of power distribution equipment.

[0024] By wirelessly connecting the data monitoring system 2 and the monitoring platform 3 via LoRa communication, the method of connecting the data monitoring system 2 to the monitoring platform 3 through shielded cables is avoided. This allows the monitoring data from the data monitoring system 2 (the operational data of the prefabricated substation 1) to be uploaded to the monitoring platform 3 via LoRa communication. This enables the monitoring platform 3 to monitor the operation of the prefabricated substation 1 in real time from a distance. Analysis of the visualized monitoring data on the monitoring platform 3 provides insights into the operational status of the prefabricated substation, preventing accidents and further improving the safety of the prefabricated substation operation. Furthermore, wirelessly connecting the data monitoring system 2 to the monitoring platform 3 via LoRa communication achieves long-distance, low-power, low-cost, and easily deployable data transmission.

[0025] In another exemplary embodiment of this application, the aforementioned high-voltage complete set of equipment 11 mainly includes a high-voltage disconnecting switch (such as a 10kV disconnecting switch) and a high-voltage circuit breaker (such as a 10kV circuit breaker) connected in sequence, wherein: The first end of the high-voltage disconnector is used to connect to the high-voltage power grid. The second end of the high-voltage disconnector is connected to the high-voltage circuit breaker. The second end of the high-voltage circuit breaker is connected to the primary side of transformer 12. The third end of the high-voltage circuit breaker is connected to the control circuit.

[0026] In this embodiment, the first terminal is the input terminal, the second terminal is the output terminal, and the third terminal is the control terminal. The relay protection device outputs a trip signal to the control circuit, and the control circuit controls the high-voltage circuit breaker to trip.

[0027] In another exemplary embodiment of this application, the low-voltage switchgear 13 mainly includes a frame circuit breaker and a plurality of molded case circuit breakers, wherein: The first end of the frame circuit breaker is connected to the secondary side of transformer 12, the second end of the frame circuit breaker is connected to the first end of each molded case circuit breaker, and the second end of each molded case circuit breaker is connected to the corresponding next-level power distribution equipment.

[0028] In this embodiment, the frame circuit breaker is used as the main switch, and the molded case circuit breaker is used as the branch switch.

[0029] In another exemplary embodiment of this application, such as Figure 2-3 As shown, the data monitoring system 2 includes a first data acquisition device 21, which includes a multi-functional digital display module 211, a microcomputer integrated protection device 212, a temperature monitoring module 213, and a temperature and humidity acquisition device 214.

[0030] The multi-functional digital display module 211 is used to collect electrical parameters of the box-type substation 1. The electrical parameters include at least voltage, current, power, frequency and power factor.

[0031] The microcomputer integrated protection device 212 is used to provide relay protection for the high-voltage complete set of equipment 11 and to collect the position signals of the high-voltage circuit breaker of the high-voltage complete set of equipment 11. The position signals include open position signals and closed position signals.

[0032] The temperature monitoring module 213 is used to collect temperature data of transformer 12.

[0033] The temperature and humidity acquisition device 214 is used to collect the temperature and humidity of the internal environment of the box-type substation.

[0034] In this embodiment, the voltage, current, power, frequency, power factor, circuit breaker open and closed positions, transformer temperature data, and internal temperature and humidity of the prefabricated substation 1 are all parameters that can well characterize the operating status of the prefabricated substation. By analyzing these parameters, the operating status of the prefabricated substation can be obtained, thereby further improving the safety of the prefabricated substation operation.

[0035] The microcomputer-based integrated protection device 212 provides relay protection for the high-voltage complete set of equipment 11, including overcurrent, zero-sequence, and differential protection.

