Small angle adjustment to die bonder

Abstract

The application relates to the field of semiconductor packaging, in particular to a small-angle adjusting TO die bonding machine which comprises a die bonding table, X-axis and Y-axis moving mechanisms arranged on the die bonding table, and a work box with a material disc fixing assembly mounted at the output end of the Y-axis moving mechanism; an angle rotating mechanism of the die bonding table drives the die bonding table to rotate so that the top surface of a TO packaging tube base is horizontal; a dispensing mechanism dispenses the TO packaging tube base; and a wafer transferring mechanism transfers a wafer to the TO packaging tube base after dispensing. The angle of the whole die bonding table can be actively adjusted, so that the top surface of the TO packaging tube base with different preset inclination angles can be accurately corrected to the horizontal state. The design solves the problem that the die bonding must rely on a customized material disc with a specific angle in the prior art.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a small-angle adjustable TO die bonder. Background Technology

[0002] A TO die bonder is a mechanical device for fixing crystals and semiconductor packaging. It can transfer and bond the wafer on the blue film to the TO package socket to complete the chip mounting. It is widely used in the production of LED direct-view displays, semiconductor discrete devices, DIP and SOP products.

[0003] In some delivery modules (TOs), the packaging sockets are angled, making die bonding impossible with conventional die bonders. Current technology typically requires the fabrication of wedge-shaped bases or custom trays with specific slope grooves to accommodate the angled sockets. This not only increases mold development costs but also necessitates manual handling and replacement of heavy fixtures during production line changes, and is prone to errors in glue application positioning. Summary of the Invention

[0004] To improve production efficiency and reduce costs, this application provides a small-angle adjustable TO die bonder.

[0005] This application provides a small-angle adjustable TO die bonder using the following technical solution:

[0006] A small-angle adjustable TO die bonder includes:

[0007] A die bonding station is provided with an X-axis moving mechanism and a Y-axis moving mechanism. The output end of the X-axis moving mechanism is connected to the Y-axis moving mechanism. A work box is installed at the output end of the Y-axis moving mechanism. A work box is provided with a tray fixing assembly for fixing the tray.

[0008] The die bonder angle rotation mechanism has its output end connected to the die bonder and is used to drive the die bonder to rotate around the horizontal axis to compensate for the preset tilt angle of the TO package socket, so that the top surface of the TO package socket to be operated is in a horizontal state.

[0009] The dispensing mechanism is used to dispense adhesive onto the TO packaging tube sockets on the material tray;

[0010] A wafer transfer mechanism is used to transfer wafers to TO packaging sockets that have been dispensed.

[0011] By adopting the above technical solution and innovatively setting a die-bonding stage angle rotation mechanism, the equipment can actively adjust the angle of the entire die-bonding stage, thereby accurately correcting the top surface of TO package sockets with different preset tilt angles to a horizontal state. This design solves the problem in existing technologies that require customized trays with specific angles for die bonding, allowing the equipment to use universal standard trays. This greatly enhances the equipment's compatibility and versatility with different products, significantly reduces the high costs incurred from developing, purchasing, and managing multiple trays, and avoids the time spent changing trays, thus greatly improving production efficiency.

[0012] Optionally, the die bonding stage angle rotation mechanism is a servo rotary motor, the rotation axis of the servo rotary motor is fixedly connected to the die bonding stage, and the rotation axis is parallel to the Y-axis.

[0013] By adopting the above technical solution and utilizing the high-precision control characteristics of servo rotary motors, the tilt angle can be adjusted quickly, accurately, and programmably according to the tilt angle parameters of different TO package socket models. This allows the equipment to flexibly adapt to products with any tilt angle, achieving true flexible production. Product changeover can be completed simply by switching parameters in the system, further enhancing the equipment's versatility and production efficiency.

