Heat dissipation assembly and power supply device

Abstract

A heat dissipation assembly and a power supply device, the heat dissipation assembly is used for the power supply device, the heat dissipation assembly includes a heat dissipation piece and a heat dissipation plate, the heat dissipation piece has a flow channel, the side wall of the heat dissipation piece has an opening, the opening is communicated with the flow channel and the outside, the heat dissipation plate is arranged at the opening and is used for closing the opening, the surface of the heat dissipation plate facing away from the flow channel is used for being connected with the heat dissipation piece of the power supply device in a heat conductive manner.The heat dissipation assembly in the utility model can dissipate heat for the heat dissipation piece such as power device in time, improves heat exchange efficiency and ensures heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of power supply technology, specifically to a heat dissipation component and a power supply device. Background Technology

[0002] In recent years, with the rapid development of new energy electric vehicles, energy conservation, environmental protection, safety, and lightweighting will become the main development directions for future new energy electric vehicles. Among them, the power supply unit in a new energy electric vehicle has the ability to safely and automatically fully charge the electric vehicle's power battery. Based on the data provided by the Battery Management System (BMS), the power supply unit can dynamically adjust the charging current or voltage parameters, execute corresponding actions, and complete the charging process.

[0003] Power devices in a power supply system generate a lot of heat when they are working, and they need to be cooled down in a timely manner. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation component and a power supply device, wherein the heat dissipation component can dissipate heat from the components to be cooled in the power supply device in a timely manner.

[0005] To achieve the objectives of this utility model, the following technical solution is provided: In a first aspect, the present invention provides a heat dissipation assembly for a power supply device. The heat dissipation assembly includes a heat sink and a heat sink plate. The heat sink has a flow channel and an opening on its side wall, the opening connecting the flow channel to the outside. The heat sink plate is disposed at the opening and is used to close the opening. The surface of the heat sink plate facing away from the flow channel is used for a heat-conductive connection with the heat-dissipating component of the power supply device.

[0006] In one embodiment, the heat sink has a connecting groove at the position corresponding to the opening, and at least a portion of the heat sink is received in the connecting groove and connected to the bottom wall of the connecting groove.

[0007] In one embodiment, the heat dissipation assembly further includes a flow deflector, which is disposed corresponding to the heat dissipation plate and is housed in the flow channel.

[0008] In one embodiment, the baffle is connected and fixed to the heat sink.

[0009] In one embodiment, the turbulence-disrupting element includes a plurality of turbulence-disrupting protrusions, which are staggered and all protrude from the surface of the connecting portion facing away from the heat sink.

[0010] In one embodiment, the turbulence protrusions enclose a flow cavity, the flow cavity is connected to the flow channel, and the flow cavities of the plurality of turbulence protrusions are connected to each other.

[0011] In one embodiment, the heat dissipation assembly further includes a connector and a water nozzle. The connector is sleeved on the outer periphery of the water nozzle, and the connector is connected and fixed to the heat dissipation assembly. The water nozzle is in communication with the heat dissipation assembly.

[0012] Secondly, the present invention also provides a power supply device, including a power device and a heat dissipation component as described in any one of the various embodiments of the first aspect, wherein the power device is thermally conductively connected to the surface of the heat sink facing away from the flow channel.

[0013] In one embodiment, the power device is attached to the surface of the heat sink facing away from the flow channel, or the power device is soldered to the surface of the heat sink facing away from the flow channel.

[0014] In one embodiment, the power device is a full-bridge power module and / or a half-bridge power module.

[0015] By setting up heat sinks and heat sinks, the heat sinks the opening of the heat sink, and the surface of the heat sink facing away from the flow channel is thermally conductively connected to the heat sink of the power device. This enables timely heat dissipation of power devices and other heat sinks, improving heat exchange efficiency and ensuring heat dissipation effect. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a perspective view of a partial structure of a power supply device according to one embodiment; Figure 2 This is an exploded view of a portion of the structure of a power supply device according to one embodiment; Figure 3 This is a cross-sectional schematic diagram of a partial structure of a power supply device according to one embodiment; Figure 4 This is a perspective view of a spoiler component according to one embodiment.

