An integrated heat dissipation device integrated in a chip top cover
By integrating a heat dissipation device into the chip's top cover, the problem of heat dissipation for high heat flux density is solved, achieving efficient and compact heat dissipation and adapting to the needs of different chip models.
Patent Information
- Application Number
- CN202521914396.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-09-05
AI Technical Summary
Existing chip heat dissipation solutions suffer from high heat flux density. Traditional heat sinks are either bulky or noisy, liquid cooling is expensive and difficult to balance with safety, and independent heat dissipation structures increase system complexity and introduce additional thermal resistance.
Design a heat dissipation device integrated into the top cover of a chip, including a heat dissipation top cover, a flow divider, a heat dissipation plate, and a core bare board. The device is connected by screws or adhesive, and features a working fluid flow port and micro-rib structure to form a heat exchange chamber. The cooling working fluid removes heat, and a heat spreader layer is used to improve the uniformity of heat transfer.
It achieves efficient heat dissipation and compact structure, eliminates contact thermal resistance, shortens the heat transfer path, improves the flow efficiency of cooling fluid, adapts to different application requirements, and is compatible with different chip models.
Smart Images
Figure CN224936069U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to an integrated heat dissipation device integrated into the top cover of a chip. Background Technology
[0002] With the rapid improvement in the performance of electronic devices, the continuous breakthroughs in chip computing speed and integration have led to a sharp increase in the heat generated during operation. High heat flux density has become a core bottleneck restricting chip performance. Taking CPUs, GPUs, and artificial intelligence accelerator chips in high-performance computers as examples, traditional heat dissipation solutions are facing severe challenges: air-cooled heat sinks need to increase their size or fan speed to enhance heat dissipation. The former contradicts the trend of device miniaturization, while the latter will cause serious noise problems. Although liquid cooling technology can improve heat dissipation efficiency, the complex sealed pipeline design not only increases construction and maintenance costs, but also poses a risk of coolant leakage that may directly damage the chip and surrounding components, making it difficult to balance safety and economy.
[0003] Furthermore, most existing heat dissipation structures are additional components separate from the chip's top cover. This design not only increases system installation complexity but also introduces additional thermal resistance between the chip and the heat dissipation device. Even with thermal interface materials used to fill the gaps, the impact of contact thermal resistance on heat transfer efficiency cannot be completely eliminated. Therefore, developing an integrated solution that combines high-efficiency heat dissipation with a compact structure has become an urgent problem to be solved in current chip heat dissipation research. Utility Model Content
[0004] The purpose of this invention is to overcome the shortcomings of the prior art by providing an integrated heat dissipation device that is integrated into the top cover of the chip, which can improve heat dissipation capacity while reducing structural complexity.
[0005] The objective of this utility model can be achieved through the following technical solution: An integrated heat dissipation device integrated into a chip top cover, comprising a heat dissipation top cover, a flow divider, a heat dissipation cold plate, and a core bare plate arranged from top to bottom. A chip core is mounted on the core bare plate. The heat dissipation top cover has a pair of working fluid flow ports for the inflow and outflow of cooling working fluid. The working fluid flow ports are connected to a heat sink connector. A heat dissipation cavity is provided on the side of the heat dissipation top cover facing the flow divider to accommodate the flow divider, the heat dissipation cold plate, and the chip core. The heat dissipation cold plate is tightly fitted to the chip core. A micro-rib structure is provided on the side of the heat dissipation cold plate facing the flow divider. A heat exchange cavity is provided on the side of the flow divider facing the heat dissipation cold plate. The micro-rib structure and the heat exchange cavity form a heat exchange chamber.
[0006] Preferably, the connection between the heat dissipation top cover, the distribution plate, and the heat dissipation cold plate is by screw connection, welding, or adhesive bonding, and the connection between the heat dissipation top cover and the core bare plate is by screw connection or adhesive bonding.
