An embedded manifold microchannel heat sink with heat pipe assisted heat dissipation

Abstract

The utility model provides a kind of embedded manifold microchannel heat sink with heat pipe auxiliary heat dissipation, belong to electronic equipment heat dissipation technical field, including heat absorption box, manifold being communicated in the lateral wall of heat absorption box, flow guide shell being communicated in the end of manifold, heat dissipation component is set in the lateral wall of flow guide shell, and auxiliary component is set in the surface of heat dissipation component and is used with heat dissipation component.The utility model connects heat absorption box and manifold to ensure that the cooling liquid after gasification moves to flow guide shell and enters connecting shell, the setting of connecting shell and flow guide box, cooperate with the small stopper, big stopper and baffle in microchannel component, the uniform distribution and slow flow of steam are realized, and the heat exchange efficiency is enhanced;The heat pipe and heat dissipation fin in auxiliary component greatly improve the heat dissipation capacity, and the setting of collection box and connecting pipe completes the circulation of cooling liquid, ensures the continuity and stability of entire heat dissipation system.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology for electronic devices, specifically relating to an embedded manifold microchannel heat dissipation device with heat pipe-assisted heat dissipation. Background Technology

[0002] Embedded manifold microchannel heat dissipation devices are developed based on microchannel heat dissipation technology. The background technology originated in the 1990s. As electronic devices develop towards miniaturization and high integration, traditional heat dissipation methods are difficult to meet the heat dissipation requirements of high heat flux density, and microchannel heat dissipation technology has emerged. Its development process has gone through a complex design that integrates manifolds and heat pipes. This device is mainly used in aerospace, military electronics, high-performance computing and other fields, and can provide efficient and compact thermal management solutions for electronic devices in extreme environments.

[0003] In the practical application of existing embedded manifold microchannel heat dissipation devices, a common problem is that when the high temperature generated by the device operation exceeds the processing capacity of the cooling system, the condensation process of the coolant in the microchannel becomes slow or even stops. This situation leads to a decrease in heat dissipation efficiency, a continuous increase in the internal temperature of the device, which affects the stability and service life of the device, and may even cause device failure or performance degradation. Therefore, an embedded manifold microchannel heat dissipation device with heat pipe-assisted heat dissipation has emerged. Utility Model Content

[0004] The purpose of this invention is to provide an embedded manifold microchannel heat dissipation device with heat pipe-assisted heat dissipation, which aims to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An embedded manifold microchannel heat dissipation device with heat pipe-assisted heat dissipation includes,

[0007] The heat absorption box, a manifold connected to the side wall of the heat absorption box, a flow guide shell connected to the end of the manifold, a heat dissipation assembly disposed on the side wall of the flow guide shell, and an auxiliary assembly disposed on the surface of the heat dissipation assembly for use in conjunction with the heat dissipation assembly.

[0008] As a preferred embodiment of the present invention, the heat dissipation assembly includes a connecting shell connected to the side wall of the air guide shell, and an air guide box connected to the side wall of the connecting shell.

[0009] As a preferred embodiment of this utility model, the heat dissipation assembly further includes a segment block fixedly installed on the inner wall of the connecting shell, and a microchannel component disposed in the inner cavity of the connecting shell to cooperate with the segment block.

[0010] As a preferred embodiment of this utility model, the microchannel component includes a small stop block fixedly installed in the inner cavity of the connecting shell, a large stop block fixedly installed in the inner wall of the connecting shell, and a baffle fixedly connected to the inner wall of the connecting shell.

[0011] As a preferred embodiment of this utility model, the auxiliary component includes a heat pipe connected to the top of the air guide box and heat dissipation fins sleeved on the outer surface of the heat pipe.

[0012] As a preferred embodiment of this utility model, the auxiliary component further includes a collection box fixedly connected to the end of the heat pipe, and a connecting pipe communicating with the bottom of the collection box.

