Heat dissipation structure of power device

Abstract

The application provides a heat dissipation structure of an electric power device, and relates to the technical field of heat dissipation of electric power devices. The heat dissipation structure of the electric power device comprises a shell, the inside of the shell is used for mounting an electronic module; a plurality of first heat conduction members, the first heat conduction members are arranged on the outer surface of the shell, adjacent two first heat conduction members form an air guide channel, and the air guide channel extends to at least two adjacent surfaces of the shell; and a blowing member, the blowing member is arranged outside the shell and is used for blowing air into the air guide channel. The heat dissipation structure of the electric power device provided by the application solves the problem that the heat dissipation effect of the electronic module is poor in the actual use of the electric power device in the prior art.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for power equipment, and more particularly to a heat dissipation structure for power equipment. Background Technology

[0002] Electrical devices (such as inverters) typically generate a large amount of heat during operation, and heat dissipation is a crucial aspect of ensuring their stable operation.

[0003] In related technologies, the power device includes a housing, a fan, and an electronic module installed inside the housing, while the fan is installed outside the housing. During operation, the fan blows air onto the housing to dissipate heat from the electronic module.

[0004] However, in actual use, the power equipment does not provide adequate heat dissipation for the electronic modules. Utility Model Content

[0005] This application provides a heat dissipation structure for an electrical device to solve the problem of poor heat dissipation of electronic modules in electrical devices during actual use in the prior art.

[0006] This application provides a heat dissipation structure for an electrical device, comprising:

[0007] The housing, the interior of which is used to house electronic modules;

[0008] Multiple first heat-conducting elements are disposed on the outer surface of the housing, and an air guide channel is formed between two adjacent first heat-conducting elements, the air guide channel extending to at least two adjacent sides of the housing.

[0009] A blower is disposed outside the housing and is used to blow airflow into the air guide channel.

[0010] In one possible implementation, the first heat-conducting element includes a first segment and a second segment connected to each other, the first segment being disposed on the upper surface of the housing and the second segment being disposed on the side surface of the housing.

[0011] In one possible implementation, the air outlet of the blower faces the housing, and the air outlet of the blower is spaced apart from the surface of the housing.

[0012] Multiple first heat-conducting elements are distributed around the blower, so that multiple air guide channels are distributed around the blower.

[0013] In one possible implementation, at least a portion of the air duct is provided with a second heat-conducting element, the extension direction of the second heat-conducting element being consistent with the extension direction of the air duct, the second heat-conducting element dividing the air duct into at least two sub-air ducts.

[0014] In one possible implementation, the height of the first heat-conducting element gradually decreases from the end closer to the blower to the end farther away from the blower.

[0015] In one possible implementation, a cover is also included, which covers a plurality of the first heat-conducting elements, and the cover and two adjacent first heat-conducting elements enclose the air duct channel.

[0016] In one possible implementation, the edge of the cover is inclined toward the outer shell to form an inclined portion, and the edge of the first heat-conducting member away from the outer shell is adapted to the cover so that the height of the first heat-conducting member gradually decreases from the end near the blower to the end away from the blower.

[0017] In one possible implementation, the cover also covers the blower, the cover having a mesh portion corresponding to the blower.

[0018] In one possible implementation, it further includes an air guide ring platform, which is located between the air outlet end of the blower and the housing, and the air guide ring platform is used to guide the airflow blown out by the blower into the air guide channel;

[0019] The air guide ring is connected to the outer casing or the air blowing component.

[0020] In one possible implementation, the housing is provided with at least one support member, and the blower is connected to the support member such that the air outlet of the blower is spaced apart from the surface of the housing.