[0007] Furthermore, the heat exchange cavity has a hollow structure, and the flow distribution plate is provided with a flow distribution cavity and a flow collection cavity on the side facing the heat dissipation top cover. The flow distribution cavity and the flow collection cavity are symmetrically arranged at both ends of the heat exchange cavity, and the flow distribution cavity and the flow collection cavity are respectively connected to a pair of working fluid flow ports on the heat dissipation top cover.
[0008] Among them, a pair of working fluid flow ports includes a working fluid inlet and a working fluid outlet. The flow-dividing cavity is connected to the working fluid inlet, and the flow-collecting cavity is connected to the working fluid outlet. Similarly, the radiator connector includes a pair, which are connected to the pair of working fluid flow ports by means of threads or welding.
[0009] Furthermore, the heat exchange cavity is provided with several baffles arranged in parallel and spaced apart and connected end to end in sequence. The connection between two adjacent baffles is connected to the side wall of the heat exchange cavity, so that a flow channel is formed between two adjacent baffles. The flow channel includes a branch flow channel and a collection flow channel. The opening of the branch flow channel faces the branch flow cavity, and the opening of the collection flow channel faces the collection flow cavity.
[0010] The diversion channel and the collection channel are arranged adjacent to each other. After the cooling working fluid flows into the diversion cavity, it flows from the diversion channel into the heat exchange chamber to exchange heat, and then flows into the collection cavity through the collection channel and out.
[0011] Furthermore, the baffle is specifically a combination of one or more of the following structures: multi-segment structure, tangent structure, cotangent structure, sine structure, and cosine structure. The multi-segment structure includes three segments, each segment having lengths of L1, L2, and L3, and at least one of L1, L2, and L3 is not zero. Half of the width of the flow channel opening is defined as W1, and half of the width of the closed end of the flow channel is defined as W2. The included angles between two adjacent segments are θ1 and θ2, respectively. When W1 and W2 are equal and L3 is 0, the flow channel is a uniform rectangular structure.
[0012] When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure.
[0013] When W2 is 0, the flow channel has a pointed nozzle shape.
[0014] When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure.
[0015] When all parameters are not zero and the included angles θ1 and θ2 are right angles, the flow channel has a convex-like structure.
[0016] The tangential or cotangential structure specifically refers to a baffle centerline to a flow channel centerline distance of E, a flow channel total length of L4, and a tangential or cotangential amplitude of A.
[0017] The sine or cosine structure specifically refers to a distance F from the center line of the baffle to the center line of the flow channel, a total flow channel length L5, an amplitude of sine / cosine of value B, and a wavelength of λ for the sine or cosine.
[0018] Furthermore, the microrib structure is specifically a rib column or rib plate, and the height of the microrib structure is less than or equal to the depth of the heat exchange cavity.
[0019] Furthermore, the ribs are arranged in a straight line or staggered pattern, and the cross-sectional shape of the ribs is selected from one or more of the following: rectangle, trapezoid, parallelogram, triangle, circle or ellipse. The three-dimensional geometric shape of the ribs is selected from one or more of the following: prism, cone, frustum, hemisphere or umbrella shape.
[0020] When the three-dimensional geometry of the rib is umbrella-shaped, the umbrella structure is divided into two parts: a head and a root. The circumcenters of the horizontal projection contours of the root and the head coincide or are misaligned. The circumradius of the horizontal projection contour of the root is R1, and the circumradius of the horizontal projection contour of the head is R2. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2. The ratio of the circumradius of the root to the circumradius of the head is 0.1 to 10. The head and the root of the umbrella structure may have the same or different shapes. The cross-sections of the head and the root are selected from one or more of the following: rectangle, trapezoid, parallelogram, triangle, circle, and ellipse.
[0021] Furthermore, the arrangement of the ribs includes linear and wavy patterns. The shape of the wavy pattern includes square wave, trapezoidal wave, triangular wave, and sine wave. The organization of the wavy pattern includes array and adjacent symmetry. The amplitude and the width of the crests and troughs of the wavy pattern are designed and adjusted according to the local heat flux density.
[0022] It should be noted that the shape of the microrib structure is not limited to the types listed above, and can be adapted to the chip's heat dissipation requirements, the material characteristics of the top cover, and the processing conditions.
