Reinforced heat exchange surface with composite structure and chip heat dissipation structure

Abstract

The utility model relates to a kind of reinforced heat exchange surface and chip heat dissipation structure with composite structure, and reinforced heat exchange surface includes: bottom plate, metal frame, bubble escape hole and porous medium, bottom plate and metal frame are integrated structure, porous medium is located on the upper surface of bottom plate, and porous medium filled in frame is provided with bubble escape hole;Chip heat dissipation structure includes: first cover plate, first radiator connector, bottom plate and the reinforced heat exchange surface set on the upper surface of bottom plate, and bottom plate is tightly connected with first cover plate, first cover plate is provided with fixed mounting hole so that bottom plate bottom surface and chip are tightly adhered by connecting structure, and first cover plate and reinforced heat exchange surface form heat exchange cavity between them.Compared with prior art, the utility model designs reinforced heat exchange surface with multiple structure composite, realizes the synergistic effect of fast bubble nucleation and directional bubble escape, can simultaneously improve critical heat flux density and heat transfer coefficient, effectively avoid chip frequency reduction due to overheating, ensure that chip is stably operated under high load.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a reinforced heat exchange surface with a composite structure and a chip heat dissipation structure. Background Technology

[0002] As electronic devices continue to advance towards miniaturization, high integration, and high performance, chips, as the core components of electronic devices, are becoming increasingly integrated and powerful. However, this also leads to a sharp increase in the heat generated by chips during operation. The heat dissipation challenge for chips is becoming increasingly prominent, especially in fields such as 5G communication base stations, data centers, and high-performance computers.

[0003] Traditional air cooling has the advantages of simple structure and low cost, but its heat transfer efficiency is no longer sufficient to meet the increasing heat flux density of chips. It cannot dissipate the heat generated by the chips in a timely and effective manner, resulting in excessively high chip temperature, which in turn affects performance and stability, and may even cause chip damage.

[0004] In existing research, liquid cooling technology has emerged, among which immersion boiling heat transfer technology has shown certain advantages. However, commonly used electronic coolants have shortcomings such as low surface tension, latent heat of vaporization, and low thermal conductivity, making it difficult to improve the heat transfer coefficient and critical heat flux density. At the same time, the silicon substrate surface of traditional microelectronic devices is mostly smooth, with few vaporization nuclei, which greatly hinders the boiling initiation and severely restricts further improvement of heat dissipation efficiency, which is not conducive to the stable and reliable use of chips under high load conditions. Utility Model Content

[0005] The purpose of this invention is to overcome the defects of the prior art by providing a reinforced heat exchange surface and chip heat dissipation structure with a composite structure, which can improve the critical heat flux density and heat transfer coefficient, and ensure stable operation of the chip under high load.

[0006] The purpose of this utility model can be achieved through the following technical solution: a reinforced heat exchange surface with a composite structure, including an integrated base plate and a metal frame, wherein the metal frame is located above the base plate, and a porous medium is provided on the upper surface of the base plate, wherein the porous medium is filled in the metal frame and has bubble venting holes.

[0007] Furthermore, the metal frame includes multiple baffles, which are arranged in a spaced or cross-arranged structure. When the spaced arrangement is used, the multiple baffles all come from the same direction, and the area between two adjacent baffles constitutes the minimum structural area.

[0008] When a cross-arrangement structure is adopted, multiple baffles come from different directions, and the smallest two-dimensional enclosed space enclosed between two intersecting baffles constitutes the smallest structural unit.

[0009] Furthermore, the baffle is specifically linear or wavy. The shape of the wavy baffle includes square wave, trapezoidal wave, triangular wave and sine wave. The organization of the wavy baffle includes array and adjacent symmetry. The amplitude and the width of the crest and trough of the wavy baffle are designed and adjusted according to the local heat flux density.