[0036] In another exemplary embodiment of this application, the multi-functional digital display module 211 includes a first multi-functional digital display for collecting electrical parameters of the high voltage connected to the high-voltage complete equipment 11. The first multi-functional digital display is connected to the output terminals of both a high-voltage current transformer and a high-voltage voltage transformer. The high-voltage current transformer is used to collect the current magnitude of the high-voltage electricity connected to the high-voltage complete equipment 11, and the high-voltage voltage transformer is used to collect the voltage magnitude of the high-voltage electricity connected to the high-voltage complete equipment 11.

[0037] In this embodiment, the high-voltage current transformer can be installed in the high-voltage incoming and outgoing line cabinet of the high-voltage complete equipment 11, and the high-voltage voltage transformer can be installed outside the high-voltage incoming and outgoing line cabinet of the high-voltage complete equipment 11.

[0038] The first multi-functional digital display meter automatically calculates electrical parameters such as power, frequency, and power factor of the connected high-voltage electricity based on the input voltage and current.

[0039] In another exemplary embodiment of this application, the multi-functional digital display module 211 further includes a plurality of second multi-functional digital display meters. The second multi-functional digital display meters are used to collect the electrical parameters of the branch where each molded case circuit breaker of the low-voltage switchgear 13 is located. The number of second multi-functional digital display meters is consistent with the number of branches collected at the second end of the low-voltage switchgear 13.

[0040] Each second multi-function digital display meter is connected to the output terminal of the low-voltage current transformer of the corresponding branch and the second terminal of the corresponding molded case circuit breaker. The low-voltage current transformer is used to collect the current magnitude of the branch where each molded case circuit breaker is located.

[0041] In this embodiment, each second multi-functional digital display meter automatically calculates electrical parameters such as frequency, power, and power factor of each branch based on the input voltage and current.

[0042] In another exemplary embodiment of this application, the temperature monitoring module employs a transformer temperature controller.

[0043] In another exemplary embodiment of this application, the transformer temperature controller is model KTS011.

[0044] In another exemplary embodiment of this application, the multi-functional digital display module 211, the microcomputer integrated protection device 212, the temperature monitoring module 213, and the temperature and humidity acquisition device 214 are connected to the second data acquisition device 22, and the second data acquisition device 22 is wirelessly connected to the monitoring platform 3 via LoRa communication.

[0045] Since the existing first data acquisition device 11 has a 485 communication interface, which cannot be directly used for LoRa communication, the multi-functional digital display module 211, the microcomputer integrated protection device 212, the temperature monitoring module 213 and the temperature and humidity acquisition device 214 are connected to the second data acquisition device 22 with LoRa communication function through a 485 communication cable, and then the second data acquisition device 22 communicates with the monitoring platform 3 through LoRa.

[0046] In another exemplary embodiment of this application, the microcomputer integrated protection device 212 is model LG-PD300.

[0047] In another exemplary embodiment of this application, the first multi-function digital display and the second multi-function digital display are model LG-CI96.

[0048] In another exemplary embodiment of this application, the temperature and humidity acquisition device 214 is model WHD46.

[0049] In another exemplary embodiment of this application, such as Figure 2 As shown, the monitoring platform 3 includes a data receiving device 31, a data reading and uploading device 32, and a display terminal 33 connected in sequence. The data receiving device 31 is wirelessly connected to the second data acquisition device 22 via LoRa communication, and the data reading and uploading device 32 is used to upload the received monitoring data to the display terminal 33.

[0050] Since the display terminal 33 does not have LoRa communication function, a data receiving device 31 with LoRa communication function is set in the power distribution room, and the monitoring data wirelessly received by the data receiving device 31 is uploaded to the display terminal 33 through the data reading and uploading device 32. The received monitoring data is visualized by the display terminal 33 so that users can understand the operating status of the box-type substation.

[0051] In another exemplary embodiment of this application, the data receiving device 31 and the second data acquisition device 22 are wirelessly connected via LoRa communication.

[0052] In this embodiment, the second data acquisition device 22 and the data receiving device 31 are the same device, both being low-frequency half-duplex LoRa data transmission terminals that support point-to-point communication protocols. They use serial ports for data transmission and reception, enabling one-to-one or one-to-many communication. When the two devices have the same transmission rate, the same channel, and the same target address, the two devices can transmit and receive data.