[0014] Optionally, the two inner sidewalls of the work box are provided with positioning grooves, the material tray is slidably connected in the positioning grooves, the groove wall of the positioning groove limits the upper and lower sides of the material tray, and the material tray fixing component is used to push the material tray so that the material tray abuts against the upper groove wall of the positioning groove.

[0015] By adopting the above technical solution, even during the dynamic process of the die bonding stage rotating at an angle, this stable and reliable tray fixing method can ensure that the standard tray always maintains accurate positioning, effectively resisting the displacement risk caused by changes in gravity and rotational inertia, and providing a stable and reliable benchmark for subsequent high-precision dispensing and die bonding operations. Furthermore, this fixing method is more cost-effective than vacuum adsorption fixing.

[0016] Optionally, the material tray fixing assembly includes a lifting mechanism, a connecting plate, a buffer, and a lifting plate. The lifting mechanism is disposed inside the work box, the connecting plate is installed at the output end of the lifting mechanism, one end of the buffer is connected to the connecting plate, and the other end is connected to the lifting plate. The surface of the lifting plate is disposed opposite to the bottom surface of the material tray.

[0017] By adopting the above technical solution, the flexible lifting force provided by the buffer can achieve a firm and uniformly force-bearing fixation without damaging the universal material tray, ensuring stability during the rotation of the die bonding stage and the high-speed movement of the X / Y platform, and further guaranteeing the feasibility of using standard material trays for high-precision operations.

[0018] Optionally, the die bonder further includes a tray transfer device, which includes a substrate, a tray collection box, a tray ejection mechanism, and a tray lifting mechanism. The tray collection box is mounted on the substrate and stacks trays along the height direction. The tray ejection mechanism pushes the trays in the tray collection box into the work box. The tray lifting mechanism drives the substrate to lift, thereby driving the tray collection box to lift.

[0019] By adopting the above technical solution, an automated tray transfer device is integrated. Combined with the core advantage of using standard trays in this application, the production process of TO products with various tilt angles is fully automated. There is no need for manual replacement of tray types, which truly realizes a highly efficient and continuous automated production line and raises production efficiency to a new level.

[0020] Optionally, the tray ejection mechanism includes a pusher plate and a suction cup disposed at the front end of the pusher plate. The pusher plate can move horizontally to push the tray in the tray collection box into the work box, and the pusher plate can pass through the tray collection box and use the suction cup to pull the tray in the work box back into the tray collection box.

[0021] By adopting the above technical solution and using a compact design that integrates push and suction, the automatic feeding and unloading of standard material trays is completed efficiently, simplifying the complexity of the automation mechanism and further improving the space utilization and smoothness of automated operation of the equipment.

[0022] Optionally, it also includes a device base and a buffer assembly disposed on the device base, the buffer assembly being connected to the four bottom corners of the die bonding stage, and a plurality of the buffer assemblies being arranged symmetrically about the rotation axis.

[0023] By adopting the above technical solution, the vibration and impact generated when the die bonding stage performs the newly added angular rotation action are effectively suppressed, ensuring the dynamic stability of the platform. This is crucial for performing micron-level die bonding operations immediately after rotation adjustment, ensuring that the addition of rotation function does not sacrifice the original high-precision performance of the equipment.

[0024] Optionally, the buffer assembly includes a gas-liquid hybrid shock absorber, one end of which is hinged to the die bonding stage and the other end of which is hinged to the device base.

[0025] By adopting the above technical solution and utilizing the excellent damping characteristics of the gas-liquid hybrid shock absorber, the energy impact brought by the rotational motion can be absorbed more efficiently, providing an extremely stable working platform for high-precision die bonding operations and further ensuring the die bonding accuracy after rotational adjustment.

[0026] Optionally, it also includes a controller, an acceleration sensor is installed at the edge of the working box away from its center, and a damping adjustment proportional valve is also provided in the gas-liquid hybrid shock absorber. The controller is electrically connected to the acceleration sensor and the damping adjustment proportional valve respectively.