[0010] Furthermore, the shape of the bubble vent is one or more of the following: circular, semi-circular, elliptical, semi-elliptical, triangular, rectangular, trapezoidal, parallelogram, rhombus, pentagonal, hexagonal, polygonal, cross-shaped, rice-shaped, snowflake-shaped, crescent-shaped, and five-pointed star-shaped.

[0011] Furthermore, the minimum structural unit is provided with one or more bubble escaping holes, and the arrangement of the bubble escaping holes in the minimum structural unit includes uniform arrangement, gradually varying spacing arrangement, random arrangement, and specific pattern arrangement; the bubble escaping holes are arranged at the full wave section, wave crest, or wave trough position of the wave-shaped baffle.

[0012] Furthermore, the minimum structural region is provided with one or more rows of bubble escaping holes, and the arrangement of the bubble escaping holes in the minimum structural region includes uniform arrangement, gradually varying spacing arrangement, random arrangement and special linear arrangement; the bubble escaping holes are arranged at the full wave section, wave crest or wave trough position of the wave-shaped baffle.

[0013] Furthermore, the uniform arrangement specifically means that the distance between any two adjacent bubble vents is equal in any direction;

[0014] The gradual spacing arrangement specifically refers to the micro-hole spacing S1 and S2 along different directions gradually increasing or decreasing according to the set corresponding change rate α, with the central micro-hole or a designated micro-hole as the origin.

[0015] The random arrangement specifically refers to the variation of the distances S1 and S2 between any two bubble vents within a set range, forming a microstructure surface that resembles a natural distribution.

[0016] Furthermore, the specific pattern arrangement includes one or more combinations of single-hole, spaced double-hole, three-hole triangle, four-hole rectangle, four-hole "human" shape, five-hole "X" shape, five-hole pentagon, and six-hole pentagon.

[0017] Furthermore, the special linear arrangement includes straight line arrangement and wave line arrangement. The wave line arrangement includes square wave line, trapezoidal wave line, triangular wave line and sine wave line arrangement. The special line arrangement is a combination of one or more of the above line shapes. The organization form of the special line arrangement includes array and adjacent symmetry. The amplitude and peak and valley width of the wave line are designed and adjusted according to the local heat flux density.

[0018] Furthermore, the depth of the bubble escaping hole is L1, and the thickness of the porous medium is L2;

[0019] When L1 < L2, the bubble escaping hole is located inside the porous medium region, and the endpoint of the bubble escaping hole is higher than the upper surface of the bottom plate.

[0020] When L1 = L2, the bubble escape hole passes through the porous medium region, and the end point of the bubble escape hole is located on the upper surface of the bottom plate (1);

[0021] When L1 > L2, the bubble escaping hole passes through the porous medium and the upper surface of the base plate, and the endpoint of the bubble escaping hole is located inside the base plate area.

[0022] Furthermore, the thickness of the porous medium is L2, and the height of the baffle is L3;

[0023] When L2 < L3, the upper surface of the porous medium is lower than the upper surface of the baffle.

[0024] When L2 = L3, the upper surface of the porous medium is flush with the upper surface of the baffle.

[0025] When L2 > L3, the upper surface of the porous medium is higher than the upper surface of the baffle.

[0026] Furthermore, the porous medium is selected from one or more of metal powder, metal wire, metal mesh and metal foam, and the porous medium achieves a stable porous structure through methods such as sintering, pressing, bonding, stacking, deposition, and chemical etching.

[0027] A chip heat dissipation structure includes a first cover plate mounted on top of an enhanced heat exchange surface. The first cover plate is equipped with a first radiator connector for the inflow and outflow of a cooling medium. The first radiator connector is connected to a medium flow port on the first cover plate. The first cover plate has a fixing hole for the bottom surface of the enhanced heat exchange surface to be tightly fitted to the chip through a connection structure. A low-temperature cooling medium enters the heat exchange cavity formed by the enhanced heat exchange surface and the first cover plate through the first radiator connector, where it undergoes boiling heat exchange, carrying away the heat conducted from the high-temperature chip to the enhanced heat exchange surface, and then is discharged to an external circulation pipeline through the first radiator connector.

