Central part of sputtering target for physical vapor deposition chamber

CN309087080SActive Publication Date: 2025-01-24APPLIED MATERIALS INC
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Patent Information

Application Number
CN202430158885.2
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Priority Date
2022-05-19
Filing Date
2022-11-16
Publication Date
2025-01-24
Estimated Expiration
2037-11-16

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Abstract

1. The name of the product of this design: Central part of a sputtering target for a physical vapor deposition chamber. 2. Purpose of the product of this design: The sputtering target for physical vapor deposition chamber is used in the physical vapor deposition chamber. The central part of the sputtering target for physical vapor deposition chamber is a material to be sputtered in the physical vapor deposition processing chamber, which can be installed on a back plate for installation in the processing chamber. 3. The key design point of this design product lies in the shape of the part shown by the solid line. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. Other situations that need explanation: The dotted lines in the figure indicate the parts that are not requested for protection.
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Citation Information

Cited By

  • Target profile for a physical vapor deposition chamber target

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