A heat dissipation structure of an inverter

Abstract

The application discloses an inverter heat dissipation structure, relates to an inverter, and improves the inverter problem. The heat dissipation structure comprises a heat conduction plate and a plurality of heat conduction columns. One end of the heat conduction plate is in thermal connection with a circuit board, and the other end extends to outside of a shell. The heat conduction columns are fixed to the part of the heat conduction plate located outside the shell, and are used for conducting heat out of the shell and dissipating.

Description

Technical Field

[0001] This application relates to an inverter, and more particularly to an inverter heat dissipation structure. Background Technology

[0002] Currently, the core function of inverters is to convert direct current to alternating current. Typical applications include portable lighting and power banks, and they are usually built into portable power bank devices.

[0003] In existing technologies, waterproofing is typically achieved by potting adhesive inside the inverter housing to seal and protect the internal circuit boards and other heat-generating components. While this potting process effectively prevents dust accumulation and moisture intrusion, it also significantly reduces the inverter's heat dissipation performance. Because the heat generated by the components during operation is difficult to dissipate effectively, long-term operation can lead to temperature buildup, affecting the reliability of the components and shortening their lifespan. Utility Model Content

[0004] To improve the heat dissipation problem of existing inverters, this application provides an inverter heat dissipation structure.

[0005] This application provides a heat dissipation structure for an inverter, employing the following technical solution: An inverter heat dissipation structure is disclosed. The inverter includes a housing and a circuit board disposed inside the housing. The heat dissipation structure includes a heat-conducting plate and a plurality of heat-conducting pillars. One end of the heat-conducting plate extends into the housing and is connected to the internal heating element, while the other end extends outside the housing. The heat-conducting pillars are fixed to the portion of the heat-conducting plate located outside the housing and are used to conduct and dissipate heat from inside the housing.

[0006] By adopting the above technical solution, an efficient internal and external heat conduction path was established, which improved the heat dissipation problem inside the inverter and significantly reduced the operating temperature of internal components while ensuring the airtightness of the casing.

[0007] Optionally, it also includes multiple heat sinks, each heat sink having a guide hole through which the heat-conducting column passes, the multiple heat sinks being arranged along the axial direction of the heat-conducting column, and heat dissipation gaps being formed between adjacent heat sinks.

[0008] By adopting the above technical solution, the heat dissipation surface area is greatly increased, and the passive heat dissipation capability is enhanced, thereby dissipating the heat conducted by the heat-conducting column to the surrounding environment more quickly and efficiently.

[0009] Optionally, it also includes a cooling fan, which is mounted on the housing and has its air outlet facing the heat-conducting column.

[0010] By adopting the above technical solution, an active heat dissipation mechanism is introduced, which significantly enhances the forced convection heat dissipation effect and can generate directional airflow to quickly remove heat.

[0011] Optionally, the cooling fans are arranged in two sets at intervals, with the air outlet of one set of cooling fans facing the air inlet of the other set of cooling fans, and the heat-conducting plate and heat-conducting column located in the air duct area between the two sets of cooling fans.

[0012] By adopting the above technical solution, a highly efficient through-flow air duct was constructed, which enabled centralized and efficient cooling of the core heat dissipation components, allowing airflow to pass through the entire heat dissipation area in a concentrated and smooth manner, thereby maximizing heat exchange efficiency.

[0013] Optionally, the heat-conducting plate is provided in two sets, and both sets of heat-conducting plates are located between two sets of cooling fans.

[0014] By adopting the above technical solution, a balanced distribution of heat dissipation load and a doubling of heat dissipation area are achieved, enabling air flowing through the air duct to exchange heat with a larger heat dissipation surface, further improving heat dissipation capacity and uniformity.

[0015] Optionally, multiple parallel heat dissipation fins are provided on the outer surface of the housing between the two sets of heat-conducting plates, and the extending direction of the heat dissipation fins is consistent with the airflow direction in the air duct.

[0016] By adopting the above technical solution, the heat dissipation area was further expanded and the airflow organization was optimized, achieving composite heat dissipation for both the casing itself and the air duct area.

[0017] Optionally, an air duct structure is fixed to the outside of the housing. The air duct structure includes two parallel channel plates and a cover plate that covers them, forming an air duct that runs through both ends. Two sets of cooling fans are respectively installed at both ends of the air duct.

[0018] By adopting the above technical solution, an independent, closed and efficient forced airflow system is provided, which guides the airflow in a directional and concentrated manner through the core heat dissipation area, thereby maximizing the utilization efficiency of the fan and the reliability of heat dissipation.

