A high power density bidirectional ac-dc circuit board
Patent Information
- Application Number
- CN202522767575.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-26
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-12-26
AI Technical Summary
Existing bidirectional AC-CDC circuit boards are prone to electromagnetic interference and high-temperature damage to components in high-power-density designs.
The design employs a stacked configuration of the motherboard and the magnetic component board, with the magnetic component and the motherboard component mounted on different boards and connected by studs and helices. By combining GaN switching transistors and magnetic integration technology, the circuit layout is optimized to avoid interference and thermal effects.
It effectively avoids electromagnetic interference, prevents device damage due to high temperature, reduces circuit board size, increases power density, and achieves efficient energy conversion and miniaturized design.
Smart Images
Figure CN224935849U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit boards, and more specifically, to a high power density bidirectional AC-CDC circuit board. Background Technology
[0002] As the core equipment for replenishing energy for electric vehicles, the design of the power module of the charging pile directly affects charging efficiency, system stability, and user experience. To meet the requirements of fast and portable charging and discharging, the bidirectional AC-DC circuit board of the charging and discharging module usually requires a large number of high-power components, resulting in a large circuit board size. Furthermore, if the circuit board is not properly laid out, the components are prone to electromagnetic interference, and some components with high heat generation can easily damage surrounding components. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a high power density bidirectional AC-CDC circuit board that, while achieving high power density bidirectional AC-CDC conversion, can effectively avoid electromagnetic interference and prevent devices from being damaged by high temperature.
[0004] The technical solution adopted by this utility model to solve its technical problem is to construct a high power density bidirectional ACCDC circuit board, including a motherboard, a magnetic component board, a first motherboard assembly, a second motherboard assembly, and a magnetic component assembly. The first motherboard assembly is mounted on the first motherboard surface of the motherboard, and the second motherboard assembly is mounted on the second motherboard surface of the motherboard; the motherboard and the magnetic component board are stacked, with the first motherboard surface of the motherboard facing the first magnetic component board surface of the magnetic component board, and the second motherboard surface of the motherboard facing away from the first motherboard surface of the motherboard; the magnetic component assembly is mounted on the second magnetic component board surface of the magnetic component board, and the second magnetic component board surface of the magnetic component board faces away from the first magnetic component board surface of the magnetic component board.
[0005] In the high power density bidirectional ACDC circuit board of this utility model, the first motherboard assembly includes a first EMC unit, a second EMC unit, an input filter unit, and a DC filter unit; The input filtering unit, the DC filtering unit, and the first EMC unit are arranged side by side along the first side edge of the first motherboard surface; the DC filtering unit is located between the first EMC unit and the input filtering unit, the DC filtering unit is adjacent to the first EMC unit and spaced apart from the input filtering unit, and the input filtering unit is located at the junction of the first side edge and the third side edge of the first motherboard surface. The second EMC unit is disposed along the second side edge of the first motherboard surface and adjacent to the input filtering unit; The first side of the first motherboard surface is parallel to the second side of the first motherboard surface and perpendicular to the third side of the first motherboard surface.
[0006] In the high power density bidirectional ACDC circuit board of this utility model, the first motherboard assembly further includes a PFC slow tube unit, an auxiliary power control unit, and a control board. The PFC slow tube unit is located on the first side of the first motherboard surface at the end away from the second EMC unit; The auxiliary power control unit is located at the center of the surface of the first motherboard. The first side of the auxiliary power control unit is adjacent to the DC filter unit and the first EMC unit, and the second side of the auxiliary power control unit is adjacent to the second EMC unit. The control board is installed between the input filter unit and the DC filter unit and is adjacent to the auxiliary power control unit; The control board is detachably connected to the motherboard.
[0007] In the high power density bidirectional ACDC circuit board of this utility model, the first motherboard assembly further includes a first connection terminal and a second connection terminal. The first connection terminal is installed between the input filter unit and the DC filter unit and is adjacent to the control board; The second connection terminal is installed between the second EMC unit and the auxiliary power control unit.
