Integrated power module heat sink
CN309801093SActive Publication Date: 2026-02-17CHONGQING CLOUDCHILD TECH CO LTD
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Patent Information
- Application Number
- CN202530401090.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-09
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2040-07-09
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: integrated power module heat sink. 2. The use of the design product: for heat dissipation and packaging of various types of power semiconductor modules. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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