Lead frame for power module
CN309784709SActive Publication Date: 2026-02-10HANGZHOU SILAN MICROELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202530083753.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2040-02-25
Smart Images
Figure 000001_ABST
Abstract
1. The name of the design product: lead frame of power module. 2. The use of the design product: for power module. 3. The design points of the design product: in the partial design shape claimed. 4. The picture or photograph best indicating the design points: front view. 5. Other circumstances requiring explanation Other explanation: the solid line part is the partial part claimed, and the dotted line marks the boundary between the partial part claimed and the remaining part.
Need to check novelty before this filing date? Find Prior Art