[0008] In the high power density bidirectional ACDC circuit board of this utility model, the second main board assembly includes a PFC fast transistor unit, a DC-DC primary-side switching transistor unit, and a DC-DC secondary-side switching transistor unit. The DC-DC primary-side switching transistor unit and the DC-DC secondary-side switching transistor unit are disposed adjacent to the first connection terminal; The PFC fast tube unit is located adjacent to the PFC slow tube unit.
[0009] In the high power density bidirectional ACDC circuit board of this utility model, the PFC fast transistor unit, the DC-DC primary-side switching transistor unit and the DC-DC secondary-side switching transistor unit each include a plurality of GaN switching transistors, and the GaN switching transistors are mounted on the surface of the second motherboard by surface mount technology. The PFC slow tube unit includes multiple MOS transistors, which are mounted on the surface of the second motherboard.
[0010] In the high power density bidirectional AC-DC circuit board of this invention, the magnetic component assembly includes a resonant capacitor, a DC magnetic integrated component, a PFC inductor, and a transformer. The resonant capacitor, the DC magnetic integrated component, the PFC inductor, and the transformer are arranged side by side on the surface of the second magnetic component plate. The transformer is located near the input filter unit, and the resonant capacitor is located near the PFC slow tube unit.
[0011] In the high power density bidirectional ACDC circuit board of this utility model, a first stud and a second stud are mounted on the surface of the first magnetic component board; the first stud faces the first connection terminal; the second stud faces the second connection terminal. The motherboard and the magnetic board are connected by a first helix, a second helix, a first stud, a first connecting terminal, a second connecting terminal, and a second stud.
[0012] This invention relates to a high-power-density bidirectional AC-CDC circuit board, comprising a motherboard, a magnetic component board, a first motherboard assembly, a second motherboard assembly, a first magnetic component assembly, and a second magnetic component assembly. The first motherboard assembly is mounted on a first surface of the motherboard, and the second motherboard assembly is mounted on a second surface of the motherboard. The first magnetic component assembly is mounted on a first surface of the magnetic component board, and the second magnetic component assembly is mounted on a second surface of the magnetic component board. The motherboard and the magnetic component board are stacked, with the second surface of the motherboard facing the second surface of the magnetic component board. Because the magnetic component assembly and the motherboard assembly are mounted on different boards, interference between the magnetic component assembly and the motherboard assembly is effectively avoided, reducing the impact of heat generated by the magnetic component assembly on the motherboard assembly and preventing damage to the motherboard assembly due to high temperatures. Furthermore, the stacked arrangement of the motherboard and the magnetic component board effectively reduces the size of the circuit board and increases power density. Attached Figure Description
[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a schematic diagram of a preferred embodiment of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 2 This is a front view of the main board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 3 This is a rear view of the main board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 4 This is a side view of the main board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 5 This is a front view of the magnetic component board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 6 This is a rear view of the magnetic component board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 7 This is a side view of the magnetic component board of the high power density bidirectional AC-CDC circuit board of this utility model. Detailed Implementation
[0014] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0015] Figure 1 This is a schematic diagram of a preferred embodiment of the high power density bidirectional AC-CDC circuit board of this utility model. Figure 4 This is a side view of the main board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 7 This is a side view of the magnetic component board of the high power density bidirectional AC-CDC circuit board of this utility model.
[0016] like Figure 1 , 4 As shown in Figure 7, the high power density bidirectional AC-CDC circuit board includes a motherboard 100, a magnetic component board 200, a first motherboard assembly 300, a second motherboard assembly 400, and a magnetic component assembly 500. The first motherboard assembly 300 is mounted on the first motherboard surface 110 of the motherboard 100, and the second motherboard assembly 400 is mounted on the second motherboard surface 120 of the motherboard 100. The motherboard 100 and the magnetic component board 200 are stacked, with the first motherboard surface 110 of the motherboard 100 facing the first magnetic component board surface 210 of the magnetic component board 200, the second motherboard surface 120 facing away from the first motherboard surface 110, and the magnetic component assembly 500 is mounted on the second magnetic component board surface 220 of the magnetic component board 200, with the second magnetic component board surface 220 facing away from the first magnetic component board surface 210.
