Fully automatic wafer bonder
CN309474331SActive Publication Date: 2025-09-02SUZHOU WISEETEC CO LTD
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Patent Information
- Application Number
- CN202430405422.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-30
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2039-06-30
Smart Images
Figure 000006_ABST
Abstract
1. The name of this design product: fully automatic wafer bonding machine. 2. Purpose of this design product: used for automatic wafer bonding. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. The bottom surface of this design product is difficult to see or cannot be seen during use, so the top view is omitted.
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