[0018] Explanation of reference numerals in the attached figures: 1000-Power supply unit, 100-Heat dissipation assembly, 10-Heat dissipation component, 11-Flow channel, 12-Opening, 13-First sidewall, 131-Connecting groove, 14-Second sidewall, 20-Heat dissipation plate, 30-Break current component, 31-Break current protrusion, 311-Flow cavity, 32-Connecting part, 41-Connecting component, 42-Water nozzle, 200-Power device. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0021] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0022] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0023] Please refer to Figures 1 to 4 This utility model provides a power supply device 1000, including a power device 200 and a heat dissipation component 100 in this utility model embodiment, wherein the power device 200 and the heat dissipation component 100 are connected by thermal conductivity.

[0024] The power supply device 1000 is used to supply power to electrical devices, which can be vehicles, portable devices, ships, spacecraft, power tools, etc. Vehicles can be gasoline-powered vehicles, natural gas-powered vehicles, or new energy vehicles. New energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. This embodiment of the invention does not impose any special limitations on the aforementioned electrical devices. Taking a vehicle as an example, the power supply device 1000 is installed inside the vehicle, and it can be located at the bottom, front, or rear of the vehicle. The power supply device 1000 can be used to supply power to the vehicle. For example, the power supply device 1000 can supply power to electrical components in the vehicle, including but not limited to headlights, display instruments, vehicle air conditioning, audio systems, etc., and these electrical components are carried on the vehicle body.

[0025] Optionally, the power supply unit 1000 can be connected and fixed to the vehicle body by means of welding, bonding, snap-fitting, screwing, riveting, magnetic connection, etc., without limitation. The power supply unit 1000 can output DC power to power the electrical devices.

[0026] Optionally, the vehicle may also include a power battery, and the power supply unit 1000 may be an on-board charger, converter, or on-board charger integration device, thereby enabling the power supply unit 1000 to convert AC input electrical signals and high-voltage DC electrical signals to each other, or the power supply unit to convert DC high-voltage electrical signals and low-voltage DC electrical signals to each other, thereby enabling the power supply to the power battery or low-voltage load.

[0027] Please refer to Figures 1 to 3 This application provides a power supply device 1000, including a housing (not shown), a power device 200, and a heat dissipation component 100 as described in this application embodiment.

[0028] The housing has a receiving cavity in which the heat dissipation assembly 100 and the power device 200 are both housed.

[0029] The shell can be made of materials with high structural strength, such as metals, high-strength plastics, and ceramics. Metals include aluminum, aluminum alloys, magnesium alloys, iron, and iron alloys. The shell can be a one-piece structure, meaning it is manufactured using a single molding process, such as stamping or casting, without limitation. Alternatively, the shell can be a modular structure, with its parts connected and fixed by welding, bonding, snap-fitting, or screwing.

[0030] In one embodiment, the housing includes a bottom wall and side peripheral walls, the side peripheral walls being connected to the periphery of the bottom wall and together with the bottom wall enclosing a receiving cavity.

[0031] The bottom wall and side walls can be an integral or separate structure, and can be connected and fixed by welding, bonding, snap-fitting, screwing, etc. Optionally, the bottom wall can be circular, rectangular, square, polygonal, etc., without limitation. The side walls connect to the bottom wall on all four sides and together with the bottom wall form a cylindrical, prismatic, etc., shape, without limitation.

[0032] Optionally, the housing also includes a cover (not shown in the figure), which is connected to the end of the side peripheral wall away from the bottom wall and closes the opening of the receiving cavity.

[0033] The heat dissipation assembly 100 is used to flow a cooling medium to exchange heat with the heat-generating device. In some embodiments, the heat dissipation assembly 100 is detachably connected to the housing, or the heat dissipation assembly 100 and the housing can be fixed by embedding or screws; the heat dissipation assembly 100 and the housing can also be integrally formed, and there are no specific limitations. Optionally, the heat dissipation assembly 100 is a three-dimensional water channel. In some embodiments, the three-dimensional water channel can be a U-shaped three-dimensional water channel, multiple U-shaped three-dimensional water channels in parallel or series, an S-shaped water channel, etc., and the cooling medium can be water, ethylene glycol solution, mineral oil, fluorinated liquid, deionized water, etc., and there are no specific limitations.

