Multi-chip intelligent mounting equipment
CN309380253SActive Publication Date: 2025-07-11恩纳基智能装备(无锡)股份有限公司
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Patent Information
- Application Number
- CN202430720323.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2039-11-14
Smart Images
Figure 000007_ABST
Abstract
1. Name of the Design Product: Multi-chip Intelligent Mounting Equipment. 2. Use of the Design Product: Die bonding in the chip packaging process. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph that Best Illustrates the Design Key Points: Perspective View 1. 5. Other Situations Requiring Explanation: Other Explanation: In the reference figure showing the transparent part, the shaded part is made of transparent or semi-transparent material.
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