[0023] Furthermore, the microrib structure is provided with capillary structures, and the thickness ratio of the capillary structures on the microrib structure is ≥0.
[0024] When the thickness of the capillary structure on the microrib structure is 0%, the microrib structure is a completely solid structure.
[0025] When the thickness of the capillary structure on the microrib structure accounts for 100%, the microrib structure is a completely porous capillary structure.
[0026] Furthermore, the heat dissipation plate has a bottom capillary structure on one side surface where the micro-rib structure is provided, and the thickness of the bottom capillary structure is ≥0.
[0027] When the thickness of the bottom capillary structure is 0, the side surface of the heat dissipation plate with the micro-rib structure is a smooth surface.
[0028] Furthermore, a heat dissipation layer for improving heat dissipation efficiency is provided between the heat dissipation plate and the core bare board. The heat dissipation layer is tightly bonded to the heat dissipation plate and the chip core by coating a thermal interface material or by welding. The heat dissipation layer is selected from one of the following: heat dissipation plate, high thermal conductivity graphite film, graphene film, diamond film, boron nitride nanosheets, copper-graphite composite layer or carbon fiber reinforced composite material.
[0029] Compared with the prior art, the present invention has the following advantages:
[0030] This invention features a heat dissipation top cover, a heat dissipation plate, a heat dissipation cold plate, and a core bare board arranged from top to bottom. The core bare board houses the chip core, and the heat dissipation cold plate is tightly fitted to the chip core. The heat dissipation top cover has a pair of working fluid flow ports for the inflow and outflow of cooling fluid. A heat dissipation cavity is provided on the side of the heat dissipation top cover facing the heat dissipation plate to accommodate the heat dissipation plate, heat dissipation cold plate, and chip core. A micro-rib structure is provided on the side of the heat dissipation cold plate facing the heat dissipation plate, and a heat exchange cavity is provided on the side of the heat dissipation plate facing the heat dissipation cold plate, forming a heat exchange chamber between the micro-rib structure and the heat exchange cavity. This integrates the heat dissipation structure with the chip top cover, significantly reducing structural complexity and improving structural compactness. The heat from the chip core is directly conducted to the heat exchange chamber through the heat dissipation cold plate and carried away by the flowing cooling fluid, eliminating contact thermal resistance, shortening the heat transfer path, and thus rapidly handling high heat flux densities.
[0031] This invention features a heat exchange cavity on the side of the distribution plate facing the heat dissipation plate. This cavity has a hollow structure, with symmetrically arranged flow-dividing and flow-collecting cavities at both ends. Within the heat exchange cavity are several baffles arranged in parallel at intervals and connected end-to-end. The connection point between adjacent baffles is connected to the sidewall of the heat exchange cavity, forming a flow-dividing channel and a flow-collecting channel between adjacent baffles. The opening of the flow-dividing channel faces the flow-dividing cavity, and the opening of the flow-collecting channel faces the flow-collecting cavity. When the cooling medium flows into the flow-dividing cavity, it flows from the flow-dividing channel into the heat exchange chamber for heat exchange, then flows through the flow-collecting channel into the flow-collecting cavity before exiting. This significantly improves the flow efficiency of the cooling medium, ensuring efficient and reliable removal of heat from the chip.
[0032] The baffles inside the heat exchange cavity of this utility model can adopt different structures, thereby forming flow channels with different structural forms. The micro-rib structure can adopt different structural forms and arrangements, which can flexibly adapt to different application needs.
[0033] This invention incorporates capillary structures on the surface of the micro-rib structure and the heat dissipation plate to promote the distribution of the cooling working fluid and enhance heat conduction through capillary action.
[0034] This invention sets up a heat dissipation layer between the heat dissipation plate and the core bare board. The heat dissipation layer makes the heat transfer more uniform. When the cooling medium flows into the heat exchange chamber and comes into full contact with the micro-rib structure set on the heat dissipation plate, the heat generated by the chip operation will be transferred to the cooling medium faster and more uniformly, thereby eliminating the danger of local dryness and achieving high-efficiency heat exchange. Attached Figure Description
[0035] Figure 1 This is an exploded view of the overall structure of the heat dissipation device in Example 1;
[0036] Figure 2 This is a schematic diagram of the front of the heat sink cover (i.e., the side of the heat sink cover facing away from the heatsink plate).