[0034] The power device 200 is housed in a housing cavity and is thermally conductively connected to the heat dissipation assembly 100. The power device 200 can be a metal oxide semiconductor (MOS), a full-bridge power module, or a half-bridge power module, or any other feasible power component.

[0035] In one embodiment, the power device 200 is a full-bridge power module and / or a half-bridge power module.

[0036] A full-bridge power module is a power conversion unit consisting of four power switching devices (e.g., four field-effect transistors), while a half-bridge power module is a power conversion unit consisting of two power switching devices (e.g., two field-effect transistors). Both can achieve DC-AC conversion or voltage regulation by alternating conduction of multiple power switching devices.

[0037] Taking the power device 200 as a full-bridge power module as an example, in a specific embodiment, the full-bridge power module includes a first circuit bridge arm, a second circuit bridge arm, and a first capacitor bridge arm; wherein, the first circuit bridge arm includes a first upper-side chip unit and a first lower-side chip unit, the first end of the first upper-side chip unit and the second end of the first lower-side chip unit are electrically connected through a metal structure, the second circuit bridge arm includes a second upper-side chip unit and a second lower-side chip unit, the first end of the second upper-side chip unit and the second end of the second lower-side chip unit are electrically connected through a metal structure, and the first circuit bridge arm and the second circuit bridge arm are arranged asymmetrically. The second terminals of both the first upper-side MOSFET chip unit and the second terminal of both upper-side MOSFET chip units are electrically connected to the DC positive terminal via a metal structure. The first terminals of both lower-side MOSFET chip units are electrically connected to the DC negative terminal via a metal structure. The first terminal of the first capacitor bridge arm is coupled to the DC positive terminal, and the second terminal of the first capacitor bridge arm is coupled to the DC negative terminal. The first capacitor bridge arm is positioned close to the first upper-side MOSFET chip unit and the first lower-side MOSFET chip unit to reduce the commutation loop between them. This configuration reduces the package size of the power module while ensuring the overall commutation performance of the circuit.

[0038] The power device 200 can be, but is not limited to, a switching element that serves as the power supply device 1000. Understandably, the power device 200 can also be used to control the magnitude of the current, or as a variable resistor, or as a constant current source, etc. The function of the power module should not be construed as a limitation on the power supply device 1000 provided in this embodiment.

[0039] The number of power devices 200 can be, but is not limited to, one, two, three, or more. The number of power devices 200 can be adjusted according to the actual application requirements of the power supply device 1000. It is understood that the number of power devices 200 should not be a limitation on the power supply device 1000 provided in this embodiment. In the schematic diagram of this embodiment, an example of multiple power devices 200 is used. Optionally, when there are multiple power devices 200, the multiple power devices 200 can be disposed on the same side or opposite sides of the heat dissipation assembly 100.

[0040] The power device 200 can be, but is not limited to, attached to the heat dissipation assembly 100, so that the heat generated by the power device 200 during operation can be transferred to the heat dissipation assembly 100 for effective heat dissipation. In some embodiments, the power device 200 can also be at a certain distance from the heat dissipation assembly 100, with other heat dissipation media conducting the heat from the power device 200 to the heat dissipation assembly 100 for heat dissipation.

[0041] The power device 200 can be, but is not limited to, attached to the side of the heat dissipation assembly 100, so that the heat generated by the power device 200 during operation can be transferred to the heat dissipation assembly 100 for effective heat dissipation. In some embodiments, the power device 200 can also be attached to the top surface of the heat dissipation assembly 100, and the heat of the power device 200 can be conducted to the heat dissipation assembly 100 by a heat dissipation medium for heat dissipation.

[0042] The power supply device 1000 in this embodiment of the application, by setting a heat dissipation component 100, can dissipate the heat generated by the power device 200 when it is working in a timely manner, thereby improving the heat exchange efficiency.

[0043] The heat dissipation component 100 in the embodiments of this application will be described in detail below.

[0044] Please refer to Figures 1 to 3 This application provides a heat dissipation component 100 for a power supply device 1000. The heat dissipation component 100 includes a heat sink 10 and a heat sink 20. The heat sink 10 has a flow channel 11 and an opening 12 on the side wall of the heat sink 10, which connects the flow channel 11 to the outside.