[0021] This application provides a heat dissipation structure for an electrical device, comprising: a housing; multiple first heat-conducting elements disposed on the outer surface of the housing, with an airflow channel formed between adjacent first heat-conducting elements extending to at least two adjacent sides of the housing; and a blower for blowing airflow into the airflow channel. During operation, the heat generated by the electronic module inside the housing is transferred to the housing and the first heat-conducting elements. The blower then generates airflow, which is blown into the airflow channel to dissipate heat from the housing surface and the first heat-conducting elements, thereby achieving heat dissipation for the electronic module. Simultaneously, the airflow blown into the airflow channel also flows along the channel to at least two adjacent sides of the housing, effectively increasing the contact area between the housing and the airflow, thus increasing the heat dissipation area of ​​the housing and improving the heat dissipation efficiency and effect for the electronic module. This solves the problem of poor heat dissipation for electronic modules in existing electrical devices during actual use. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0023] Figure 1 This is a schematic diagram of a heat dissipation structure for an electrical device provided in an embodiment of this application;

[0024] Figure 2 for Figure 1 Schematic diagram of the installation structure of the first heat-conducting component;

[0025] Figure 3 This is a partial exploded structural diagram of a heat dissipation structure for an electrical device provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100 - Outer shell; 110 - Protrusion;

[0028] 200 - First heat-conducting component; 210 - First section; 220 - Second section;

[0029] 300-Air duct;

[0030] 400 - Blower component; 410 - Support component;

[0031] 500 - Cover part; 510 - Inclined part; 520 - Middle part; 530 - Mesh part;

[0032] 600 - Second heat-conducting component;

[0033] 700-Air guide ring platform.

[0034] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0035] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0036] Electrical devices such as inverters and battery boxes are used. In this embodiment, an inverter is taken as an example. The inverter mainly converts the direct current (DC) output from the photovoltaic modules into alternating current (AC). The converted AC power can be input into the power grid or used to power loads. It can also transform the DC output from the photovoltaic modules to charge the batteries, and convert the AC power from the power grid into DC power to supply the batteries.

[0037] An inverter consists of a housing, a fan, and electronic modules installed inside the housing, such as power semiconductor devices, filters, and transformers. The fan is mounted outside the housing. During operation, the electronic modules generate heat, which is dissipated by the fan blowing air onto one side of the housing.

[0038] However, in actual use, the inverter's fan only blows air onto the side of the casing that corresponds to it, which limits the heat dissipation area on the casing and results in poor heat dissipation for the electronic modules.

[0039] Therefore, this application provides a heat dissipation structure for a power device, including: a housing, the interior of which is used to install an electronic module; a plurality of first heat-conducting elements, each disposed on the outer surface of the housing, with an airflow channel formed between adjacent first heat-conducting elements, extending to at least two adjacent sides of the housing; and a blower, disposed on the exterior of the housing, used to blow airflow into the airflow channel. During operation, the heat generated by the electronic module inside the housing is transferred to the housing and the first heat-conducting elements, and then blown into the airflow channel by the blower to dissipate heat from the housing surface and the first heat-conducting elements, thereby achieving the purpose of heat dissipation for the electronic module. Simultaneously, the airflow blown into the airflow channel also flows along the airflow channel to at least two adjacent sides of the housing, effectively increasing the contact area between the housing and the airflow, thereby increasing the heat dissipation area of ​​the housing, improving the heat dissipation efficiency and effect for the electronic module, and solving the problem of poor heat dissipation for electronic modules in existing power devices during actual use.

[0040] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0041] like Figure 1 and Figure 2 As shown in the embodiment of this application, a heat dissipation structure for an electrical device includes:

[0042] The housing 100 has an interior for mounting electronic modules.

[0043] Multiple first heat-conducting elements 200 are disposed on the outer surface of the housing 100, and an air guide channel 300 is formed between two adjacent first heat-conducting elements 200, which extends to at least two adjacent sides of the housing 100.

[0044] The blower 400 is disposed on the outside of the housing 100 and is used to blow air into the air guide channel 300.

[0045] It should be noted that the shape of the housing 100 is not limited. In practice, the electronic module can be installed inside the housing 100 and made to contact the inner surface of the housing 100 to ensure good heat conduction.

[0046] The first heat-conducting element 200 can be a heat dissipation fin or a heat dissipation plate, and its specific shape is not limited. Multiple first heat-conducting elements 200 are spaced apart on the outer surface of the housing 100, and each first heat-conducting element 200 extends on at least two adjacent surfaces of the housing 100, forming an airflow channel 300 between adjacent first heat-conducting elements 200, and the airflow channel 300 extends to at least two adjacent surfaces of the housing 100. The first heat-conducting elements 200 can be connected to the housing 100 by welding, bonding, integral molding, or other means.