[0037] Figure 3 This is a schematic diagram of the structure of the back of the heat sink cover (i.e., the side of the heat sink cover facing the distribution plate);
[0038] Figure 4 This is a schematic diagram of the radiator connector structure;
[0039] Figure 5 This is a structural diagram of the front of the manifold (i.e., the side of the manifold facing the heat sink cover);
[0040] Figure 6 This is a structural diagram of the back of the manifold (i.e., the side of the manifold facing the heat dissipation plate);
[0041] Figure 7 This is a schematic diagram of the split / collection structure;
[0042] Figure 8 This is a schematic diagram of the front of the heat dissipation plate (i.e., the side of the heat dissipation plate facing the distribution plate);
[0043] Figure 9 This is a schematic diagram of the structure on the back of the heat dissipation plate (i.e., the side of the heat dissipation plate facing away from the distribution plate);
[0044] Figure 10 This is a schematic diagram of a microrib structure that is a rib-column structure.
[0045] Figure 11 A schematic diagram of the shape of a microrib structure as a rib column;
[0046] Figure 12 A schematic diagram of an umbrella-shaped ribbed column structure with overlapping and misaligned centers of gravity;
[0047] Figure 13 This is a schematic diagram showing the shape of the microrib structure as ribs;
[0048] Figure 14 This is a schematic diagram of the front of the heat dissipation layer (i.e., the side where the heat dissipation layer is connected to the heat sink).
[0049] Figure 15 This is a schematic diagram of the structure on the back side of the heat exchange layer (i.e., the side where the heat exchange layer is connected to the core bare plate);
[0050] Figure 16 This is a schematic diagram of the front of the core bare board (i.e., the side of the core bare board facing the heat sink).
[0051] Figure 17 This is a schematic diagram of the structure on the back of the core bare board (i.e., the side of the core bare board facing away from the heat sink).
[0052] Figure 18 A schematic diagram of the capillary structure of a heat dissipation plate;
[0053] Figure 19 This is a cross-sectional view of the overall structure of the heat dissipation device in Example 1;
[0054] Figure 20 This is an exploded view of the overall structure of the heat dissipation device in Example 2, where the heat dissipation plate has a bowl-shaped structure.
[0055] Explanation of markings in the diagram: 1. Heat dissipation top cover; 101. Front of heat dissipation top cover; 102. Working fluid inlet; 103. Working fluid outlet; 104. Heat dissipation cavity; 105. Back of heat dissipation top cover.
[0056] 2. Diverter plate, 201. Front of diverter plate, 202. Diverter cavity, 203. Collector cavity, 204. Diverter channel, 205. Collector channel, 206. Baffle, 207. Back of diverter plate, 208. Heat exchange cavity.
[0057] 3. Heat dissipation plate, 301. Front of heat dissipation plate, 302. Rib structure, 303. Micro-rib structure, 304. Back of heat dissipation plate, 305. Rib column structure, 306. Bowl-shaped heat dissipation plate, 310. Capillary structure, 311. Bottom capillary structure.
[0058] 4. Radiator connector; 41. Connector structure; 42. Bottom surface structure;
[0059] 5. Heat dissipation layer; 501. Front side of heat dissipation layer; 502. Back side of heat dissipation layer;
[0060] 6. Core bare board, 601. Front of motherboard, 602. Chip core, 603. Back of motherboard. Detailed Implementation
[0061] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.
[0062] Example 1
[0063] like Figure 1 ,2 As shown in Figure 3, this embodiment provides an integrated heat dissipation device integrated into the chip top cover, including: a heat dissipation top cover 1, a flow divider 2, a heat dissipation cold plate 3, a heat sink connector 4, a heat spreader layer 5, and a core bare plate 6. The front side 101 of the heat dissipation top cover is provided with a pair of working fluid flow ports (working fluid inlet 102 and working fluid outlet 103) for corresponding connection to a pair of heat sink connectors 4. The flow divider 2, the heat dissipation cold plate 3, the heat spreader layer 5, and the core bare plate 6 are carried in the heat dissipation cavity 104 on the back side 105 of the heat dissipation top cover.
