A device for removing flash from the surface of a plastic encapsulation strip

By combining laser peeling, chemical soaking, and cleaning and wiping, the problem of incomplete removal of plastic sealant strip overflow in existing technologies has been solved, achieving efficient and thorough overflow removal, and improving production efficiency and equipment reliability.

CN224936036UActive Publication Date: 2026-11-03SICHUAN QISAI MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202522486315.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-24
Publication Date
2026-11-03
Estimated Expiration
2035-11-24

AI Technical Summary

Technical Problem

Existing technologies for removing excess material from the surface of integrated circuit molding compound strips are inefficient and incomplete, while laser ablation is inefficient and costly, making it difficult to achieve efficient and thorough removal.

Method used

A laser-based skin-breaking unit creates holes in the overflow area, which is then combined with a chemical soaking unit to soften the overflow by penetrating a soft adhesive solution into the bottom of the overflow. Subsequently, the material is rinsed with high-pressure water by a cleaning unit and mechanically wiped by a wiping unit, forming an automated production line that reduces manual intervention.

Benefits of technology

It achieves efficient and thorough removal of large areas or thick overflows, improves production efficiency, reduces human error and maintenance difficulty, and lowers the failure rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of equipment for removing overflow of plastic package strip surface, including laser skin breaking unit, chemical soaking unit, cleaning unit and overflow removal unit arranged in sequence, and manipulator for transporting plastic package strip between each unit;Wherein, laser skin breaking unit upper portion is provided with laser for the overflow area of plastic package strip is burnt skin breaking;Chemical soaking unit is provided with the load platform for loading plastic package strip after soaking is completed, and the soft glue liquid tank for placing soft glue liquid below load platform, to be softened overflow by soft glue liquid soaking;High-pressure water nozzle and compressed air nozzle are equipped in cleaning unit, for flushing and drying plastic package strip;Overflow removal unit is used for wiping to remove overflow.The utility model is manufactured hole in overflow surface by laser skin breaking, so that soft glue liquid can penetrate into overflow bottom, facilitate subsequent wiping, to realize efficient, thorough cleaning.
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Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging and manufacturing technology, specifically, it is a device for removing excess material from the surface of molding compound strips. Background Technology

[0002] In integrated circuit molding processes, gaps or contaminants between the protective film and the lead frame often cause molding compound to overflow into areas that should not be covered, resulting in overflow. The presence of overflow can affect subsequent electroplating processes, preventing solder joints from forming a proper plating layer, and consequently impacting the electrical performance and reliability of the integrated circuit.

[0003] Currently, there are two main methods for removing overflow:

[0004] Chemical soaking method: This method involves soaking the sealing strip in a chemical solution to soften the overflow material, which is then removed by an automatic wiping device. This method is not effective for large areas or thick layers of overflow and is prone to incomplete removal.

[0005] Laser ablation: This method removes excess material by ablating it point by point with a laser. Although it offers high precision, it is inefficient and has high processing costs. Utility Model Content

[0006] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a device for removing excess material from the surface of the plastic sealant strip, so as to achieve rapid and thorough removal of excess material from the surface of the plastic sealant strip, so as to balance efficiency and thoroughness.

[0007] The present invention solves the above problems through the following technical solution:

[0008] An apparatus for removing excess material from the surface of a plastic sealant strip includes a laser breaking unit, a chemical soaking unit, a cleaning unit, and an overflow removal unit arranged sequentially, as well as a robotic arm for transferring the plastic sealant strip between the units. The laser breaking unit is equipped with a laser at its upper part for burning and breaking the excess material area of ​​the plastic sealant strip. The chemical soaking unit includes a support platform for holding the soaked plastic sealant strip and a soft adhesive tank located below the support platform for placing soft adhesive liquid to soak and soften the excess material. The cleaning unit is equipped with high-pressure water nozzles and compressed air nozzles for rinsing and drying the plastic sealant strip. The overflow removal unit is used for wiping away the excess material.

[0009] As a further improvement of this utility model, the equipment also includes: a feeding unit and a discharging unit for loading and unloading plastic sealing strips;

[0010] The feeding unit is equipped with a conveyor belt, which is used to transport the plastic sealant strip with overflow material on it to the laser breaking unit.

[0011] The feeding unit is equipped with a feeding platform for collecting finished plastic sealing strips.

[0012] As a further improvement of this utility model, a feed inlet is formed on the left side of the laser skin breaking unit, and one end of the conveyor belt is set at the feed inlet.

