Wafer automatic loading and unloading device

Abstract

The utility model discloses a kind of wafer automatic feeding and discharging devices, including intercommunicating first rack and second rack, the first rack is embedded with first workstation, carrier and manipulator are provided on the first workstation, wafer is sequentially arranged in the carrier from top to bottom, the manipulator grabs the wafer and moves it into or moves it out of the carrier, dust removal system is arranged in the first rack, the dust removal system includes high efficiency filter, ventilation channel and exhaust port, the moving range of the manipulator is located in the ventilation channel, the high efficiency filter is filtered by negative pressure after external air is blown into the first rack airflow, and the surface of wafer grabbed by the manipulator is dusted simultaneously while being discharged from the exhaust port through the ventilation channel.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer processing equipment, and specifically to an automatic wafer loading and unloading device. Background Technology

[0002] In the semiconductor wafer manufacturing process, wafer handling technology is a crucial factor affecting wafer production efficiency and manufacturing quality. During wafer transfer, wafers need to be moved between various workstations. To ensure manufacturing quality, it's essential to prevent particulate contamination of wafers during loading and unloading, thereby improving yield. Typically, loading and unloading equipment are equipped with loading and unloading protective covers to protect the loading and unloading mechanisms. However, these covers can obstruct the transfer process, causing inconvenience. Furthermore, the opening and closing of the covers can easily allow dust from the external environment to contaminate the wafer surface. Therefore, simply using protective covers is insufficient to effectively prevent contamination. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide an automatic wafer loading and unloading device.

[0004] The objective of this utility model is achieved through the following technical solution: An automated wafer loading and unloading device includes a first frame and a second frame connected by a connection port. The first frame contains a first worktable, and the second frame contains a second worktable. A carrier and a robotic arm are mounted on the first worktable. Wafers are arranged layer by layer from top to bottom in the carrier. The robotic arm picks up the wafers and moves them into or out of the carrier. A dust removal system is installed in the first frame, including a high-efficiency filter, a ventilation channel, and an exhaust vent. The high-efficiency filter is located at the top of the first frame. A ventilation vent is located on the first worktable below the carrier. A cavity is located at the bottom of the first frame that connects to the ventilation vent. The cavity, ventilation vent, and exhaust vent of the first frame form the ventilation channel. The exhaust vent is located on the side of the cavity and connects to the outside atmosphere. The robotic arm moves within the ventilation channel. The high-efficiency filter filters outside air through negative pressure and blows it into the first frame. The airflow passes through the ventilation channel and exits through the exhaust vent, simultaneously removing dust from the surface of the wafers picked up by the robotic arm.

[0005] Preferably, an exhaust fan is installed inside the exhaust vent.

[0006] Preferably, the dust removal system further includes a plasma bar, which is horizontally mounted between the high-efficiency filter and the robotic arm, and located above the range of motion of the robotic arm, to eliminate static electricity on the surface of the wafer gripped by the robotic arm.

[0007] Preferably, the vehicle is externally provided with a matching positioning bracket. The positioning bracket includes a base plate, positioning rods, a top positioning plate, and a rear positioning block. Two positioning rods are vertically fixed on the left and right sides of the base plate to limit the left and right positions of the vehicle. The top positioning plate is fixed to the top of the two positioning rods to limit the top position of the vehicle. A handle is provided on the top of the positioning plate. Two rear positioning blocks are vertically fixed on the rear side of the base plate to limit the rear position of the vehicle. The front side of the positioning bracket has an opening that matches the vehicle, so that the vehicle can move into or out of the positioning bracket by horizontal movement.

[0008] Preferably, the first workbench is provided with a carrier positioning platform for placing the positioning bracket. The carrier positioning platform is a hollow frame consisting of a top plate and side plates fixed to the left and right sides of the bottom of the top plate. The ventilation opening is located below the top plate. The top plate is provided with a positioning pin, and the bottom of the bottom plate is provided with a positioning hole that matches the positioning pin to limit the position of the positioning bracket.

[0009] Preferably, the robotic arm is a Bernoulli suction cup.

[0010] Preferably, the top plate is further provided with a limiting mechanism consisting of a set of limiting blocks and limiting posts. Two of the limiting blocks are fixed on the vehicle positioning platform and limit the front position of the positioning bracket. A set of limiting posts are evenly distributed along the side of the bottom plate. The bottom of the limiting posts is pivotally connected to the top of the vehicle positioning platform so as to rotate relative to the top of the vehicle positioning platform. The axis of the limiting post does not coincide with its axis of rotation so as to limit the left and right position of the bottom plate by eccentric rotation.

[0011] Preferably, a first detection sensor is provided on the back of the top plate for detecting the vehicle model, and a first through hole is provided on the top plate directly opposite the trigger end of the first detection sensor.