[0019] In summary, this application has the following beneficial effects: By directly connecting the heat dissipation material heat-conducting plate and heat-conducting pillar to the circuit board, and combining it with heat sinks to expand the heat dissipation area, and combining it with fans and air ducts to enhance airflow exchange, the problem of heat accumulation caused by the potting and sealing of the inverter is effectively solved, and the heat transfer and dissipation efficiency is improved. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application; Figure 2This is a schematic diagram illustrating the connection between the heat-conducting plate and the heating element in an embodiment of this application; Figure 3 This is a schematic diagram illustrating the air duct structure in the embodiments of this application; Figure 4 This is a schematic diagram illustrating the heat-conducting plate and heat-conducting pillars in an embodiment of this application; Figure 5 This is a schematic diagram illustrating the structure of the heat dissipation fins in the embodiments of this application.

[0021] Explanation of reference numerals in the attached drawings: 1. Housing; 2. Heat-conducting plate; 3. Heat-conducting pillar; 4. Heat sink; 5. Cooling fan; 6. Heating element; 7. Guide hole; 8. Support ring; 9. Channel plate; 10. Cover plate; 11. Heat sink fins. Detailed Implementation

[0022] The present application will be further described in detail below with reference to the accompanying drawings.

[0023] This application discloses an inverter heat dissipation structure, which is mainly used in inverters including a housing and a circuit board disposed inside the housing.

[0024] Reference Figure 1 , 2 The heat dissipation structure includes a heat-conducting plate 2, several heat-conducting pillars 3, several heat sinks 4, and a cooling fan 5. One end of the heat-conducting plate 2 is connected to the heat-generating element 6 inside the inverter, such as a power device or a hot spot area on the circuit board. The other end passes through the side wall of the housing 1 and extends outside the housing 1. A sealing element, such as a rubber gasket or sealant, is used to achieve a sealed connection between the heat-conducting plate 2 and the side wall of the housing 1, ensuring the waterproof and dustproof performance of the housing 1.

[0025] Reference Figure 2 , 3 The heat-conducting plate 2 is made of a material with high thermal conductivity, such as copper or aluminum alloy, and is formed into a plate structure. One end of the heat-conducting plate 2 is fixed to the internal circuit board or other heat-generating elements 6 of the inverter by screws or other means to efficiently collect heat. The other end of the heat-conducting plate 2 passes through a pre-set opening on the side wall of the housing 1 and extends outside the housing 1. When passing through the side wall of the housing 1, a sealing ring is set between the heat-conducting plate 2 and the opening or potting sealant is used for fixation to ensure the overall airtightness of the housing 1 and prevent moisture and dust from entering.

[0026] Reference Figure 3 , 4 The heat-conducting pillars 3 are also made of highly thermally conductive materials (such as copper) and have a columnar structure. The number of pillars can be adjusted according to heat dissipation requirements. One end of each heat-conducting pillar 3 is fixed to the portion of the heat-conducting plate 2 extending from the housing 1 by welding or threaded connection, allowing heat to be quickly transferred from the heat-conducting plate 2 to the heat-conducting pillars 3. The heat-conducting pillars 3 are arranged perpendicular to the heat-conducting plate 2 to maximize the heat dissipation area.

[0027] Reference Figure 4 , 5 The heat sink 4 is made of lightweight, highly thermally conductive materials such as aluminum or aluminum alloy and has a sheet-like structure. Each heat sink 4 has a guide hole 7, the size of which matches the outer diameter of the heat-conducting pillar 3, allowing the heat sink 4 to be fitted onto the heat-conducting pillar 3. Multiple heat sinks 4 are arranged sequentially along the axial direction of the heat-conducting pillar 3 to form a stacked structure.

[0028] Reference Figure 4 , 5 To ensure sufficient clearance between adjacent heat sinks 4 for airflow, each heat sink 4 is coaxially fixed with a support ring 8 at the edge of the guide hole 7. The support ring 8 can be a protruding structure integrally formed with the heat sink 4, or an additional ring-shaped component welded on. The height of the support ring 8 determines the size of the heat dissipation gap between adjacent heat sinks 4, typically between 2-5 mm, to balance the heat dissipation area and airflow resistance. When the heat sink 4 is fitted onto the heat-conducting pillar 3, the support rings 8 contact each other, maintaining a stable gap, thereby allowing natural convection or forced airflow to carry away heat.

[0029] Reference Figure 1 , 3 The cooling fan 5 is installed on the outside of the inverter housing 1, specifically on one side of the heat-conducting pillar 3 and the heat sink 4. The cooling fan 5 is an axial fan or a centrifugal fan, and its air outlet is directed towards the heat-conducting pillar 3 and the heat sink 4 to generate a directional airflow to blow towards the heat dissipation area and accelerate heat dissipation.