[0064] In practical applications, the materials of the heat dissipation top cover 1, the heat dissipation plate 2, the heat dissipation cold plate 3, and the heat sink connector 4 can be selected from one or more of the following: copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic, or glass. The connection method between the heat dissipation top cover 1, the heat dissipation plate 2, and the heat dissipation cold plate 3 can be screw connection, welding, or adhesive bonding. The connection method between the heat dissipation top cover 1 and the core bare plate 6 can be screw connection or adhesive bonding. In this embodiment, the connection method between the heat dissipation top cover 1 and the core bare plate 6 is adhesive bonding.
[0065] like Figure 4 As shown, the radiator connector 4 is provided with a connector structure 41 and a bottom structure 42, which are used to realize pipeline connection and connector installation respectively. The radiator connector 4 is connected to a pair of working fluid flow ports by means of threads to cool the input and output of the working fluid.
[0066] like Figure 5 and 6 As shown, the flow divider 2 has a hollowed-out heat exchange cavity 208, and the front side 201 of the flow divider 2 also has a flow dividing cavity 202 and a flow collecting cavity 203 located at opposite ends of the heat exchange cavity 208. The flow dividing cavity 202 is connected to the working fluid inlet 102, and the flow collecting cavity 203 is connected to the working fluid outlet 103. The heat exchange cavity 208 has several baffles 206 arranged in parallel and spaced apart and connected end to end in sequence. The connecting part of two adjacent baffles 206 is also connected to the side wall of the heat exchange cavity 208. This creates a flow channel between two adjacent baffles 206, including a flow channel 204 with its opening facing the flow distribution cavity 202 and a flow collection channel 205 with its opening facing the flow collection cavity 203. The flow distribution channel 204 and the flow collection channel 205 are arranged adjacent to each other. The cooling working fluid flows into the flow distribution cavity 202 through the working fluid inlet 102, then flows into the heat exchange cavity 208 through the flow distribution channel 204 to exchange heat, then flows into the flow collection cavity 203 through the flow collection channel 205, and finally flows out through the working fluid outlet 103.
[0067] like Figure 7As shown, the structure of baffle 206 includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure. When baffle 206 is a multi-segment structure, baffle 206 includes three segments, the lengths of each segment being L1, L2, and L3 respectively, and at least one of L1, L2, and L3 is not zero. Half of the width of the flow channel opening is defined as W1, half of the width of the closed end of the flow channel is defined as W2, the included angles between two adjacent segments are θ1 and θ2 respectively, and the width of baffle 206 is D1.
[0068] When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure.
[0069] When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure.
[0070] When W2 is 0, the flow channel has a pointed nozzle shape.
[0071] When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure.
[0072] When all parameters are not zero and the included angles θ1 and θ2 are right angles, the flow channel has a convex-like structure.
[0073] When the baffle 206 structure is a tangential structure or a cotangential structure, the center line of the baffle 206 is defined as follows: the distance from the y-axis to the center line of the flow channel is E, the total length of the flow channel is L4, the amplitude of the tangential or cotangential structure is A, and the width of the baffle 206 is D2.
[0074] When the baffle 206 structure is a sine or cosine structure, the center line of the baffle 206 is defined as follows: the distance from the x-axis to the center line of the flow channel is F, the total length of the flow channel is L5, the amplitude of the sine / cosine is B, the wavelength of the sine or cosine is λ, and the width of the baffle 206 is D3.
[0075] like Figures 8-10 As shown, the heat dissipation plate 3 is provided with micro-rib structures 303 corresponding to the heat exchange cavity 211 and used to enhance heat exchange. The micro-rib structures 303 are selected from one of the rib pillar 305 and rib 302 structures, and are arranged on the front side 301 of the heat dissipation plate. The micro-rib structures 303 and the heat exchange cavity 208 on the back side 207 of the diversion plate form a heat exchange chamber.