[0017] In the high power density bidirectional ACDC circuit board of this invention, since the magnetic component assembly and the main board assembly are respectively set on different boards, the interference of the magnetic component assembly to the main board assembly is effectively avoided, the impact of the heat generated by the magnetic component assembly on the main board assembly is reduced, and the main board assembly is prevented from being damaged due to high temperature. At the same time, since the main board and the magnetic component board are stacked, the size of the circuit board can be effectively reduced and the power density can be increased.
[0018] Figure 2 This is a front view of the main board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 3 This is a rear view of the main board of the high power density bidirectional AC-CDC circuit board of this utility model; Figure 4 This is a side view of the main board of the high power density bidirectional AC-CDC circuit board of this utility model.
[0019] like Figures 2-4 As shown, the first motherboard assembly 300 includes a first EMC unit 310, a second EMC unit 320, an input filter unit 330, a DC filter unit 340, a PFC slow-tube unit 350, an auxiliary power control unit 360, a control board 370, a first connection terminal 380, and a second connection terminal 390. The input filter unit 330, the DC filter unit 340, and the first EMC unit 310 are arranged side by side along the first side 111 of the first motherboard surface 110; the DC filter unit 340 is located between the first EMC unit 310 and the input filter unit 330, and is arranged adjacent to the first EMC unit 310 and spaced apart from the input filter unit 330; the second EMC unit 320 is arranged along the second side 112 of the first motherboard surface 110 and adjacent to the input filter unit 330; the first side 111 of the first motherboard surface 110 is parallel to the second side 112 of the first motherboard surface 110. The first side 111 and the second side 112 of the first motherboard surface 110 are along the length direction L.
[0020] The auxiliary power supply control unit 360 is disposed at the center of the first motherboard surface 110. A first side of the auxiliary power supply control unit 360 is adjacent to the DC filter unit 340 and the first EMC unit 310, and a second side of the auxiliary power supply control unit 360 is adjacent to the second EMC unit 320. The control board 370 is installed between the input filter unit 330 and the DC filter unit 340 and adjacent to the auxiliary power supply control unit 360. The control board 370 is detachably connected to the motherboard 100. A first connection terminal 380 is installed between the input filter unit 330 and the DC filter unit 340 and adjacent to the control board 370. A second connection terminal 390 is installed between the second EMC unit 320 and the auxiliary power supply control unit 360.
[0021] like Figures 2-4 As shown, the second motherboard assembly 400 includes a PFC fast transistor unit 410, a DC-DC primary-side switching transistor unit 420, and a DC-DC secondary-side switching transistor unit 430; the DC-DC primary-side switching transistor unit 420 and the DC-DC secondary-side switching transistor unit 430 are disposed adjacent to the first connection terminal 380; the PFC fast transistor unit 410 is disposed adjacent to the PFC slow transistor unit 350.
[0022] In a preferred embodiment of this invention, the first motherboard assembly 300, the second motherboard assembly 400, and the magnetic component assembly 500 adopt a totem-pole PFC+CLLLC DC-DC topology. The PFC control uses totem-pole PFC control, and the DC-DC conversion section uses a bidirectional CLLLC topology circuit as its core circuit structure. Soft switching of the power semiconductor devices is achieved through the rational design of the resonant cavity, effectively reducing switching losses. The use of relays on the secondary side changes the circuit connection method, thereby achieving a wide range of DC output / input voltages. The secondary-side rectification structure adopts a bridge rectification method, which reduces transformer windings, increases transformer utilization, achieves high efficiency, and saves module size and cost.