[0012] Preferably, a second detection sensor is provided on the side plate for detecting the presence of the vehicle.

[0013] Preferably, a third detection sensor is provided on the side plate, and a second through hole is provided on the chassis to allow the detection light of the third detection sensor to pass through, for detecting whether the vehicle is placed correctly.

[0014] The beneficial effects of this utility model are mainly reflected in: 1. A dust removal system consisting of a high-efficiency filter, a ventilation channel, and an exhaust vent is set up. A carrier containing wafers and a robotic arm are set up on the first workbench in the first frame so that the robotic arm's movement range for transferring wafers is within the ventilation channel. This achieves dust removal by blowing air, ensuring the integrity of the wafers while maximizing the cleanliness of the wafers during the transfer process. 2. The ventilation openings are placed under the carrier so that the robotic arm will inevitably pass through the ventilation channel during the transfer of wafers, ensuring the cleanliness of the wafers by the dust removal system. Plasma bars are also installed to remove static electricity from the wafer surface, further ensuring the effectiveness of the dust removal system. 3. Set up positioning brackets that match the outer contour of the vehicle to enable quick installation or removal of the vehicle and ensure the convenience of the vehicle during the transplanting process; 4. Multiple detection sensors are installed on the carrier positioning platform to detect the model and placement position of the carrier, so as to ensure effective cooperation between the robot and the carrier; 5. The robotic arm uses Bernoulli fingers to pick up the wafers, ensuring their integrity and avoiding damage caused by directly gripping the wafers with vacuum negative pressure. Attached Figure Description

[0015] The technical solution of this utility model will be further described below with reference to the accompanying drawings: Figure 1 : A schematic diagram of the first angle of an embodiment of this utility model; Figure 2 : A schematic diagram of the second angle of an embodiment of this utility model; Figure 3 : A schematic diagram of the third angle of an embodiment of this utility model; Figure 4 : Partial structural schematic diagrams of the embodiments of this utility model. Detailed Implementation

[0016] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments are not limited to the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the protection scope of the present invention.

[0017] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Also, in the description of the solution, with the operator as a reference, the direction closer to the operator is the proximal end, and the direction farther from the operator is the distal end.

[0018] like Figures 1 to 4 As shown, this utility model discloses an automatic wafer loading and unloading device, including a first frame 1 and a second frame 2, which are connected by a connection port 3. The first frame 1 has a first workbench 101 built in it, and the second frame 2 has a second workbench 201 built in it. A carrier 4 and a robot arm 5 are arranged on the first workbench 101. Wafers 6 are arranged layer by layer from top to bottom in the carrier 4. The robot arm 5 grabs the wafers 6 and moves them into or out of the carrier 4. A dust removal system is provided in the first frame 1. The dust removal system includes a high-efficiency filter 7, a ventilation channel, and an exhaust port 104. The high-efficiency filter 7 is located in the first frame 1. At the top, a ventilation opening 102 is provided on the first workbench 101 below the carrier 4. A cavity 103 is provided at the bottom of the first frame 1 to connect with the ventilation opening 102. The inner cavity of the first frame 1, the ventilation opening 102, and the cavity 103 form the ventilation channel. The exhaust port 104 is provided on the side of the cavity 103 and is connected to the outside atmosphere. The moving range of the robotic arm 5 is located within the ventilation channel. The high-efficiency filter 7 filters the outside air through negative pressure and blows it into the first frame 1. The airflow is discharged from the exhaust port 104 through the ventilation channel, while simultaneously removing dust from the surface of the wafer 6 grasped by the robotic arm 5.

[0019] The first frame 1 and the second frame 2 are enclosed structures consisting of a frame body and a sealing plate disposed on the frame body. Figure 1 and Figure 2 This is a schematic diagram showing the structure after removing part of the sealing plate. This solution includes a dust removal system consisting of the high-efficiency filter 7, a ventilation channel, and an exhaust vent 104. A carrier 4 carrying the wafer 6 and a robotic arm 5 are installed on the first workbench 101 within the first frame 1. This ensures that the robotic arm 5's movement range for transferring the wafer 6 is within the ventilation channel, achieving dust removal through air blowing, thus maintaining the integrity of the wafer 6 while maximizing its cleanliness during the transfer process.

