Water-guided laser polishing device for semiconductor dicing blade processing
CN309717091SActive Publication Date: 2026-01-02NANJING UNIV OF POSTS & TELECOMM
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Patent Information
- Application Number
- CN202430732887.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2039-11-19
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Figure 000001_ABST
Abstract
1. The name of the design product: water guide laser polishing device for semiconductor cleaver processing. 2. The use of the design product: the design product is used for subsequent surface polishing, arc polishing, surface polishing, hole polishing and internal chamfer polishing of unfinished semiconductor cleavers. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view.
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