[0013] As a further improvement of this utility model, a discharge port is formed on the right side of the overflow removal unit, and the unloading platform is disposed at the discharge port.

[0014] As a further improvement of this utility model, the overflow removal unit is provided with an automatic wiping device for wiping the surface of the plastic sealant strip to remove overflow.

[0015] As a further improvement of this utility model, the support platform is horizontally installed on the right side plate of the chemical soaking unit and is perpendicular to the right side plate.

[0016] As a further improvement of this utility model, a soft glue inlet is provided on the rear side plate of the chemical soaking unit above the soft glue tank; and / or a soft glue outlet is provided on the bottom plate of the chemical soaking unit.

[0017] As a further improvement of this utility model, the laser is used to burn the area with overflow material on the molding compound strip until the underlying metal material is exposed, so as to form several holes.

[0018] As a further improvement of this utility model, the laser skin breaking unit, chemical soaking unit, cleaning unit and overflow removal unit are each equipped with a safety door.

[0019] As a further improvement of this utility model, the cleaning unit is also provided with a support platform to facilitate the placement of the plastic sealant strip on the support platform for rinsing and drying.

[0020] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0021] (1) This utility model creates holes on the surface of the overflow by laser breaking, so that the subsequent soft glue can penetrate into the bottom of the overflow, greatly increasing the reaction contact area, realizing the full softening of large areas or thick overflows, making it easy to wipe later, so as to achieve efficient and thorough cleaning.

[0022] (2) This utility model uses a robotic arm for material transfer, forming a compact and continuous automated production line. This layout reduces material transfer time, avoids manual intervention, significantly improves overall production efficiency, and reduces the risk of human error and product damage.

[0023] (3) The present invention provides safety doors for the laser processing unit, chemical soaking unit and other units, which facilitates the rapid and thorough drainage and cleaning of the chemical soaking unit, reducing the failure rate and maintenance difficulty. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a method for removing excess material from the surface of a plastic sealant strip according to the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of a device for removing excess material from the surface of a plastic sealant strip according to the present invention.

[0026] Attached reference numerals: a) Feeding unit; b) Laser breaking unit; c) Chemical soaking unit; d) Cleaning unit; e) Overflow removal unit; f) Unloading unit; 1. Conveyor belt; 2. Sealing strip; 3. Laser; 4. Soft adhesive liquid; 5. Supporting platform; 6. Robotic arm; 7. High-pressure water nozzle; 8. Compressed air nozzle; 9. Automatic wiping device; 10. Unloading platform; 11. Safety door of wiping unit; 12. Safety door of cleaning unit; 13. Safety door of chemical soaking unit; 14. Safety door of laser processing unit; 15. Soft adhesive liquid inlet; 16. Wastewater drain outlet; 17. Soft adhesive liquid discharge outlet. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1:

[0029] Combined with appendix Figure 1 As shown, a method for removing excess material from the surface of a molding compound strip includes the following steps:

[0030] First, place the plastic sealant strip with overflowing material under the laser to load it. Then, use the high-frequency laser to burn and break the overflow area. By controlling the laser power, frequency, and scanning speed, evenly distributed holes are formed on the overflow surface until the metal material beneath is exposed, achieving laser breaking. Next, immerse the broken plastic sealant strip in a softening liquid, allowing the liquid to seep into the bottom of the overflow through the holes, increasing the reaction area and fully softening the overflow. After immersion, rinse the plastic sealant strip with high-pressure water to remove residual softening liquid and some of the softened overflow. Finally, remove the plastic sealant strip and mechanically wipe the overflow area. Alternatively, manual or other methods can be used to wipe the area to remove the overflow.

[0031] Example 2:

