Heat sink (for thyristor cooling modules)
CN309812421SActive Publication Date: 2026-02-24SHANGHAI EECTRL ELECTRIC
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Patent Information
- Application Number
- CN202530411783.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-15
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2040-07-15
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Heat sink (for thyristor heat dissipation module). 2. Purpose of this design: Used for heat dissipation of thyristors in a thyristor heat dissipation module. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the key design points: Design 1 3D view. 5. Other situations requiring explanation: This design is a similar design, and Design 1 is the basic design.
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