Thermal insulation unit cover for semiconductor manufacturing equipment
CN309505946SActive Publication Date: 2025-09-19KOKUSAI DENKI KK
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Patent Information
- Application Number
- CN202130803498.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2021-06-28
- Filing Date
- 2021-12-06
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2036-12-06
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product of this design: Thermal insulation unit cover for semiconductor manufacturing equipment. 2. The purpose of this design product: It is a cover that covers the heat insulation unit installed at the furnace mouth of a reaction tube for processing substrates such as semiconductor wafers. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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