Copper clad ceramic substrate (DBC board)

CN309163658SActive Publication Date: 2025-03-11HAINAN HANGXIN HIGH TECH IND GRP CO LTD
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Patent Information

Application Number
CN202430420199.8
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-07-05
Publication Date
2025-03-11
Estimated Expiration
2039-07-05

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Abstract

1. The name of this design product: copper-clad ceramic substrate (DBC board). 2. Purpose of this design product: This design product is used for the copper-clad ceramic substrate of IGBT modules. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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