[0053] By installing a second data acquisition device 22 inside the prefabricated substation and a data receiving device 31 in the power distribution room, the operating data of the prefabricated substation can be uploaded to the display terminal 33 through LoRa communication between the data receiving device 31 and the second data acquisition device 22.

[0054] In another exemplary embodiment of this application, the internal communication interfaces (485 communication ports) of the multi-functional digital display module 21, the microcomputer integrated protection device 22, the temperature monitoring module 23, and the temperature and humidity acquisition device 24 are connected in series to the external communication circuit of the second data acquisition device 22.

[0055] In another exemplary embodiment of this application, such as Figure 2 As shown, the number of first data acquisition devices 21 does not exceed 32, and all first data acquisition devices 21 have unique addresses and the same baud rate.

[0056] In another exemplary embodiment of this application, the data reading and uploading device 32 employs a gateway.

[0057] In this embodiment, when the gateway reads data, the first data acquisition device 21 transmits the monitoring data to the serial port of the second data acquisition device 22 via a serial port. The monitoring data undergoes serial-to-LoRa conversion communication within the second data acquisition device 22, and then the monitoring data is transmitted to the data receiving device 31 via LoRa wireless communication. The data receiving device 31 performs LoRa-to-serial conversion within the device, and then transmits the monitoring data to the gateway via a serial port. After receiving the monitoring data, the gateway internally converts the monitoring data into actual measurement values ​​and uploads them to the display terminal for visualization.

[0058] In another exemplary embodiment of this application, the data reading and uploading device 32 is model USR-M300.

[0059] In another exemplary embodiment of this application, both the second data acquisition device 22 and the data receiving device 31 adopt the LoRa data transmission terminal 4, such as... Figure 4 As shown, the LORA data transmission terminal includes a processing module 41, a power supply module 42, an RF module 43, and an external communication circuit 44. The first output terminal of the processing module 41 is connected to the drive signal input terminal of the RF module 43, and the second output terminal of the processing module 42 is connected to the transmit / receive direction control signal input terminal of the external communication circuit 44. The transmit / receive direction control signal controls the external communication circuit 44 to receive or transmit signals. The power supply module 42 is connected to the operating voltage input terminals of the processing module 41, the RF module 43, and the external communication circuit 44.

[0060] The radio frequency module 43 of the second data acquisition device 22 communicates wirelessly with the radio frequency module 43 of the data receiving device 31 via LoRa. The external communication circuit 44 of the first data acquisition device is connected to the internal communication interfaces of the multi-functional digital display module 211, the microcomputer integrated protection device 212, the temperature monitoring module 213, and the temperature and humidity acquisition device 214.

[0061] In another exemplary embodiment of this application, the processing module 41 employs an STM32 microprocessor chip.

[0062] In another exemplary embodiment of this application, the processing module 41 employs an STM32F103RCT6 microprocessor chip, such as... Figure 5 As shown, pins 19, 32, 48, and 64 of the STM32F103RCT6 microprocessor chip are power supply pins, connected to the 3.3V output voltage of power module 42. Pins 18, 31, 47, and 63 of the STM32F103RCT6 microprocessor chip are ground pins. Pins 8, 9, 10, 11, 20, 21, 22, and 23 of the STM32F103RCT6 microprocessor chip are connected to RF module 43. Specifically, pin 8 is connected to the BUSY terminal of RF module 43, pin 9 is connected to the SX NRESET terminal of RF module 43, pin 10 is connected to the DIO1 terminal of RF module 43, pin 11 is connected to the ANT SW terminal of RF module 43, pin 20 is connected to the NSS terminal of RF module 43, pin 21 is connected to the SCK terminal of RF module 43, pin 22 is connected to the MISO terminal of RF module 43, and pin 23 is connected to the MISI terminal of RF module 43. Pins 51 and 52 of the STM32F103RCT6 microprocessor chip are connected to the external communication circuit. Specifically, pin 51 is connected to the UART RX terminal of the external communication circuit 44, and pin 52 is connected to the UART TX terminal of the external communication circuit 44.