[0028] Compared with the prior art, the present invention has the following advantages:

[0029] This invention proposes an enhanced heat exchange surface, comprising an integrated base plate and a metal frame, wherein the metal frame is located above the base plate, and a porous medium is provided on the upper surface of the base plate. The porous medium is filled in the metal frame and has bubble venting holes. By utilizing the porous medium and bubble venting holes, bubble nucleation and bubble escape can be achieved, which can improve the critical heat flux density and heat transfer coefficient, thereby improving heat dissipation efficiency.

[0030] This invention, on the one hand, designs the baffles in the metal frame to adopt different arrangements, and designs the baffle types to be linear and corrugated. On the other hand, it designs the bubble escaping holes to adopt different shapes, and designs the arrangement and position of the bubble escaping holes under different baffle arrangements. In addition, it designs different combination schemes of bubble escaping holes, porous media and baffles, thereby realizing a multi-structure composite enhanced heat transfer surface, further realizing the synergistic effect of rapid bubble nucleation and directional bubble escape, and significantly improving the critical heat flux density and heat transfer coefficient.

[0031] This invention proposes a chip heat dissipation structure that combines a reinforced heat exchange surface. By installing a first cover plate above the reinforced heat exchange surface, a heat exchange cavity is formed between the reinforced heat exchange surface and the first cover plate. Then, by using the fixing and mounting holes opened on the first cover plate, the bottom surface of the base plate of the reinforced heat exchange surface and the chip are tightly attached to each other through the connection structure. When the cooling medium flows into the heat exchange cavity through the first heat sink joint installed on the first cover plate, the heat of the high-temperature chip can be carried away through efficient boiling heat exchange, ensuring that the chip can operate stably and reliably under high load. Attached Figure Description

[0032] Figure 1 Schematic diagram for enhancing heat exchange surfaces;

[0033] Figure 2 This is a diagram showing the arrangement parameters of the metal frame in this utility model;

[0034] Figure 3 This is a schematic diagram of the cross-arrangement of the metal frames in this utility model;

[0035] Figure 4 This is a schematic diagram of the metal frame baffle type in this utility model;

[0036] Figure 5 This is a schematic diagram of the spaced arrangement of the metal frame in this utility model;

[0037] Figure 6 This is a schematic diagram of the shape of the bubble escaping hole in this utility model;

[0038] Figure 7 This is a schematic diagram showing the arrangement of the bubble escaping holes in this utility model;

[0039] Figure 8 This is a schematic diagram of the arrangement of the bubble escaping holes in this utility model;

[0040] Figure 9 This is a schematic diagram of the specific pattern arrangement of the bubble escaping holes in this utility model;

[0041] Figure 10 This is a schematic diagram showing the number of rows of bubble escaping holes within the intermediate spacer frame of this utility model;

[0042] Figure 11 This is a schematic diagram of the special linear arrangement of the bubble escaping holes in this utility model;

[0043] Figure 12 This is a schematic diagram comparing the thickness of the porous medium, the depth of the pores, and the height of the baffle in this utility model;

[0044] Figure 13 This is an exploded view of the overall CPU heat dissipation structure in the embodiment;

[0045] Figure 14 This is an exploded view of the overall GPU heat dissipation structure in the embodiment.

