Sealing material for semiconductor manufacturing equipment

CN309410899SActive Publication Date: 2025-07-29NIPPON VALQUA IND LTD
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Patent Information

Application Number
CN202430665105.3
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Priority Date
2024-05-27
Filing Date
2024-10-22
Publication Date
2025-07-29
Estimated Expiration
2039-10-22

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Abstract

1. Name of the design product: Sealing material for semiconductor manufacturing equipment. 2. Use of the design product: The design product is applicable to semiconductor manufacturing equipment such as CVD, dry etching equipment, etc. As shown in the enlarged view of Part B, the cross-sectional shape of the design product is a substantially rectangular shape in an inclined posture, and has a concave portion on the side portion of the inner peripheral side. 3. Design key points of the design product: lies in the shape. 4. Picture or photograph that best shows the design key points: perspective view. 5. The rear view is the same as the front view, so the rear view is omitted; the left view is the same as the right view, so the left view is omitted; the bottom view is the same as the top view, so the bottom view is omitted.
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