[0047] The first heat-conducting element 200 is made of a material with good thermal conductivity, such as copper, aluminum, or graphite. The entire outer shell 100 can be made of a material with good thermal conductivity, such as copper, aluminum, or graphite, or one end of the outer shell 100 corresponding to the first heat-conducting element 200 can be made of a material with good thermal conductivity, such as copper, aluminum, or graphite, to ensure good heat conduction and facilitate the transfer of heat generated by the electronic module to the outside through the outer shell 100 and the first heat-conducting element 200.

[0048] The blower 400 can be a fan and there is no limitation on the model. The blower 400 is disposed on the outside of the housing 100 and is used to blow air into the airflow channel 300. The blower 400 can be connected to the housing 100 by screwing, fastening, welding or other means.

[0049] Understandably, when the blower 400 blows air into the airflow channel 300, the airflow will flow over the corresponding surface of the outer casing 100 and the first heat-conducting component 200, and then carry away some heat and flow out of the airflow channel 300, thereby indirectly achieving the purpose of heat dissipation for the electronic module.

[0050] During operation, the heat generated by the electronic module inside the housing 100 is transferred to the housing 100 and the first heat-conducting component 200. Subsequently, an airflow is generated by the blower 400 and blown into the air guide channel 300 to dissipate heat from the surface of the housing 100 and the first heat-conducting component 200, thereby achieving the purpose of cooling the electronic module. Simultaneously, the airflow blown into the air guide channel 300 also flows along the air guide channel 300 to at least two adjacent surfaces of the housing 100, effectively increasing the contact area between the housing 100 and the airflow, thus increasing the heat dissipation area of ​​the housing 100 and improving the heat dissipation efficiency and effect on the electronic module. This solves the problem of poor heat dissipation of electronic modules in existing power devices during actual use.

[0051] like Figure 1 and Figure 2 As shown, in some embodiments, a cover 500 is also included, which covers a plurality of first heat-conducting elements 200, and the cover 500 and two adjacent first heat-conducting elements 200 enclose an air duct 300.

[0052] In this embodiment, the cover 500 can be a cover plate, and its specific shape and material are not limited. The cover 500 covers the plurality of first heat-conducting elements 200, so that the cover 500 provides better protection for the first heat-conducting elements 200. The cover 500 can be fastened to the outer shell 100 by screwing, snapping, welding or other means.

[0053] Based on this, the outer surface of the outer casing 100, the inner surface of the cover 500, and the adjacent two first heat-conducting elements 200 together form an air guide channel 300. One end of the air guide channel 300 extends towards the blower 400, and the other end extends to the outside of the cover 500, so as to facilitate the smooth discharge of the heated airflow to the outside of the cover 500. In addition, the cover 500 can also prevent external debris from getting stuck in the air guide channel 300, reducing the possibility of blockage in the air guide channel 300.

[0054] In this embodiment, the blower 400 is correspondingly disposed on the upper surface of the housing 100, the air outlet of the blower 400 faces the housing 100, and the air outlet of the blower 400 is spaced apart from the upper surface of the housing 100.

[0055] Multiple first heat-conducting elements 200 are distributed around the blower 400 so that multiple air-guiding channels 300 are distributed around the blower 400. Furthermore, a portion of the first heat-conducting elements 200 extends on the surface of the housing 100, and another portion extends on the side surface of the housing 100, thereby enabling the formed air-guiding channels 300 to extend to the upper surface and side surface of the housing 100.

[0056] When the blower 400 is working, the airflow blown onto the surface of the housing 100 disperses to the surroundings and enters the air guide channel 300, and then is output to the outside of the cover 500 along the air guide channel 300. During this process, the airflow carries away the heat from the surface of the housing 100 and the first heat-conducting component 200, thereby achieving the purpose of heat dissipation for the electronic module.

[0057] Specifically, the first heat-conducting element 200 includes a first segment 210 and a second segment 220 that are connected to each other. The first segment 210 and the second segment 220 can be integrally formed or connected to each other by welding, bonding or other means. The first segment 210 can be disposed on the upper surface of the outer shell 100 by welding, bonding, integral forming or other means, and the second segment 220 can be disposed on the side surface of the outer shell 100 by welding, bonding, integral forming or other means.

