Die bonder
CN309645925SActive Publication Date: 2025-12-02SHENZHEN LIANDE SEMICON TECH CO LTD
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Patent Information
- Application Number
- CN202530204351.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2040-04-16
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Die Bonder. 2. Purpose of this design: a die bonder for the semiconductor packaging and testing industry. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.
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