[0027] The acceleration sensor is used to detect the vibration or motion state of the working box. The controller is adapted to send a command to the damping adjustment proportional valve according to the preset rotation angle and speed command before rotation is executed, so as to pre-adjust the damping of the gas-liquid hybrid shock absorber to the set value corresponding to the rotation angle and speed command.

[0028] By adopting the above technical solution, an active intelligent vibration reduction system was constructed. This system can sense the dynamic changes caused by different rotation angles and speeds in real time and adaptively adjust the damping force, achieving optimal suppression of vibration during rotation. This ensures that the equipment maintains optimal dynamic stability and positioning accuracy under TO product production tasks at any tilt angle.

[0029] Optionally, the die bonder further includes an AOI inspection mechanism, which is electrically connected to the X-axis moving mechanism, the Y-axis moving mechanism, the die bonder angle rotation mechanism, the dispensing mechanism, and the wafer transfer mechanism. The work box is provided with a correction lens, and the AOI inspection mechanism can correct the horizontal position of the work box through the correction lens.

[0030] By adopting the above technical solution, AOI visual inspection provides closed-loop feedback for the angle correction of the die bonding stage. After die bonding, although the tray can be reset by the die bonding stage angle rotation mechanism, the die bonding stage angle rotation mechanism will experience wear or zero-point drift after long-term operation, thus affecting the reset of the tray. This approach utilizes the existing AOI inspection mechanism, only requiring the addition of a low-cost lens to the work box, to accurately achieve the reset of the work box after die bonding, ensuring the subsequent transport of the tray.

[0031] In summary, this application includes at least one of the following beneficial technical effects:

[0032] 1. Strong versatility and compatibility, significantly reducing production costs: This application adapts tilted TO package sockets to a rotating die bonder, eliminating the reliance on customized trays tied to the product's tilt angle during the die bonder process. Companies only need to purchase and manage a single standard tray to produce all TO products with different tilt angles, thus eliminating the need to develop and manufacture expensive dedicated trays for different products, significantly reducing mold and material management costs.

[0033] 2. Significantly Improved Production Efficiency and Flexibility: Since there's no need to change material trays for different products, production line changeover time is reduced from physically replacing and adjusting trays to simply calling or inputting an angle parameter in the equipment program. Changeover time is virtually negligible. This extremely high production flexibility greatly improves equipment utilization and overall production efficiency, enabling rapid response to the needs of multi-variety, small-batch production.

[0034] 3. Ensuring high-precision die bonding quality: This application comprehensively applies technologies such as servo motors, AOI vision closed-loop feedback, and active intelligent vibration reduction systems to ensure the accuracy of angle adjustment, dynamic stability of the platform, and positioning accuracy on the basis of the added rotation function. This ensures that even when dealing with TO package sockets with various complex tilt angles, high-precision and high-quality die bonding can still be achieved, thus ensuring product yield. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this application.

[0036] Figure 2 This is a schematic diagram of the die bonding stage and the material transfer device shown in Embodiment 1 of this application.

[0037] Figure 3 This is a schematic diagram of the structure of the working box shown in Embodiment 1 of this application.

[0038] Figure 4 This is a schematic diagram of the die bonding stage angle rotation mechanism shown in Embodiment 1 of this application.

[0039] Figure 5 This is a schematic diagram of the structure of the buffer component shown in Embodiment 2 of this application.

[0040] Figure 6 This is a structural schematic diagram illustrating the position of the correction lens in Embodiment 3 of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100. Tray; 200. Die-bonding stage; 210. X-axis moving mechanism; 220. Y-axis moving mechanism; 230. Work box; 231. Positioning slot; 240. Tray fixing assembly; 241. Lifting mechanism; 242. Connecting plate; 243. Buffer; 244. Lifting plate; 300. Die-bonding stage angle rotation mechanism; 400. Dispensing mechanism; 500. Wafer transfer mechanism; 600. Tray transfer device; 610. Substrate; 620. Tray collection box; 630. Tray ejection mechanism; 631. Pusher plate; 632. Suction cup; 640. Tray lifting mechanism; 700. Equipment base; 800. Buffer assembly; 900. AOI inspection mechanism; 910. Correction lens. Detailed Implementation

[0043] The following will be combined with the appendix Figure 1-6 The technical solutions in the embodiments of the present invention are further described in detail below. The described embodiments are only possible technical implementations of the present invention, but are not limited thereto. Those skilled in the art can certainly combine the embodiments of the present invention to obtain other embodiments without creative effort, which are also within the protection scope of the present invention.