[0058] Thus, the formed air guide channel 300 can extend to the upper surface and side surface of the housing 100. It can be understood that the distribution of multiple first heat conduction elements 200 around the blower 400 will cause the second segments 220 on the multiple first heat conduction elements 200 to be distributed on the side surfaces of the housing 100 in multiple directions (i.e., the four sides adjacent to the upper surface of the housing 100).

[0059] In other words, in addition to extending on the upper surface of the housing 100, multiple air ducts 300 also extend on multiple side surfaces of the housing 100, greatly increasing the contact area between the surface of the housing 100 and the airflow, and improving the heat dissipation effect.

[0060] like Figure 2 and Figure 3 As shown, in some embodiments, the heat dissipation structure of the power device further includes an air guide ring 700, which is located between the air outlet end of the blower 400 and the housing 100. The air guide ring 700 is used to guide the airflow blown out by the blower 400 into the air guide channel 300.

[0061] The air guide ring 700 is connected to the outer casing 100 or the blower 400.

[0062] In this embodiment, the air guide ring platform 700 has a ring structure that is smaller at the top and larger at the bottom. The air guide ring platform 700 is disposed on the upper surface of the housing 100, and the air guide ring platform 700 corresponds to the blower 400, so that the air outlet end of the blower 400 can coaxially face the air guide ring platform 700.

[0063] Understandably, multiple first heat-conducting elements 200 are distributed around the air guide ring platform 700, resulting in multiple air guide channels 300 being distributed around the air guide ring platform 700. That is to say, when the blower 400 is working, the airflow generated will first blow onto the air guide ring platform 700, and then be stably guided into each air guide channel 300 by the inclined side wall of the air guide ring platform 700, ensuring that the airflow enters the air guide channel 300 relatively smoothly.

[0064] In practice, the air guide ring 700 can be integrally formed, welded, or otherwise installed on the upper surface of the housing 100. The air guide ring 700 can be a solid structure or a hollow structure. Of course, the air guide ring 700 can also be connected to the blower 400 by screwing, so that the air guide ring 700 is fixed to the air outlet side of the blower 400.

[0065] To facilitate the installation of the blower 400, in some embodiments, the housing 100 is provided with at least one support member 410, and the blower 400 is connected to the support member 410 so that the air outlet end of the blower 400 is spaced apart from the surface of the housing 100.

[0066] The support member 410 can be columnar, block-shaped, plate-shaped, or other shaped structures. There can be one, two, four, or other quantities of support members 410, and there are no restrictions on their shape or quantity.

[0067] In this embodiment, the support member 410 has a columnar structure, and there are four of them, which are distributed around the air guide ring platform 700. The support member 410 can be connected to the upper surface of the outer shell 100 by integral molding, welding, screwing, bonding or other means.

[0068] At this time, the blower 400 can be connected to the support 410 by screwing, bonding, snapping, or other means. Thus, the support 410 mounts the blower 400 on the side of the air guide ring 700 away from the outer shell 100, ensuring the stability of the blower 400 during use.

[0069] During operation, because multiple first heat-conducting elements 200 are distributed around the blower 400, the distance between two adjacent first heat-conducting elements 200 at the end away from the blower 400 will be greater than the distance between two adjacent first heat-conducting elements 200 at the end closer to the blower 400. Consequently, when the airflow reaches the area of ​​the air guide channel 300 away from the end of the blower 400, the airflow velocity will gradually decrease.

[0070] like Figure 2 As shown, in some embodiments, at least a portion of the air duct 300 is provided with a second heat-conducting element 600, the extension direction of the second heat-conducting element 600 is consistent with the extension direction of the air duct 300, and the second heat-conducting element 600 divides the air duct 300 into at least two sub-air ducts.

[0071] Specifically, the second heat-conducting component 600 is made of materials with good thermal conductivity such as copper, aluminum, and graphite. The second heat-conducting component 600 can be connected to the outer shell 100 by welding, bonding, integral molding, or other methods. The second heat-conducting component 600 is located inside the air guide channel 300, and the second heat-conducting component 600 is located at the end of the air guide channel 300 away from the blower 400.

