Wafer thinning machine
CN309436279SActive Publication Date: 2025-08-12江苏元夫半导体科技有限公司
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Patent Information
- Application Number
- CN202430811762.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2039-12-20
Smart Images
Figure 000007_ABST
Abstract
1. The name of this design product: Wafer thinning machine. 2. Purpose of this design product: This design product is used for automatic thinning and grinding of semiconductor wafers. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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