[0076] like Figure 10 , Figure 11 and Figure 12 As shown, when the microrib structure 303 is a rib column 305, the arrangement of the rib columns 305 is either straight or staggered. The cross-sectional shape of the rib column 305 is selected from one or more of the following: rectangular, trapezoidal, parallelogram, triangular, circular or elliptical. The three-dimensional geometric shape of the rib column 305 is selected from one or more of the following: column, cone, frustum, hemispherical or umbrella-shaped.
[0077] When the three-dimensional geometry of rib 305 is umbrella-shaped, the umbrella structure is divided into two parts: the head and the root. The circumcenters of the horizontal projection contours of the root and the head coincide or are misaligned. The circumradius of the horizontal projection contour of the root is denoted as R1, and the circumradius of the horizontal projection contour of the head is denoted as R2. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2. The ratio of the circumradius of the root to the circumradius of the head is 0.1 to 10. The head and the root of the umbrella structure may have the same or different shapes. The cross-sections of the head and the root are selected from one or more of the following: rectangle, trapezoid, parallelogram, triangle, circle, and ellipse.
[0078] like Figure 8 and Figure 13 As shown, when the microrib structure 303 is a rib 302, the arrangement of the ribs 302 includes straight lines and wavy lines; the shape of the wavy line rib 302 includes square waves, trapezoidal waves, triangular waves and sine waves, and the organization of the wavy line rib 302 includes arrays and adjacent symmetry; the distance between two adjacent ribs is defined as C, the amplitude of the wavy line rib 302 is H1, the crest width is H2, and the trough width is H3. The amplitude and crest and trough width of the wavy line rib 302 are designed and adjusted according to the local heat flux density.
[0079] In practical applications, the shape of the micro-rib structure 303 is not limited to the types listed above, and can be adapted to meet the heat dissipation requirements of the chip, the material properties of the heat dissipation cover 1, and the processing conditions.
[0080] In this embodiment, a heat dissipation layer 5 is provided between the heat dissipation plate 3 and the core bare plate 6, such as Figures 14-17 The front side 501 of the heat spreader layer is tightly bonded to the back side 304 of the heat sink, and the chip core 602 on the core bare board 6 is tightly bonded to the back side 502 of the heat spreader layer. The front side 501 of the heat spreader layer can be tightly bonded to the back side 304 of the heat sink by applying a thermal interface material or by welding; the back side 502 of the heat spreader layer can also be tightly bonded to the chip core 602 by applying a thermal interface material or by welding. The heat spreader layer 5 can be selected from one of the following: heat spreader plate, high thermal conductivity graphite film, graphene film, diamond film, boron nitride nanosheets, copper-graphite composite layer, or carbon fiber reinforced composite material.
[0081] like Figure 18 As shown, in this embodiment, a plurality of capillary structures 310 are also provided on the microrib structure 303. The thickness ratio of the capillary structures 310 on the microrib structure 303 is ≥0. When the thickness ratio of the capillary structures 310 on the microrib structure 303 is 0%, the microrib structure 303 is a completely solid structure. When the thickness ratio of the capillary structures 310 on the microrib structure 303 is 100%, the microrib structure 303 is composed of a completely porous capillary structure.
[0082] In addition, a multi-layer bottom capillary structure 311 is provided on one side surface of the heat dissipation plate 3 where the micro-rib structure 303 is provided, and the thickness of the bottom capillary structure 310 is ≥0; when the thickness of the bottom capillary structure 310 is 0, the side surface of the heat dissipation plate 3 where the micro-rib structure 303 is provided is a smooth surface.
[0083] Both the capillary structure 310 and the bottom capillary structure 311 are porous capillary structures. The porous capillary structure can be constructed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering.