[0020] The high-efficiency filter 7 is a fan filter unit (FFU), an air purification device with its own fan and filter module. The high-efficiency filter 7 contains a filter module to filter dust particles from the external atmosphere, ensuring the cleanliness of the air blown into the first frame 1. The robotic arm 5 is a Bernoulli suction cup, capable of horizontal extension, vertical lifting, and 360° rotation. The robotic arm 5 uses one or more combinations of these actions to move the wafer 6 into or out of the carrier 4. Specifically, the robotic arm 5 uses Bernoulli fingers to adhere to the bottom or top of the wafer 6 to ensure its integrity and avoid damage caused by directly gripping the wafer 6 with vacuum negative pressure. The robotic arm 5 picks up the wafer 6 from the carrier 4 and transfers it to the second workbench 201, or picks up the wafer 6 from the second workbench 201 and transfers it into the carrier 4.

[0021] An exhaust fan 10 is installed inside the exhaust vent 104. The exhaust fan 10 rotates continuously to generate positive pressure, which discharges the gas in the cavity 103 and prevents external air from being blown in through the exhaust vent 104.

[0022] The dust removal system also includes a plasma rod 8, which is horizontally mounted between the high-efficiency filter 7 and the robotic arm 5, and located above the range of motion of the robotic arm 5, to eliminate static electricity on the surface of the wafer 6 grasped by the robotic arm 5, thereby further ensuring the effectiveness of the dust removal system.

[0023] The carrier 4 is externally equipped with a matching positioning bracket. The positioning bracket includes a base plate 901, positioning rods 902, a top positioning plate 903, and a rear positioning block 904. Two positioning rods 902 are vertically fixed to the left and right sides of the base plate 901 to define the left and right positions of the carrier 4. The top positioning plate 903 is fixed to the top of the two positioning rods 902 to define the top position of the carrier 4. A handle 905 is provided on the top of the positioning plate 904. Two rear positioning blocks 904 are vertically fixed to the rear side of the base plate 901 to define the rear position of the carrier 4. The front side of the positioning bracket has an opening that matches the carrier 4, allowing the carrier 4 to be moved horizontally into or out of the positioning bracket. The positioning bracket, matching the outer contour of the carrier 4, enables quick installation or removal of the carrier 4. The handle 905 improves the convenience of the carrier 4 during transplantation.

[0024] Furthermore, the first workbench 101 is provided with a carrier positioning platform for placing the positioning bracket. The carrier positioning platform is a hollow frame consisting of a top plate 906 and side plates 907 fixed to the left and right sides of the bottom of the top plate 906. The ventilation opening 102 is located below the top plate 906. This structural arrangement ensures that the robotic arm 5 will inevitably pass through the ventilation channel during the transfer of the wafer 6, thereby ensuring the cleanliness of the wafer 6 surface by the dust removal system.

[0025] The top plate 906 is provided with a positioning pin, and the bottom of the bottom plate 901 is provided with a positioning hole that matches the positioning pin, so as to define the position of the positioning bracket.

[0026] The top plate 906 is also provided with a limiting mechanism consisting of a set of limiting blocks 105 and limiting posts 106. Two of the limiting blocks 105 are fixed on the vehicle positioning platform and limit the front position of the positioning bracket. A set of limiting posts 106 are evenly distributed along the side of the bottom plate 901. The bottom of the limiting posts 106 is pivotally connected to the top of the vehicle positioning platform so as to rotate relative to the top of the vehicle positioning platform. The axis of the limiting posts 106 does not coincide with its axis of rotation so as to limit the left and right positions of the bottom plate 901 by eccentric rotation.

[0027] A first detection sensor 11 is provided on the back of the top plate 906 for detecting the model of the vehicle 4. A first through hole 908 is provided on the top plate 906, directly opposite the trigger end of the first detection sensor 11. The detection principle of the first detection sensor 11 is as follows: a notch is provided on the front side of the bottom plate 901, and the first through hole 908 is positioned directly opposite the notch. When the detection light from the first detection sensor 11 passes through the first through hole 908, it is determined that the model of the vehicle 4 placed therein is correct.

[0028] A second detection sensor 12 is provided on the side plate 907. The detection end of the second detection sensor 12 is directly opposite the side of the vehicle 4 and is used to detect whether the vehicle 4 exists.

[0029] A third detection sensor 13 is provided on the side plate 907, and a second through hole 909 is provided on the chassis 901 to allow the detection light from the third detection sensor 13 to pass through, for detecting whether the carrier 4 is placed correctly. The detection principle of the third detection sensor 13 is the same as that of the first detection sensor 11, which determines whether its detection light can pass through the through hole directly opposite its detection end. Preferably, two sensors are provided on each side plate 907, and preferably two second through holes 909 are provided on each side to ensure the reliability of the detection results.

[0030] The second frame 2 is a mechanism for applying a coating, such as an adhesive layer, to the surface of the wafer 6. Therefore, the first frame 1 is also equipped with a detection camera 14 for detecting the coating status of the wafer 6 surface, and a detection light source 15 that cooperates with the detection camera 14.