[0046] Figure 15 This is a schematic diagram illustrating the heat dissipation principle of the chip heat dissipation structure in this utility model;

[0047] The markings in the diagram are as follows: 1. Base plate; 2. Metal frame; 21. First baffle; 22. Second baffle; 3. Bubble vent; 4. Porous medium; 101. First cover plate; 102. First radiator connector; 103. Working fluid flow port; 104. Fixing hole; 105. First screw; 111. Second cover plate; 112. Main board; 113. Fixed base plate; 114. Second radiator connector; 115. Working fluid inlet / outlet; 116. Second screw; 117. Third screw. Detailed Implementation

[0048] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0049] Example

[0050] like Figure 1 As shown, a reinforced heat exchange surface with a composite structure includes: a base plate 1, a metal frame 2, bubble venting pores 3, and a porous medium 4. The base plate 1 and the metal frame 2 are integrally formed. The porous medium 4 is selected from one or more mixtures of metal powder, metal wire, metal mesh, and metal foam. The porous medium 4 is deposited on the upper surface of the base plate 1 by methods such as sintering, pressing, adhesive bonding, stacking, deposition, and chemical etching to form a stable porous structure. The porous medium 4 filling the frame 2 is provided with bubble venting pores 3.

[0051] As shown in Figures 2-5 , the metal frame 2 is composed of a plurality of baffles. When all the baffles extend from the same direction, all the baffles are parallel to each other;

[0052] When all the baffles extend from the same direction, the baffles of the frame 2 are arranged at intervals; the distance between two adjacent baffles is defined as C, the wall thickness W of the baffle is 0-10 mm, including a deformation with a dimension of 0, and the area between two adjacent baffles is the minimum structural region;

[0053] When all the baffles extend from two different directions, the baffles of the frame 2 are arranged in a crossed manner. The minimum structural unit is defined as the minimum two-dimensional enclosed space enclosed by the adjacent first baffle 21 and second baffle 22, the distance between adjacent first baffles 21 is defined as A1, the distance between adjacent second baffles 22 is defined as A2, the included angle of the crossed baffles is R1, the included angle between the first baffle 21 and the vertical direction is R2, the included angle between the second baffle 22 and the horizontal direction is R3, and the wall thickness W of the baffle is 0-10 mm, including a deformation with a dimension of 0,

[0054] When both the included angles R2 and R3 are right angles, the first baffle 21 and the second baffle 22 are perpendicular to each other, and the structure of the frame 2 is a rectangular structure;

[0055] When neither of the included angles R2 and R3 is a right angle and A1 and A2 are not equal, the structure of the frame 2 is a parallelogram structure, and if A1 and A2 are equal, the structure of the frame 2 is a rhombus structure;

[0056] The types of baffles include linear type and wavy type; the metal frame 2 is formed by combining one or more types of baffles; the shape of the wavy baffle includes square wave, trapezoidal wave, triangular wave and sine wave, and the arrangement form of the wavy baffles includes array and adjacent symmetry; the amplitude of the wavy baffle is defined as B1, the peak width is B2, the valley width is B3, and the amplitude and the peak and valley widths of the wavy baffle are designed and adjusted according to the local heat flux density.

[0057] As shown in Figure 6 , the shape features of the bubble escape hole 3 include one or a combination of shapes such as circle, semicircle, ellipse, semi-ellipse, triangle, rectangle, trapezoid, parallelogram, rhombus, pentagon, hexagon, polygon, cross shape, asterisk shape, snowflake shape, crescent shape, and pentagram shape. In practical applications, the diameter D of the circumscribed circle of the bubble escape hole 3 may be set to be greater than 10 micrometers.

[0058] As shown in Figures 7-11As shown, the minimum structural unit contains one or more bubble vents 3. The arrangement of the bubble vents 3 includes uniform arrangement, gradually varying spacing arrangement, random arrangement, and specific pattern arrangement. The minimum structural region contains one or more rows of bubble vents 3. The spacing between two adjacent rows is defined as M1 greater than 10 micrometers, and the minimum interval distance M2 between the geometric centers of two adjacent bubble vents 3 in the same row is greater than 10 micrometers. The arrangement of the bubble vents 3 within the minimum structural region includes uniform arrangement, gradually varying spacing arrangement, random arrangement, and special linear arrangement. When the baffle is wavy, the arrangement position of the bubble vents 3 on the baffle includes being located in the entire wave segment, at the wave crest, and at the wave trough. The distance from the bubble vent to the baffle is defined as greater than 10 micrometers.

