Memory stick housing
CN309754399SActive Publication Date: 2026-01-27HANGZHOU HIKSTORAGE TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202530253415.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-07
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2040-05-07
Smart Images
Figure 000007_ABST
Abstract
1. Name of this design product: Memory module casing. 2. Purpose of this product design: To be installed on the exterior of a memory module to protect the memory module and promote heat dissipation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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