Chip flip-chip bonding equipment

Abstract

1. The name of the design product: Chip flip-chip bonding equipment. 2. The use of the design product: For flip-chip bonding in the chip packaging process. 3. The design key points of the design product: Lies in the shape. 4. The picture or photograph that best shows the design key points: Perspective view 1. 5. Other circumstances that need to be explained: Other explanations: In the reference figure showing the transparent part, the shaded part is made of transparent or translucent material.

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