[0045] The heat sink 10 is used to flow a cooling medium to exchange heat with the heat-generating device. In some embodiments, the heat sink 10 is detachably connected to the housing, for example, by means of inlay casting or screw fastening; the heat sink 10 and the housing may also be integrally formed, and there is no specific limitation.

[0046] The heat sink 10 can be made of a material with high structural strength, specifically metal, high-strength plastic, ceramic, etc. Metal materials include aluminum, aluminum alloys, magnesium alloys, iron, and iron alloys. The heat sink 10 can be a one-piece structure, meaning it is manufactured using a single molding process, such as stamping or casting, without limitation. Alternatively, the heat sink 10 can be a modular structure, with its components connected and fixed by welding, bonding, snap-fitting, screwing, or other methods.

[0047] In one embodiment, the heat sink 10 is a three-dimensional water channel. In some embodiments, the three-dimensional water channel can be a U-shaped three-dimensional water channel, multiple U-shaped three-dimensional water channels in parallel or series, an S-shaped water channel, etc., and the cooling medium can be water, ethylene glycol solution, mineral oil, fluorinated liquid, deionized water, etc., without specific limitations. Optionally, the shape of the opening 12 can be square, circular, triangular, elliptical, regular polygonal, irregular shape, etc., without limitation.

[0048] Optional, such as Figure 3As shown, the heat sink 10 includes a first sidewall 13 and a second sidewall 14 that are arranged opposite to and spaced apart from each other. A flow channel 11 is formed between the first sidewall 13 and the second sidewall 14. The first sidewall 13 is closer to the outer side of the heat sink 10 than the second sidewall 14. Optionally, the opening 12 penetrates through the first sidewall 13 or the second sidewall 14, that is, the heat sink 20 can be disposed on the outer sidewall of the heat sink 10 or on the inner sidewall of the heat sink 10, without limitation.

[0049] The heat sink 20 is disposed at the opening 12 and is used to close the opening 12. The surface of the heat sink 20 facing away from the flow channel 11 is used for thermally conductive connection with the heat-dissipating component 10 of the power supply device 1000.

[0050] The heat sink 20 can be made of a material with high structural strength and high thermal conductivity, specifically a metal, high-strength plastic, ceramic, etc. Metal materials include aluminum, aluminum alloys, magnesium alloys, iron, and iron alloys. Optionally, the shape of the heat sink 20 can be adapted to the shape of the opening 12, and there are no specific limitations.

[0051] Optionally, the surface of the heat sink 20 facing away from the flow channel 11 can be thermally conductively connected to the power device 200. This connection can be direct or indirect, and the connection method can be welding, bonding, snap-fitting, screwing, riveting, magnetic connection, etc., without limitation. With this configuration, the heat sink 20 can dissipate heat from the power device 200, improving heat exchange efficiency and ensuring effective heat dissipation.

[0052] In some other embodiments, the surfaces of the heat sink 10 and the heat sink 20 facing away from the flow channel 11 can also be thermally connected to other heat sink components 10 of the power supply device 1000 other than the power device 200. These other heat sink components 10 can be circuit boards, batteries, transformers, inductors, capacitors, etc., without limitation.

[0053] The heat dissipation assembly 100 in this embodiment of the application, by setting a heat sink 10 and a heat sink 20, the heat sink 20 closes the opening 12 of the heat sink 10, and the surface of the heat sink 20 facing away from the flow channel 11 is thermally conductively connected to the heat sink 10 of the power device 1000, can dissipate heat from the heat sink 10 of the power device 200 in a timely manner, improve heat exchange efficiency, and ensure heat dissipation effect.

[0054] In one embodiment, the power device 200 is attached to the surface of the heat sink 20 facing away from the flow channel 11, or the power device 200 is soldered to the surface of the heat sink 20 facing away from the flow channel 11.

[0055] The power device 200 can be adhered to the surface of the heat sink 20 via a thermally conductive adhesive layer. This adhesive layer can be made of a material that combines thermal conductivity and adhesion, such as silicone thermally conductive adhesive (based on silicone resin with added thermally conductive fillers like boron nitride and alumina), epoxy resin thermally conductive adhesive (epoxy resin substrate + fillers like silver flakes and alumina, cross-linked with a curing agent), or polyurethane thermally conductive adhesive (polyurethane prepolymer + thermally conductive fillers such as aluminum hydroxide and graphene), etc. Specific applications are not limited. The thermally conductive adhesive layer achieves both fixation and heat dissipation for the power device 200, eliminating the need for additional fixing structures, resulting in a simple structure and easy operation.