[0084] like Figure 19 As shown, the basic application principle of the heat dissipation device provided in this embodiment is as follows: the low-temperature cooling medium enters the diversion cavity 202 through the heat sink connector 4 on one side, enters the heat exchange cavity 211 along the diversion channel 204, takes away the heat conducted by the high-temperature chip to the heat dissipation plate 3, and enters the collection cavity 203 along the collection channel 205, and finally is discharged to the external circulation pipeline through the heat sink connector 4 on the other side.
[0085] Example 2
[0086] like Figure 20 As shown, the difference between this embodiment and embodiment 1 is that a bowl-shaped heat dissipation plate 306 is used, and the micro-rib structure is located inside the bowl-shaped structure. This is significantly different from the heat dissipation plate 3 structure design in embodiment 1. However, the final heat dissipation effect is just as excellent as that of the planar heat dissipation plate in embodiment 1, which can fully meet the heat dissipation requirements of the chip during operation and ensure that the chip works stably and efficiently.
[0087] In summary, this solution integrates the heat dissipation structure into the chip top cover, eliminating contact thermal resistance and shortening the heat transfer path to quickly handle high heat flux density. Furthermore, it optimizes the working fluid flow and heat exchange design, improving heat dissipation efficiency. The integrated design eliminates independent components, significantly reducing the thickness of the integrated chip device and adapting to miniaturization and high-density integration requirements. This solution can be customized for different chip models without altering the core chip structure, facilitating compatibility with various integrated chip devices and providing an efficient solution for chip heat dissipation.
Claims
1. An integrated heat dissipation device integrated into the top cover of a chip, characterized in that, The device includes a heat dissipation top cover (1), a flow divider (2), a heat dissipation cold plate (3), and a core bare plate (6) arranged from top to bottom. A chip core (602) is installed on the core bare plate (6). A pair of working fluid flow ports for cooling working fluid inflow and outflow are provided on the heat dissipation top cover (1). The working fluid flow ports are connected to the heat sink connector (4). A heat dissipation cavity (104) is provided on the side of the heat dissipation top cover (1) facing the flow divider (2) to accommodate the flow divider (2), the heat dissipation cold plate (3), and the chip core (602). The heat dissipation cold plate (3) is tightly attached to the chip core (602). A micro rib structure (303) is provided on the side of the heat dissipation cold plate (2) facing the flow divider (2). A heat exchange cavity (208) is provided on the side of the flow divider (2) facing the heat dissipation cold plate (3). The micro rib structure (303) and the heat exchange cavity (208) form a heat exchange chamber.
2. The integrated heat dissipation device integrated into the chip top cover according to claim 1, characterized in that, The heat exchange cavity (208) has a hollow structure. The flow distribution plate (2) is provided with a flow distribution cavity (202) and a flow collection cavity (203) on the side facing the heat dissipation top cover (1). The flow distribution cavity (202) and the flow collection cavity (203) are symmetrically arranged at both ends of the heat exchange cavity (208). The flow distribution cavity (202) and the flow collection cavity (203) are respectively connected to a pair of working fluid flow ports on the heat dissipation top cover (1).
3. The integrated heat dissipation device integrated into the chip top cover according to claim 1, characterized in that, The heat exchange cavity (208) is provided with a number of baffles (206) arranged in parallel and connected end to end. The connection between two adjacent baffles (206) is connected to the side wall of the heat exchange cavity (208), so that a flow channel is formed between two adjacent baffles (206). The flow channel includes a branch flow channel (204) and a collection flow channel (205). The opening of the branch flow channel (204) faces the branch cavity (202), and the opening of the collection flow channel (205) faces the collection cavity (203). The diversion channel (204) and the collection channel (205) are arranged adjacent to each other. After the cooling working fluid flows into the diversion cavity (202), it flows into the heat exchange chamber through the diversion channel (204) to exchange heat, and then flows into the collection cavity (203) through the collection channel (205) and then flows out.