[0044] This application mainly adopts a rotating die bonder to make the TO package socket horizontally die bonded, which achieves the effects of adapting to sockets with different tilt angles, reducing costs and improving efficiency. The following is a further detailed description of this application.

[0045] It should be explained that "small angle" in this application refers to the rotation angle of the tray relative to the horizontal plane being less than 20°.

[0046] Example 1: The small-angle adjustable TO die bonder provided in this application embodiment, referring to... Figure 1 and Figure 2 The device includes a die bonding stage 200, a die bonding stage angle rotation mechanism 300, a dispensing mechanism 400, and a wafer transfer mechanism 500. The output end of the die bonding stage angle rotation mechanism 300 is connected to the die bonding stage 200, which can drive the die bonding stage 200 to rotate around a horizontal axis, so that the top surface of the TO package socket in the tray 100 is in a horizontal state. The dispensing mechanism 400 dispenses glue to the TO package socket on the tray 100, and the wafer transfer mechanism 500 transfers the wafer to the dispensed TO package socket. This allows the die bonding machine to adapt to TO package sockets with different tilt angles, and enables the TO package socket to be dispensed and die bonded in a horizontal state, solving the problems of increased cost and reduced efficiency caused by changing the tray 100.

[0047] Reference Figure 2 and Figure 3 Specifically, the die bonding stage 200 is equipped with an X-axis moving mechanism 210 and a Y-axis moving mechanism 220. The output end of the X-axis moving mechanism 210 is connected to the Y-axis moving mechanism 220. The X-axis moving mechanism 210 can adopt a lead screw and nut pair structure. The lead screw is driven to rotate by a motor, and the nut is fixedly connected to the Y-axis moving mechanism 220. When the motor drives the lead screw to rotate, the nut will move linearly along the lead screw, thereby realizing the movement of the Y-axis moving mechanism 220 in the X-axis direction. The output end of the Y-axis moving mechanism 220 is equipped with a work box 230. The Y-axis moving mechanism 220 can also adopt a lead screw and nut pair structure, and its working principle is similar to that of the X-axis moving mechanism 210. The work box 230 is equipped with a tray fixing assembly 240 for fixing the tray 100.

[0048] The work box 230 extends through both sides along the X-axis. Positioning grooves 231 are provided on the two inner side walls of the work box 230. The material tray 100 is slidably connected in the positioning grooves 231. The groove wall of the positioning groove 231 limits the upper and lower sides of the material tray 100. The material tray fixing component 240 is used to push the material tray 100 so that the material tray 100 abuts against the groove wall of the positioning groove 231.

[0049] Reference Figure 3 Optionally, the tray fixing assembly 240 includes a lifting mechanism 241, a connecting plate 242, a buffer 243, and a lifting plate 244. The lifting mechanism 241 is located inside the work box 230. The lifting mechanism 241 can be a cylinder, which can push the connecting plate 242 upward when the piston rod of the cylinder extends; or it can be an electric push rod, which extends and pushes the connecting plate 242 after being energized. The connecting plate 242 is installed at the output end of the lifting mechanism 241. One end of the buffer 243 is connected to the connecting plate 242, and the other end is connected to the lifting plate 244. The buffer 243 can be a spring, which has elasticity and can play a buffering role during the lifting process to avoid damage to the tray 100 due to excessive lifting force; or it can be a rubber buffer pad, which is soft and can also play a buffering role. The surface of the lifting plate 244 is set opposite to the bottom surface of the material tray 100. When the lifting mechanism 241 is activated, the lifting plate 244 is driven to lift the material tray 100 upward through the connecting plate 242 and the buffer 243, so that the material tray 100 abuts against the groove wall of the positioning groove 231, thereby fixing the material tray 100.