[0023] The second EMC unit 320 is an AC EMC unit, which can adopt any known AC EMC circuit structure in the art. It generally includes components such as fuses, surge absorbers, X capacitors, Y capacitors, common-mode inductors, and AC relays. These components are arranged closely in sequence and are positioned along the second side 112 of the first motherboard surface 110, adjacent to the first end of the input filter unit 330. The PFC fast transistor unit 410 includes multiple GaN switching transistors, which are surface-mounted on the second motherboard surface 120. Preferably, they can be directly mounted on the second motherboard surface 120 using a thermally conductive sheet such as alumina, greatly reducing the area occupied by the switching transistors. The PFC slow transistor unit 350 includes multiple low-resistance MOSFETs, which generate little heat; therefore, these MOSFETs are directly mounted on the second motherboard surface 120. The input filter unit 330 is located at the junction of the first side 111 and the third side 113 of the first motherboard surface 110. The first side 111 of the first motherboard surface 110 is parallel to the second side 112 and perpendicular to the third side 113. Therefore, the input filter unit 330 can be kept as far away from the switching transistor as possible to avoid overheating and ensure a long lifespan. The DC-DC primary-side switching transistor unit 420 includes multiple GaN switching transistors, which are mounted on the second motherboard surface 120 via surface mount technology. Preferably, they can be directly mounted on the second motherboard surface 120 using a thermally conductive sheet such as alumina, greatly reducing the area occupied by the switching transistors. The DC-DC secondary-side switching transistor unit 430 also includes multiple GaN switching transistors, which are mounted on the second motherboard surface 120 via surface mount technology. Preferably, they can be directly mounted on the second motherboard surface 120 using a thermally conductive sheet such as alumina, greatly reducing the area occupied by the switching transistors. In this preferred embodiment, GaN switching transistors are used as the core power devices, and the switching frequency is increased to significantly improve the module's energy transfer efficiency and power density.
[0024] The DC-DC primary-side switching unit 420 and the DC-DC secondary-side switching unit 430, in conjunction with the high-low voltage switching circuit, can achieve high-low voltage switching without the need for additional transformer windings and rectifier devices, greatly saving cost and size. The DC filter unit 340 includes an energy storage filter capacitor, which, in conjunction with a DC relay, achieves high-low DC voltage switching. The first EMC unit 310 is a DC EMC unit, which can adopt any known DC EMC circuit structure in the art, generally including fuses, X capacitors, Y capacitors, common-mode inductors, DC relays, etc., with each component arranged closely in sequence and positioned along the first side 111 of the first motherboard surface 110, away from the end of the first side 111 away from the input filter unit 330. The control board 370 is installed between the input filter unit 330 and the DC filter unit 340 and adjacent to the auxiliary power control unit 360, thus effectively connecting the power supply and drive / control functions, ensuring smooth wiring. Meanwhile, the control board 370 can also shield some of the interference from the DC-DC switching transistors, reducing EMI interference. The control board adopts a modular design and is detachably connected to the main board, facilitating the replacement and maintenance of the control board and improving the performance and reliability of the module. The first connection terminal 380 is installed between the input filter unit 330 and the DC filter unit 340 and adjacent to the control board 370. The first connection terminal 380 is a DC-DC flexible connection terminal, which is screwed onto the studs of the magnetic material plate to connect the GaN switching transistor to the main transformer. The flexible terminal ensures the reliability of the connection. The second connection terminal 390 is installed between the second EMC unit 320 and the auxiliary power control unit 360. The second connection terminal 390 is a PFC flexible connection terminal, which is screwed onto the studs of the magnetic material plate to connect the GaN switching transistor to the PFC inductor. The flexible terminal ensures the reliability of the connection. The auxiliary power control unit 360 includes an auxiliary power supply and a signal transmission circuit. The auxiliary power supply includes a primary-side auxiliary power supply and a secondary-side auxiliary power supply. The control board 370 is adjacent to the auxiliary power control unit 360. The auxiliary power control unit 360 is located on one side of the control board 370 and maintains a certain safety distance from the main power DC-DC section to avoid interference from the DC-DC switching circuit and improve circuit reliability. The above motherboard achieves efficient space utilization within a limited PCB space.
[0025] Figure 5 This is a front view of the magnetic component board of the high power density bidirectional AC-CDC circuit board of this utility model. Figure 6 This is a rear view of the magnetic component board of the high power density bidirectional AC-CDC circuit board of this utility model. Figure 7This is a side view of the magnetic component board of the high power density bidirectional AC-CDC circuit board of this utility model.
[0026] like Figures 5-7 As shown, the magnetic component assembly 500 includes a resonant capacitor 510, a DC magnetic integrated component 520, a PFC inductor 530, and a transformer 540; the resonant capacitor 510, the DC magnetic integrated component 520, the PFC inductor 530, and the transformer 540 are arranged side by side on the surface 220 of the second magnetic component plate; the transformer 540 is arranged adjacent to the input filtering unit, and the resonant capacitor 510 is arranged adjacent to the PFC slow tube unit 350.