[0063] In another exemplary embodiment of this application, the radio frequency module 43 includes a wireless transceiver, a temperature-compensated crystal oscillator (TCXO), and a radio frequency switch module (SWITCH). The TCXO is connected to the clock signal input of the wireless transceiver. The signal transceiver of the wireless transceiver is connected to an antenna via the radio frequency switch (SWITCH). The radio frequency switch is used to switch the input / output state of the half-duplex wireless transceiver.

[0064] In another exemplary embodiment of this application, the wireless transceiver is model SX1268.

[0065] In this embodiment, the SX1268 is a long-range, low-power wireless transceiver used for receiving and transmitting LoRa wireless signals. The TCXO is a 32MHz passive crystal oscillator used to provide a precise clock for the SX1268's high-frequency circuitry. The SWITCH is a PE4259, an RF switch chip used to switch the input or output states of the half-duplex SX1268.

[0066] In another exemplary embodiment of this application, such as Figure 7-9 As shown, the power module 42 includes: a first power conversion module 421 for converting the output voltage of an external power supply to a first target voltage, a second power conversion module 422 for converting the first target voltage to the operating voltage of the processing module 41 and the radio frequency module 43, and a third power conversion module 423 for converting the first target voltage to the operating voltage of the external communication circuit 44.

[0067] In another exemplary embodiment of this application, such as Figure 7As shown, the first power conversion module 421 includes a first capacitor C19, a second capacitor C20, a third capacitor C21, a fourth capacitor C22, a first resistor R3, a buck converter U4, a second resistor R4, a third resistor R5, a fourth resistor R6, a fifth capacitor C18, a first inductor L8, a sixth capacitor C23, a seventh capacitor C24, an eighth capacitor C25, and a ninth capacitor C26. The sixth capacitor C23 is an electrolytic capacitor. The first terminal of the first capacitor C19 is connected to the output voltage of the external power supply, the first terminals of the second capacitor C20, the third capacitor C21, the fourth capacitor C22, the first terminal of the first resistor R3, and the input voltage pin VIN of the buck converter U4. The second terminal of the first capacitor C19 is grounded together with the second terminals of the second capacitor C20, the third capacitor C21, the fourth capacitor C22, and the ground pin GND of the buck converter U4. The second terminal of the first resistor R3 is connected to the enable control pin of the buck converter U4. With the EN connection established, the BS pin of buck converter U4 is connected to the first terminal of the fifth capacitor C18. The SW pin of buck converter U4 and the second terminal of the fifth capacitor C18 are both connected to the first terminal of the first inductor L8. The FB pin of buck converter U4 is connected to the first terminal of the ninth capacitor C26, the first terminal of the third resistor R5, and the first terminal of the fourth resistor R6. The second terminal of the first inductor L8 is connected to the first terminal of the second resistor R4, the first terminal of the sixth capacitor C23, the first terminal of the seventh capacitor C24, and the first terminal of the eighth capacitor C25, and outputs the first target voltage. The second terminal of the second resistor R4 is connected to the second terminal of the ninth capacitor C26 and the second terminal of the third resistor R5. The second terminal of the fourth resistor R6 is grounded. The second terminals of the sixth capacitor C23, the seventh capacitor C24, and the eighth capacitor C25 are all grounded.

[0068] In another exemplary embodiment of this application, such as Figure 7 As shown, the output voltage of the external power supply is +12V, and the first target voltage is +5V.

[0069] In another exemplary embodiment of this application, the buck converter U4 is model TPS54302DDCR.

