Wafer repair equipment (Micro-LED)
CN309057550SActive Publication Date: 2025-01-07XIAMEN DAZU SHANGLI SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202430095028.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2039-02-26
Smart Images
Figure 000001_ABST
Abstract
1. Name of the product of this design: Wafer repair equipment (Micro‑LED). 2. Purpose of this design product: used to remove bad Micro LED core particles on quartz glass / sapphire substrates through laser processing. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the key points of the design: main view. 5. The bottom surface of this product is difficult to see or invisible when in use, so the top view is omitted.
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