[0050] Reference Figure 2 and Figure 4 In one embodiment, the die bonding stage angle rotation mechanism 300 is a servo rotary motor. The rotation axis of the servo rotary motor is fixedly connected to the die bonding stage 200, and the rotation axis is parallel to the Y-axis. The servo rotary motor can precisely control the rotation angle and direction. After obtaining the tilt angle of the TO package socket through preset parameters, the servo rotary motor drives the die bonding stage 200 to rotate by the corresponding angle, so that the top surface of the TO package socket in the tray 100 is in a horizontal state. The preset parameters here refer to the angle input module contained in the die bonding machine, which is used to input or store preset tilt angle parameters of different models of TO package sockets.

[0051] Reference Figure 1 The dispensing mechanism 400 is positioned above the die bonder 200 and is capable of precisely dispensing adhesive onto the top surface of the horizontally positioned TO package sockets. The dispensing mechanism 400 can employ a structure known in the art. The dispensing mechanism 400 dispenses adhesive onto the TO package sockets on the tray 100, and a dispensing heating mechanism can heat the surface during the dispensing process to facilitate dispensing.

[0052] The wafer transfer mechanism 500 is used to transfer wafers to the TO packaging socket after dispensing. The wafer transfer mechanism 500 may include a blue film moving assembly, a first wafer moving arm assembly, etc. The blue film moving assembly fixes the blue film onto a blue film holder, and the moving mechanism adjusts the position of the blue film to facilitate the first wafer moving arm assembly to pick up the wafer for die bonding. The arm rotation mechanism of the first wafer moving arm assembly rotates the arm to the blue film station, and the arm Z-axis moving mechanism adjusts the nozzle height. The nozzle picks up the wafer from the blue film on the blue film moving assembly and moves it to the die bonding station, bonding the wafer to the TO packaging socket after dispensing. The wafer transfer mechanism 500 may also employ a structure known in the art.

[0053] Reference Figure 1 and Figure 2 In a preferred embodiment, the die bonder further includes a tray transfer device 600, which includes a substrate 610, a tray collection box 620, a tray ejection mechanism 630, and a tray lifting mechanism 640. The tray collection box 620 is mounted on the substrate 610 and stacks trays 100 along the height direction. The tray ejection mechanism 630 is used to push the trays 100 in the tray collection box 620 into the work box 230. The tray lifting mechanism 640 is used to drive the tray collection box 620 to rise and fall.

[0054] The tray ejection mechanism 630 includes a pusher plate 631 and a suction cup 632 disposed at the front end of the pusher plate 631. The pusher plate 631 can move horizontally to push the trays 100 in the tray collection box 620 into the work box 230. The pusher plate 631 can also pass through the tray collection box 620 and the suction cup 632 can pull the trays 100 in the work box 230 back into the tray collection box 620. The pusher plate 631 can be driven by a motor-belt mechanism, with one side of the pusher plate 631 fixed to the belt. The motor drives the belt to move, thereby causing the pusher plate 631 to move back and forth. In other embodiments, the pusher plate 631 can be driven by a motor-screw mechanism.

[0055] In this embodiment, the pusher plate 631 is a flat, thin plate that can pass through the inner cavity of the tray collection box 620 to push the tray 100 inside the tray collection box 620 into the work box 230. Then, the lifting mechanism 241 inside the work box 230 is activated to fix the tray 100, and then the pusher plate 631 retracts to complete the loading. When unloading is required, the pusher plate 631 continues to pass through the tray collection box 620 and uses the suction cup 632 to pick up the tray 100. Then, the pusher plate 631 retracts, pulling the tray 100 back into the tray collection box 620. During this process, the limiting structure inside the tray collection box 620 can be used to limit the tray 100, causing the suction cup 632 to separate from the tray 100, thus completing the unloading.