[0013] In a preferred embodiment of this utility model, the bottom of the heat dissipation fins is fixedly connected to the surface of the connecting shell, and the bottom of the connecting pipe is connected to a heat absorption box.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: the connection between the heat absorption box and the manifold ensures that the vaporized coolant moves to the guide shell and enters the connecting shell. The setting of the connecting shell and the air guide box, together with the small baffle, large baffle and baffle in the microchannel component, realizes the uniform distribution and slow flow of steam, and enhances the heat exchange efficiency. The heat pipe and heat dissipation fins in the auxiliary components greatly improve the heat dissipation capacity. The setting of the collection box and the connecting pipe completes the circulation of coolant, ensuring the continuity and stability of the entire heat dissipation system. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram showing the connection between the manifold and the heat absorption box of this utility model;

[0018] Figure 3 This is a schematic diagram showing the connection between the connecting shell and the dividing block of this utility model;

[0019] Figure 4 This is a schematic diagram showing the connection between the heat pipe and the heat dissipation fins of this utility model.

[0020] In the diagram: 101, heat absorption box; 102, manifold; 103, airflow guide shell; 104, heat dissipation assembly; 104a, connecting shell; 104b, air duct box; 104c, dividing block; 104d, microchannel component; 104d-1, small baffle; 104d-2, large baffle; 104d-3, baffle; 105, auxiliary component; 105a, heat pipe; 105b, heat dissipation fins; 105c, collection box; 105d, connecting pipe. Detailed Implementation

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0024] Example

[0025] Reference Figures 1-4 This is an embodiment of the present invention, which provides an embedded manifold 102 microchannel heat dissipation device with heat pipe 105a for auxiliary heat dissipation, comprising,

[0026] The heat absorption box 101, the manifold 102 connected to the side wall of the heat absorption box 101, the flow guide shell 103 connected to the end of the manifold 102, the heat dissipation assembly 104 disposed on the side wall of the flow guide shell 103, and the auxiliary assembly 105 disposed on the surface of the heat dissipation assembly 104 for use in conjunction with the heat dissipation assembly 104.

[0027] Specifically, the heat absorption box 101 is made of aluminum and is placed in the position with the highest heating efficiency. Aluminum has good thermal conductivity and can quickly absorb and conduct heat into the coolant.

[0028] The heat dissipation assembly 104 includes a connecting shell 104a connected to the side wall of the air guide shell 103, and an air guide box 104b connected to the side wall of the connecting shell 104a. The heat dissipation assembly 104 also includes a dividing block 104c fixedly installed on the inner wall of the connecting shell 104a, and a microchannel component 104d disposed in the inner cavity of the connecting shell 104a and used in conjunction with the dividing block 104c.

[0029] Furthermore, the number of dividing blocks 104c is four, dividing the space inside the connecting shell 104a into five parts, forming five separate channels, which facilitates the use of the device.

[0030] The microchannel component 104d includes a small stop 104d-1 fixedly installed in the inner cavity of the connecting shell 104a, a large stop 104d-2 fixedly installed in the inner wall of the connecting shell 104a, and a baffle 104d-3 fixedly connected to the inner wall of the connecting shell 104a.

[0031] Preferably, the small stop 104d-1 is arranged in an equilateral triangle and the large stop 104d-2 is arranged in an isosceles trapezoid. A distance of 1mm-1.5mm is left between the small stop 104d-1 and the large stop 104d-2 to facilitate the deceleration of the gas formed after the coolant evaporates.

[0032] The auxiliary component 105 includes a heat pipe 105a connected to the top of the air guide box 104b, and heat dissipation fins 105b sleeved on the outer surface of the heat pipe 105a. The auxiliary component 105 also includes a collection box 105c fixedly connected to the end of the heat pipe 105a, and a connecting pipe 105d connected to the bottom of the collection box 105c. The bottom of the heat dissipation fins 105b is fixedly connected to the surface of the connecting shell 104a, and the bottom of the connecting pipe 105d is connected to a heat absorption box 101.

[0033] It should be noted that there are seven heat pipes 105a and several heat dissipation fins 105b, which are equidistantly mounted on the outer surface of the heat pipes 105a. The arrangement of the heat dissipation fins 105b facilitates the recondensation of gas inside the heat pipes 105a into coolant.