[0059] When the distribution of the bubble escaping holes 3 is uniform, the distance between two adjacent bubble escaping holes 3 in any direction is equal.

[0060] When the distribution of the bubble escaping holes 3 is arranged with a gradually varying spacing, with the central micropore or a designated micropore as the origin, the spacing between the micropores S1 and S2 along different directions gradually increases or decreases with a certain rate of change α. The rate of change in different directions is independent of each other, and the value of the rate of change α is between 0.2 and 5.

[0061] When the distribution of the bubble escaping holes 3 is random, the positions of the bubble escaping holes 3 do not follow fixed row and column coordinates or periodic patterns, and the spacing S1 and S2 between any two bubble escaping holes 3 varies within a certain range, forming a microstructure surface that resembles a natural distribution.

[0062] When the arrangement of the bubble escaping holes 3 within the smallest structural unit is a specific pattern arrangement, the specific pattern arrangement includes one or more combinations of arrangements such as single hole, spaced double holes, three holes enclosing a triangle, four holes enclosing a rectangle, four holes enclosing a "human" shape, five holes enclosing an "X" shape, five holes enclosing a pentagon, and six holes enclosing a pentagon.

[0063] When the bubble escaping holes 3 are arranged in a special linear pattern within the minimum structural region, the special linear pattern includes straight lines and wavy lines. The wavy lines include square wave lines, trapezoidal wave lines, triangular wave lines, and sine wave lines. The special linear pattern arrangement is a combination of one or more of the above linear patterns. The organization form of the special linear pattern arrangement includes array and adjacent symmetry. The amplitude and peak and valley widths of the wavy lines are designed and adjusted according to the local heat flux density.

[0064] like Figure 12 As shown, the depth of the bubble escaping hole 3 is defined as L1, and the thickness of the porous medium 4 is defined as L2.

[0065] When L1 < L2, the bubble escaping hole 3 is located inside the porous medium 4 region, and the endpoint of the bubble escaping hole (3) is higher than the upper surface of the bottom plate 1.

[0066] When L1 = L2, the bubble escape hole 3 passes through the porous medium 4 region, and the end point of the bubble escape hole 3 is located on the upper surface of the bottom plate 1;

[0067] When L1 > L2, the bubble escape hole 3 passes through the porous medium 4 and the upper surface of the base plate 1, and the end point of the bubble escape hole 3 is located inside the area of ​​the base plate 1.

[0068] Define the thickness of porous medium 4 as L2 and the height of the baffle as L3.

[0069] When L2 < L3, the upper surface of the porous medium 4 is lower than the upper surface of the baffle.

[0070] When L2 = L3, the upper surface of the porous medium 4 is flush with the upper surface of the baffle.

[0071] When L2 > L3, the upper surface of the porous medium 4 is higher than the upper surface of the baffle.

[0072] Among them, porous medium 4 can achieve good heat exchange efficiency when the height of the cooling working fluid liquid is higher or lower than the height of porous medium 4.

[0073] Based on the above-mentioned enhanced heat exchange surface, this embodiment proposes a CPU chip heat dissipation structure, such as... Figure 13 As shown, the base plate 1 includes a first cover plate 101, a first heat sink connector 102, a first screw 105, and a reinforced heat exchange surface on the upper surface of the base plate 1. The base plate 1 and the first cover plate 101 are tightly connected by the first screw 105. The first cover plate 101 has a fixing mounting hole 104 to ensure that the bottom surface of the base plate 1 is tightly fitted to the chip through the connection structure. The first heat sink connector 102 is connected to the working fluid flow port 103 by a thread. The chips include CPUs, GPUs, TPUs, FPGAs, ASICs, laser chips, network communication chips, radio frequency chips, image sensor chips, and other high heat flux electronic chips. The structure of the base plate 1 can be adapted to suit the size and installation position of different chips.

