Electroplating machine
CN309172598SActive Publication Date: 2025-03-14ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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Patent Information
- Application Number
- CN202430344046.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2039-06-06
Smart Images
Figure 000001_ABST
Abstract
1. The name of the product under this design: electroplating machine. 2. Purpose of this design product: This design product is used for wafer electroplating. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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