[0056] Optionally, the tray lifting mechanism 640 can adopt a motor screw structure, which drives the tray collection box 620 to lift and lower, thereby loading and unloading the trays 100 on each layer of the tray collection box 620; in other embodiments, the tray lifting mechanism 640 can also adopt an electric push rod or other structures.

[0057] The implementation principle of this embodiment is as follows: the position of the work box 230 can be adjusted by the X-axis moving mechanism 210 and the Y-axis moving mechanism 220 on the die bonding stage 200, and the tray fixing assembly 240 can fix the tray 100 inside the work box 230. The die bonding stage angle rotation mechanism 300 drives the die bonding stage 200 to rotate, so that the top surface of the TO package sockets with different tilt angles reaches the horizontal, eliminating the need to replace the tray 100, reducing costs and improving production efficiency. The dispensing mechanism 400 and the wafer transfer mechanism 500 cooperate to complete the die bonding operation of dispensing and wafer transfer. The tray transfer device 600 realizes the automatic transfer of the tray 100, improving the automation level of the die bonding machine, reducing manual intervention, further improving production efficiency, reducing labor costs, and making the entire die bonding process more efficient and flexible, adapting to the die bonding needs of sockets with different tilt angles, which is a significant improvement and enhancement compared to the prior art.

[0058] In Example 2, during actual production, the die bonding stage 200 will frequently rotate at high speed and start and stop. During the start and stop process, the die bonding stage 200 will experience slight vibrations, which will affect the positioning accuracy of the die bonding stage 200, and thus affect the subsequent dispensing and die bonding accuracy and efficiency.

[0059] To address the aforementioned problems, this application provides Embodiment 2: The die bonder further includes a device base 700, a buffer assembly 800, and a controller. The buffer assembly 800 is mounted on the device base 700 and is hinged to the four bottom corners of the die bonder 200. Multiple buffer assemblies 800 are arranged symmetrically about the rotation axis of the die bonder angle rotation mechanism 300. The buffer assembly 800 solves the vibration problem of the die bonder 200.

[0060] However, when the die bonder 200 rotates at a large angle (±15°) at high speed, it requires significant damping to quickly absorb energy and prevent overshoot. Conversely, when performing a small angle (±2°) correction quickly, excessive damping can actually make the system response sluggish and prolong the settling time.

[0061] Therefore, in this embodiment, the buffer assembly 800 includes a gas-liquid hybrid shock absorber, one end of which is hinged to the die-bonding stage 200, and the other end is hinged to the device base 700. An acceleration sensor is installed at the edge of the working box 230 away from its center. The gas-liquid hybrid shock absorber also contains a damping adjustment proportional valve. The controller is electrically connected to both the acceleration sensor and the damping adjustment proportional valve. The acceleration sensor detects the vibration or motion state of the working box 230, and the controller sends a command to the damping adjustment proportional valve based on the obtained rotation angle and speed to adjust the damping of the gas-liquid hybrid shock absorber to a set value.

[0062] Specifically, the first step is to establish a "working condition-optimal damping" mapping table: during the "self-learning" or "calibration" process before the equipment leaves the factory, the system will automatically execute a series of preset actions.

[0063] The rotating platform is started and stopped at different angles (e.g., 5°, 10°, 15°) and speeds (high, medium, low). Under each condition, the system automatically scans and tries different damping values. Simultaneously, the accelerometer monitors the vibration convergence time after each movement stops in real time. With the goal of "shortest vibration convergence time," the system finds the optimal damping value for each condition (angle-speed combination) and automatically generates a multidimensional lookup table stored in the controller.