[0031] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0032] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementation methods or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. An automatic wafer loading and unloading device, characterized in that: The system includes a first frame (1) and a second frame (2), which are connected by a connection port (3). The first frame (1) contains a first workbench (101), and the second frame (2) contains a second workbench (201). A carrier (4) and a robotic arm (5) are provided on the first workbench (101). Wafers (6) are arranged layer by layer from top to bottom in the carrier (4). The robotic arm (5) grabs the wafers (6) and moves them into or out of the carrier (4). A dust removal system is provided in the first frame (1). The dust removal system includes a high-efficiency filter (7), a ventilation channel, and an exhaust port (104). The high-efficiency filter (7) is located on the top of the first frame (1). The carrier (101) contains a first workbench (101), and the second workbench (201) contains a second workbench (201). 4) A ventilation opening (102) is provided on the first workbench (101) below. A cavity (103) is provided at the bottom of the first frame (1) to connect with the ventilation opening (102). The inner cavity of the first frame (1), the ventilation opening (102), and the cavity (103) form the ventilation channel. The exhaust port (104) is located on the side of the cavity (103) and is connected to the outside atmosphere. The moving range of the robot (5) is located within the ventilation channel. The high-efficiency filter (7) filters the outside air through negative pressure and blows it into the first frame (1). The airflow is discharged from the exhaust port (104) through the ventilation channel while removing dust from the surface of the wafer (6) grasped by the robot (5).

2. The automatic wafer loading and unloading device according to claim 1, characterized in that: An exhaust fan (10) is installed inside the exhaust vent (104).

3. The automatic wafer loading and unloading device according to claim 2, characterized in that: The dust removal system also includes a plasma rod (8), which is horizontally mounted between the high-efficiency filter (7) and the robotic arm (5), and located above the range of motion of the robotic arm (5), to eliminate static electricity on the surface of the wafer (6) grasped by the robotic arm (5).

4. The automatic wafer loading and unloading device according to claim 3, characterized in that: The vehicle (4) is provided with a matching positioning bracket on its exterior. The positioning bracket includes a base plate (901), positioning rods (902), a top positioning plate (903), and a rear positioning block (904). Two positioning rods (902) are vertically fixed on the left and right sides of the base plate (901) to limit the left and right positions of the vehicle (4). The top positioning plate (903) is fixed on the top of the two positioning rods (902) to limit the top position of the vehicle (4). A handle (905) is provided on the top of the top positioning plate (903). Two rear positioning blocks (904) are vertically fixed on the rear side of the base plate (901) to limit the rear position of the vehicle (4). The front side of the positioning bracket is an opening that matches the vehicle (4) so ​​that the vehicle (4) can move into or out of the positioning bracket by horizontal movement.

5. The automatic wafer loading and unloading device according to claim 4, characterized in that: The first workbench (101) is provided with a carrier positioning platform for placing the positioning bracket. The carrier positioning platform is a hollow frame consisting of a top plate (906) and side plates (907) fixed to the left and right sides of the bottom of the top plate (906). The ventilation opening (102) is located below the top plate (906). The top plate (906) is provided with a positioning pin. The bottom of the bottom plate (901) is provided with a positioning hole that matches the positioning pin to limit the position of the positioning bracket.

6. The automatic wafer loading and unloading device according to any one of claims 1-5, characterized in that: The robotic arm (5) is a Bernoulli suction cup.

7. The automatic wafer loading and unloading device according to claim 5, characterized in that: The top plate (906) is also provided with a limiting mechanism consisting of a set of limiting blocks (105) and limiting posts (106). Two of the limiting blocks (105) are fixed on the vehicle positioning platform and limit the front position of the positioning bracket. A set of limiting posts (106) are evenly distributed along the side of the bottom plate (901). The bottom of the limiting post (106) is pivotally connected to the top of the vehicle positioning platform so as to rotate relative to the top of the vehicle positioning platform. The axis of the limiting post (106) does not coincide with its axis of rotation so as to limit the left and right positions of the bottom plate (901) by eccentric rotation.

8. The automatic wafer loading and unloading device according to claim 7, characterized in that: The top plate (906) is provided with a first detection sensor (11) on the back side for detecting the model of the vehicle (4). The top plate (906) is provided with a first through hole (908) that is directly opposite the trigger end of the first detection sensor (11).

9. The automatic wafer loading and unloading device according to claim 7, characterized in that: A second detection sensor (12) is provided on the side plate (907) for detecting whether the vehicle (4) exists.

10. The automatic wafer loading and unloading device according to claim 9, characterized in that: A third detection sensor (13) is provided on the side plate (907), and a second through hole (909) is provided on the bottom plate (901) to allow the detection light of the third detection sensor (13) to pass through, for detecting whether the vehicle (4) is placed correctly.

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