[0056] Alternatively, the power device 200 can be fixed to the heat sink 20 by welding. Since the thermal conductivity of commonly used solders (such as tin-lead alloys and silver-copper alloys) is much higher than that of air and ordinary adhesives, and the heat sink 20 itself is also an excellent thermal conductor, welding can create a low thermal resistance path. Furthermore, welding the power device 200 to the heat sink 20 eliminates the contact gap between them, avoiding air thermal resistance.

[0057] Alternatively, the power device 200 can be connected to the heat sink 20 via a spring-loaded tab. The spring-loaded tab can be of any shape and material feasible in the art, without limitation. By providing the spring-loaded tab, the spring-loaded tab can apply a pressing force to the power device 200 toward the heat sink 20, so that the power device 200 is in close contact with the heat sink 20, which facilitates the heat sink 20 in conducting the heat generated by the power device 200.

[0058] Alternatively, any other feasible heat-conducting connection method can be used between the power device 200 and the heat sink 20, without any specific restrictions.

[0059] With this configuration, the power device 200 is placed on the surface of the heat sink 20 facing away from the opening 12. The heat sink 20 is then connected to the heat sink 10 to achieve the functions of fixing and heat dissipation of the power device 200. There is no need to use an additional structure to install the power device 200, which can save installation space, simplify the process, and reduce costs.

[0060] In one implementation, such as Figure 2 and Figure 3 As shown, the heat sink 10 has a connecting groove 131 at the position corresponding to the opening 12. At least a portion of the heat sink 20 is accommodated in the connecting groove 131 and connected to the bottom wall of the connecting groove 131.

[0061] Optionally, the heat sink 20 is disposed at the connecting groove 131, and the heat sink 20 and the connecting groove 131 are detachably connected. The connection method can be adhesive, snap-fit, screw, riveting, magnetic connection, etc., without limitation. Optionally, the opening 12 penetrates the bottom wall of the connecting groove 131, and the heat sink 20 is connected to the bottom wall of the connecting groove 131, thus sealing the opening 12. Optionally, when the heat sink 20 seals the opening 12, the surface of the heat sink 20 facing the inner wall of the connecting groove 131 also engages with the inner wall of the connecting groove 131, which can improve the sealing performance of the heat dissipation assembly 100.

[0062] Optionally, the surface of the heat sink 20 facing away from the flow channel 11 protrudes from the surface of the first sidewall 13 facing away from the second sidewall 14, or the surface of the heat sink 20 facing away from the flow channel 11 is flush with the surface of the first sidewall 13 facing away from the second sidewall 14, without limitation.

[0063] With this configuration, the power device 200 can be installed on the heat sink 20 first, and then connected to the bottom wall of the connecting groove 131. The assembly of the power device 200 and the sealing of the heat sink 10 are achieved through the heat sink 20, without the need for additional structures, which simplifies the manufacturing process and saves installation space. In addition, when the power device 200 needs to be replaced or repaired, only the heat sink 20 needs to be removed to replace the power device 200. The same applies when the heat sink 10 needs to be replaced or repaired, without the need to replace the entire heat sink assembly 100, thus saving costs.

[0064] In one implementation, such as Figures 2 to 4 As shown, the heat dissipation assembly 100 also includes a flow deflector 30, which is disposed correspondingly to the heat dissipation plate 20 and is housed in the flow channel 11.

[0065] The turbulence-inducing element 30 is used to change the fluid shape, causing the water flow to generate spiral motion or turbulence, increasing the contact area and mixing degree between the fluid and the pipe wall, thereby improving heat transfer efficiency. Optionally, the turbulence-inducing element 30 is connected to the heat sink 10 and / or the heat sink plate 20 to fix its own position and prevent the turbulence-inducing element 30 from shaking under the impact of the cooling medium and colliding with the heat sink 10 and the heat sink plate 20.