[0064] Then, feedforward active adjustment is performed. In actual production, when the controller issues a rotation command (for example, a command of: rotation +13.5°, speed 80%), it no longer simply sends the command to the motor. Instead:

[0065] Step 1: Lookup Table. Based on the instructions (angle, speed) to be executed, the controller immediately looks up the optimal damping setting value in the "multidimensional lookup table".

[0066] Step 2: Presetting. Before or at the beginning of the action of the die bonding stage angle rotation mechanism 300, the controller sends a command to the damping adjustment proportional valve of the shock absorber to pre-set its damping to the optimal value.

[0067] Step 3: Perform rotation. Then, the rotary motor moves according to the command.

[0068] The above method ensures that the equipment can operate with optimal dynamic performance under any working condition, achieving globally optimal stability and efficiency.

[0069] The implementation principle of this embodiment is as follows: the gas-liquid hybrid damper in the buffer assembly 800 can act as a buffer when the die bonding stage 200 rotates, reducing the impact of vibration on the die bonding operation. An accelerometer detects the rotation of the work box 230 in real time, and the controller adjusts the damping proportional valve based on the detection data, allowing the damping of the gas-liquid hybrid damper to adapt to different rotational states, further improving the stability of the die bonding process. Compared with existing technologies, this represents a significant improvement in stability.

[0070] Example 3, this example differs from the above examples in that: (Refer to...) Figure 1 and Figure 6 The die bonder also includes an AOI inspection mechanism 900, which is electrically connected to an X-axis moving mechanism 210, a Y-axis moving mechanism 220, a die bonder stage angle rotation mechanism 300, a dispensing mechanism 400, and a wafer transfer mechanism 500. A calibration lens 910 is provided on the work box 230, and the AOI inspection mechanism 900 can correct the horizontal position of the work box 230 through the calibration lens 910.

[0071] The calibration lens 910 is preferably a plane mirror with a high-reflectivity coating or a standard block with cross-shaped markings. The AOI inspection mechanism 900 illuminates the calibration lens 910 with a collimated beam and determines whether the working box 230 is absolutely level by detecting the offset of the reflected beam (similar to the principle of an autocollimator). Compared to relying solely on the motor encoder for zeroing, this optical-physical calibration can eliminate zeroing errors caused by gearbox backlash and bearing wear.

[0072] In actual production, the die-bonding stage angle rotation mechanism 300 may experience wear or zero-point drift after long-term operation, affecting the reset of the tray 100. Therefore, when the work box 230 is in a horizontal position, the AOI inspection mechanism 900 is first aligned with the correction lens 910 and illuminated. The AOI inspection mechanism 900 records the reflected light spot information from the correction lens 910, and uses this light spot information to record the horizontal position of the work box 230. After the die-bonding stage 200 undergoes multiple rotations for die bonding, the servo rotary motor drives the work box 230 back to a horizontal position. At this time, the AOI inspection mechanism 900 is aligned with the correction lens 910 again to verify the position of the light spot, and the horizontal position of the work box 230 is determined by the light spot position information. Therefore, this solution mainly verifies whether the work box 230 has returned to a horizontal position. This method utilizes the existing AOI inspection mechanism 900, requiring only the addition of a low-cost lens to the work box 230 to accurately achieve the reset of the work box 230 after die bonding, ensuring the subsequent transport of the tray 100.