[0070] In another exemplary embodiment of this application, such as Figure 8As shown, the second power conversion module 422 includes a tenth capacitor C27, an eleventh capacitor C28, a voltage regulator chip U7, a twelfth capacitor C29, and a thirteenth capacitor C30. The first terminal of the tenth capacitor C27 is connected to the first target voltage, the first terminal of the eleventh capacitor C28, and the input voltage pin VIN of the voltage regulator chip U7. The second terminal of the tenth capacitor C27 is grounded together with the second terminal of the eleventh capacitor C28 and the ground pin GND of the voltage regulator chip U7. The first output pin VOUT of the voltage regulator chip U7 outputs the operating voltage of the processing module 41. The second output pin VOUT of the voltage regulator chip U7 is connected to the first terminal of the twelfth capacitor C29 and the first terminal of the thirteenth capacitor C30 and outputs the operating voltage of the radio frequency module 43. The second terminals of the twelfth capacitor C29 and the thirteenth capacitor C30 are grounded together.

[0071] In another exemplary embodiment of this application, such as Figure 8 As shown, the first target voltage is +5V, and the operating voltage of the processing module 41 and the radio frequency module 43 is +3.3V.

[0072] In another exemplary embodiment of this application, the voltage regulator chip U7 is model AMS1117-3.3.

[0073] In another exemplary embodiment of this application, such as Figure 9 As shown, the third power conversion module 423 includes a fourteenth capacitor C31, a second inductor L9, a fifteenth capacitor C32, a DC-DC power module U9, and a sixteenth capacitor C33. The first terminal of the fourteenth capacitor C31 is connected to the first target voltage and the first terminal of the second inductor L9. The second terminal of the second inductor L9 is connected to the first terminal of the fifteenth capacitor C32 and the input voltage pin VIN of the DC-DC power module U9. The second terminals of the fourteenth capacitor C31 and the fifteenth capacitor C32 are grounded together with the ground pin GND of the DC-DC power module U9. The output pin Vo of the DC-DC power module U9 is connected to the first terminal of the sixteenth capacitor C33 and outputs the operating voltage of the external communication circuit 44. The second terminal of the sixteenth capacitor C33 is connected to the signal ground 485GND together with the 0V pin of the DC-DC power module U9.

[0074] In another exemplary embodiment of this application, the DC-DC power module U9 is model B0505S-1W.

[0075] In another exemplary embodiment of this application, the first target voltage is +5V, and the operating voltage of the external communication circuit 44 is +5V.

[0076] In this embodiment, the DC-DC power module U9 isolates a DC 5V channel to supply power to the external communication circuit 44.

[0077] In another exemplary embodiment of this application, such as Figure 7 As shown, to convert +12V to +5V, the capacitance of the first capacitor C19 is 10nF, the capacitance of the second capacitor C20 is 10pF, the capacitance of the third capacitor C21 and the fourth capacitor C22 is 22uF, the capacitance of the fifth capacitor C18 is 1uF, the capacitance of the sixth capacitor C23 is 220uF, the capacitance of the seventh capacitor C24 is 22uF, and the capacitance of the eighth capacitor C25 and the ninth capacitor C26 is 100nF. The resistance of the first resistor R3 and the third resistor R5 is 100kΩ, the resistance of the second resistor R4 is 49.9kΩ, the resistance of the fourth resistor R6 is 13.3kΩ, and the inductance of the first inductor L8 is 15uH.

[0078] In another exemplary embodiment of this application, such as Figure 8 As shown, to convert +5V to +3.3V, the capacitance of the tenth capacitor C27, the eleventh capacitor C28, and the thirteenth capacitor C30 is 100nF, and the capacitance of the twelfth capacitor C29 is 10uF.

[0079] In another exemplary embodiment of this application, such as Figure 9 As shown, the capacitance of the fourteenth capacitor C3 and the sixteenth capacitor C33 is 10uF, the capacitance of the fifteenth capacitor C32 is 4.7uF, and the inductance of the second inductor L9 is 6.8uH.