[0072] Therefore, during operation, the second heat-conducting component 600 can also transfer the heat generated by the electronic module to the outside, and then dissipate it under the action of airflow, further increasing the heat dissipation area. In addition, the second heat-conducting component 600 can also divide the airflow channel 300 into two sub-airflow channels, effectively increasing the airflow velocity when passing through this area, which helps to improve the heat transfer efficiency.

[0073] In this embodiment, the upper surface of the outer casing 100 is divided into a left region and a right region along its length. The blower 400 is located in the left region. Since the first heat-conducting element 200 extending into the right region is longer, the corresponding air guide channel 300 is also longer, and the diameter of the end furthest from the blower 400 is larger. Therefore, multiple second heat-conducting elements 600 are located in the right region, dividing the corresponding air guide channel 300 into two sub-air guide channels to ensure that the airflow has a better velocity.

[0074] like Figure 1 and Figure 2 As shown, in some embodiments, the height of the first heat-conducting element 200 gradually decreases from the end closer to the blower element 400 to the end farther away from the blower element 400.

[0075] This allows the height of the air guide channel 300 formed by the first heat-conducting element 200 to gradually decrease from the end closer to the blower 400 to the end farther away from the blower 400. Based on the Venturi effect, this effectively increases the airflow velocity as it passes through the air guide channel 300, thus helping to improve heat transfer efficiency.

[0076] like Figure 1 and Figure 2As shown, in some embodiments, the edge of the cover 500 is inclined toward the housing 100 to form an inclined portion 510, and the edge of the first heat-conducting member 200 away from the housing 100 is adapted to the cover 500 so that the height of the first heat-conducting member 200 gradually decreases from the end near the blower 400 to the end away from the blower 400.

[0077] In this embodiment, the cover 500 is a plate-shaped structure. The cover 500 includes a middle part 520 and an inclined part 510. The cover 500 covers the upper surface of the outer shell 100, and the extension direction of the middle part 520 is parallel to the extension direction of the corresponding surface of the outer shell 100. The edge of the cover 500 is inclined toward the outer shell 100 to form the inclined part 510, and the inclined part 510 is arranged around the middle part 520.

[0078] In practice, the middle part 520 and the inclined part 510 can be integrally formed, or the middle part 520 and the inclined part 510 can be connected by welding, bonding or other means.

[0079] At this time, the cover 500 simultaneously covers the first heat-conducting element 200, the second heat-conducting element 600, and the blower element 400. Specifically, the middle portion 520 covers the blower element 400, and the inclined portion 510 covers the first heat-conducting element 200 and the second heat-conducting element 600.

[0080] Furthermore, the edges of the first heat-conducting element 200 and the second heat-conducting element 600 at the ends away from the outer casing 100 are adapted to the shape of the inclined portion 510 of the cover 500, so that the height of the first heat-conducting element 200 and the second heat-conducting element 600 gradually decreases from the end near the blower 400 to the end away from the blower 400, thereby effectively increasing the airflow velocity when passing through the air guide channel 300, which helps to improve the heat transfer efficiency.

[0081] Additionally, the cover 500 has a mesh portion 530, which corresponds to the blower 400. Specifically, the area on the middle portion 520 corresponding to the blower 400 is configured with a grid structure to form the mesh portion 530.

[0082] This design ensures that the cover 500 provides better protection for the blower 400, while the mesh portion 530 prevents obstruction of the airflow into the blower 400, thus ensuring the effective operation of the blower 400.

[0083] At the same time, the inclined portion 510 on the cover 500 also has a better guiding effect on the airflow in the air guide channel 300 corresponding to the first section 210, so that when the airflow is output from the air guide channel 300 corresponding to the first section 210, it has a downward flow tendency, which facilitates the airflow to enter the air guide channel 300 corresponding to the second section 220, and facilitates heat dissipation from the side of the outer shell 100.

[0084] In other embodiments, the cover 500 may be configured as a flat plate structure. In this case, a plurality of inclined protrusions are provided on the side of the cover 500 facing the outer shell 100. The protrusions are inserted into the air guide channel 300 to form the air guide channel 300 with a structure in which the height gradually decreases from the end near the blower 400 to the end away from the blower 400.