[0027] In this preferred embodiment, the magnetic component plate 200 mainly houses larger heat-dissipating devices (primarily magnetic materials), and then potting compound is immersed in the heat dissipation groove below to conduct heat to the heat dissipation plate, thus effectively dissipating heat. Here, potting compound heat dissipation methods known in the art can be used.
[0028] In this preferred embodiment, the resonant capacitor 510, the DC magnetic integrated component 520, the PFC inductor 530, and the transformer 540 are arranged side-by-side on the surface 220 of the second magnetic component plate. The resonant capacitor 510 is neatly arranged and kept away from the main transformer of the DC magnetic integrated component 520 to avoid overheating and ensure its lifespan. The DC magnetic integrated component 520 is a DC-DC main transformer plus a resonant inductor. Magnetic integration technology effectively utilizes the magnetic core, reducing its size. The DC-DC main transformer is placed in a heat dissipation slot of a corresponding size and shape, and thermally conductive adhesive is applied to conduct the transformer's heat to the heat dissipation plate. In this preferred embodiment, the resonant inductor and isolation transformer are integrated into a single magnetic core. This magnetic integration technology optimizes the size and performance of the magnetic components. By integrating the side magnetic cores of the transformer and inductor in a single phase, this magnetic integration technology reduces the number of side magnetic cores by two, making full use of the magnetic core while saving costs and reducing size, providing a highly efficient, compact, and reliable energy conversion solution for the charging module.
[0029] The PFC inductor 530 uses flat copper wire winding technology and operates at high frequency, effectively reducing its size and weight. The PFC inductor is placed in a heat sink of corresponding size and shape, and thermally conductive adhesive is applied to fully conduct the inductor's heat to the heat sink. The transformer 540 is a monitoring power supply transformer, which is also placed in a heat sink of corresponding size and shape, and thermally conductive adhesive is applied to fully conduct the transformer's heat to the heat sink. A first stud 211 and a second stud 212 are mounted on the surface 210 of the first magnetic component board. The first stud 211 faces the first connecting terminal 380; the second stud 212 faces the second connecting terminal 390. The main board 100 and the magnetic component board 200 are connected by a first helix 610, a second helix 620, the first stud 211, the first connecting terminal 380, the second connecting terminal 380, and the second stud 212. The first stud 211 connects the main transformer to the switching transistor on the main board, unlike traditional wire connections. This connection using studs and helices is shorter, easier to operate, and saves space. The second stud 212 connects the PFC inductor to the switching transistor on the main board, again using a stud and helical connection, resulting in a shorter distance, easier operation, and greater space savings. The magnetic component board effectively conducts heat from high-heat-generating components to the heat sink using customized heat dissipation grooves and potting compound, and finally dissipates the heat through a fan. The high-power-density bidirectional ACDC circuit board of this invention effectively avoids interference between the magnetic components and the main board assembly because the magnetic components and the main board assembly are mounted on separate boards. This reduces the impact of heat generated by the magnetic components on the main board assembly and prevents damage to the main board assembly due to high temperatures. Simultaneously, magnetic integration technology effectively reduces the size of magnetic components and optimizes the circuit board layout, achieving high-performance output of the charging module within a compact size. The vertical stacking design of two four-layer boards further reduces the circuit board size. Flexible terminals, studs, and helices connect the components on the magnetic board to the switching transistors on the main board using the shortest path, reducing the current circulation area, lowering EMI interference, and eliminating the problem of significant EMI variations with operational changes that occurs with flexible wire connections.
[0030] Compared to traditional designs, the high-power-density bidirectional AC-CDC circuit board of this invention reduces the PCB size by 30% and supports a full range of DC voltages from 250V to 1000V. It achieves 3.3kW charging and discharging output within a size of 395.1mm × 295mm × 62.5mm. Compared to traditional designs that use two power modules for charging and discharging, the overall volume is reduced by more than 50%. The module's peak conversion efficiency reaches 96%, its full-load efficiency is 95.8%, and its output current ripple is less than 1%. Compared to existing technologies, this solution achieves a wide-range integrated charging and discharging solution without increasing size, meeting the rapid charging and discharging needs of electric vehicles, and combining advantages in miniaturization, high reliability, and cost.