4. The integrated heat dissipation device integrated into the chip top cover according to claim 3, characterized in that, The baffle (206) is specifically a combination of one or more of the following structures: multi-segment structure, tangent structure, cotangent structure, sine structure, and cosine structure. The multi-segment structure includes three segments, each segment having lengths L1, L2, and L3, with at least one of L1, L2, and L3 being non-zero. Half the width of the flow channel opening is defined as W1, and half the width of the closed end of the flow channel is defined as W2. The included angles between adjacent segments are respectively... When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure. When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure. When W2 is 0, the flow channel has a pointed nozzle shape. When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure. When all parameters are not zero, and the included angle When the angle is right, the flow channel has a convex-like structure; The tangential or cotangential structure specifically refers to a distance of E from the center line of the baffle (206) to the center line of the flow channel, a total flow channel length of L4, and an amplitude of A for the tangential or cotangential structure. The sine or cosine structure specifically refers to a distance F from the centerline of the baffle (206) to the centerline of the flow channel, a total flow channel length L5, an amplitude of sine / cosine of value B, and a wavelength of sine or cosine of value B. .
5. The integrated heat dissipation device integrated into the chip top cover according to claim 1, characterized in that, The micro-rib structure (303) is specifically a rib column (305) or a rib plate (302), and the height of the micro-rib structure (303) is less than or equal to the depth of the heat exchange cavity (208).
6. The integrated heat dissipation device integrated into the chip top cover according to claim 5, characterized in that, The ribs (305) are arranged in a straight line or staggered pattern. The cross-sectional shape of the ribs (305) is selected from one or more of the following: rectangle, trapezoid, parallelogram, triangle, circle or ellipse. The three-dimensional geometric shape of the ribs (305) is selected from one or more of the following: prism, cone, frustum, hemisphere or umbrella shape. When the three-dimensional geometry of the rib (305) is umbrella-shaped, the umbrella structure is divided into two parts: a head and a root. The circumcenter of the horizontal projection contour of the root coincides with or is misaligned with that of the head. The circumcircle radius of the horizontal projection contour of the root is R1, and the circumcircle radius of the horizontal projection contour of the head is R2. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2. The ratio of the circumcircle radius of the root to the circumcircle radius of the head is 0.1 to 10. The head and the root of the umbrella structure may have the same or different shapes. The cross-sections of the head and the root are selected from one or more of the following: rectangle, trapezoid, parallelogram, triangle, circle, and ellipse.
7. The integrated heat dissipation device integrated into the chip top cover according to claim 5, characterized in that, The arrangement of the ribs (302) includes straight lines and wavy lines. The shape of the wavy lines includes square waves, trapezoidal waves, triangular waves and sine waves. The organization of the wavy lines includes arrays and adjacent symmetry. The amplitude and the width of the peaks and valleys of the wavy lines are designed and adjusted according to the local heat flux density.
8. The integrated heat dissipation device integrated into the chip top cover according to claim 5, characterized in that, The microrib structure (303) is provided with capillary structures (310), and the thickness ratio of the capillary structures (310) on the microrib structure (303) is ≥0. When the thickness ratio of the capillary structure (310) on the microrib structure (303) is 0%, the microrib structure (303) is a completely solid structure. When the thickness ratio of the capillary structure (310) on the microrib structure (303) is 100%, the microrib structure (303) is a completely porous capillary structure (310).
9. The integrated heat dissipation device integrated into the chip top cover according to claim 8, characterized in that, The heat dissipation plate (3) has a micro-rib structure (303) on one side surface with a bottom capillary structure (311), and the thickness of the bottom capillary structure (311) is ≥0. When the thickness of the bottom capillary structure (311) is 0, the surface of the heat dissipation plate (3) with the micro-rib structure (303) is a smooth surface.
10. The integrated heat dissipation device integrated into the chip top cover according to claim 1, characterized in that, A heat dissipation layer (5) for improving heat dissipation efficiency is provided between the heat dissipation plate (3) and the core bare board (6). The heat dissipation layer (5) is tightly bonded to the heat dissipation plate (3) and the chip core (602) by applying thermal interface material or welding. The heat dissipation layer (5) is selected from one of the following: heat dissipation plate, high thermal conductivity graphite film, graphene film, diamond film, boron nitride nanosheet, copper-graphite composite layer or carbon fiber reinforced composite material.