[0080] In another exemplary embodiment of this application, the circuit connections of SX1268 with TCXO and SWITCH are as follows: Figure 6 As shown. Pin 1 of the TCXO is connected to VCC 3.3 output from power module 42 via capacitor C4 (seventeenth capacitor). Pin 2 of the TCXO is grounded. Pin 3 of the TCXO is connected to pin 4 of the SX1268. Pin 4 of the TCXO is connected to pin 3 of the SX1268. Pin 1 of the SX1268 is the chip power supply pin, connected to VCC 3.3 output from power module 42. Pins 2, 5, 8, and 20 (ground pins) of the SX1268 are grounded. Pin 7 of the SX1268 is the output voltage pin of the internal regulator. Pin 7 of the SX1268 is connected to VCC 3.3 output from power module 42 via inductor L4 (third inductor), to pin 9 of the SX1268 via inductor L7 (fourth inductor), to ground via capacitor C15 (eighteenth capacitor), and connected to pin 24 of the SX1268. Pins 10 and 11 of the SX1268 are both connected to VCC 3.3 and grounded via capacitor C16 (nineteenth capacitor). Pin 12 of the SX1268 is DIO2, which is used to control the SWITCH. It is connected to the CTRL pin of the SWITCH via resistor R2.

[0081] Pins 13-19 of the SX1268 are the control pins of the processing module 41, used to connect the I / O ports and SPI interface of the processing module 41. Specifically, pin 13 of the SX1268 is connected to pin 10 of the STM32F103RCT6 microprocessor chip, pin 14 of the SX1268 is connected to pin 8 of the STM32F103RCT6 microprocessor chip, pin 15 of the SX1268 is connected to pin 9 of the STM32F103RCT6 microprocessor chip, pin 16 of the SX1268 is connected to pin 22 of the STM32F103RCT6 microprocessor chip, pin 17 of the SX1268 is connected to pin 23 of the STM32F103RCT6 microprocessor chip, pin 18 of the SX1268 is connected to pin 21 of the STM32F103RCT6 microprocessor chip, and pin 19 of the SX1268 is connected to pin 20 of the STM32F103RCT6 microprocessor chip. Pin 20 of the SX1268 is grounded. Pin 21 of the SX1268 is grounded via capacitor C17. Pin 22 of the SX1268 is connected to the twentieth capacitor C17 via inductor L6, and to the RF2 pin of the SWITCH circuit via the twenty-first capacitor C12, as well as the first terminal of the twenty-second capacitor C13. The second terminal of the twenty-second capacitor C13 is grounded. Pin 23 of the SX1268 is connected to the first terminals of the fifth inductor L1, the sixth inductor L2, and the twenty-third capacitor C5. The second terminal of the fifth inductor L1 is connected to the first terminals of the twenty-fourth capacitor C2, the twenty-fifth capacitor C1, and pin 24 of the SX1268. The second terminals of the twenty-fourth capacitor C2, the twenty-fifth capacitor C1, and pin 25 of the SX1268 are all grounded. The second terminal of the sixth inductor L2 and the second terminal of the twenty-third capacitor C5 are grounded via the twenty-sixth capacitor C7, and then connected sequentially via the twenty-seventh capacitor C6, the sixth inductor L3 to the first terminal of the twenty-eighth capacitor C8, and the RF1 pin of the SWITCH. The second terminal of the twenty-eighth capacitor C8 is grounded. The GND pin of the SWITCH is grounded. The VDD pin of the SWITCH is connected to pin 11 of the STM32F103RCT6 microprocessor chip via the fifth resistor R1, and grounded via the twenty-ninth capacitor C3. The RFC pin of the SWITCH is connected via the thirtieth capacitor C9 to the first terminal of the thirty-first capacitor C10 and the first terminal of the seventh inductor L5, and the second terminal of the thirty-first capacitor C10 is grounded. The second terminal of the seventh inductor L5 is grounded via the thirty-second capacitor C11, and then grounded via the RF connector SMA. The RF connector SMA is connected to the external antenna via a coaxial cable.