[0031] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.
[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high power density bidirectional AC-CDC circuit board, characterized in that, Includes the motherboard, magnetic board, first motherboard assembly, second motherboard assembly, and magnetic board assembly; The first motherboard assembly is mounted on the first motherboard surface of the motherboard, and the second motherboard assembly is mounted on the second motherboard surface of the motherboard; the motherboard and the magnetic component board are stacked, with the first motherboard surface of the motherboard facing the first magnetic component board surface of the magnetic component board, and the second motherboard surface of the motherboard facing away from the first motherboard surface of the motherboard; the magnetic component assembly is mounted on the second magnetic component board surface of the magnetic component board, and the second magnetic component board surface of the magnetic component board faces away from the first magnetic component board surface of the magnetic component board.
2. The high power density bidirectional AC-CDC circuit board according to claim 1, characterized in that, The first motherboard assembly includes a first EMC unit, a second EMC unit, an input filtering unit, and a DC filtering unit; The input filtering unit, the DC filtering unit, and the first EMC unit are arranged side by side along the first side edge of the first motherboard surface; the DC filtering unit is located between the first EMC unit and the input filtering unit, the DC filtering unit is adjacent to the first EMC unit and spaced apart from the input filtering unit, and the input filtering unit is located at the junction of the first side edge and the third side edge of the first motherboard surface. The second EMC unit is disposed along the second side edge of the first motherboard surface and adjacent to the input filtering unit; The first side of the first motherboard surface is parallel to the second side of the first motherboard surface and perpendicular to the third side of the first motherboard surface.
3. The high power density bidirectional AC-CDC circuit board according to claim 2, characterized in that, The first motherboard assembly further includes a PFC slow tube unit, an auxiliary power control unit, and a control board; The PFC slow tube unit is located on the first side of the first motherboard surface at the end away from the second EMC unit; The auxiliary power control unit is located at the center of the surface of the first motherboard. The first side of the auxiliary power control unit is adjacent to the DC filter unit and the first EMC unit, and the second side of the auxiliary power control unit is adjacent to the second EMC unit. The control board is installed between the input filter unit and the DC filter unit and is adjacent to the auxiliary power control unit; The control board is detachably connected to the motherboard.
4. The high power density bidirectional AC-CDC circuit board according to claim 3, characterized in that, The first motherboard assembly further includes a first connection terminal and a second connection terminal; The first connection terminal is installed between the input filter unit and the DC filter unit and is adjacent to the control board; The second connection terminal is installed between the second EMC unit and the auxiliary power control unit.
5. The high power density bidirectional AC-CDC circuit board according to claim 4, characterized in that, The second motherboard assembly includes a PFC fast transistor unit, a DC-DC primary-side switching transistor unit, and a DC-DC secondary-side switching transistor unit; The DC-DC primary-side switching transistor unit and the DC-DC secondary-side switching transistor unit are disposed adjacent to the first connection terminal; The PFC fast tube unit is located adjacent to the PFC slow tube unit.
6. The high power density bidirectional AC-CDC circuit board according to claim 5, characterized in that, The PFC fast transistor unit, the DC-DC primary-side switching transistor unit, and the DC-DC secondary-side switching transistor unit each include multiple GaN switching transistors, which are mounted on the surface of the second motherboard via surface mount technology. The PFC slow tube unit includes multiple MOS transistors, which are mounted on the surface of the second motherboard.
7. The high power density bidirectional AC-CDC circuit board according to any one of claims 4 to 6, characterized in that, The magnetic component assembly includes a resonant capacitor, a DC magnetic integrated component, a PFC inductor, and a transformer; The resonant capacitor, the DC magnetic integrated component, the PFC inductor, and the transformer are arranged side by side on the surface of the second magnetic component plate. The transformer is located near the input filter unit, and the resonant capacitor is located near the PFC slow tube unit.
8. The high power density bidirectional AC-CDC circuit board according to claim 7, characterized in that, A first stud and a second stud are mounted on the surface of the first magnetic component plate; the first stud faces the first connecting terminal; the second stud faces the second connecting terminal. The motherboard and the magnetic board are connected by a first helix, a second helix, a first stud, a first connecting terminal, a second connecting terminal, and a second stud.