Stacked high-precision die bonding machine
CN309568311SActive Publication Date: 2025-10-28NODING INTELLIGENCE
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Patent Information
- Application Number
- CN202530039508.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2040-01-21
Smart Images
Figure 000003_ABST
Abstract
1. Name of the product in this design: Stacked High-Precision Die Bonding Machine. 2. Purpose of this design: For chip mounting. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. The design for which protection is sought includes color.
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