Vibration-resistant modular package
CN309492168SActive Publication Date: 2025-09-1258TH RES INST OF CETC
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Patent Information
- Application Number
- CN202430790750.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2039-12-12
Smart Images
Figure 000003_ABST
Abstract
1. The name of this design product: vibration-resistant modular package. 2. Purpose of this design product: It can be used in the outline packaging of integrated circuits, adopting a mixed form of surface mount and direct plug-in, which can enhance the circuit's ability to resist vibration tests. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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