[0082] In another exemplary embodiment of this application, the external communication circuit 44 adopts a 485 communication circuit, i.e. Figure 2 The 485 communication interface of the second data acquisition device 22 and the data receiving device 31.

[0083] In another exemplary embodiment of this application, the circuit principle of the 485 communication circuit is as follows: Figure 10 As shown, the system includes a first optocoupler U5, a half-duplex RS485 transceiver U6, and a second coupler U8. The GND pin of the first optocoupler U5 is grounded. The VO pin of the first optocoupler U5 is connected to pin 52 of the STM32F103RCT6 microprocessor chip and then connected to VCC 3.3 via the seventh resistor R7. The VCC pin of the first optocoupler U5 is connected to VCC 3.3. The CATHODE pin of the first optocoupler U5 is connected to the RO pin of the half-duplex RS485 transceiver U6. The ANODE pin of the first optocoupler U5 is connected to the +5V output of the third power conversion module 423 via the eighth resistor R8.

[0084] The GND pin of the second coupler U8 is grounded. The VO pin of the second coupler U8 is connected to the DI pin of the half-duplex RS485 transceiver U6, and then connected to the +5V output of the third power conversion module 423 via the thirteenth resistor R13. The VCC pin of the second coupler U8 is also connected to the +5V output of the third power conversion module 423. The CATHODE pin of the second coupler U8 is connected to pin 51 of the STM32F103RCT6 microprocessor chip. The ANODE pin of the second coupler U8 is connected to VCC 3.3 via the twelfth resistor R12.

[0085] The RE# and DE pins of the half-duplex RS485 transceiver U6 are connected and then connected to the +5V voltage output from the third power conversion module 423 via the tenth resistor R10. The VCC pin of the half-duplex RS485 transceiver U6 is also connected to the +5V voltage output from the third power conversion module 423. Pin B is connected to 485B, grounded via the eleventh resistor R11, and then connected to the cathode of the second LED D2. Pin A is connected to 485A and then connected to the cathode of the first LED D1. The GND pin of the half-duplex RS485 transceiver U6, the cathode of the first LED D1, and the cathode of the second LED D2 are all grounded together. 485A and 485B are external interfaces used for communication with the data reading and uploading device 32 or other devices.

[0086] In this embodiment, U5 and U8 are high-speed optical couplers, U6 is a half-duplex RS485 transceiver with automatic direction selection control function, UART_RX and UART_TX are serial communication signal lines of the microprocessor module for bidirectional data transmission, and 485A and 485B are external interfaces for communication with the data reading and uploading device 32 or other devices.

[0087] In another exemplary embodiment of this application, the first optical coupler U5 and the second coupler U8 are of model HCPL-M453-500E.

[0088] In another exemplary embodiment of this application, the half-duplex RS485 transceiver U6 is model MAX13487EESA+T.

[0089] In another exemplary embodiment of this application, both the second data acquisition device 22 and the data receiving device 31 are model LG207.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An intelligent prefabricated substation, characterized in that, The intelligent prefabricated substation includes a prefabricated substation (1) and a data monitoring system (2), wherein: The box-type substation (1) includes a high-voltage complete set of equipment (11), a transformer (12) and a low-voltage switchgear (13). The first end of the high-voltage complete set of equipment (11) is used to connect to the high-voltage power grid. The second end of the high-voltage complete set of equipment (11) is connected to the primary side of the transformer (12). The secondary side of the transformer (12) is connected to the first end of the low-voltage switchgear (13). The second end of the low-voltage switchgear (13) is connected to the next level of power distribution equipment. The data monitoring system (2) and the monitoring platform (3) are connected via LoRa wireless communication; The data monitoring system (2) is used to monitor the operation data of the box-type substation (1) in real time and send the monitoring data to the monitoring platform (3).

