Semiconductor heat sink (YM-3A)
CN309582607SActive Publication Date: 2025-11-04邓微
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Patent Information
- Application Number
- CN202530119187.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2040-03-13
Smart Images
Figure 000005_ABST
Abstract
1. The name of the design product: semiconductor heat sink (YM-3A). 2. The use of the design product: a semiconductor heat sink for mobile phone heat dissipation. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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