[0066] The baffle 30 can adopt any feasible baffle structure in the art, such as a metal twisted band, a spiral groove, etc., without limitation. Optionally, in the orthographic projection of the heat sink 20, at least a portion of the baffle 30 coincides with the heat sink 20.

[0067] By incorporating a baffle 30 within the heat dissipation assembly 100, the baffle 30 can improve the heat exchange efficiency of the cooling medium within the flow channel 11, thereby enhancing the heat exchange effect.

[0068] In one embodiment, the baffle 30 is connected and fixed to the heat sink 20. Optionally, the baffle 30 and the heat sink 20 can be an integral structure manufactured using a one-piece molding process, or the baffle 30 and the heat sink 20 can be connected and fixed by means of welding, bonding, snap-fitting, screwing, riveting, plugging, magnetic connection, etc., without limitation. With this configuration, the baffle 30 can improve the heat transfer efficiency of the cooling medium at the heat sink 20, thereby improving the heat exchange effect.

[0069] In one implementation, such as Figure 4 As shown, the turbulence-disrupting component 30 includes a plurality of turbulence-disrupting protrusions 31, which are staggered and protrude from the surface of the heat sink 20 toward the flow channel 11.

[0070] Optionally, the spoiler 30 also includes a connecting portion 32, through which the plurality of spoiler protrusions 31 are connected.

[0071] The spoiler 30 can be a one-piece structure, that is, the connecting part 32 and the multiple spoiler protrusions 31 are a one-piece structure manufactured by a one-piece molding process. The spoiler 30 can also be a split structure, and the connecting part 32 and the multiple spoiler protrusions 31 can be connected and fixed by welding, bonding, snap-fitting, screwing, riveting, plugging, magnetic connection and other methods, without limitation.

[0072] Optionally, the baffle 30 and the heat sink 20 can be connected and fixed by means of welding, bonding, snap-fitting, screwing, riveting, plugging, magnetic connection, etc., without limitation. In some embodiments, the baffle 30 and the heat sink 20 can also be an integral structure.

[0073] The shape of the turbulence protrusion 31 can be roughly blocky, columnar, conical, hemispherical, etc., without limitation. Optionally, multiple turbulence protrusions 31 can be roughly the same in size and shape.

[0074] Optionally, the multiple turbulence protrusions 31 are arranged in a multi-row, multi-column array on the connecting part 32. The spacing between two adjacent rows of turbulence protrusions 31 and the spacing between two adjacent columns of turbulence protrusions 31 can be the same or different, without limitation.

[0075] With this configuration, the multiple turbulence protrusions 31 can change the flow pattern of the cooling medium, increase the contact area between the cooling medium and the heat sink 20 and the heat sink 10, and improve the heat exchange efficiency.

[0076] In one implementation, such as Figure 4 As shown, the turbulence protrusion 31 encloses the flow cavity 311, which is connected to the flow channel 11, and the flow cavities 311 of the multiple turbulence protrusions 31 are connected to each other.

[0077] Optionally, at least one end of the flow cavity 311 has a flow port, the orientation of which is approximately parallel to the flow direction of the cooling medium, so as to facilitate the flow of the cooling medium in the flow channel 11 and the flow cavity 311.

[0078] By setting the turbulence protrusion 31 to enclose the flow cavity 311, the volume occupied by the turbulence component 30 in the flow channel 11 can be reduced, and the contact area between the cooling medium and the turbulence component 30 can be further increased. The heat generated by the power device 200 during operation is transferred to the turbulence component 30 through the heat sink 20 and quickly dissipated through the flowing cooling medium, which can improve the heat exchange efficiency and achieve good heat exchange effect.

[0079] In one implementation, such as Figures 1 to 3 As shown, the heat dissipation assembly 100 also includes a connector 41 and a water nozzle 42. The connector 41 is sleeved on the outer periphery of the water nozzle 42. The connector 41 is connected and fixed to the heat dissipation assembly 10, and the water nozzle 42 is connected to the heat dissipation assembly 10.

[0080] The faucet 42 and the connector 41 can be an integral structure, for example, one side surface of the connector 41 protrudes to form the faucet 42; or, the faucet 42 and the connector 41 can also be a separate structure, and the faucet 42 and the connector 41 can be connected and fixed by welding, bonding, snap-fitting, screwing or other methods, without limitation.