[0085] like Figure 2 As shown, during implementation, the upper end of the outer casing 100 can be protruded outward to form several protrusions 110 according to actual needs, so as to avoid the electronic modules installed inside the outer casing 100.

[0086] In summary, the heat dissipation structure for a power device provided in this application allows the heat generated by the electronic module inside the housing 100 to be transferred to the housing 100 and the first heat-conducting component 200 during operation. Subsequently, an airflow is generated by the blower 400 and blown into the air guide channel 300 to dissipate heat from the surface of the housing 100 and the first heat-conducting component 200, thereby achieving the purpose of heat dissipation for the electronic module. Simultaneously, the airflow blown into the air guide channel 300 also flows along the air guide channel 300 to at least two adjacent surfaces of the housing 100, effectively increasing the contact area between the housing 100 and the airflow, thereby increasing the heat dissipation area of ​​the housing 100 and improving the heat dissipation efficiency and effect for the electronic module. This solves the problem of poor heat dissipation for the electronic module in existing power devices during actual use.

[0087] Finally, it should be noted that other embodiments of this utility model will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This utility model is intended to cover any variations, uses, or adaptations of this utility model that follow the general principles of this utility model and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this utility model is limited only by the appended claims.

Claims

1. A heat dissipation structure for an electrical device, characterized in that, include: A housing (100), the interior of which is used to install electronic modules; A plurality of first heat-conducting elements (200) are disposed on the outer surface of the housing (100) and extend on at least two adjacent surfaces of the housing (100). An air duct (300) is formed between two adjacent first heat-conducting elements (200) and extends to at least two adjacent surfaces of the housing (100). A blower (400) is disposed outside the housing (100) and is used to blow airflow into the air guide channel (300).

2. The heat dissipation structure of the power device according to claim 1, characterized in that, The first heat-conducting element (200) includes a first segment (210) and a second segment (220) connected to each other. The first segment (210) is disposed on the upper surface of the housing (100), and the second segment (220) is disposed on the side surface of the housing (100).

3. The heat dissipation structure of the power device according to claim 1, characterized in that, The air outlet of the blower (400) faces the housing (100), and the air outlet of the blower (400) is spaced apart from the surface of the housing (100). A plurality of the first heat-conducting elements (200) are distributed around the blower (400) such that a plurality of the air guide channels (300) are distributed around the blower (400).

4. The heat dissipation structure of the power device according to claim 1, characterized in that, At least a portion of the air duct (300) is provided with a second heat-conducting element (600), the extension direction of the second heat-conducting element (600) is consistent with the extension direction of the air duct (300), and the second heat-conducting element (600) divides the air duct (300) into at least two sub-air ducts.

5. The heat dissipation structure of the power device according to any one of claims 1-4, characterized in that, The height of the first heat-conducting element (200) gradually decreases from the end closer to the blower (400) to the end farther away from the blower (400).

6. The heat dissipation structure of the power device according to claim 5, characterized in that, It also includes a cover (500) that covers a plurality of the first heat-conducting elements (200), and the cover (500) and two adjacent first heat-conducting elements (200) enclose the air duct (300).

7. The heat dissipation structure of the power device according to claim 6, characterized in that, The edge of the cover (500) is inclined toward the outer shell (100) to form an inclined portion (510), and the edge of the first heat-conducting member (200) away from the outer shell (100) is adapted to the cover (500) so that the height of the first heat-conducting member (200) gradually decreases from the end near the blower (400) to the end away from the blower (400).

8. The heat dissipation structure of the power device according to claim 6, characterized in that, The cover (500) also covers the blower (400), and the cover (500) has a mesh portion (530) corresponding to the blower (400).

9. The heat dissipation structure of the power device according to claim 3, characterized in that, It also includes an air guide ring platform (700), which is located between the air outlet end of the blower (400) and the outer shell (100). The air guide ring platform (700) is used to guide the airflow blown out by the blower (400) into the air guide channel (300). The air guide ring (700) is connected to the outer shell (100) or the blower (400).

10. The heat dissipation structure of the power device according to claim 9, characterized in that, The housing (100) is provided with at least one support member (410), and the blower (400) is connected to the support member (410) so that the air outlet end of the blower (400) is spaced apart from the surface of the housing (100).

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