[0030] To further enhance heat dissipation, two sets of cooling fans 5 are spaced apart. One set of cooling fans 5 acts as an intake fan, with its exhaust port facing the intake port of the other set, which acts as an exhaust fan, thus forming a through-flow air duct between the two sets of fans. The heat-conducting plate 2 and the heat-conducting pillar 3 are located within this air duct area, allowing the airflow to be concentrated and smoothly flow through the entire heat dissipation core area, achieving efficient heat exchange.

[0031] Reference Figure 1 , 3 An independent air duct structure is fixed to the outer surface of the housing 1. This air duct structure consists of two parallel channel plates 9 and a cover plate 10 that fits over the two channel plates 9, forming a rectangular air duct that runs through both ends. The channel plates 9 and the cover plate 10 are connected by screws or clips to ensure the air duct is airtight. Two sets of cooling fans 5 are installed at both ends of the air duct. One set of fans blows air into the air duct, while the other set of fans draws air out of the air duct, forming a unidirectional airflow.

[0032] Reference Figure 1 , 3The heat-conducting plates 2 inside the air duct structure are arranged in two sets, corresponding to different heat-generating elements 6 inside the inverter. Both sets of heat-conducting plates 2 are located in the air duct area between the two sets of cooling fans 5, so that the airflow simultaneously cools the two sets of heat-conducting plates 2 and the heat-conducting pillars 3 and heat sinks 4 on them, achieving a balanced distribution of heat dissipation load.

[0033] Reference Figure 3 In addition, multiple parallel heat dissipation fins 11 are provided on the outer surface of the housing 1 between the two sets of heat-conducting plates 2. The heat dissipation fins 11 are made of aluminum or other heat-dissipating materials, and the extension direction of the heat dissipation fins 11 is consistent with the airflow direction in the air duct. The heat dissipation fins 11 are fixed to the surface of the housing 1 by welding or integral molding, which increases the heat dissipation area of ​​the housing 1 and guides the airflow to reduce the temperature of the housing 1.

[0034] The implementation principle of an inverter heat dissipation structure in this application is as follows: When the inverter is operating, the heat generated by the internal heating element 6 is rapidly conducted to the outside of the housing 1 through the heat conduction plate 2. The heat is then transferred to the heat conduction column 3 and the heat sink 4, and dissipated into the surrounding air through passive heat dissipation. At the same time, the cooling fan 5 starts, forming a forced airflow in the air duct. The airflow enters from the intake fan, flows through the heat conduction column 3, the heat sink 4 and the heat dissipation fins 11, carries away the heat and is then discharged from the exhaust fan.

[0035] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation structure for an inverter, the inverter comprising a housing (1), characterized in that, The heat dissipation structure includes a heat-conducting plate (2) and several heat-conducting columns (3); one end of the heat-conducting plate (2) extends into the housing (1) and connects to the internal heating element (6), and the other end extends to the outside of the housing (1); the heat-conducting columns (3) are fixed to the part of the heat-conducting plate (2) located outside the housing (1) and are used to conduct and dissipate the heat inside the housing (1).

2. The inverter heat dissipation structure according to claim 1, characterized in that: It also includes multiple heat sinks (4), each heat sink (4) having a guide hole (7) through which the heat-conducting column (3) passes. The multiple heat sinks (4) are arranged axially along the heat-conducting column (3), and a heat dissipation gap is formed between adjacent heat sinks (4).

3. The inverter heat dissipation structure according to claim 1, characterized in that: It also includes a cooling fan (5), which is mounted on the housing (1) and the air outlet of the cooling fan (5) faces the direction of the heat-conducting column (3).

4. The inverter heat dissipation structure according to claim 3, characterized in that: Two sets of cooling fans (5) are arranged at intervals. The air outlet of one set of cooling fans (5) faces the air inlet of the other set of cooling fans (5). The heat-conducting plate (2) and the heat-conducting column (3) are located in the air duct area between the two sets of cooling fans (5).

5. The inverter heat dissipation structure according to claim 4, characterized in that: The heat-conducting plate (2) is provided in two sets, and both sets of heat-conducting plates (2) are located between the two sets of cooling fans (5).

6. The inverter heat dissipation structure according to claim 5, characterized in that: On the outer surface of the housing (1), there are multiple parallel heat dissipation fins (11) located between two sets of heat conduction plates (2), and the extension direction of the heat dissipation fins (11) is consistent with the airflow direction in the air duct.

7. An inverter heat dissipation structure according to claim 4 or 5, characterized in that: The housing (1) is fixed with an air duct structure, which includes two parallel channel plates (9) and a cover plate (10) covering them, forming an air duct that runs through both ends. Two sets of cooling fans (5) are respectively installed at both ends of the air duct.

Images