[0074] This embodiment also proposes a GPU chip heat dissipation structure, such as... Figure 14 As shown, the system includes a second cover plate 111, a main board 112, a fixed base plate 113, a second radiator connector 114, a second screw 116, a third screw 117, and an enhanced heat exchange surface on the base plate 1. The second cover plate 111 and the base plate 1 with the enhanced heat exchange surface are connected by the third screw 117 to form a heat dissipation space. A pair of working fluid inlets and outlets 115 are provided on one side of the second cover plate 111 and are connected to the second radiator connector 114 by threads, serving as the working fluid inlet and outlet of the radiator, respectively. The second cover plate 111, the main board 112, and the fixed base plate 113 are connected by the second screw 116.

[0075] like Figure 15 As shown, the basic application principle of the CPU chip heat sink is as follows: the low-temperature cooling medium enters the heat exchange cavity formed by the enhanced heat exchange surface and the first cover plate 101 through the first heat sink connector 102 on one side and undergoes boiling heat exchange, which carries away the heat conducted from the high-temperature chip to the enhanced heat exchange surface, and is discharged to the external circulation pipeline through the first heat sink connector 102 on the other side.

[0076] In practical applications, the base plate 1, metal frame 2, porous medium 4, first cover plate 101, first radiator connector 102, second cover plate 111, fixed base plate 113, and second radiator connector 114 are made of one or more of the following: copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic, or glass. The cooling medium is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquid.

[0077] In summary, this solution first proposes a multi-structure composite enhanced heat transfer surface, achieving a synergistic effect of rapid bubble nucleation and directional bubble escape. This significantly improves both the critical heat flux (CHF) and the heat transfer coefficient (HTC). This composite structure can be extended to various porous media surfaces (such as metal powder, metal wire, metal mesh, and metal foam) without requiring redesign of the core principles for specific substrates, demonstrating strong compatibility. Furthermore, combining this enhanced heat transfer surface with the chip heat dissipation structure effectively prevents chip frequency throttling due to overheating, ensuring stable operation under high loads, significantly improving performance and reliability, extending chip lifespan, and preventing device performance degradation or damage caused by localized overheating.

Claims

1. A reinforced heat transfer surface with a composite structure, characterized in that, Comprising an integrally designed base plate (1) and a metal frame (2), the metal frame (2) is located above the base plate (1), the upper surface of the base plate (1) is provided with a porous medium (4), and the porous medium (4) is filled in the metal frame (2) and provided with bubble escape holes (3).

2. The enhanced heat transfer surface with a composite structure according to claim 1, characterized in that, The metal frame (2) comprises a plurality of baffles, which adopt a spaced arrangement or a cross arrangement structure. When the spaced arrangement structure is adopted, the plurality of baffles all extend from the same direction, and the area between two adjacent baffles forms the minimum structural region; When the cross arrangement structure is adopted, the plurality of baffles extend from different directions, and the minimum two-dimensional enclosed space enclosed between two intersecting baffles forms the minimum structural unit.

3. The enhanced heat transfer surface with a composite structure according to claim 2, characterized in that, The baffles are specifically linear or wavy, the shape of the wavy baffles includes square wave, trapezoidal wave, triangular wave and sine wave, the organization form of the wavy baffles includes array and adjacent symmetry, and the amplitude and the widths of wave crests and wave troughs of the wavy baffles are designed and adjusted according to the local heat flux density.

4. The enhanced heat transfer surface with a composite structure according to claim 1, characterized in that, The shape of the bubble escape holes (3) is one or a combination of more of circle, semicircle, ellipse, semi-ellipse, triangle, rectangle, trapezoid, parallelogram, rhombus, pentagon, hexagon, polygon, cross shape, asterisk shape, snowflake shape, crescent shape and five-pointed star shape.

