Sealing material for semiconductor manufacturing equipment
CN309410899SActive Publication Date: 2025-07-29NIPPON VALQUA IND LTD
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Patent Information
- Application Number
- CN202430665105.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-27
- Filing Date
- 2024-10-22
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2039-10-22
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Figure 000004_ABST
Abstract
1. Name of the design product: Sealing material for semiconductor manufacturing equipment. 2. Use of the design product: The design product is applicable to semiconductor manufacturing equipment such as CVD, dry etching equipment, etc. As shown in the enlarged view of Part B, the cross-sectional shape of the design product is a substantially rectangular shape in an inclined posture, and has a concave portion on the side portion of the inner peripheral side. 3. Design key points of the design product: lies in the shape. 4. Picture or photograph that best shows the design key points: perspective view. 5. The rear view is the same as the front view, so the rear view is omitted; the left view is the same as the right view, so the left view is omitted; the bottom view is the same as the top view, so the bottom view is omitted.
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