Heating plate (semiconductor process)
CN309252341SActive Publication Date: 2025-04-22爱利彼半导体设备(上海)有限公司
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Patent Information
- Application Number
- CN202430442075.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2039-07-16
Smart Images
Figure 000008_ABST
Abstract
1. The name of the product of this design: Heating plate (semiconductor process). 2. Purpose of this design product: used for heating in the wafer processing process. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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