[0032] Combined with appendix Figure 2 As shown, an apparatus for removing excess material from the surface of a plastic sealant strip includes a feeding unit a, a laser breaking unit b, a chemical soaking unit c, a cleaning unit d, an excess material removal unit e, and a discharging unit f arranged sequentially in the above-described process flow, as well as a robotic arm 6 for transferring the plastic sealant strip 2 between the units. The feeding unit a is equipped with a conveyor belt 1, which automatically transports the plastic sealant strip 2 with excess material onto it to the laser breaking unit b. The laser breaking unit b is equipped with a laser 3 at its upper part for precisely burning and breaking the excess material area of ​​the plastic sealant strip 2. Preferably, the laser breaking unit b has a feed inlet on its left side, with one end of the conveyor belt 1 positioned at the feed inlet to feed the plastic sealant strip 2 with excess material onto the conveyor belt 1 into the laser breaking unit b. The chemical soaking unit c is equipped with a support platform 5 and a soft adhesive liquid tank located below the support platform 5 for placing the soft adhesive liquid 4, so as to soak and soften the overflow material through the soft adhesive liquid 4; the cleaning unit d is equipped with a high-pressure water nozzle 7 and a compressed air nozzle 8 for rinsing and drying the plastic sealant strips; the overflow removal unit e is equipped with an automatic wiping device 9 for wiping and removing the overflow material; the unloading unit f is equipped with an unloading platform 10 for collecting the finished material strips; preferably, an outlet is formed on the right side of the overflow removal unit e, and the unloading platform 10 is set at the outlet so that the plastic sealant strips with the overflow removed can be placed on the unloading platform 10 by the robotic arm 6.

[0033] Furthermore, the support platform 5 is horizontally installed on the right side plate of the chemical soaking unit c and is perpendicular to the right side plate. A soft glue inlet 15 is provided on the rear side plate of the chemical soaking unit c, which is higher than the soft glue tank, so as to add soft glue to the soft glue tank; a soft glue outlet 17 is provided on the bottom plate of the chemical soaking unit c, which is the bottom plate of the soft glue tank, so as to discharge the soft glue from the soft glue tank.

[0034] Specifically, the workflow is as follows: At the far left of the equipment is a feeding unit a, with a conveyor belt 1 that automatically transports the plastic sealing strip 2 to the laser breaking unit b inside the equipment. A laser 3 burns the areas of the plastic sealing strip with excess material, creating holes until the underlying metal material is exposed. A robotic arm 6 then transports the broken plastic sealing strip 2 to the chemical soaking unit c, where a softening adhesive 4 is used to soak the strip to soften the excess material. The soaking unit has a support platform 5 to hold the soaked strip. The robotic arm then removes the plastic sealing strip from the support platform 5. The sealing strip is pushed to the cleaning unit d, where a high-pressure water nozzle 7 sprays high-pressure water to rinse the sealing strip. The cleaning unit is also equipped with a rinsing tank to receive the liquid from rinsing the sealing strip and the liquid itself. A compressed air nozzle 8 dries the strip by blowing air onto its surface. The dried sealing strip 2 is transported to the wiping unit e by a robotic arm 6. An existing automatic wiping device 9 wipes the surface of the strip to remove excess material. After wiping, the robotic arm 6 automatically pushes the sealing strip onto the unloading platform 10 to complete the entire processing flow.

[0035] In this embodiment, the laser skin breaking unit b, chemical soaking unit c, cleaning unit d, and overflow removal unit e are each equipped with a safety door, namely laser processing unit safety door 14, chemical soaking unit safety door 13, cleaning unit safety door 12, and wiping unit safety door 11. Each safety door is located on the connecting front side and the upper side of each unit, so as to facilitate the opening of each safety door for the maintenance of each unit.

[0036] Preferably, the safety door can be opened upwards when the equipment is not running, allowing for observation of the internal situation and handling of equipment or production abnormalities. When the equipment is running, the safety door is closed and automatically locked to prevent safety issues. Since the internal tanks containing liquids such as chemical solutions are independent, such as adhesive tanks or rinsing tanks, opening the safety door will not result in liquid leakage.

[0037] In an optional embodiment, the robotic arm 6 can be suspended above each unit via a top mounting bracket, allowing it to move between units to grasp and place the plastic sealant strip 2. The robotic arm 6 is preferably a six-axis articulated robot. Alternatively, the robotic arm can be mounted on the left and right plates of each unit, allowing it to grasp and release the plastic sealant strip by sliding the left and right plates up and down. This invention does not limit the specific structure of the robotic arm 6, as long as it can move between units to grasp and place the plastic sealant strip 2.

[0038] Laser 3 is fixedly mounted on the outside or top of the laser-driven skin-breaking unit. The laser emitted by it is controlled and guided by a galvanometer scanning system. This system contains two high-speed galvanometer motors, which control the deflection of the laser along the X and Y axes, respectively, thereby driving the laser focus to perform high-speed and precise scanning on the overflow area of ​​the encapsulating strip 2 placed below. This method can complete the processing of the entire two-dimensional plane without moving the workpiece or the laser itself, resulting in extremely high speed and efficiency. By precisely controlling the scanning path and speed of the galvanometer and the switching on and off of the laser, a uniformly distributed array of holes can be formed on the overflow surface.