[0081] The water nozzle 42 is used to deliver the cooling medium. Optionally, the number of water nozzles 42 can be one or two. When there is one water nozzle 42, the water nozzle 42 has two through holes spaced apart. The cooling medium flows into the heat sink 10 through one through hole and flows out of the heat sink 10 through the other through hole. Alternatively, there can be two water nozzles 42, each with one through hole. One water nozzle 42 is used to allow the cooling medium to flow into the heat sink 10, and the other water nozzle 42 is used to allow the cooling medium to flow out of the heat sink 10. The shape and number of water nozzles 42 can also be adopted in any other feasible manner, without limitation. In a specific embodiment, as shown in the figure, there are two water nozzles 42, which are spaced apart.

[0082] Optionally, the connector 41 and the heat sink 10 can be connected and fixed by means of welding, bonding, snap-fitting, screwing, etc., without limitation. In some embodiments, the connector 41 and the heat sink 10 can be fixed and sealed by brazing or adhesive bonding.

[0083] Optionally, the water nozzle 42 is located on the outside of the housing to facilitate assembly of the water nozzle 42 with the external water passage.

[0084] Optionally, the connector 41 is detachably connected to the housing. The heat sink 10 can be connected to the housing or placed only in the housing's receiving cavity. The position of the heat sink 10 is fixed by connecting the connector 41 to the housing.

[0085] This configuration allows the heat sink 10, connector 41, and water nozzle 42 to be assembled into one unit before installation onto the housing, reducing assembly difficulty and facilitating the disassembly of the heat sink 100 when replacement or maintenance is required.

[0086] In the description of the embodiments of this utility model, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0087] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the present utility model.

Claims

1. A heat dissipation component (100), characterized in that, For a power supply device (1000), the heat dissipation assembly (100) includes: A heat sink (10) has a flow channel (11), and the side wall of the heat sink (10) has an opening (12) that connects the flow channel (11) to the outside. A heat sink (20) is disposed at the opening (12) and used to close the opening (12). The surface of the heat sink (20) facing away from the flow channel (11) is used for thermally conductive connection with the heat sink (10) of the power supply device (1000).

2. The heat dissipation assembly (100) according to claim 1, characterized in that, The heat sink (10) has a connecting groove (131) at the position corresponding to the opening (12), at least a portion of the heat sink (20) is received in the connecting groove (131) and connected to the bottom wall of the connecting groove (131).

3. The heat dissipation assembly (100) according to claim 1, characterized in that, The heat dissipation assembly (100) further includes a flow deflector (30), which is disposed corresponding to the heat dissipation plate (20) and is housed in the flow channel (11).

4. The heat dissipation assembly (100) according to claim 3, characterized in that, The baffle (30) is connected and fixed to the heat sink (20).

5. The heat dissipation assembly (100) according to claim 3, characterized in that, The turbulence-disrupting element (30) includes a plurality of turbulence-disrupting protrusions (31), which are staggered and protrude from the surface of the heat sink (20) facing the flow channel (11).

6. The heat dissipation assembly (100) according to claim 5, characterized in that, The turbulence protrusion (31) encloses a flow cavity (311), the flow cavity (311) is connected to the flow channel (11), and the flow cavities (311) of the plurality of turbulence protrusions (31) are connected to each other.

7. The heat dissipation assembly (100) according to any one of claims 1 to 6, characterized in that, The heat dissipation assembly (100) further includes a connector (41) and a water nozzle (42). The connector (41) is sleeved on the outer periphery of the water nozzle (42). The connector (41) is connected and fixed to the heat dissipation assembly (10). The water nozzle (42) is in communication with the heat dissipation assembly (10).

8. A power supply device (1000), characterized in that, Includes a power device (200) and a heat dissipation assembly (100) as described in any one of claims 1 to 7, wherein the power device (200) is thermally conductively connected to the surface of the heat sink (20) facing away from the flow channel (11).

9. The power supply device (1000) according to claim 8, characterized in that, The power device (200) is attached to the surface of the heat sink (20) facing away from the flow channel (11), or the power device (200) is soldered to the surface of the heat sink (20) facing away from the flow channel (11).

10. The power supply device (1000) according to claim 8, characterized in that, The power device (200) is a full-bridge power module and / or a half-bridge power module.

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