5. A reinforced heat transfer surface with a composite structure according to claim 3, characterized in that, One or more bubble escape holes (3) are arranged in the minimum structural unit, and the arrangement modes of the bubble escape holes (3) in the minimum structural unit include uniform arrangement, gradient spacing arrangement, random arrangement and specific pattern arrangement; One or more rows of bubble escape holes (3) are arranged in the minimum structural region, and the arrangement modes of the bubble escape holes (3) in the minimum structural region include uniform arrangement, gradient spacing arrangement, random arrangement and special linear arrangement; The bubble escape holes (3) are arranged at the full wave section, wave crests or wave troughs of the wavy baffles; The uniform arrangement specifically means that the spacing between two adjacent bubble escape holes (3) in any direction is equal; The gradient spacing arrangement specifically means that taking a central micro-hole or a specified micro-hole as the origin, the micro-hole spacings S1 and S2 along different directions gradually increase or decrease according to a set corresponding change rate α; The random arrangement specifically means that the spacings S1 and S2 between any two bubble escape holes (3) vary within a set range, forming a micro-structured surface with a quasi-natural distribution.

6. The enhanced heat transfer surface with a composite structure according to claim 5, characterized in that, The specific pattern arrangement is one or a combination of more of arrangement modes of single hole, spaced double holes, three holes enclosing a triangle, four holes enclosing a rectangle, four holes enclosing a herringbone shape, five holes enclosing an X shape, five holes enclosing a pentagon, and six holes enclosing a five-pointed star.

7. The enhanced heat transfer surface with a composite structure according to claim 5, characterized in that, The special linear arrangement includes linear arrangement and wavy linear arrangement, the wavy linear arrangement includes square wave linear arrangement, trapezoidal wave linear arrangement, triangular wave linear arrangement and sine wave linear arrangement, the special linear arrangement is one or a combination of more of the above linear shapes, the organization form of the special linear arrangement includes array and adjacent symmetry, and the amplitude and the widths of wave crests and wave troughs of the wavy line are designed and adjusted according to the local heat flux density.

8. The enhanced heat transfer surface with a composite structure according to claim 1, characterized in that, The depth of the bubble escape holes (3) is L1, and the thickness of the porous medium (4) is L2; When L1 < L2, the bubble escaping hole (3) is located inside the porous medium (4) region, and the endpoint of the bubble escaping hole (3) is higher than the upper surface of the bottom plate (1); When L1=L2, the bubble escaping hole (3) passes through the porous medium (4) region, and the end point of the bubble escaping hole (3) is located on the upper surface of the bottom plate (1). When L1 > L2, the bubble escaping hole (3) passes through the porous medium (4) and the upper surface of the base plate (1), and the end point of the bubble escaping hole (3) is located inside the area of ​​the base plate (1).

9. A reinforced heat transfer surface with a composite structure according to claim 2, characterized in that, The thickness of the porous medium (4) is L2, and the height of the baffle is L3; When L2 < L3, the upper surface of the porous medium (4) is lower than the upper surface of the baffle. When L2=L3, the upper surface of the porous medium (4) is flush with the upper surface of the baffle. When L2 > L3, the upper surface of the porous medium (4) is higher than the upper surface of the baffle.

10. A chip heat dissipation structure, characterized in that, The device includes a first cover plate (101) installed above the enhanced heat exchange surface as described in claim 1. The first cover plate (101) is equipped with a first radiator connector (102) for the flow of cooling working fluid into and out of the device. The first radiator connector (102) is connected to the working fluid flow port (103) opened on the first cover plate (101). The first cover plate (101) is provided with a fixing mounting hole (104) for the bottom surface of the base plate (1) of the enhanced heat exchange surface to be tightly attached to the chip through the connection structure. The low-temperature cooling medium enters the heat exchange cavity formed by the enhanced heat exchange surface and the first cover plate (101) through the first radiator connector (102) and undergoes boiling heat exchange, which takes away the heat conducted from the high-temperature chip to the enhanced heat exchange surface. The medium is then discharged to the external circulation pipeline through the first radiator connector (102).

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