[0034] In use, the device is installed on the component that needs heat dissipation. The heat absorption box 101 absorbs the heat generated by the component during operation and conducts it into the coolant. The coolant evaporates and is evenly dispersed into the five guide shells 103 through the manifold 102. It then enters the connecting shell 104a through the guide shells 103. The steam is slowed down by the obstruction of the small baffle 104d-1, the large baffle 104d-2, and the baffle 104d-3. The gas moves forward in a unidirectional manner, which also initially cools the steam. The initially cooled gas enters the heat pipe 105a through the air guide box 104b. The heat pipe 105a absorbs the temperature of the gas and conducts it to the heat dissipation fins 105b. After the gas is cooled, it condenses back into coolant. The coolant flows into the collection box 105c connected to the heat pipe 105a and returns to the heat absorption box 101 through the connecting pipe 105d below the collection box 105c, forming a cycle.

[0035] In summary, the efficient cooperation between the heat absorption box 101 and the coolant ensures rapid heat transfer and reduces the operating temperature of the components. Secondly, the design of the manifold 102 and the guide shell 103 achieves uniform distribution of the coolant and unidirectional flow of steam, effectively improving heat dissipation uniformity and system stability. Furthermore, the blocking effect of the small baffle 104d-1, the large baffle 104d-2, and the baffle 104d-3 slows down the gas movement speed, achieving initial cooling of the steam and reducing the workload of the heat pipe 105a. Finally, the efficient heat dissipation of the heat pipe 105a and the heat dissipation fins 105b enables the gas to condense rapidly, forming a closed loop, ensuring the continuous and stable operation of the device and long-term heat dissipation effect.

[0036] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0037] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0038] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0039] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An embedded manifold microchannel heat spreader with heat pipe assisted heat spreading, characterized by: include, The heat absorption box (101), the manifold (102) connected to the side wall of the heat absorption box (101), the flow guide shell (103) connected to the end of the manifold (102), the heat dissipation assembly (104) disposed on the side wall of the flow guide shell (103), and the auxiliary assembly (105) disposed on the surface of the heat dissipation assembly (104) for use with the heat dissipation assembly (104).

2. The microchannel heat sink with embedded manifold and heat pipe auxiliary cooling of claim 1, wherein: The heat dissipation assembly (104) includes a connecting shell (104a) connected to the side wall of the air guide shell (103), and an air guide box (104b) connected to the side wall of the connecting shell (104a).

3. The microchannel heat sink with embedded manifolds and heat pipe assisted heat dissipation of claim 2, wherein: The heat dissipation assembly (104) also includes a segment block (104c) fixedly installed on the inner wall of the connecting shell (104a), and a microchannel component (104d) disposed in the inner cavity of the connecting shell (104a) to cooperate with the segment block (104c).

4. The microchannel heat exchanger with embedded manifolds and heat pipe assisted heat removal of claim 3, wherein: The microchannel component (104d) includes a small stop (104d-1) fixedly installed in the inner cavity of the connecting shell (104a), a large stop (104d-2) fixedly installed in the inner wall of the connecting shell (104a), and a baffle (104d-3) fixedly connected to the inner wall of the connecting shell (104a).

5. The microchannel heat sink with embedded manifolds and heat pipe auxiliary cooling of claim 4, wherein: The auxiliary component (105) includes a heat pipe (105a) connected to the top of the air guide box (104b) and heat dissipation fins (105b) sleeved on the outer surface of the heat pipe (105a).

6. The microchannel heat sink with embedded manifolds and heat pipe auxiliary cooling of claim 5, wherein: The auxiliary component (105) also includes a collection box (105c) fixedly connected to the end of the heat pipe (105a) and a connecting pipe (105d) connected to the bottom of the collection box (105c).

7. The microchannel heat exchanger with embedded manifolds and heat pipe assisted heat removal of claim 6, wherein: The bottom of the heat dissipation fin (105b) is fixedly connected to the surface of the connecting shell (104a), and the bottom of the connecting pipe (105d) is connected to the heat absorption box (101).

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