[0073] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A small-angle adjustable TO die bonder, wherein the small angle refers to a rotation angle of the die tray (100) relative to the horizontal plane of less than 20°, characterized in that, include: A die bonding stage (200) is provided with an X-axis moving mechanism (210) and a Y-axis moving mechanism (220). The output end of the X-axis moving mechanism (210) is connected to the Y-axis moving mechanism (220). A work box (230) is installed on the output end of the Y-axis moving mechanism (220). A tray fixing assembly (240) for fixing the tray (100) is provided inside the work box (230). The die bonder angle rotation mechanism (300) has its output end connected to the die bonder (200) and is used to drive the die bonder (200) to rotate so that the top surface of the TO package tube seat in the tray (100) is in a horizontal state; The dispensing mechanism (400) is used to dispense adhesive onto the TO packaging tube socket on the tray (100); The wafer transfer mechanism (500) is used to transfer the wafer to the TO packaging socket after dispensing; the die bonding stage angle rotation mechanism (300) is a servo rotary motor, the rotation axis of the servo rotary motor is fixedly connected to the die bonding stage (200), and the rotation axis is parallel to the Y-axis; The work box (230) has positioning grooves (231) on its two inner side walls. The material tray (100) is slidably connected in the positioning groove (231). The groove wall of the positioning groove (231) limits the upper and lower sides of the material tray (100). The material tray fixing assembly (240) is used to push the material tray (100) so that the material tray (100) abuts against the groove wall of the positioning groove (231). The material tray fixing assembly (240) includes a lifting mechanism (241), a connecting plate (242), a buffer (243), and a lifting plate (244). The lifting mechanism (241) is disposed inside the work box (230). The connecting plate (242) is installed at the output end of the lifting mechanism (241). One end of the buffer (243) is connected to the connecting plate (242), and the other end is connected to the lifting plate (244). The surface of the lifting plate (244) is disposed opposite to the bottom surface of the material tray (100).

2. The small-angle adjustable TO die bonder according to claim 1, characterized in that: The die bonder also includes a tray transfer device (600), which includes a substrate (610), a tray collection box (620), a tray ejection mechanism (630), and a tray lifting mechanism (640). The tray collection box (620) is mounted on the substrate (610) and stacks trays (100) along the height direction. The tray ejection mechanism (630) is used to push the trays (100) in the tray collection box (620) into the work box (230). The tray lifting mechanism (640) is used to drive the substrate (610) to lift and lower, thereby driving the tray collection box (620) to lift and lower.

3. A small-angle adjustable TO die bonder according to claim 2, characterized in that: The tray ejection mechanism (630) includes a pusher plate (631) and a suction cup (632) disposed at the front end of the pusher plate (631). The pusher plate (631) can move horizontally to push the tray (100) in the tray collection box (620) into the work box (230). The pusher plate (631) can pass through the tray collection box (620) and use the suction cup (632) to pull the tray (100) in the work box (230) back into the tray collection box (620).

4. A small-angle adjustable TO die bonder according to claim 1, characterized in that: It also includes a device base (700) and a buffer assembly (800) disposed on the device base (700), the buffer assembly (800) being connected to the four bottom corners of the die bonding stage (200), and a plurality of the buffer assemblies (800) being arranged symmetrically about the rotation axis.

5. A small-angle adjustable TO die bonder according to claim 4, characterized in that: The buffer assembly (800) includes a gas-liquid hybrid shock absorber, one end of which is hinged to the die bonding stage (200) and the other end of which is hinged to the device base (700).

6. A small-angle adjustable TO die bonder according to claim 5, characterized in that: It also includes a controller, an acceleration sensor is installed at the edge of the working box (230) away from its center, and a damping adjustment proportional valve is also provided in the gas-liquid hybrid shock absorber. The controller is electrically connected to the acceleration sensor and the damping adjustment proportional valve respectively. The acceleration sensor is used to detect the vibration or motion state of the working box (230). The controller sends a command to the damping adjustment proportional valve according to the obtained rotation angle and speed to adjust the damping of the gas-liquid hybrid shock absorber to the set value.

7. A small-angle adjustable TO die bonder according to claim 1, characterized in that: The die bonder also includes an AOI inspection mechanism (900), which is electrically connected to an X-axis moving mechanism (210), a Y-axis moving mechanism (220), a die bonder angle rotation mechanism (300), a dispensing mechanism (400), and a wafer transfer mechanism (500). The work box (230) is provided with a correction lens (910), and the AOI inspection mechanism (900) can correct the horizontal position of the work box (230) through the correction lens (910).

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