2. The intelligent prefabricated substation according to claim 1, characterized in that, The data monitoring system (2) includes a first data acquisition device (21), which includes: A multi-functional digital display module (211) for collecting electrical parameters of the prefabricated substation (1); wherein the electrical parameters include at least voltage, current, power, frequency and power factor; A microcomputer-based integrated protection device (212) for relay protection of the high-voltage complete set of equipment (11) and for collecting the position signals of the high-voltage circuit breakers of the high-voltage complete set of equipment (11), wherein the position signals include open position signals and closed position signals; Temperature monitoring module (213) for collecting temperature data of the transformer (12); Temperature and humidity acquisition device (214) for collecting temperature and humidity of the internal environment of the box-type substation (1).

3. The intelligent prefabricated substation according to claim 2, characterized in that, The multi-functional digital display module (211), the microcomputer integrated protection device (212), the temperature monitoring module (213) and the temperature and humidity acquisition device (214) are connected to the second data acquisition device (22), and the second data acquisition device (22) is connected to the monitoring platform (3) via LoRa wireless communication.

4. The intelligent prefabricated substation according to claim 2, characterized in that, The monitoring platform (3) includes a data receiving device (31), a data reading and uploading device (32), and a display terminal (33) connected in sequence, wherein: The data receiving device (31) and the second data acquisition device (22) are connected via LoRa wireless communication; The data reading and uploading device (32) is used to upload the received monitoring data to the display terminal (33).

5. The intelligent prefabricated substation according to claim 4, characterized in that, The second data acquisition device (22) and the data receiving device (31) both adopt the LORA data transmission terminal (4); The LORA data transmission terminal (4) includes a processing module (41), a power supply module (42), a radio frequency module (43), and an external communication circuit (44), wherein: The first output terminal of the processing module (41) is connected to the drive signal input terminal of the radio frequency module (43), and the second output terminal of the processing module (41) is connected to the transmit / receive direction control signal input terminal of the external communication circuit (44). The power module (42) is connected to the working voltage input terminals of the processing module (41), the radio frequency module (43) and the external communication circuit (44); The radio frequency module (43) of the second data acquisition device (22) communicates with the radio frequency module (43) of the data receiving device (31) via LoRa wireless communication; The external communication circuit (44) of the second data acquisition device (22) is connected to the internal communication interface of the multi-functional digital display module (211), the microcomputer integrated protection device (212), the temperature monitoring module (213), and the temperature and humidity acquisition device (214).

6. The intelligent prefabricated substation according to claim 5, characterized in that, The internal communication interfaces of the multi-functional digital display module (211), the microcomputer integrated protection device (212), the temperature monitoring module (213), and the temperature and humidity acquisition device (214) are connected in series to the external communication circuit (44) of the second data acquisition device (22).

7. The intelligent prefabricated substation according to claim 5, characterized in that, The radio frequency module (43) includes a wireless transceiver, a temperature-compensated crystal oscillator, and a radio frequency switch, wherein: The temperature-compensated crystal oscillator is connected to the clock signal input terminal of the wireless transceiver; The signal transceiver of the wireless transceiver is connected to the antenna via the radio frequency switch. The radio frequency switch is used to switch the input / output state of the half-duplex wireless transceiver.

8. The intelligent prefabricated substation according to claim 5, characterized in that, The power module (42) includes: First power conversion module (421) for converting the output voltage of an external power supply to a first target voltage. A second power conversion module (422) is used to convert the first target voltage into the operating voltage of the processing module (41) and the radio frequency module (43). A third power conversion module (423) for converting the first target voltage into the operating voltage of the external communication circuit (44).

9. The intelligent prefabricated substation according to claim 5, characterized in that, The processing module (41) uses an STM32 microprocessor chip, and the external communication circuit (44) uses a 485 communication circuit.

10. The intelligent prefabricated substation according to claim 7, characterized in that, The wireless transceiver is model SX1268, and the radio frequency switch is model PE4259.

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