Central part of sputtering target for physical vapor deposition chamber
CN309087080SActive Publication Date: 2025-01-24APPLIED MATERIALS INC
Patent Information
- Application Number
- CN202430158885.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2022-05-19
- Filing Date
- 2022-11-16
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2037-11-16
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Figure 000008_ABST
Abstract
1. The name of the product of this design: Central part of a sputtering target for a physical vapor deposition chamber. 2. Purpose of the product of this design: The sputtering target for physical vapor deposition chamber is used in the physical vapor deposition chamber. The central part of the sputtering target for physical vapor deposition chamber is a material to be sputtered in the physical vapor deposition processing chamber, which can be installed on a back plate for installation in the processing chamber. 3. The key design point of this design product lies in the shape of the part shown by the solid line. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. Other situations that need explanation: The dotted lines in the figure indicate the parts that are not requested for protection.
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Citation Information
Cited By
Target profile for a physical vapor deposition chamber target
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