Leadframe (IPM-SSOP)
CN309810888SActive Publication Date: 2026-02-24SICHUAN MOUNTEK ELECTRONIC TECH CO LTD
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Patent Information
- Application Number
- CN202530465354.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-07
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2040-08-07
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Figure 000001_ABST
Abstract
1. The name of the present design product: lead frame (IPM-SSOP). 2. The use of the present design product: for intelligent power module manufacturing. 3. The design points of the present design product: in shape. 4. The picture or photo that can best show the design points: design 1 front view. 5. The present design product is a thin product, and the design 1 left view, the design 1 right view, the design 1 bottom view, and the design 1 top view are omitted; the present design product is a thin product, and the design 2 left view, the design 2 right view, the design 2 bottom view, and the design 2 top view are omitted; the design 1 rear view is symmetrical to the design 1 front view, and the design 1 rear view is omitted; the design 2 rear view is symmetrical to the design 2 front view, and the design 2 rear view is omitted. 6. Design 1 is designated as the basic design.
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