[0039] In another preferred embodiment, the cleaning unit d is further provided with a support platform to facilitate placing the molding compound strip on the support platform for rinsing and drying. The cleaning unit d is also provided with a wastewater drain outlet 16 to facilitate the discharge of wastewater from the cleaning unit d.

[0040] This invention first uses a laser to burn the area of ​​excess material on the surface of the molding compound strip, and precisely controls the burning depth by using parameters such as laser power, frequency, and scanning speed. A small number of holes are evenly created in the excess area to expose the metal area covered by the excess material. Then, a soft adhesive is used to soak the workpiece. The soft adhesive can flow into the bottom of the excess material through the holes, greatly increasing the contact area with the excess material, thus softening it better and more thoroughly. Finally, after cleaning the workpiece, the excess material is wiped off, completely removing the excess material. This avoids the problem of incomplete removal of excess material caused by the soft adhesive only contacting the material from the outside due to the large area or thickness of the excess material, which prevents it from fully reacting.

[0041] This invention increases the contact area between the soft adhesive and the overflow material by using laser-induced skin breaking, thereby achieving a more efficient method for removing overflow material from the plastic sealant strip and making the removal of overflow material from the plastic sealant strip more thorough and faster.

[0042] Although the present invention has been described herein with reference to illustrative embodiments, the above embodiments are merely preferred embodiments of the present invention, and the implementation of the present invention is not limited to the above embodiments. It should be understood that those skilled in the art can design many other modifications and implementations, which will fall within the scope and spirit of the principles disclosed in this application.

Claims

1. A device for removing excess material from the surface of a plastic sealant strip, characterized in that, The system includes a laser breaking unit, a chemical soaking unit, a cleaning unit, and an overflow removal unit arranged sequentially, as well as a robotic arm for transferring the molding compound strip between the units. The laser breaking unit is equipped with a laser at its upper part for burning and breaking the overflow area of ​​the molding compound strip. The chemical soaking unit has a support platform for holding the molding compound strip after soaking, and a soft adhesive tank located below the support platform for placing soft adhesive liquid to soak and soften the overflow. The cleaning unit is equipped with high-pressure water nozzles and compressed air nozzles for rinsing and drying the molding compound strip. The overflow removal unit is used to wipe away the overflow.

2. The device for removing excess material from the surface of a plastic sealant strip according to claim 1, characterized in that, The equipment also includes a loading unit and a unloading unit for loading and unloading plastic sealing strips; The feeding unit is equipped with a conveyor belt, which is used to transport the plastic sealant strip with overflow material on it to the laser breaking unit. The feeding unit is equipped with a feeding platform for collecting finished plastic sealing strips.

3. The device for removing excess material from the surface of a plastic sealant strip according to claim 2, characterized in that, The laser skin-breaking unit has a feed inlet on its left side, and one end of the conveyor belt is located at the feed inlet.

4. The device for removing excess material from the surface of a plastic sealant strip according to claim 2, characterized in that, The overflow removal unit has a discharge port on its right side, and the unloading platform is located at the discharge port.

5. The device for removing excess material from the surface of a plastic sealant strip according to claim 1, characterized in that, The overflow removal unit is equipped with an automatic wiping device to wipe the surface of the plastic sealant strip to remove overflow.

6. The device for removing excess material from the surface of a molding compound strip according to claim 1, characterized in that, The support platform is horizontally installed on the right side plate of the chemical immersion unit and is perpendicular to the right side plate.

7. The device for removing excess material from the surface of a molding compound strip according to claim 1, characterized in that, The rear plate of the chemical soaking unit is provided with a soft glue inlet above the soft glue tank; and / or the bottom plate of the chemical soaking unit is provided with a soft glue outlet.

8. The device for removing excess material from the surface of a plastic sealant strip according to claim 1, characterized in that, The laser is used to burn the areas with overflowing plastic sealant strips until the underlying metal material is exposed, thereby creating several holes.

9. The device for removing excess material from the surface of a molding compound strip according to claim 1, characterized in that, The laser skin breaking unit, chemical soaking unit, cleaning unit, and overflow removal unit are each equipped with a safety door.

10. The apparatus for removing excess material from the surface of a molding compound strip according to any one of claims 1-9, characterized in that, The cleaning unit is also equipped with a support platform to facilitate the placement of the plastic sealant strip on the support platform for rinsing and drying.